CN101327575A - Grinding head - Google Patents
Grinding head Download PDFInfo
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- CN101327575A CN101327575A CNA200710112605XA CN200710112605A CN101327575A CN 101327575 A CN101327575 A CN 101327575A CN A200710112605X A CNA200710112605X A CN A200710112605XA CN 200710112605 A CN200710112605 A CN 200710112605A CN 101327575 A CN101327575 A CN 101327575A
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- ring portion
- grinding head
- grinding
- inner ring
- outer ring
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention discloses a grinding head, which is applicable to the chemical mechanical grinding technique. The grinding head comprises an inner ring part and an outer ring part. The outer ring part has an annular structure and is connected with the inner ring part. The inner ring part is integrated with the outer ring part. Moreover, a level difference exists between the surface of the outer ring part and the surface of the inner ring part, so that the surface of the outer ring part is higher than the surface of the inner ring part. The grinding head can increase the grinding rate of the edge of the grinding head without consumables in order to improve the uniformity of the grinding rate, and fixed back pressure can be applied on the grinding head in order to obtain better grinding uniformity.
Description
Technical field
The present invention is relevant for a kind of IC apparatus, particularly relevant for a kind of grinding head.
Background technology
In semiconductor process technique, the principle of cmp is to utilize the mechanical type principle of similar sharpening, cooperates suitable chemical assistant (reagent), and the profile that differs that just rises and falls of the wafer surface on the grinding pad (polishing pad) is polished.In general, chemical mechanical polishing device uses grinding head to catch wafer mostly, the front of wafer is pressed in for having on the grinding pad that grinds slurry (slurry) grinds then.In the process of cmp, because the restriction on the frame for movement, and make the pressure on the grinding head can't be comprehensively consistent, cause the grinding rate of subregion to understand too high or too low.
The known technology utilization imposes different back pressures in grinding head, just uses similar air bag (air bag) to adjust pressure in the mode of floating type back pressure, improves the inconsistent problem of grinding rate.But, stress on the easy control instability of grinding head in the mode of floating type back pressure, and cause the poor effect of pressurizeing because of air pressure.In addition, in known technology, also have by covering film carrier (carrierfilm) on the grinding head of surfacing, and in the lower position of grinding rate, for example be the edge of grinding head, a band of cushioning (tape) comes intensified pressure on film carrier.Yet the thickness of the band of cushioning on grinding head must be extremely thin, is generally 30 μ m, makes that the quality of band is wayward in the process of making.Therefore, above-mentioned two kinds of known technologies meeting is because air pressure control is unstable or because the difference of consumptive material quality bills of materials makes the effect of grinding rate uniformity improvement limited, can't reach its intended purposes.
Summary of the invention
Technical problem to be solved by this invention provides a kind of grinding head, need not use consumptive material just can promote the grinding rate at grinding head edge, to improve the uniformity of grinding rate.
The present invention proposes a kind of grinding head, be applicable to chemical mechanical milling tech (chemicalmechanical polishing, CMP).Grinding head comprises inner ring portion and outer ring portion.Outer ring portion is a circulus, and is connected in inner ring portion.The structure that inner ring portion and outer ring portion are formed in one.In addition, the surface section of having of the surface of outer ring portion and inner ring portion is poor, makes the surface of outer ring portion be higher than the surface of inner ring portion.
In one embodiment of this invention, above-mentioned section difference is between 5 μ m to 35 μ m.
In one embodiment of this invention, above-mentioned section difference is 10 μ m.
In one embodiment of this invention, above-mentioned inner ring portion is circle, and outer ring portion is a circular rings.
In one embodiment of this invention, the ratio of the width of above-mentioned radius of a circle and circular rings is between 2: 1 to 5: 1.
In one embodiment of this invention, above-mentioned radius of a circle is 3: 1 with the ratio of the width of circular rings.
In one embodiment of this invention, above-mentioned outer ring portion is adjacent to the outer rim of inner ring portion, and the face that connects of inner ring portion and outer ring portion is the vertical junction face.
In one embodiment of this invention, between inner ring portion and outer ring portion, more comprise connecting ring, inner ring portion is connected with outer ring portion.
In one embodiment of this invention, the surface of above-mentioned connecting ring is the inclined-plane.
