CN101325163A - Memory card and manufacturing method thereof - Google Patents
Memory card and manufacturing method thereof Download PDFInfo
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- CN101325163A CN101325163A CNA2007101089898A CN200710108989A CN101325163A CN 101325163 A CN101325163 A CN 101325163A CN A2007101089898 A CNA2007101089898 A CN A2007101089898A CN 200710108989 A CN200710108989 A CN 200710108989A CN 101325163 A CN101325163 A CN 101325163A
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- Prior art keywords
- circuit board
- memory card
- board unit
- chip
- film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses a memory card and a manufacturing method thereof. The method comprises the steps of: arranging at least one chip on a circuit board unit with a predetermined shape of the memory card and electronically connecting the chip with the circuit board; coating a film on the surface of the circuit board unit, which is not provided with and connected with the chip; covering the circuit board unit and the film with a mold to form a mold cavity with the same shape as but larger size than the circuit board unit; and filling a package material into the mold cavity to form a package rubber matrix for covering the outer sides of the chip and the circuit board unit, so as to obtain the memory card with the predetermined shape. The inventive manufacturing method does not need the subsequent shape cutting operation by using a water jet or laser, which is required in the prior art, so as to reduce manufacturing cost and improve process yield.
Description
Technical field
The present invention relates to a kind of semiconductor packaging, particularly relate to a kind of memory card and method for making thereof.
Background technology
Along with constantly weeding out the old and bring forth the new of digital products such as digital camera, mobile phone, personal digital aid (PDA), audio and video player, product technology is day by day ripe, makes the consumer only increase for the flash memory demand.Common flash memory product roughly is divided into CF (CompactFlash) card, SMC (Smart Media Card), MMC (Multi Media Card), SD (SecureDigital) card, MS (Memory Stick) card etc.Because memory size constantly promotes, can access data volume also promote several times, relatively in case the damage of breaking, also represent numerous data instants of user's preciousness to disappear totally, therefore manufacturer is when the memory card capacity is expanded in research and development, also update structure, though make it thin not cracky, and have suitable waterproof effect.
Traditional memory card structure is generally two-chip type, two chip architectures are established the circuit plate holder wherein about promptly utilizing, utilize the high frequency fusion techniques to incite somebody to action two chip bondings up and down together again, form a memory card structure, but shortcoming is repeatedly to extract for a long time when electronic product, joint is broken and damage, or joint is easy to generate minimum space.United States Patent (USP) the 5th, 677, No. 524, the 6th, 040, No. 622, the 6th, 624, No. 005 and Japan Patent 62-239554 number etc. for example have been disclosed in relevant for the memory card structure correlation technique.
The TaiWan, China patent announcement discloses a kind of manufacture method of memory card for No. 570294, be in having the array circuit board of a plurality of circuit board units, correspondence respectively this circuit board unit is carried out chip and is connect and put and electrically connect, on this full wafer circuit board, form a packing colloid again, then utilize diamond wheel (Grinding wheel cutter) to cut along this circuit board unit respectively, thereby, again this packaging part is embedded among the shell body by becoming batch mode to produce the packaging part of a plurality of rectangular Founders.But this needs after chip is finished encapsulation, and extra again capping one shell body so, not only will cause the cost that this shell body additionally is provided and this shell body is attached on the packaging part to be caused and the increase of fabrication steps, and not be inconsistent economic benefit.
For cooperating light, thin, short, the littleization development of various electronic installation, the design of memory card also needs therefore miniaturization more, develops to RS-MMC (Reduced Size MultiMedia Card) and MMC-Micro and have from MMC; And develop to the development and application of mini SD and Micro-SD etc. by SD, Sony company releases Memory Stick Mirco (M2) especially, be with, be accompanied by the variation of processing procedure variation and product, the demand pattern of these memory cards is non-as described above traditional by the upright rectangle that straight line constituted, and is transformed into the irregular shape of tool.Yet the cutting mode of employing diamond wheel only can form the straight cuts path in the aforementioned processing procedure, has been unable to cope with irregularly shaped cassette packaging part demand as memory cards such as Micro-SD, MMC-Micro, M2 in fact.
United States Patent (USP) the 6th, 548, though disclose a kind of multimedia circuit card process technique that need not use shell body for No. 911, but only can provide the memory card that is applied to make the MMC external form, still can't provide the memory card that is applied to make such as irregular external forms such as MMC-Micro and Micro-SD.
The 2004/0259291 open another kind of process technique that need not use shell body and can handle irregular memory card packaging part of U.S. Patent Publication US, it mainly is to have on the circuit board of a plurality of circuit board units corresponding each circuit board unit one to put crystalline substance and routing operation, on this circuit board, carry out the packing colloid processing procedure more comprehensively, the packaging part external form of then utilizing the corresponding institute of grinding, water cutter or laser mode desire to form memory card is again cut, with form a plurality of tools irregularly shaped as memory cards such as Micro-SD, MMC-Micro, M2 the cassette packaging part.
But in aforementioned processing procedure, the employed water cutter of the corresponding irregular packaging part of cutting, be through high pressure turbocharger with water, so that water is pressurized to 55000psi, by the only nozzle ejection of 0.004 inch of diameter, use the high-velocity flow that produces 3000 English Foot/second (about tripler speed) then, can add the high rigidity fine sand in addition simultaneously, strengthening its cutting power, but and cutting metal and hard material.Yet, the cost height of this water cutter processing procedure, and the grinding-material (abrasive) that adds fine sand in the water column domestic demand of water cutter, dust that this fine sand produced and slag charge not only can cause environmental pollution, this grinding-material is deserted simultaneously, after using once, promptly need abandon and can't reuse, improve manufacturing cost relatively.Moreover, the granular size that the cutting width of this water cutter and path are subject to water cutter pressure and grind material, therefore very easily when irregular packaging part cuts, cause the cutting path wild effect and influence process rate, and the spout of this water cutter is often blocked by grinding-material, also improves the unsteadiness of processing procedure relatively; In addition because its cut surface often for fine sand washes away, thereby causes packaging part cut surface out-of-flatness problem.
Cut though there is the dealer to attempt changing with laser mode, but also can produce problems such as packing colloid and board edge burn when laser cutting, cause cut surface out-of-flatness problem, otch also has situations such as burr problem and dust pollution simultaneously; In addition, be subject to the influence of laser radiation angle, cause the cut surface of part packaging part that crooked phenomenon is arranged; Moreover this laser cutting cost (as laser cutting device, fluorescent tube consumables cost) is also too high, and is not inconsistent economic benefit.In addition, no matter water cutter or laser cutting mode, because it is to utilize the light beam of fine sand or prodigiosin die-cut from the upper limb that encapsulates colloid downwards, easily cause collapsing of packing colloid scarce (chip-out) or colloid rhegma cut surface irregularity problems such as (crack), have a strong impact on the outward appearance and the quality of memory card packaging part.
Therefore, how effectively to solve aforementioned existing in prior technology problem, simplify processing procedure to provide a kind of, need not carry out external form cutting, shorten the processing procedure time, promote process rate, reduce the memory khaki method for making and the structure of manufacturing cost, be into present industry institute problem demanding prompt solution.
Summary of the invention
The shortcoming of background technology in view of the above, a purpose of the present invention provide a kind of memory card and the method for making thereof that need not carry out the external form cutting.
Another object of the present invention provides a kind of memory card and method for making thereof, to simplify processing procedure.
Of the present invention time a purpose provides a kind of memory card and method for making thereof, to shorten the processing procedure time.
A further object of the present invention provides a kind of memory card and method for making thereof, to promote process rate and to reduce manufacturing cost.
For reaching above-mentioned and other purpose, the invention provides a kind of method for making of memory card, comprise: provide to have the circuit board that is spaced a plurality of circuit board units, respectively this circuit board unit is the memory card reservation shape and is connected to this circuit board with connecting portion, and connects and put and electrically connect at least one chip; Paste a film in this circuit board correspondence respectively this circuit board unit do not meet the apparent surface who puts chip; With the mould cover cover this circuit board and this film and constitute identical shaped and size greater than the die cavity of this circuit board unit, form the packing colloid that coats this chip and this circuit board unit outside in this die cavity through filling encapsulating material; And remove this film and this connecting portion of excision, thereby make the memory card of reservation shape.
