CN101332548A - Halogen-free extinction welding flux - Google Patents

Halogen-free extinction welding flux Download PDF

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Publication number
CN101332548A
CN101332548A CNA2008100271116A CN200810027111A CN101332548A CN 101332548 A CN101332548 A CN 101332548A CN A2008100271116 A CNA2008100271116 A CN A2008100271116A CN 200810027111 A CN200810027111 A CN 200810027111A CN 101332548 A CN101332548 A CN 101332548A
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CN
China
Prior art keywords
soldering flux
rosin
extinction
halogen
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2008100271116A
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Chinese (zh)
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CN101332548B (en
Inventor
钟立新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU YOUNUO ELECTRONIC MATERIAL SCIENCE & TECHNOLOGY CO., LTD.
Original Assignee
DONGGUAN EUNOW ELECTRONIC WELDING MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN2008100271116A priority Critical patent/CN101332548B/en
Publication of CN101332548A publication Critical patent/CN101332548A/en
Application granted granted Critical
Publication of CN101332548B publication Critical patent/CN101332548B/en
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Abstract

The invention relates to the technical field of a soldering flux, in particular to a halogen-free extinction soldering flux. The soldering flux of the invention comprises 4.0 - 6.0% of hydrogenated rosin, 1.0 - 2.2% of butane diacid, 1.5 - 2.0% of palmitic acid, 1.5 - 2.0% of tert-butyl benzoic acid and 87.8 - 92% of isopropyl alcohol; the soldering flux takes organic acids to replace hydrochloride, which not only leads the soldering flux to meet the requirements of welding activity, but also forms an extinction film under the combined action of the macromolecular organic acids and rosin at the softening point; as the rosin can not be easily oxidized and the color of the rosin can not be easily darkened, the soldering flux can be stored for a longer time; meanwhile, as the soldering flux contains a macromolecule organic acid, namely, tert-butyl benzoic acid, the soldering flux has better property in the secondary welding and better welding quality, and can effectively reduce electromigration probability; when the electromigration is tested, the probability of impedance drop does not occur.

Description

A kind of halogen-free extinction welding flux
Technical field:
The present invention relates to the scaling powder technical field, refer in particular to a kind of halogen-free extinction welding flux.
Background technology:
Traditional extinction type scaling powder all is to cooperate with delustering agent by hydrochloride, the welding back forms a skim on solder joint, thereby reach extinction effect, the characteristics of this type of extinction welding flux are because the existence of hydrochloride wherein, can quicken the oxidation of rosin, make the appearance color of scaling powder deepen, be unfavorable for stock control, simultaneously, also increased the cost of quality control, in welding process, halide ion can remain on the circuit board, for the circuit board of silver-plated processing, exists under the voltage condition, electromigration easily takes place in the halide ion that remains on the circuit board, and the electric property of circuit board is descended.
Summary of the invention:
The objective of the invention is to provides a kind of halogen-free extinction welding flux at the deficiencies in the prior art, its slowed down oxidation of rosin, the appearance color of scaling powder is stable, and the scaling powder storage time is longer, reduce the quality control cost, and can effectively reduce the electromigratory probability of generation.
For achieving the above object, invention is achieved through the following technical solutions:
A kind of halogen-free extinction welding flux, it comprises the composition of following weight ratio,
Foral 4.0~6.0%
Succinic acid 1.0~2.2%
Palmitic acid 1.5~2.0%
P-tert-butyl benzoic acid 1.5~2.0%
Isopropyl alcohol 87.8~92%.
Beneficial effect of the present invention: scaling powder of the present invention comprises 4.0~6.0% Foral, 1.0~2.2% succinic acid, 1.5~2.0% palmitic acid, 1.5~2.0% p-tert-butyl benzoic acid and 87.8~92% isopropyl alcohol, it uses organic acid to replace hydrochloride, thereby make scaling powder both satisfy the active requirement of welding, acting in conjunction by macromolecule organic acid and softening-point rosin forms matt film again, compare with present halogen extinction type scaling powder, scaling powder of the present invention is because rosin is difficult for oxidized, the rosin color is difficult for deepening, storage time is longer, in single wave soldering connects, welding quality is identical with traditional shape extinction welding flux, in the double wave welding, owing to contain the macromolecule organic acid p-tert-butyl benzoic acid in the scaling powder, show better when secondary welding, welding quality is better, and can effectively reduce the electromigratory probability of generation, when carrying out electro-migration testing, the phenomenon that impedance descends can not appear.
The specific embodiment:
A kind of halogen-free extinction welding flux, it comprises following composition, be by weight,
Main Ingredients and Appearance content
Foral 4.0~6.0%
Succinic acid 1.0~2.2%
Palmitic acid 1.5~2.0%
P-tert-butyl benzoic acid 1.5~2.0%
Isopropyl alcohol 87.8~92%.
Following is preferred embodiment of the present invention, be by weight,
Main Ingredients and Appearance content
Foral 6.0%
Succinic acid 2.2%
Palmitic acid 2.0%
P-tert-butyl benzoic acid 2.0%
Isopropyl alcohol 87.8%.
The above only is the preferred embodiment of invention, so all equivalences of doing according to the described structure of application for a patent for invention scope, feature and principle change or modify, is included in the application for a patent for invention scope.

Claims (2)

1, a kind of halogen-free extinction welding flux is characterized in that: it comprises following composition, be by weight,
Foral 4.0~6.0%
Succinic acid 1.0~2.2%
Palmitic acid 1.5~2.0%
P-tert-butyl benzoic acid 1.5~2.0%
Isopropyl alcohol 87.8~92%.
2, a kind of halogen-free extinction welding flux according to claim 1, it is characterized in that: it comprises following composition, be by weight,
Foral 6.0%
Succinic acid 2.2%
Palmitic acid 2.0%
P-tert-butyl benzoic acid 2.0%
Isopropyl alcohol 87.8%.
CN2008100271116A 2008-03-31 2008-03-31 Halogen-free extinction welding flux Active CN101332548B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008100271116A CN101332548B (en) 2008-03-31 2008-03-31 Halogen-free extinction welding flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008100271116A CN101332548B (en) 2008-03-31 2008-03-31 Halogen-free extinction welding flux

Publications (2)

Publication Number Publication Date
CN101332548A true CN101332548A (en) 2008-12-31
CN101332548B CN101332548B (en) 2010-07-21

Family

ID=40195572

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100271116A Active CN101332548B (en) 2008-03-31 2008-03-31 Halogen-free extinction welding flux

Country Status (1)

Country Link
CN (1) CN101332548B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101829864A (en) * 2010-05-07 2010-09-15 常州大学 Delustering agent for eliminating glossy of welding spots in soldering flux
CN113249034A (en) * 2021-05-10 2021-08-13 广东风华高新科技股份有限公司 Film covering agent and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1017324B (en) * 1989-05-09 1992-07-08 化学工业部晨光化工研究院一分院 Flux assistant for tin soldering of printed circuit board
CN1042809C (en) * 1994-04-06 1999-04-07 化学工业部晨光化工研究院成都分院 Non-halogen non-rosin type low solid content non-cleaning scaling powder
JP3498427B2 (en) * 1995-06-19 2004-02-16 ソニー株式会社 Flux for molding solder
JP2003275892A (en) * 2002-03-20 2003-09-30 Tamura Kaken Co Ltd Lead-free solder alloy and solder paste composition
CN1290662C (en) * 2004-03-30 2006-12-20 深圳市唯特偶化工开发实业有限公司 Welding flux agent of solder with no lead and free from cleaning

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101829864A (en) * 2010-05-07 2010-09-15 常州大学 Delustering agent for eliminating glossy of welding spots in soldering flux
CN101829864B (en) * 2010-05-07 2013-01-16 常州大学 Delustering agent for eliminating glossy of welding spots in soldering flux
CN113249034A (en) * 2021-05-10 2021-08-13 广东风华高新科技股份有限公司 Film covering agent and application thereof

Also Published As

Publication number Publication date
CN101332548B (en) 2010-07-21

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Owner name: SUZHOU YOUNUO ELECTRONIC MATERIALS TECHNOLOGY CO.,

Free format text: FORMER OWNER: DONGGUAN YOUNUO ELECTRONIC WELDING MATERIAL CO., LTD.

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Free format text: CORRECT: ADDRESS; FROM: 523829 DONGGUAN YOUNUO ELECTRONIC WELDING MATERIAL CO., LTD., TAIGONGLING VILLAGE, DALINGSHAN TOWN, DONGGUAN CITY, GUANGDONG PROVINCE TO: 215152 NO.8, AIMIN ROAD, XIANGCHENG DISTRICT, SUZHOU CITY, JIANGSU PROVINCE

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Effective date of registration: 20100419

Address after: 215152 No. 8 Aimin Road, Suzhou, Jiangsu, Xiangcheng District

Applicant after: SUZHOU YOUNUO ELECTRONIC MATERIAL SCIENCE & TECHNOLOGY CO., LTD.

Address before: 523829 Guangdong Province, Dongguan City Dalingshan Town of Tai Gong Ling Cun Dongguan uneed electronic welding material Co. Ltd.

Applicant before: Dongguan Eunow Electronic Welding Material Co., Ltd.

C14 Grant of patent or utility model
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