CN101312625B - 具有发泡阻挡块的电子控制装置 - Google Patents
具有发泡阻挡块的电子控制装置 Download PDFInfo
- Publication number
- CN101312625B CN101312625B CN2008101079104A CN200810107910A CN101312625B CN 101312625 B CN101312625 B CN 101312625B CN 2008101079104 A CN2008101079104 A CN 2008101079104A CN 200810107910 A CN200810107910 A CN 200810107910A CN 101312625 B CN101312625 B CN 101312625B
- Authority
- CN
- China
- Prior art keywords
- electronic
- controlled installation
- stopper
- electrical
- electronic element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Electrophonic Musical Instruments (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07425297.4 | 2007-05-21 | ||
EP07425297A EP2006160B1 (en) | 2007-05-21 | 2007-05-21 | Electronic control unit with expanded blocks |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101312625A CN101312625A (zh) | 2008-11-26 |
CN101312625B true CN101312625B (zh) | 2012-05-16 |
Family
ID=38610659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101079104A Expired - Fee Related CN101312625B (zh) | 2007-05-21 | 2008-05-21 | 具有发泡阻挡块的电子控制装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7916491B2 (zh) |
EP (1) | EP2006160B1 (zh) |
CN (1) | CN101312625B (zh) |
AT (1) | ATE452052T1 (zh) |
BR (1) | BRPI0802084A2 (zh) |
DE (1) | DE602007003822D1 (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090067139A1 (en) * | 2007-09-07 | 2009-03-12 | Kerr Geoffrey H | Large electronic component dampening fixation |
JP4638923B2 (ja) * | 2008-03-31 | 2011-02-23 | 日立オートモティブシステムズ株式会社 | 制御装置 |
DE102008040504A1 (de) * | 2008-07-17 | 2010-01-21 | Robert Bosch Gmbh | Elektrische Schaltungsanordnung |
US8305763B2 (en) * | 2008-10-27 | 2012-11-06 | Keihin Corporation | Housing case for electronic circuit board |
CN102065667B (zh) * | 2009-11-12 | 2015-03-25 | 赛恩倍吉科技顾问(深圳)有限公司 | 电子装置及其散热装置 |
JP5546889B2 (ja) * | 2010-02-09 | 2014-07-09 | 日本電産エレシス株式会社 | 電子部品ユニット及びその製造方法 |
JP5479139B2 (ja) * | 2010-02-10 | 2014-04-23 | 三菱重工業株式会社 | インバータ一体型電動圧縮機およびその組立方法 |
DE102010030891A1 (de) * | 2010-07-02 | 2012-01-05 | Zf Friedrichshafen Ag | Steuergerätbaugruppe |
US9229021B2 (en) * | 2011-04-20 | 2016-01-05 | Endress + Hauser Flowtec Ag | Measuring device with a multi-walled housing |
DE102011080988A1 (de) * | 2011-08-16 | 2013-02-21 | Zf Friedrichshafen Ag | Gehäuseelement für ein Steuergerätegehäuse |
JP2013070028A (ja) * | 2011-09-07 | 2013-04-18 | Hitachi Automotive Systems Ltd | 電子制御装置 |
CN103174529A (zh) * | 2011-12-21 | 2013-06-26 | 镇江中研电控有限公司 | 内燃机控制单元 |
JP6257881B2 (ja) * | 2012-05-31 | 2018-01-10 | 株式会社ミクニ | エンジンコントロールユニット |
JP6105887B2 (ja) * | 2012-09-28 | 2017-03-29 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
DE102012110683A1 (de) * | 2012-11-08 | 2014-05-08 | Conti Temic Microelectronic Gmbh | LC-Modul zum Einbau in einem Kraftfahrzeugsteuergerät |
DE102013204029A1 (de) * | 2013-03-08 | 2014-09-11 | Zf Friedrichshafen Ag | Vorrichtung zum Kühlen eines elektrischen Gerät und zugehöriges Herstellungsverfahren |
JP6036547B2 (ja) * | 2013-05-22 | 2016-11-30 | 株式会社デンソー | 電子制御ユニットおよび保護ケース |
DE102015200548A1 (de) * | 2015-01-15 | 2016-07-21 | Zf Friedrichshafen Ag | Anordnung zum Entwärmen von zumindest einem elektronischen Bauteil |
US9293870B1 (en) * | 2015-03-10 | 2016-03-22 | Continental Automotive Systems, Inc. | Electronic control module having a cover allowing for inspection of right angle press-fit pins |
USD758321S1 (en) * | 2015-04-21 | 2016-06-07 | Norman R. Byrne | Electrical bus bar cover |
DE102015112031B4 (de) * | 2015-07-23 | 2017-08-17 | Halla Visteon Climate Control Corporation | Anordnung zur Verbesserung einer Strombelastbarkeit von Leiterbahnen |
SE540653C2 (sv) * | 2016-03-29 | 2018-10-09 | Atlas Copco Airpower Nv | Arrangemang anordnat att innesluta ett kretskort innefattande elektroniska komponenter och ett verktyg innefattande arrangemanget |
DE102016216672A1 (de) * | 2016-09-02 | 2018-03-08 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einem Gehäuse mit Andruckelementen |