The present invention provides a kind of memory card again, comprising: circuit board unit is the memory card reservation shape; At least one chip is electrically connected to this circuit board unit; And packing colloid, have the shape that is same as this circuit board unit and greater than the size of this circuit board unit through metaideophone moulding (Transfer Molding), and coat the outside of this chip and this circuit board unit.
In the method for making of aforementioned memory card, can be included in the respectively step of this circuit board unit one side formation chamfering again, thereby make the memory card of reservation shape and tool chamfering, the step of described formation chamfering is decided in response to the pattern of memory card, be not imperative, chamfering pattern or position also do not have specific limited.In an embodiment, the step that forms chamfering is to carry out after forming packing colloid; In another embodiment, the step that forms chamfering is to carry out before with this connecting portion of excision in removing this film.
The reservation shape of this memory card can be irregularly shaped, and the described irregularly shaped shape that for example meets Micro-SD, MMC-Micro or Memory Stick Mirco (M2), that is described this memory card can be the wherein a kind of cassette packaging part that is selected from Micro-SD, MMC-Micro, reaches Memory Stick Mirco (M2).Aforementioned this circuit board can have the multiple tracks perforate separating respectively this circuit board unit, the shape of this perforate arrange in pairs or groups this circuit board unit shape and do not have specific limited; This chip can be electrically connected to this circuit board unit by covering crystalline substance, routing or alternate manner, does not also have specific limited; The material of this film can be heat proof material.
In an embodiment, a plurality of circuit board units of this circuit board can be single arrangement architecture, and respectively this circuit board unit is to be connected to this circuit board with connecting portion, and with the perforate each interval.In another embodiment, a plurality of circuit board units of this circuit board can be many rows' arrangement architecture, and respectively this circuit board unit of same row is with the perforate each interval, and respectively this circuit board unit of non-same row is to be connected to each other with connecting portion.Preferably, this connecting portion is connecting rod (Connecting Bar).
Respectively this circuit board unit can have in order to connect the first surface of putting this chip, with respect to the second surface of this first surface and run through this first and second surperficial conductive through hole.In addition, the first surface of this circuit board unit can have connection respectively the circuit pattern of this conductive through hole for electrically connecting this chip, this second surface can have be connected to this conductive through hole respectively respectively electric terminal for electrically connecting external device (ED).
Described mould can comprise one in order to holder support this film counterdie, and one cover the patrix of this circuit board and this film in order to cover, by this patrix and this film formation in order to limit the die cavity of encapsulating material packing space, to prevent the outside spill and leakage of encapsulating material.
Than prior art, memory card provided by the present invention and method for making thereof, only need to cut off respectively this connecting portion 11 respectively this circuit board unit 11 be separated from each other, can obtain the irregularly shaped Micro-SD that for example is, the memory card of MMC-Micro or Memory Stick Mirco cassette packaging parts such as (M2), formed irregular cutting path carries out the cutting work of irregular colloid around there is no corresponding each circuit board unit of prior art, so need not use for example grinding, the water cutter, facility such as laser carry out external form cutting work, can simplify processing procedure relatively, shorten the processing procedure time, simultaneously because need not use grinding, the water cutter, facility such as laser and can reduce equipment cost, promote process rate, reduce manufacturing cost, and can avoid because make the water cutter, the colloid that laser caused collapses problems such as scarce or colloid rhegma, obviously overcomes the many disadvantages of prior art.
Description of drawings
Fig. 1 to Fig. 4 is that the method for making that shows memory card of the present invention is implemented illustration, wherein, Fig. 1 is the plan structure schematic diagram of display circuit board, Fig. 2 shows the cutaway view of being drawn along A-A hatching line among Fig. 1 and pastes a film, Fig. 3 shows the schematic diagram that carries out the metaideophone moulding by mould, and Fig. 4 shows to finish metaideophone moulding cutting action schematic diagram afterwards; And
Fig. 5 A and Fig. 5 B are that the structure that shows memory card of the present invention is implemented illustration, and wherein, 5A figure is that the side that shows memory card is cutd open schematic diagram, and 5B figure is the elevational schematic view that shows memory card.
The component symbol explanation
1 circuit board, 11 circuit board units
15 perforates of 13 connecting portions
2 chips, 3 films
5 moulds, 50 die cavitys
51 patrixes, 53 counterdies
6 packing colloids, 7 cutting tools
Embodiment
Below conjunction with figs. illustrates specific embodiments of the invention now, so that those skilled in the art can understand technical characterictic of the present invention easily and reach effect.
Seeing also Fig. 1 to Fig. 5 A, is the flow chart that shows memory card provided by the present invention.
As shown in Figure 1, at first provide a circuit board 1, this circuit board 1 has spaced a plurality of circuit board unit 11, and respectively this circuit board unit 11 is the memory card reservation shape and is connected to this circuit board 1 with connecting portion 13, and connects and put and electrically connect at least one chip 2.
In present embodiment, this circuit board unit 11 that is the memory card reservation shape has the shape that is same as predetermined formation such as Micro-SD, MMC-Micro or Memory Stick Mirco cassette packaging parts such as (M2), but undersized, and respectively this circuit board unit 11 has been finished configuration, and be provided with a plurality of electric terminals (Terminals) (not shown) in the back side for electrically connecting with external device (ED), and described connecting portion 13 can be connecting rod (Connecting Bar).
Simultaneously, a plurality of circuit board units 11 of circuit board shown in the present embodiment 1 can be many rows' arrangement architecture, it is array structure, respectively this circuit board unit 11 of same row is with perforate 15 each intervals, respectively this circuit board unit 11 of non-same row is to be connected to each other with connecting portion 13, but in other embodiment, respectively this circuit board unit 11 also can be many rows' of for example single arrangement architecture or other row's number arrangement architecture, with in response to a batch manufacturing demand, absolutely not only exceed with the present embodiment those shown.For example in other embodiment, a plurality of circuit board units 11 of this circuit board 1 can be single arrangement architecture, respectively this circuit board unit 11 is to be connected to this circuit board 1 with connecting portion 13, and with perforate 15 each intervals, the technical staff knows in the affiliated field of circuit board (or substrate) because these quantitative variations should be, and another embodiment that therefore will not arrange in pairs or groups gives unnecessary details.
Respectively this circuit board unit 11 can have in order to connect the first surface of putting this chip 2, with respect to the second surface of this first surface and run through this first and second surperficial conductive through hole (not shown).In addition, the first surface of this circuit board unit 11 can have connection, and respectively the circuit pattern of this conductive through hole (not icon) is for electrically connecting this chip 2, and this second surface can have and is connected to respectively the electric terminal of this conductive through hole (not shown) respectively for electrically connecting external device (ED).Chip 2 in present embodiment is to be electrically connected to this circuit board unit 11 in the routing mode, and this chip 2 is electrically conducted to the electric terminal at this circuit board unit 11 back sides; But, in other embodiment, also can utilize and cover crystalline substance or other suitable mode electrically connects this chip 2 to this circuit board unit 11, and quantity being set and being provided with that the position is also non-exceeds with the present embodiment those shown of this chip 2.In addition, if this chip 2 has the passive device that needs collocation external, then simultaneously required passive device lotus root is connected on each circuit board unit 11 in this.
Then; as shown in Figure 2; paste a film 3 in this circuit board 1 correspondence respectively this circuit board unit 11 do not meet the apparent surface who puts chip 2; that is paste a film 3 in this circuit board 1 bottom surface; seal the respectively bottom of this perforate 15 to pass through this film 3, and protect the respectively electrical contact of these circuit board unit 11 second surfaces (being the bottom surface), wherein; the material of this film 3 is a heat proof material, and has the elastic deformation characteristic of deflection.
Then as shown in Figure 3, cover this circuit board 1 with mould 5 cover and constitute identical shaped and size die cavity 50 with this film 3 greater than this circuit board unit 11, form the packing colloid 6 that coats this chip 2 and this circuit board unit 11 outsides in this die cavity 50 through filling encapsulating material, because the shape of this die cavity 50 is identical and size greater than this circuit board unit 11, therefore the packing colloid 6 of metaideophone moulding (Transfer Molding) will directly form the reservation shape of memory card through filling encapsulating material.
In the present embodiment, described mould 5 comprise one in order to holder support this film 3 counterdie 53, and one cover the patrix 51 of circuit board and this film 3 in order to cover, constitute in order to limit the die cavity 50 of encapsulating material packing space by this patrix 51 and this film 3.Because this film 3 of utilization seals the bottom of respectively this perforate 15 (not shown) and protects the respectively electrical contact of these circuit board unit 11 second surfaces (being the bottom surface); and pass through these film 3 elastically deformable characteristics for this patrix 51 and counterdie 53 tight pressings, therefore can prevent the outside spill and leakage of encapsulating material.
Remove this film 3 and each connecting portion 13 of excision at last, and make the memory card of reservation shape.As shown in Figure 4, after respectively this circuit board unit 11 is finished metaideophone moulding packing colloid 6, almost made required cassette packaging part, but still be connected in this circuit board 3 individually because of connecting portion 13, simultaneously because utilize perforate 15 to separate the design of circuit board unit 11, need not at last vertically to cut, only need prolong and utilize shown in the illustrated dotted line, can make the memory card that shown in Fig. 5 A and Fig. 5 B, is reservation shape such as cutting tool 7 transversely cuttings of saw blade or cutter this connecting portion 13 respectively.Certainly, remove this film 3 and excision respectively the step of this connecting portion 13 decide by the processing procedure situation, for example remove after this film 3 respectively this connecting portion 13 of excision more earlier, also can excise earlier respectively that this connecting portion 13 removes this film 3 individually afterwards again, there is no specific limited.
Than prior art must corresponding each circuit board unit around formed irregular cutting path carry out the cutting work of irregular colloid, only need among the present invention to cut off respectively this connecting portion 13 respectively this circuit board unit 11 be separated from each other, can obtain the irregularly shaped memory card of Micro-SD, MMC-Micro or Memory Stick Mirco cassette packaging parts such as (M2) of for example being.So need not use facility such as for example grinding, water cutter, laser to carry out external form cutting work, so can simplify processing procedure, shorten the processing procedure time, simultaneously can reduce equipment cost, promote process rate, reduce manufacturing cost, and can avoid lacking or problems such as colloid rhegma because the colloid that water cutter, laser are caused collapses because need not to use facility such as grinding, water cutter, laser.
What need special instruction is, exterior design in response to various Micro-SD, MMC-Micro or Memory StickMirco cassette packaging parts such as (M2), in the method for making of aforementioned memory card, can be included in the respectively step of this circuit board unit 11 1 sides formation chamfering again, thereby make the memory card of reservation shape and tool chamfering, certainly, the step of described formation chamfering is to decide in response to the pattern of memory card, be not imperative, chamfering pattern or position also do not have specific limited.Simultaneously, the step that forms chamfering does not also have specific limited, can carry out after forming packing colloid 6, also can carry out before removing film 3 or excision connecting portion 13.
According to the prepared memory card of aforementioned method for making, shown in Fig. 5 A and Fig. 5 B, this memory card comprises the circuit board unit 11 that is the memory card reservation shape, is electrically connected at least one chip 2 of this circuit board unit 11 and coats this chip 2 and the packing colloid 6 in this circuit board unit 11 outsides, wherein, packing colloid 6 has the shape that is same as this circuit board unit 11 and greater than the size of this circuit board unit 11 through metaideophone moulding (Transfer Molding).
Certainly, this circuit board unit 11 can have connect the first surface of putting this chip 2, with respect to the second surface of this first surface and run through this first and second surperficial conductive through hole (not shown).In addition, the first surface of this circuit board unit 11 can have connection respectively the circuit pattern of this conductive through hole (not icon) for electrically connecting this chip 2, this second surface can have be connected to this conductive through hole respectively respectively electric terminal for electrically connecting external device (ED), and described packing colloid 6 coats the outside, and this first surface of these chips 2, this circuit board unit 11, but does not coat this second surface.
