CN201260291Y - Heat pipe radiator - Google Patents
Heat pipe radiator Download PDFInfo
- Publication number
- CN201260291Y CN201260291Y CNU2008201586335U CN200820158633U CN201260291Y CN 201260291 Y CN201260291 Y CN 201260291Y CN U2008201586335 U CNU2008201586335 U CN U2008201586335U CN 200820158633 U CN200820158633 U CN 200820158633U CN 201260291 Y CN201260291 Y CN 201260291Y
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- CN
- China
- Prior art keywords
- heat
- heat pipe
- substrate
- radiator
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat pipe radiator. The radiator comprises a metal base plate containing an installing hole, a heat pipe of the same metal is fixed in the installing hole on the base plate, a conductive plate for installing a semiconductor element is welded on the surface of the base plate by copper, and a radiating rib is fixed on the heat pipe. The heat pipe radiator has the advantages of small thermal resistance, stable performance, long service life (the same as the service life of a locomotive), and the like.
Description
Technical field
The utility model belongs to heat-pipe radiator, particularly a kind of heat-pipe radiator that is used for rectifying device on electric locomotive, the diesel locomotive.
Background technology
Heat-pipe radiator is used in the rectifying device on electric locomotive, diesel locomotive, there have been nearly ten years, existing radiator is to adopt aluminum substrate and the close interference fit of copper heat pipe that has fin on manufacturing process, and the substrate of radiator is crimped on respectively on the anode and cathode copper conductive plate on the semiconductor element and forms semiconductor subassembly.The conductive plate of semiconductor element flows through the conducting electric current of element during work, and the power heating of generation finally rejects heat in the air to fin by several bed boundarys.Owing to there is the contact-making surface of several different metal materials in semiconductor subassembly, they can produce electrical erosion and the too big problem of contact heat resistance in long-term contact conduction, and each interface all can produce additional contact heat resistance and resistance.Under Aluminum matter substrate and the copper heat pipe mated condition, it is very big to produce additional contact heat resistance and resistance, (below the 2500kw) can manage it in middle power dissipation, when big volume element needed high-power heat radiation consume (more than the 4000kw), additional contact heat resistance ratio arrived the unacceptable degree of total heat resistance greatly.Another problem is, the hole that copper pipe is installed on the substrate all is to bore by hand to obtain, and it is many that this mode machining hole expends man-hour, the quality instability.
The utility model content
The purpose of this utility model is to provide that a kind of thermal resistance is little, stable performance, long heat-pipe radiator of life-span.
The purpose of this utility model is achieved through the following technical solutions:
Heat-pipe radiator comprises that one contains the metal substrate of installing hole, and the installing hole internal fixation on substrate has the heat pipe of same metal, and the surface of substrate is connected to the conductive plate that is used to install semiconductor element with brazing, is fixed with fin on the heat pipe.
Described substrate and heat pipe adopt copper material, and heat pipe adopts silver-colored soldering to be connected on the substrate.
Not being both of the heat-pipe radiator that uses on heat-pipe radiator of the present utility model and the existing locomotive: substrate and heat pipe adopt metal material of the same race, as forming by copper heat pipe (utilizing the latent heat of the gas, liquid attitude variation of liquid to conduct heat), copper substrate and fin, the copper conductive plate of copper substrate and semiconductor element is integrally welded, and copper base adopts the mould extrusion molding.Be characterized in: the substrate and the radiating tube that adopt same material, welding forms the good welds face easily, can reduce the contact heat resistance of contact-making surface, and substrate adopts the copper conductive plate identical materials with semiconductor element, both can save copper material, and can make contact heat resistance reach minimum again.Heat-pipe radiator of the present utility model has avoided copper heat pipe Yu Aluminum matter substrate in the existing radiator to contact electrical erosion problem in the conduction for a long time, increase the service life, reliability and capacity (more than the 4300W) have been improved, contact heat resistance and entire thermal resistance (0.013 ℃/w is following) have been reduced, and adopt the substrate that the mould extrusion molding contains installing hole to replace hand drill, material and man-hour be can economize on, working (machining) efficiency and quality improved.
In a word, this heat-pipe radiator have that thermal resistance is little, stable performance, long advantages such as (identical life-spans) of life-span with locomotive.Convertor assembly with the assembling of 3-5 inches big element couplings, after replacing the device in the existing electric locomotive, not only have with now draft type is identical, more excellent performance is stablized, save material, good characteristics that the life-span is long, and because the capacity of radiator improves the actual output increase that causes element, each rectification brachium pontis is only used discrete component, the cancellation parallel branch has been simplified device, has improved reliability of operation.This novel heat pipe radiator is suitable on the convertor assembly of electric locomotive, various motor train unit, diesel locomotive and vehicles such as SS6, SS7, SS9G, is a kind of product of update, has practicality and application prospect widely.
The utility model is described in further detail below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the schematic diagram of the utility model heat-pipe radiator.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the schematic diagram of substrate in the utility model heat-pipe radiator.
Embodiment
See Fig. 1, Fig. 2 and Fig. 3, heat-pipe radiator comprises the copper substrate 2 that adopts the mould extrusion molding to contain installing hole, be connected to the copper conductive plate 1 that is used to install semiconductor element with brazing on two surfaces of substrate 2, fixing and be connected to copper heat pipe 3 in the installing hole 5 of substrate 2 with silver-colored soldering, be fixed with fin 4 on the heat pipe 3.
Claims (2)
1, a kind of heat-pipe radiator is characterized in that comprising that one contains the metal substrate of installing hole, and the installing hole internal fixation on substrate has the heat pipe of same metal, and the surface of substrate is connected to the conductive plate that is used to install semiconductor element with brazing, is fixed with fin on the heat pipe.
2, heat-pipe radiator according to claim 1 is characterized in that described substrate and heat pipe adopt copper material, and heat pipe adopts silver-colored soldering to be connected on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201586335U CN201260291Y (en) | 2008-09-28 | 2008-09-28 | Heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201586335U CN201260291Y (en) | 2008-09-28 | 2008-09-28 | Heat pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201260291Y true CN201260291Y (en) | 2009-06-17 |
Family
ID=40774530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201586335U Expired - Fee Related CN201260291Y (en) | 2008-09-28 | 2008-09-28 | Heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201260291Y (en) |
-
2008
- 2008-09-28 CN CNU2008201586335U patent/CN201260291Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090617 Termination date: 20170928 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |