CN101319320B - Passivation liquid composition for surface of polished computer hard disk substrate - Google Patents
Passivation liquid composition for surface of polished computer hard disk substrate Download PDFInfo
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- CN101319320B CN101319320B CN2008100400117A CN200810040011A CN101319320B CN 101319320 B CN101319320 B CN 101319320B CN 2008100400117 A CN2008100400117 A CN 2008100400117A CN 200810040011 A CN200810040011 A CN 200810040011A CN 101319320 B CN101319320 B CN 101319320B
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Abstract
The invention discloses passivating liquid composition for a surface of a polished computer hard disc substrate, in particular to the passivating liquid composition for the surface suitable for the polished computer hard disc substrate based on Ni-P plating, belonging to the computer hard disc surface cleaning technical field. The passivating liquid has the characteristics that the passivating liquid contains an oxidant, an inhibitor and a surfactant as well as deionized water, wherein the percentages of the components are as follows: 0.05 to 5.0 percent of the oxidant, 0.05 to 3.0 percent of the inhibitor, 0.01 to 1.0 percent of the surfactant, the balance being the deionized water. The polished computer hard disc substrate is passivated by the passivating liquid composition, thereby improving easy cleanness of the surface and effectively reducing micro-defect amount remained on the surface.
Description
Technical field
The present invention relates to a kind of passivation liquid composition that is used for surface of polished computer hard disk substrate, particularly a kind of passivation liquid composition that is used for the surface of polished computer hard disk substrate of Ni-P plating; Can improve the property easy to clean on surface after the Passivation Treatment, and reduce surface residue.Belong to hard disc of computer surface cleaning technical field.
Background technology
In recent years, along with the fast rise of memory, hard disk capacity and storage density, the flying height of computer magnetic head has been reduced to about 10nm, estimates that the next generation will be reduced to 7-8nm.Along with operation between magnetic head and disk is so approaching, more and more higher to the requirement of the planarization of magnetic disk surface and cleanliness factor.If hard disc surface roughness, percent ripple are excessive, in the process of high speed rotating, magnetic head will bump with magnetic disk surface, damages magnetic head or the lip-deep magneticmedium of memory, hard disk, thereby causes disk unit to break down or the mistake of reading writing information.Simultaneously, residual microparticle also can cause head crash on the memory, hard disk surface.
At present, generally adopt chemically machinery polished (CMP) technology that the hand disk wafer surface is polished, because polishing back unsalted surface is active high, and factors such as a large amount of nanometer abrasive particles (as nano silicon, nano alumina particles) that use high densitys, number of chemical product in the CMP polishing fluid, workpiece surface very easily adsorbs pollutents such as nano particle, causes cleaning behind the chemical machinery extremely difficult.The height of cleaning quality has badly influenced the use properties of computer hard disc substrate.
Summary of the invention
The objective of the invention is to overcome the deficiency of clear technology after the existing hand disk wafer chemically machinery polished, the passivating solution on a kind of suitable computer hard disc substrate surface is provided, be used for the Passivation Treatment after the hand disk wafer polishing.
A kind of passivation liquid composition that is used for surface of polished computer hard disk substrate of the present invention is characterized in that having following composition and weight percentage:
Oxygenant: 0.05～5.0%; Described oxygenant is a hydrogen peroxide;
Inhibiter: 0.05～3.0%; Described inhibiter is glycine, thiocarbamide, thionamic acid, dodecyl polyoxyethylene ether phosphate or hydroxy benzo triazole;
Tensio-active agent: 0.01～1.0%; Described tensio-active agent is any in sodium alkyl sulfate, alkyl polyoxyethylene ether carboxylic acid potassium or the alkyl polyoxyethylene ether.
Deionized water: surplus.
Passivation liquid composition of the present invention is specially adapted to the Passivation Treatment of the computer hard disc substrate chemically machinery polished rear surface of Ni-P plating.
By the effect of each composition in the passivation liquid composition to hand disk wafer surface after polishing, promptly to effects such as the oxidation on hand disk wafer surface, absorption, make the surface after the new polishing in time reduce active, thereby reduce polishing fluid pollutent such as particle in the absorption of harddisk surface with residual, improve the easy cleaning and the raising cleaning quality on surface.
Embodiment
After now specific embodiments of the invention being described in.
Embodiment one: in the present embodiment, the moiety and the weight percentage of the passivating solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent sodium lauryl sulphate 0.3%;
Inhibiter glycine 1%;
Oxidant hydrogen peroxide 1%;
Deionized water 97.7%.
