CN102314100A - PS (Photoshop) version retouching paste containing dimethyl sulfate - Google Patents
PS (Photoshop) version retouching paste containing dimethyl sulfate Download PDFInfo
- Publication number
- CN102314100A CN102314100A CN 201110125427 CN201110125427A CN102314100A CN 102314100 A CN102314100 A CN 102314100A CN 201110125427 CN201110125427 CN 201110125427 CN 201110125427 A CN201110125427 A CN 201110125427A CN 102314100 A CN102314100 A CN 102314100A
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- CN
- China
- Prior art keywords
- version
- retouching
- dimethyl sulfate
- paste
- photoshop
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a PS (Photoshop) version retouching paste containing dimethyl sulfate, which comprises the following components: ethanol, polyethylene glycol, emulsified silicone oil, sodium benzoate, dimethyl sulfate and acetic acid. The dimethyl sulfate is added into the paste disclosed by the invention, thus the retouching effect is better and a version base and the printing quality are not influenced; and simultaneously, an antioxidant and a thickening agent are added, thus the paste has the advantages of high viscosity and small possibility of flowing and is easy to use.
Description
Technical field
The present invention relates to a kind of sulfur acid dimethyl ester PS version retouching paste.
Background technology
Printing more or less has dirty point or film edge tracking mark with the PS version after printing down, development, if without modification, then damage the plate quality.Present retouching paste acidity is all more intense, damages oxide layer and version base easily, directly influences printing quality.
Summary of the invention
The invention provides a kind of sulfur acid dimethyl ester PS version retouching paste, neither influence version base does not influence printing quality yet.
The present invention has adopted following technical scheme: a kind of sulfur acid dimethyl ester PS version retouching paste, its lotion is composed of the following components: ethanol, polyglycol, silicone emulsion, Sodium Benzoate, dimethyl suflfate and acetic acid.
Each percentages of ingredients of lotion is: hexanol 50-55%, polyglycol 1-5%, silicone emulsion 10-25%, Sodium Benzoate 1%-2%, dimethyl suflfate 1-5%, acetic acid 1-2%.
Also be added with anti-oxidant and thickening agent in the lotion.
The present invention has following beneficial effect: the adding dimethyl suflfate makes among the present invention neither influences the colour-separation drafting better effects if version base and does not also influence printing quality, adds anti-oxidant and thickening agent simultaneously, makes viscosity big, is difficult for trickling, is easy to use.
Embodiment
A kind of sulfur acid dimethyl ester PS version retouching paste, its lotion is composed of the following components: ethanol, polyglycol, silicone emulsion, Sodium Benzoate, dimethyl suflfate, acetic acid, anti-oxidant and thickening agent.Each percentages of ingredients of lotion is: hexanol 50-55%, polyglycol 1-5%, silicone emulsion 10-25%, Sodium Benzoate 1%-2%, dimethyl suflfate 1-5%, acetic acid 1-2%.
Claims (3)
1. a sulfur acid dimethyl ester PS version retouching paste is characterized in that its lotion is composed of the following components: ethanol, polyglycol, silicone emulsion, Sodium Benzoate, dimethyl suflfate and acetic acid.
2. a kind of sulfur acid dimethyl ester PS version retouching paste according to claim 1; It is characterized in that each percentages of ingredients of lotion is: hexanol 50-55%, polyglycol 1-5%, silicone emulsion 10-25%, Sodium Benzoate 1%-2%, dimethyl suflfate 1-5%, acetic acid 1-2%.
3. a kind of sulfur acid dimethyl ester PS version retouching paste according to claim 1 is characterized in that also being added with in the lotion anti-oxidant and thickening agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110125427 CN102314100A (en) | 2011-05-10 | 2011-05-10 | PS (Photoshop) version retouching paste containing dimethyl sulfate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110125427 CN102314100A (en) | 2011-05-10 | 2011-05-10 | PS (Photoshop) version retouching paste containing dimethyl sulfate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102314100A true CN102314100A (en) | 2012-01-11 |
Family
ID=45427373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110125427 Pending CN102314100A (en) | 2011-05-10 | 2011-05-10 | PS (Photoshop) version retouching paste containing dimethyl sulfate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102314100A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104714377A (en) * | 2013-12-11 | 2015-06-17 | 中国航空工业第六一八研究所 | Anticorrosion film opaque |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1229522A (en) * | 1997-06-24 | 1999-09-22 | 克拉瑞特国际有限公司 | Detergent for lithography |
| US6440856B1 (en) * | 1999-09-14 | 2002-08-27 | Jsr Corporation | Cleaning agent for semiconductor parts and method for cleaning semiconductor parts |
| JP2008058624A (en) * | 2006-08-31 | 2008-03-13 | Tokyo Ohka Kogyo Co Ltd | Photoresist stripping liquid, and substrate treatment method using the same |
| CN101339369A (en) * | 2008-08-07 | 2009-01-07 | 温州康尔达印刷器材有限公司 | PS plate retouching paste |
| WO2011008051A2 (en) * | 2009-07-17 | 2011-01-20 | 동우 화인켐 주식회사 | Composition for removing resists used with copper or copper alloy |
-
2011
- 2011-05-10 CN CN 201110125427 patent/CN102314100A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1229522A (en) * | 1997-06-24 | 1999-09-22 | 克拉瑞特国际有限公司 | Detergent for lithography |
| US6440856B1 (en) * | 1999-09-14 | 2002-08-27 | Jsr Corporation | Cleaning agent for semiconductor parts and method for cleaning semiconductor parts |
| JP2008058624A (en) * | 2006-08-31 | 2008-03-13 | Tokyo Ohka Kogyo Co Ltd | Photoresist stripping liquid, and substrate treatment method using the same |
| CN101339369A (en) * | 2008-08-07 | 2009-01-07 | 温州康尔达印刷器材有限公司 | PS plate retouching paste |
| WO2011008051A2 (en) * | 2009-07-17 | 2011-01-20 | 동우 화인켐 주식회사 | Composition for removing resists used with copper or copper alloy |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104714377A (en) * | 2013-12-11 | 2015-06-17 | 中国航空工业第六一八研究所 | Anticorrosion film opaque |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120111 |