CN217004301U - Heat-conducting and radiating module of automobile LED headlamp body - Google Patents

Abstract

The utility model provides a heat conduction and dissipation module of an automobile LED headlamp body, which comprises a lamp post, wherein a chuck is movably arranged at the top of the lamp post, the chuck is a medium boundary of the module arranged in an automobile headlamp assembly and plays a role in fixing, a substrate component is inserted and arranged at the top of the lamp post, a fin radiator is welded at the tail end of the lamp post, the tightness of the lamp post and the fin radiator is increased through upper tin reflow soldering or fiber soldering, a better heat conduction effect is achieved, the air flow of the fin radiator is larger through the effect of increasing the downward air pressure by a middle cover and the effect of fixing wires, the taken heat is more, the speed is higher, compared with the prior art, the problems that the heat conduction and the heat dissipation of the existing automobile headlamp body structure are insufficient, the high lighting effect and the low light attenuation cannot be really achieved are solved, the increase of the heat conduction area, the heat conduction speed is increased, the combination density is increased, and the heat dissipation area is increased, and the integrated combination design of the heat dissipation speed is increased.

Description

Heat-conducting and radiating module of automobile LED headlamp body

Technical Field

The utility model relates to the field of heat conduction and heat dissipation structures of fins, in particular to a heat conduction and dissipation module of an automobile LED headlamp body.

Background

The automobile LED headlamp is one of indispensable components of an automobile, and due to the structural particularity of the automobile LED headlamp, a large amount of heat is generated during use of the automobile LED headlamp, and the lamp beads (luminous bodies) of the automobile LED headlamp are invalid or damaged due to long-term accumulation of the heat, so that the automobile LED headlamp is required to be provided with a radiator;

the single substrate is matched with the extruded alloy aluminum profile to be used as a heat conduction and dissipation structure in the market at present, the structure has the defects of low heat conduction speed, poor heat dissipation effect and incapability of using overhigh power, the area of the single substrate which can be used for heat conduction after a thermoelectric separation process is small, the extruded aluminum profile is made of 6063 aluminum material, and the heat conduction coefficient is not high.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a heat conduction and dissipation module of an automobile LED headlamp body, which is used for solving the problems in the background art.

In order to achieve the purpose, the utility model is realized by the following technical scheme: automobile LED headlamp lamp body leads thermal module, including the lamp pole, lamp pole top movable mounting has the chuck, lamp pole top grafting is installed and is base plate subassembly, base plate subassembly passes through last heat conduction silicone grease with rivet locking or go up tin and crosses the compactness that the reflow soldering increased between the base plate, reaches better heat conduction effect, the tail end welding of lamp pole has the fin radiator, crosses the compactness that reflow soldering or fine welding increased lamp pole and fin radiator through last tin, reaches better heat conduction effect, radiator unit is installed to fin radiator bottom, radiator unit installs the keysets with the junction of fin radiator, radiator unit outside wire installs the electric wire.

Furthermore, the base plate subassembly includes wired circuit base plate, wired circuit base plate both sides are equipped with two wireless circuit base plates, and wireless circuit base plate and wired circuit base plate pass through last heat conduction silicone grease with rivet locking or go up tin and cross the reflow soldering and come the laminating, three jack has been seted up to same position on wired circuit base plate and the wireless circuit base plate surface, and the jack internal toothing is pegged graft and is had the rivet.

Furthermore, a socket is formed in the top of the lamp post, and the connecting end at the bottom of the wired circuit substrate is inserted into the socket of the lamp post.

Furthermore, two rubber rings are arranged at the joint of the lamp pole and the chuck, and the rubber rings are sleeved at the installation positions of the lamp pole and the chuck in an extruding mode.

Furthermore, the heat dissipation assembly comprises a middle cover, the top of the middle cover is riveted to the bottom of the fin radiator, the fan is rotatably installed inside the middle cover, the bottom of the middle cover is clamped and assembled with a rear cover, and the output end of the fan is fixedly connected with the adapter plate.

Furthermore, the surfaces of the middle cover and the rear cover are provided with hollowed-out notches.

The utility model has the beneficial effects that: the utility model discloses a heat conduction and dissipation module of an automobile LED headlamp body, which comprises a chuck; a substrate assembly; a circuit substrate; a wireless circuit board; riveting; a rubber ring; a lamp post; a finned heat sink; an adapter plate; a heat dissipating component; a middle cover; a fan; and (7) a rear cover.

1. The heat conduction and dissipation module of the automobile LED headlamp body is respectively attached to the wired circuit substrates through the two wireless circuit substrates to increase the heat conduction area and the thickness of the heat conduction material so as to increase the heat conduction speed.

2. The heat conduction and dissipation module of the automobile LED headlamp body increases the tightness between the substrates by locking the heat conduction silicone grease with rivets or soldering through reflow soldering, so that a better heat conduction effect is achieved.

3. The lamp post of the heat conduction and dissipation module of the automobile LED headlamp body and the fin radiator are combined through a tin spraying process and then through reflow soldering or fiber soldering, so that the combination is tight, and the heat conduction effect is better.

4. This car LED head-light lamp body leads heat dissipation module increases the effect of pushing down the amount of wind through the well lid, makes fin radiator air current bigger, and the heat of taking away is more, and speed is faster.

5. Compared with the prior art, the heat conduction and dissipation module for the automobile LED headlamp body solves the problems that the heat conduction and the heat dissipation of the existing automobile headlamp body structure are insufficient, and the high light efficiency and the low light attenuation cannot be really achieved, so that the heat conduction area is increased, the heat conduction speed is increased, the combination density is increased, the heat dissipation area is increased, and the integrated combination design of the heat dissipation speed is increased.

Drawings

FIG. 1 is a schematic view of an overall front structure of a heat conducting and dissipating module of an automotive LED headlamp body according to the present invention;

FIG. 2 is an exploded view of the heat dissipation module of the LED headlamp body of the automobile;

FIG. 3 is a schematic view of a heat dissipation assembly of the heat dissipation module of the LED headlamp body of the automobile of the present invention;

FIG. 4 is a schematic structural diagram of a substrate assembly of the heat dissipation module of the LED headlamp body of the automobile of the present invention;

in the figure: 1. a chuck; 2. a substrate assembly; 21. a circuit substrate; 22. a wireless circuit board; 23. riveting; 3. a rubber ring; 4. a lamp post; 5. a finned heat sink; 6. an adapter plate; 7. a heat dissipating component; 71. a middle cover; 72. a fan; 73. a rear cover; 8. a conductive wire.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further explained by combining the specific embodiments.

Referring to fig. 1 to 4, the present invention provides a technical solution: the automobile LED headlamp body heat conduction and dissipation module comprises a lamp post 4, a chuck 1 is movably mounted at the top of the lamp post 4, a substrate component 2 is installed at the top of the lamp post 4 in an inserted manner, a fin radiator 5 is welded at the tail end of the lamp post 4, a heat dissipation component 7 is installed at the bottom of the fin radiator 5, an adapter plate 6 is installed at the joint of the heat dissipation component 7 and the fin radiator 5, two rubber rings 3 are arranged at the joint of the lamp post 4 and the chuck 1, the rubber rings 3 are extruded and sleeved at the installation positions of the lamp post 4 and the chuck 1 (the lamp post 4 and the chuck 1 are fixedly sleeved through the rubber rings 3), a conductive wire 8 is installed on an electric wire at the outer side of the heat dissipation component 7, the conductive wire 8 is connected with a circuit of a vehicle to supply power for the heat dissipation component 7, the substrate component 2 is firstly attached by rivet locking or soldering reflow soldering through the conductive silicone grease, and the tightness between the substrates is increased, reach better heat conduction effect, assemble lamp pole 4 in proper order again, lamp pole 4 and fin radiator 5 combine with reflow soldering or fine solder through the tin spraying technology earlier again, it is inseparable to make it combine, the heat conduction effect is better, the module that combines good with base plate subassembly 2 and lamp pole 4 and fin radiator 5 again assembles through riveting or add tin reflow soldering or add tin vacuum welding, realize increasing heat conduction area, increase heat conduction speed, increase bonding density, increase heat dissipation area, increase radiating rate, install radiating component 7 in fin radiator 5 bottom.

In this embodiment, the substrate assembly 2 includes a wired circuit substrate 21, two wireless circuit substrates 22 are disposed on two sides of the wired circuit substrate 21, the wireless circuit substrates 22 and the wired circuit substrate 21 are bonded by applying heat-conductive silicone grease and locking with rivets 23 or soldering and reflow soldering, three insertion holes are disposed at the same positions on the surfaces of the wired circuit substrate 21 and the wireless circuit substrate 22, and the rivets 23 are engaged and inserted into the insertion holes, the top of the lamp post 4 is provided with an insertion hole, a single substrate or two substrates are used as a thermoelectric separation process wiring circuit (wired circuit substrate 21), and then two wireless circuit substrates 22 (without thermoelectric separation process) are respectively bonded to the wired circuit substrate 21 to increase the heat-conducting area and the thickness of the heat-conducting material to increase the heat-conducting speed (the substrates are bonded by reflow soldering, vacuum soldering or silicone grease), and the rivets 23 are used to lock to increase the tightness between the substrates, thereby achieving a better heat-conducting effect, and (3) the assembled substrate assembly 2 is arranged in the assembled combination of the lamp post 4 and the finned radiator 5 through riveting, tin reflow soldering or tin vacuum soldering.

This embodiment, radiator unit 7 includes well lid 71, well lid 71 top riveting is in fin radiator 5 bottom, well lid 71 internally mounted has fan 72, and well lid 71 bottom joint equipment has back lid 73, fan 72 output and keysets 6 fixed connection, well lid 71 and back lid 73 have seted up the fretwork breach on the surface, and inside fan 72 rotated to enter into fin radiator 5 with the fretwork breach of air permeation well lid 71 and back lid 73, well lid 71 was the fan 72 support, has the effect that increases the volume of pushing down the air, makes fin radiator 5's air flow bigger, and the heat of taking away is more, and the speed is faster.

When the device is used, the substrate component 2 and the lamp post 4 are assembled in sequence, the two wireless circuit substrates 22 are respectively attached to the wired circuit substrate 21 to increase the heat conduction area and the thickness of the heat conduction material to increase the heat conduction speed, the rivets 23 are used for locking to increase the tightness between the substrates, a better heat conduction effect is achieved, the assembled substrate component 2 is arranged in the assembled combination of the lamp post 4 and the fin radiator 5 through riveting or tin-adding reflow soldering or tin-adding vacuum soldering, the lamp post 4 and the fin radiator 5 are combined through a tin spraying process and then through reflow soldering or fiber soldering, the combination is tight, the heat conduction effect is better, and the heat dissipation component 7 is arranged at the bottom of the fin radiator 5.

While there have been shown and described what are at present considered to be the basic principles and essential features of the utility model and advantages thereof, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (6)

1. Automobile LED head-light lamp body leads heat dissipation module, including lamp pole (4), its characterized in that: lamp pole (4) top movable mounting has chuck (1), lamp pole (4) top is pegged graft and is installed base plate subassembly (2), the tail end welding of lamp pole (4) has fin radiator (5), radiator unit (7) are installed to fin radiator (5) bottom, adapter plate (6) are installed with the junction of fin radiator (5) in radiator unit (7), conductive wire rod (8) are installed to radiator unit (7) outside electric wire.

2. The LED headlamp body heat dissipation module of claim 1, wherein: the base plate assembly (2) comprises a wired circuit base plate (21), two wireless circuit base plates (22) are arranged on two sides of the wired circuit base plate (21), the wireless circuit base plates (22) are extruded and bonded or tinned and bonded with the wired circuit base plate (21), three jacks are formed in the same positions on the surfaces of the wired circuit base plate (21) and the wireless circuit base plate (22), and rivets (23) are meshed and inserted in the jacks.

3. The LED headlamp body heat dissipation module of claim 2, wherein: the socket is opened at the top of the lamp pole (4), and the connecting end at the bottom of the circuit substrate (21) is inserted into the socket of the lamp pole (4).

4. The LED headlamp body heat dissipation module of claim 1, wherein: the lamp pole (4) is provided with two rubber rings (3) with the junction of chuck (1), and rubber ring (3) extrusion cup joints lamp pole (4) and chuck (1) mounted position.

5. The LED headlamp body heat dissipation module of claim 1, wherein: the heat dissipation assembly (7) comprises a middle cover (71), the top of the middle cover (71) is riveted to the bottom of the fin radiator (5), a fan (72) is installed inside the middle cover (71) in a rotating mode, the bottom of the middle cover (71) is clamped and assembled to form a rear cover (73), and the output end of the fan (72) is fixedly connected with the adapter plate (6).

6. The LED headlamp lamp body heat conduction and dissipation module of claim 5, wherein: hollow notches are formed in the surfaces of the middle cover (71) and the rear cover (73).

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