According to such scheme, the present invention is significant with respect to the effect of prior art:
Grinding head of the present invention utilizes its surface profile section of being formed with poor, adjusts the lower phenomenon of fringe region grinding rate.Because the surface of the outer ring portion of grinding head is higher than the surface of inner ring portion, make the grinding rate of the fringe region that the rate of grinding originally is lower can obtain to promote, to improve the uniformity of grinding rate.
In addition, grinding head of the present invention does not need additionally to use consumptive material, as film carrier or band, therefore can avoid the grinding rate to be subjected to the influence that the consumptive material quality bills of materials differs.And can reduce the cost of manufacture of grinding head by reducing the use of consumptive material.
Moreover the grinding head that utilizes the present invention to have concavo-convex configuration carries out the grinding of wafer, when imposing identical back pressure in this grinding head, can form bigger pressure in the outer ring of grinding head portion.Therefore, can adjust whole grinding rate, and the uniformity of wafer surface can be promoted.
Description of drawings
Figure 1A is for according to the vertical view of the grinding head that one embodiment of the invention illustrated and along the projection relation contrast schematic diagram of I-I ' line segment profile.
Figure 1B is for according to the vertical view of the grinding head that another embodiment of the present invention illustrated and along the projection relation contrast schematic diagram of I-I ' line segment profile.
Fig. 2 is for carrying out the rate that the removes distribution map of chemical mechanical milling tech with grinding head of the present invention.
Fig. 3 is for carrying out the rate that the removes distribution map of chemical mechanical milling tech with the grinding head of known covering film carrier.
The main element symbol description
100,200 ... grinding head 102 ... inner ring portion
104 ... outer ring portion 106 ... connecting ring
106a ... surface 108 ... connect face
D ... section difference W1 ... radius
W2 ... width
The specific embodiment
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Figure 1A is for according to the vertical view of the grinding head that one embodiment of the invention illustrated and along the projection relation contrast schematic diagram of I-I ' line segment profile.
Please refer to Figure 1A, the grinding head 100 that is applicable to chemical mechanical milling tech for example is the structure of a circle.Grinding head 100 comprises inner ring portion 102 and outer ring portion 104.
In the present embodiment, inner ring portion 102 is the solid circles structure, and outer ring portion 104 is circular circulus.Outer ring portion 104 be surrounded on inner ring portion 102 around, and the outer rim of the inner edge of outer ring portion 104 and inner ring portion 102 is adjacent, makes the face that connects 108 between the two be the vertical junction face.The structure that inner ring portion 102 and outer ring portion 104 are formed in one.That is to say that from the angle grinding head of overlooking 100, the inner ring portion 102 and the outer ring portion 104 of ring-type for example are the common concentrically ringed structures that constitutes.
Please refer to Figure 1A, on the radius cross section of grinding head 100, the ratio of the width W 2 that the radius W1 of inner ring portion 102 and outer ring portion 104 are shared is in this way between 2: 1 to 5: 1.On the other hand, the thickness of outer ring portion 104 for example is the thickness greater than inner ring portion 102, and the surface of outer ring portion 104 can be higher than the surface of inner ring portion 102, and the section difference D between the two for example is between 5 μ m to 35 μ m.In one embodiment, the radius of grinding head 100 is 100mm, and the radius W1 of inner ring portion 102 is 75mm, and 2 of the width W of outer ring portion 104 circuluses are 25mm; And the section difference D between outer ring portion 104 surfaces and inner ring portion 102 surfaces is 10 μ m.
Figure 1B is for according to the vertical view of the grinding head that another embodiment of the present invention illustrated and along the projection relation contrast schematic diagram of I-I ' line segment profile.In Figure 1B, the member identical with Figure 1A then uses identical label and omits its explanation.
Please refer to Figure 1B, the present invention also proposes the grinding head 200 that another kind is applicable to chemical mechanical milling tech.The basic building block of forming grinding head 200 is roughly the same with the basic building block of forming grinding head 100, wherein main difference is: in grinding head 200, between inner ring portion 102 and outer ring portion 104, more comprise connecting ring 106, connect between inner ring portion 102 and the outer ring portion 104.Connecting ring 106 is circular circulus, and its inner rim and inner ring portion 102 adjacency, its outer rim then with outer ring portion 104 adjacency.The surperficial 106a of connecting ring 106 for example is the inclined-plane, the surface of inner ring portion 102 and the surface of outer ring portion 104 can be coupled together.What deserves to be mentioned is that the quantity of connecting ring 106 and surface structure are not limited to Figure 1B and illustrate, as long as inner ring portion 102 is connected with outer ring portion 104 and constitutes integrally formed structure, the present invention does not do special qualification in this.
