CN101325185A - Heat pipe radiator and method of processing the same - Google Patents
Heat pipe radiator and method of processing the same Download PDFInfo
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- CN101325185A CN101325185A CNA2008100319191A CN200810031919A CN101325185A CN 101325185 A CN101325185 A CN 101325185A CN A2008100319191 A CNA2008100319191 A CN A2008100319191A CN 200810031919 A CN200810031919 A CN 200810031919A CN 101325185 A CN101325185 A CN 101325185A
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- pipe
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat pipe heat radiator, which comprises a substrate, a current-conducting plate and a heat pipe fixed on the substrate for installing a semiconductor component, and a heat radiating fin fixed on the substrate. The heat pipe heat radiator is characterized in that the substrate and the heat pipe are made from a same metal material such as copper. A processing method of the heat pipe heat radiator comprises the steps of collecting the substrate and the heat pipe made from the same metal material, extrusion forming the substrate with a heat pipe installation hole, soldering the substrate and the current-conducting plate of the semiconductor component together, inserting the heat pipe into the installation hole of the substrate in a close fitting way, jointing the heat pipe and the substrate by soldering, and pressure assembling the heat radiating fin on the heat pipe. The inventive heat pipe heat radiator has the advantages of low thermal resistance, stable performance, long service life (the same as that of a locomotive), etc.
Description
Technical field
The invention belongs to heat-pipe radiator, particularly a kind of heat-pipe radiator and processing method thereof that is used for rectifying device on electric locomotive, the diesel locomotive.
Background technology
Heat-pipe radiator is used in the rectifying device on electric locomotive, diesel locomotive, there have been nearly ten years, existing radiator is to adopt aluminum substrate and the close interference fit of copper heat pipe that has fin on manufacturing process, and the substrate of radiator is crimped on respectively on the anode and cathode copper conductive plate on the semiconductor element and forms semiconductor subassembly.The conductive plate of semiconductor element flows through the conducting electric current of element during work, and the power heating of generation finally rejects heat in the air to fin by several bed boundarys.Owing to there is the contact-making surface of several different metal materials in semiconductor subassembly, they can produce electrical erosion and the too big problem of contact heat resistance in long-term contact conduction, and each interface all can produce additional contact heat resistance and resistance.Under Aluminum matter substrate and the copper heat pipe mated condition, it is very big to produce additional contact heat resistance and resistance, (below the 2500kw) can manage it in middle power dissipation, when big volume element needed high-power heat radiation consume (more than the 4000kw), additional contact heat resistance ratio arrived the unacceptable degree of total heat resistance greatly.Another problem is, the hole that copper pipe is installed on the substrate all is to bore by hand to obtain, and it is many that this mode machining hole expends man-hour, the quality instability.
Summary of the invention
The object of the present invention is to provide that a kind of thermal resistance is little, stable performance, long heat-pipe radiator and processing method thereof of life-span.
The objective of the invention is to be achieved through the following technical solutions:
Heat-pipe radiator comprises a substrate, is fixed with the conductive plate and the heat pipe that are used to install semiconductor element on the substrate, is fixed with fin on the heat pipe, it is characterized in that described substrate and heat pipe adopt metal material of the same race.
Described substrate and heat pipe adopt copper material, and heat pipe adopts silver-colored soldering to connect and is fixed on the substrate.
The processing method of heat-pipe radiator of the present invention is:
Adopt the substrate and the heat pipe of metal material of the same race, the substrate that contains the heat pipe installing hole adopts the mould extrusion molding, conductive plate with substrate and semiconductor element is combined into one earlier, again heat pipe is inserted to form in the installing hole of substrate and closely cooperate, adopt welding between heat pipe and the substrate, on heat pipe, assemble fin.
Described substrate and heat pipe adopt copper material, adopt silver-colored soldering to connect between heat pipe and the substrate.
The conductive plate of described substrate and semiconductor element is connected into one with brazing.
Not being both of the heat-pipe radiator that uses on heat-pipe radiator of the present invention and the existing locomotive: substrate and heat pipe adopt metal material of the same race, as forming by copper heat pipe (utilizing the latent heat of the gas, liquid attitude variation of liquid to conduct heat), copper substrate and fin, the copper conductive plate of copper substrate and semiconductor element is integrally welded, and copper base adopts the mould extrusion molding.Be characterized in: the substrate and the radiating tube that adopt same material, welding forms the good welds face easily, can reduce the contact heat resistance of contact-making surface, and substrate adopts the copper conductive plate identical materials with semiconductor element, both can save copper material, and can make contact heat resistance reach minimum again.Heat-pipe radiator of the present invention has avoided copper heat pipe Yu Aluminum matter substrate in the existing radiator to contact electrical erosion problem in the conduction for a long time, increase the service life, reliability and capacity (more than the 4300W) have been improved, contact heat resistance and entire thermal resistance (0.013 ℃/w is following) have been reduced, and mould extruding shape material can be economized on the man-hour of material and hand drill, improves working (machining) efficiency and quality.