The preparation of passivating solution: under mechanical stirring, successively tensio-active agent, inhibiter are joined in the deionized water, after the stirring and dissolving, under agitation add oxygenant again, stir full and uniform after, promptly obtain transparent passivating solution.
Computer hard disc substrate to the Ni-P plating after the polishing soaks Passivation Treatment, and the passivation soak time is 30 seconds; Normal wash technology is cleaned routinely then; Adopting the quality product test macro that described hand disk wafer is carried out the surface at last detects; The microdefect rate that the qualification rate of testing hard disk substrate surface and surface exist.Detected result sees Table 1.
Embodiment two: in the present embodiment, the moiety and the weight percentage of the passivating solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent dodecyl Soxylat A 25-7 carboxylic acid potassium 0.3%;
Inhibiter thiocarbamide 1%;
Oxidant hydrogen peroxide 1%;
Deionized water 97.7%.
The preparation of the passivating solution in the present embodiment, soak Passivation Treatment, and surperficial testing process fully identical with the foregoing description 1.Detected result sees Table 1.
Embodiment three: in the present embodiment, the moiety and the weight percentage of the passivating solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent dodecyl Soxylat A 25-7 0.3%;
Inhibiter hydroxy benzo triazole 1%;
Oxidant hydrogen peroxide 1%;
Deionized water 97.7%.
The preparation of the passivating solution in the present embodiment, soak Passivation Treatment, and surperficial testing process fully identical with the foregoing description 1.Detected result sees Table 1.
Embodiment four: in the present embodiment, the moiety and the weight percentage of the passivating solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent sodium lauryl sulphate 0.3%;
Inhibiter dodecyl polyoxyethylene ether phosphate 1%;
Oxidant hydrogen peroxide 1%;
Deionized water 97.7%.
The preparation of the passivating solution in the present embodiment, soak Passivation Treatment, and surperficial testing process fully identical with the foregoing description 1.Detected result sees Table 1.
Embodiment five: in the present embodiment, the moiety and the weight percentage of the passivating solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent dodecyl Soxylat A 25-7 0.3%;
Inhibiter thionamic acid 1%;
Oxidant hydrogen peroxide 1%;
Deionized water 97.7%.
The preparation of the passivating solution in the present embodiment, soak Passivation Treatment, and surperficial testing process fully identical with the foregoing description 1.Detected result sees Table 1.
In order to compare the effect of passivating solution, as a comparison case with blank deionized water.
Comparative example 1 (blank test)
Deionized water 100%
Soak substrate with deionized water, detect equally then, it the results are shown in Table 1.
The detected result of each experimental example of table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative example 1 | |
| Qualification rate (%) | 35.42 | 53.13 | 31.96 | 31.18 | 35.48 | 29.67 |
| Microdefect rate (%) | 45.83 | 43.75 | 46.39 | 47.31 | 50.54 | 56.04 |
Can find out that from table 1 passivation liquid composition of the present invention has result of use preferably.
Claims (1)
1. passivation liquid composition that is used for surface of polished computer hard disk substrate is characterized in that having following composition and weight percentage:
Oxygenant: 0.05～5.0%; Described oxygenant is a hydrogen peroxide;
Inhibiter: 0.05～3.0%; Described inhibiter is glycine, thiocarbamide, thionamic acid, dodecyl polyoxyethylene ether phosphate or hydroxy benzo triazole;
Tensio-active agent: 0.01～1.0%; Described tensio-active agent is any in sodium alkyl sulfate, alkyl polyoxyethylene ether carboxylic acid potassium or the alkyl polyoxyethylene ether.
Deionized water: surplus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100400117A CN101319320B (en) | 2008-07-01 | 2008-07-01 | Passivation liquid composition for surface of polished computer hard disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100400117A CN101319320B (en) | 2008-07-01 | 2008-07-01 | Passivation liquid composition for surface of polished computer hard disk substrate |
Publications (2)
| Publication Number | Publication Date |
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| CN101319320A CN101319320A (en) | 2008-12-10 |
| CN101319320B true CN101319320B (en) | 2010-08-11 |
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| CN2008100400117A Expired - Fee Related CN101319320B (en) | 2008-07-01 | 2008-07-01 | Passivation liquid composition for surface of polished computer hard disk substrate |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011128B (en) * | 2010-12-30 | 2012-07-04 | 上海大学 | Cleaning agent composite used after computer hard disk substrate polishing |
| CN107841740A (en) * | 2017-11-06 | 2018-03-27 | 常熟市梅李合金材料有限公司 | A kind of nickel filament |
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