Please be simultaneously with reference to Figure 1A and Figure 1B, in other words, grinding head 100 has concavo-convex configuration with grinding head 200, and above-mentioned inner ring portion 102 is recess, and outer ring portion 104 is a protuberance.Certainly, in other embodiments, the recess of grinding head 100 and grinding head 200 is not limited to above-mentioned inner ring portion 102 and outer ring portion 104 with the configuration of protuberance, has in this field to know that usually visual its demand of the knowledgeable adjusts.
Hold above-mentioned, the structure that the structure of inner ring portion 102 and outer ring portion 104 is formed in one.Therefore, grinding head 100 is to have on the rigid body material (not illustrating) of flat surface with the formation method of grinding head 200, for example be plane lapping head body, keep the lower marginal position of grinding rate performance, remove part rigid body material in the higher inner ring position of grinding rate as inner ring portion 102.The method that removes the rigid body material for example is to grind by cutting or the mode down-cutting of grinding, and makes the inner ring portion 102 and outer ring portion 104 that form the section of having difference D on the rigid body material.Section difference D utilizes the degree of depth of control down-cutting or grinding to adjust.Certainly, the radius W1 of inner ring portion 102 and section difference D can be via using grinding head 100 and grinding head 200 to carry out follow-up chemical mechanical milling tech, and the material surface profile that grinds is out revised, to obtain optimized condition.In addition, remove the formation position of the inner ring portion 102 that the position of rigid body material partly is not limited in the present embodiment to be illustrated, the zone that removes part rigid body material can need the zone of adjustment for any grinding rate is higher, has in this field and knows that usually the knowledgeable works as visual its demand and adjusts.
What specify is that in grinding head 100 and grinding head 200, the outer ring portion 104 with high surfaces is disposed at the lower zone of grinding rate in the known plane lapping head.And use above-mentioned grinding head 100 or grinding head 200 to carry out chemical mechanical milling tech, and be with grinding head 100 or grinding head 200 wafer (not illustrating) to be fixed on the grinding pad (not illustrating) earlier, wherein for example be to be covered with to grind slurry on the grinding pad.Afterwards, imposing fixedly back pressure utilizes relatively moving of grinding pad and wafer to carry out grinding steps in grinding head 100 or grinding head 200 again.Because grinding head 100 has concavo-convex configuration with grinding head 200, even, still can provide wafer different pressure with the difference of grinding head 200 surface profiles by grinding head 100 applying under the situation of fixing back pressure.Furthermore, the outer ring portion 104 of formation protuberance can provide big pressure in wafer.Therefore, when carrying out grinding steps, can make the grinding head 100 and the grinding rate at grinding head 200 edges obtain to promote, grind uniformity and improve.
For confirming that grinding head of the present invention truly has its effect, below the effect that grinding head of the present invention is reached when being applied to chemical mechanical milling tech is described especially exemplified by an experimental example.
Experimental example
Fig. 2 is the rate that the removes distribution map that carries out chemical mechanical milling tech with grinding head of the present invention (grinding head 100 shown in Figure 1A).
Please refer to Fig. 2, when using grinding head of the present invention to carry out chemical mechanical milling tech, is that wafer is fixed on the grinding head of the present invention, applies fixing back pressure again in grinding head, and wafer is depressed on the grinding pad to carry out grinding steps.From the result of Fig. 2, show, can promote effectively really away from the rate that removes of the edge part in the center of circle, and the uniformity of integral grinding rate also be improved (the grinding uniformity is 500A/min).Moreover four secondary data that illustrate respectively among Fig. 2 distribute very consistent, show that grinding head of the present invention can also make the grinding rate that continual and steady performance is arranged.
Comparative example
Fig. 3 is the rate that the removes distribution map that carries out chemical mechanical milling tech with the grinding head of known covering film carrier.
Comparative example is similar to the method that experimental example carries out cmp, and unique difference is only in employed grinding head difference.Please refer to Fig. 3, when using the grinding head that only covers film carrier to carry out cmp, the surface can cause the rate that removes of subregion too high or too low for the grinding head on plane, and especially the edge part away from the center of circle can remove the problem that rate obviously reduces, and causes uniformity not good.