In a word, this heat-pipe radiator have that thermal resistance is little, stable performance, long advantages such as (identical life-spans) of life-span with locomotive.Convertor assembly with the assembling of the big element coupling of 3-5 inch, after replacing the device in the existing electric locomotive, not only have with now draft type is identical, more excellent performance is stablized, save material, good characteristics that the life-span is long, and because the capacity of radiator improves the actual output increase that causes element, each rectification brachium pontis is only used discrete component, the cancellation parallel branch has been simplified device, has improved reliability of operation.This novel heat pipe radiator is suitable on the convertor assembly of electric locomotive, various motor train unit, diesel locomotive and vehicles such as SS6, SS7, SS9G, is a kind of product of update, has practicality and application prospect widely.
The invention will be further described below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the schematic diagram of heat-pipe radiator of the present invention.
The vertical view of Fig. 2 Fig. 1.
Fig. 3 is the schematic diagram of substrate in the heat-pipe radiator of the present invention.
Embodiment
See Fig. 1 Fig. 2 and Fig. 3, heat-pipe radiator comprises copper substrate 2, is fixed with the copper conductive plate 1 that is used to install semiconductor element on two surfaces of substrate 2, is fixed with copper heat pipe 3 in the installing hole 5 of substrate 2, be fixed with fin 4 on the heat pipe 3, heat pipe 3 adopts silver-colored soldering to connect and is fixed on the substrate 2.
The processing method of heat-pipe radiator: adopt copper substrate 2 and heat pipe 3, substrate 2 adopts the mould extrusion molding, substrate 2 forms six heat pipe installing holes 5, copper conductive plate 1 usefulness brazing with substrate 2 and semiconductor element earlier is connected into one, form in the installing hole 5 with heat pipe 3 insertion substrates 2 again and closely cooperate, adopt silver-colored soldering to connect between heat pipe 3 and the substrate 2, on heat pipe 3, press-fit fin 4.
Claims (5)
1, a kind of heat-pipe radiator comprises a substrate, is fixed with the conductive plate and the heat pipe that are used to install semiconductor element on the substrate, is fixed with fin on the heat pipe, it is characterized in that described substrate and heat pipe adopt metal material of the same race.
2, heat-pipe radiator according to claim 1 is characterized in that described substrate and heat pipe adopt copper material, and heat pipe adopts silver-colored soldering to connect and is fixed on the substrate.
3, a kind of processing method of heat-pipe radiator, it is characterized in that adopting the substrate and the heat pipe of metal material of the same race, the substrate that contains the heat pipe installing hole adopts the mould extrusion molding, conductive plate with substrate and semiconductor element is combined into one earlier, again heat pipe is inserted to form in the installing hole of substrate and closely cooperate, adopt welding between heat pipe and the substrate, on heat pipe, assemble fin.
4, the processing method of heat-pipe radiator according to claim 3 is characterized in that described substrate and heat pipe adopt copper material, adopts silver-colored soldering to connect between heat pipe and the substrate.
5,, it is characterized in that the conductive plate of described substrate and semiconductor element is connected into one with brazing according to the processing method of claim 3 or 4 described heat-pipe radiators.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100319191A CN101325185A (en) | 2008-07-29 | 2008-07-29 | Heat pipe radiator and method of processing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100319191A CN101325185A (en) | 2008-07-29 | 2008-07-29 | Heat pipe radiator and method of processing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101325185A true CN101325185A (en) | 2008-12-17 |
Family
ID=40188633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100319191A Pending CN101325185A (en) | 2008-07-29 | 2008-07-29 | Heat pipe radiator and method of processing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101325185A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103846638A (en) * | 2012-11-30 | 2014-06-11 | Lg电子株式会社 | Heat exchanger and method of manufacturing the same |
| CN105716457A (en) * | 2016-02-16 | 2016-06-29 | 江西理工大学 | Automatic filling and sealing device for solder paste |
| US9566672B2 (en) | 2012-12-10 | 2017-02-14 | Lg Electronics Inc. | Method of manufacturing a heat exchanger |
-
2008
- 2008-07-29 CN CNA2008100319191A patent/CN101325185A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103846638A (en) * | 2012-11-30 | 2014-06-11 | Lg电子株式会社 | Heat exchanger and method of manufacturing the same |
| US9566672B2 (en) | 2012-12-10 | 2017-02-14 | Lg Electronics Inc. | Method of manufacturing a heat exchanger |
| CN105716457A (en) * | 2016-02-16 | 2016-06-29 | 江西理工大学 | Automatic filling and sealing device for solder paste |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20081217 |