Described before combining, memory card provided by the present invention and method for making thereof, only need to cut off respectively this connecting portion 11 respectively this circuit board unit 11 be separated from each other, can obtain the irregularly shaped Micro-SD that for example is, the memory card of MMC-Micro or Memory Stick Mirco cassette packaging parts such as (M2), formed irregular cutting path carries out the cutting work of irregular colloid around there is no corresponding each circuit board unit of prior art, so need not use for example grinding, the water cutter, facility such as laser carry out external form cutting work, can simplify processing procedure relatively, shorten the processing procedure time, simultaneously because need not use grinding, the water cutter, facility such as laser and can reduce equipment cost, promote process rate, reduce manufacturing cost, and can avoid because make the water cutter, the colloid that laser caused collapses problems such as scarce or colloid rhegma.Hereat, memory card provided by the present invention and method for making thereof can address the deficiencies of the prior art
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (10)
1. the method for making of a memory card comprises:
Provide to have the circuit board that is spaced a plurality of circuit board units, respectively this circuit board unit is the memory card reservation shape and is connected to this circuit board with connecting portion, and connects and put and electrically connect at least one chip;
Paste a film in this circuit board correspondence respectively this circuit board unit do not meet the apparent surface who puts chip;
With the mould cover cover this circuit board and this film and constitute identical shaped and size greater than the die cavity of this circuit board unit, form the packing colloid that coats this chip and this circuit board unit outside in this die cavity through filling encapsulating material; And
Remove this film and this connecting portion of excision, thereby make the memory card of reservation shape.
2. the method for making of memory card according to claim 1, wherein, the material of this film is a heat proof material.
3. the method for making of memory card according to claim 1, wherein, this mould comprise one in order to holder support this film counterdie, and one cover the patrix of this circuit board and this film in order to cover, constitute in order to limit the die cavity of encapsulating material packing space, to prevent the outside spill and leakage of encapsulating material by this patrix and this film.
4. the method for making of memory card according to claim 1, wherein, the reservation shape of this memory card is irregularly shaped.
5. the method for making of memory card according to claim 1, wherein, this connecting portion is a connecting rod.
6. the method for making of memory card according to claim 1, wherein, a plurality of circuit board units of this circuit board are single arrangement architecture, and respectively this circuit board unit is to be connected to this circuit board with connecting portion, and with the perforate each interval.
7. the method for making of memory card according to claim 1, wherein, a plurality of circuit board units of this circuit board are many rows' arrangement architecture, and respectively this circuit board unit of same row is with the perforate each interval, and respectively this circuit board unit of non-same row is to be connected to each other with connecting portion.
8. the method for making of memory card according to claim 1, wherein, this memory card is for being selected from Micro-SD, MMC-Micro, and wherein a kind of cassette packaging part of Memory Stick Mirco (M2).
9. memory card comprises:
Circuit board unit is the memory card reservation shape;
At least one chip is electrically connected to this circuit board unit; And
Packing colloid has the shape that is same as this circuit board unit and greater than the size of this circuit board unit through the metaideophone moulding, and coats the outside of this chip and this circuit board unit.
10. memory card according to claim 9, wherein, this circuit board unit have connect the first surface of putting this chip, with respect to the second surface of this first surface and run through this first and second surperficial conductive through hole, and this packing colloid coats the outside, and this first surface of this chip, this circuit board unit, but does not coat this second surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101089898A CN101325163A (en) | 2007-06-11 | 2007-06-11 | Memory card and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101089898A CN101325163A (en) | 2007-06-11 | 2007-06-11 | Memory card and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101325163A true CN101325163A (en) | 2008-12-17 |
Family
ID=40188620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101089898A Pending CN101325163A (en) | 2007-06-11 | 2007-06-11 | Memory card and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101325163A (en) |
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2007
- 2007-06-11 CN CNA2007101089898A patent/CN101325163A/en active Pending
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Open date: 20081217 |