Shown by above practical test result: grinding head of the present invention not only can promote the grinding rate at edge, can also improve the uniformity of grinding rate and make the stable performance of grinding rate.
In sum, the present invention forms recess in the inner ring portion of grinding head, make and be positioned at grinding head outer ring portion as protuberance, bestow again grinding head fixedly back pressure carry out chemical mechanical milling tech, can make of the change of the lower edge of the rate of grinding originally by the concavo-convex configuration build-up of pressure of grinding head, and outer ring portion grinding rate is increased, thereby can obtain preferable uniformity.
On the other hand,, and do not need additionally to use consumptive materials such as film carrier or band, can avoid the quality bills of materials of consumptive material to cause grinding rate instability because grinding head of the present invention adopts fixed rigid structure.In addition, the integrated structure of this kind is the optimization of technological parameter and safeguards all more or less freelyly, and can obtain bigger process margin (process window).
Moreover the present invention gets final product adjustment member zone grinding rate by changing the simple means of grinding head surface profile, reaches preferable inhomogeneity purpose, and does not need additionally to use consumptive material, can help to save the technology cost.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the scope that claims define.
Claims (9)
1. a grinding head is applicable to a chemical mechanical milling tech, it is characterized in that, comprising:
One inner ring portion; And
One outer ring portion, this outer ring portion is a circulus, is connected in this inner ring portion, and this inner ring portion and this outer ring portion are formed in one, and wherein the surface of the surface of this outer ring portion and this inner ring portion has one section difference, makes the surface of this outer ring portion be higher than the surface of this inner ring portion.
2. grinding head as claimed in claim 1 is characterized in that, this section difference is between 5 μ m to 35 μ m.
3. grinding head as claimed in claim 2 is characterized in that, this section difference is 10 μ m.
4. grinding head as claimed in claim 1 is characterized in that, this inner ring portion is a circle, and this outer ring portion is a circular rings.
5. grinding head as claimed in claim 4 is characterized in that, the ratio of the width of this radius of a circle and this circular rings is between 2: 1 to 5: 1.
6. grinding head as claimed in claim 5 is characterized in that, this radius of a circle is 3: 1 with the ratio of the width of this circular rings.
7. grinding head as claimed in claim 1 is characterized in that this outer ring portion is adjacent to the outer rim of this inner ring portion, and the face that connects of this inner ring portion and this outer ring portion is the vertical junction face.
8. grinding head as claimed in claim 1 is characterized in that, more comprises a connecting ring between this inner ring portion and this outer ring portion, and this inner ring portion is connected with this outer ring portion.
9. grinding head as claimed in claim 8 is characterized in that, the surface of this connecting ring is the inclined-plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710112605XA CN101327575A (en) | 2007-06-22 | 2007-06-22 | Grinding head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710112605XA CN101327575A (en) | 2007-06-22 | 2007-06-22 | Grinding head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101327575A true CN101327575A (en) | 2008-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200710112605XA Pending CN101327575A (en) | 2007-06-22 | 2007-06-22 | Grinding head |
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| CN (1) | CN101327575A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103909465A (en) * | 2014-04-02 | 2014-07-09 | 天通控股股份有限公司 | Method for grinding and polishing large-size sapphire substrate slice |
| CN108816450A (en) * | 2018-07-09 | 2018-11-16 | 马鞍山纽泽科技服务有限公司 | A kind of material ball-milling device |
| CN109531404A (en) * | 2018-11-30 | 2019-03-29 | 上海华力微电子有限公司 | A kind of grinding system and grinding method for chemical mechanical grinding |
-
2007
- 2007-06-22 CN CNA200710112605XA patent/CN101327575A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103909465A (en) * | 2014-04-02 | 2014-07-09 | 天通控股股份有限公司 | Method for grinding and polishing large-size sapphire substrate slice |
| CN103909465B (en) * | 2014-04-02 | 2016-05-11 | 天通控股股份有限公司 | A kind of method of large-size sapphire substrate slice grinding and polishing |
| CN108816450A (en) * | 2018-07-09 | 2018-11-16 | 马鞍山纽泽科技服务有限公司 | A kind of material ball-milling device |
| CN109531404A (en) * | 2018-11-30 | 2019-03-29 | 上海华力微电子有限公司 | A kind of grinding system and grinding method for chemical mechanical grinding |
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Open date: 20081224 |