DE102017119235B3 (de) * | 2017-08-23 | 2018-12-13 | Trw Automotive Electronics & Components Gmbh | Kraftfahrzeugbedienvorrichtung sowie Verfahren zur Herstellung einer zumindest teilweise elektrisch leitfähigen Bedieneinheit für eine Kraftfahrzeugbedienvorrichtung |
US11056864B2 (en) * | 2018-02-23 | 2021-07-06 | Sumitomo Wiring Systems, Ltd. | Electrical junction box |
FR3097095B1 (fr) * | 2019-06-07 | 2022-04-29 | Valeo Siemens Eautomotive France Sas | Équipement electrique comprenant un élément élastique de fixation |
AU2021221637A1 (en) * | 2021-08-25 | 2023-03-16 | Redarc Technologies Pty Ltd | Electronics housing assembly |
KR20230163635A (ko) * | 2022-05-24 | 2023-12-01 | 주식회사 엘지에너지솔루션 | 심플 배터리팩 및 이의 제조방법 |
US20240010209A1 (en) * | 2022-07-06 | 2024-01-11 | Gm Cruise Holdings Llc | Environmental and electromagnetic seal for autonomous vehicle control systems |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5623394A (en) * | 1994-12-05 | 1997-04-22 | International Business Machines Corporation | Apparatus for cooling of chips using a plurality of customized thermally conductive materials |
US6275381B1 (en) * | 1998-12-10 | 2001-08-14 | International Business Machines Corporation | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
US6656770B2 (en) * | 1998-03-31 | 2003-12-02 | International Business Machines Corporation | Thermal enhancement approach using solder compositions in the liquid state |
CN2629393Y (zh) * | 2003-06-20 | 2004-07-28 | 艾默生网络能源有限公司 | 一种模块电源 |
US7023699B2 (en) * | 2002-06-10 | 2006-04-04 | Visteon Global Technologies, Inc. | Liquid cooled metal thermal stack for high-power dies |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4233645A (en) * | 1978-10-02 | 1980-11-11 | International Business Machines Corporation | Semiconductor package with improved conduction cooling structure |
DE3020902A1 (de) * | 1980-06-02 | 1981-12-17 | Robert Bosch Gmbh, 7000 Stuttgart | Elektronisches steuergeraet, insbesondere fuer kraftfahrzeuge |
US5060113A (en) * | 1987-04-09 | 1991-10-22 | Raychem Corporation | Connector assembly |
DE3933084A1 (de) * | 1989-10-04 | 1991-04-11 | Bosch Gmbh Robert | Gehaeuse fuer eine elektronische schaltung |
JPH0722722A (ja) * | 1993-07-05 | 1995-01-24 | Mitsubishi Electric Corp | 樹脂成形タイプの電子回路装置 |
DE4337866A1 (de) * | 1993-11-05 | 1995-05-11 | Siemens Ag | Steuergerät, insbesondere für ein Kraftfahrzeug |
JPH0846317A (ja) * | 1994-07-26 | 1996-02-16 | Honda Motor Co Ltd | 制御基板 |
DE19533298A1 (de) * | 1995-09-08 | 1997-03-13 | Siemens Ag | Elektronisches Modul mit Leistungsbauelementen |
DE19956675A1 (de) * | 1999-11-25 | 2001-05-31 | Daimler Chrysler Ag | Kunststoffgehäuse zur Aufnahme einer Baugruppe mit elektrischen und elektronischen Bauteilen auf einer Leiterplatte |
US6317324B1 (en) * | 2000-02-01 | 2001-11-13 | Shiaw-Jong Steve Chen | Encapsulated power supply with a high thermal conductivity molded insert |
EP1381262B1 (de) * | 2002-07-10 | 2007-03-07 | Tyco Electronics AMP GmbH | Elektrisches Gerät, insbesondere Schalt- und/oder Steuergerät für Kraftfahrzeuge |
ITTO20030754A1 (it) * | 2003-09-29 | 2005-03-30 | Gate Srl | Unita' elettronica di controllo, in particolare unita' |
-
2007
- 2007-05-21 EP EP07425297A patent/EP2006160B1/en not_active Not-in-force
- 2007-05-21 AT AT07425297T patent/ATE452052T1/de not_active IP Right Cessation
- 2007-05-21 DE DE602007003822T patent/DE602007003822D1/de active Active
-
2008
- 2008-05-19 US US12/122,824 patent/US7916491B2/en not_active Expired - Fee Related
- 2008-05-20 BR BRPI0802084-1A patent/BRPI0802084A2/pt not_active IP Right Cessation
- 2008-05-21 CN CN2008101079104A patent/CN101312625B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5623394A (en) * | 1994-12-05 | 1997-04-22 | International Business Machines Corporation | Apparatus for cooling of chips using a plurality of customized thermally conductive materials |
US6656770B2 (en) * | 1998-03-31 | 2003-12-02 | International Business Machines Corporation | Thermal enhancement approach using solder compositions in the liquid state |
US6275381B1 (en) * | 1998-12-10 | 2001-08-14 | International Business Machines Corporation | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
US7023699B2 (en) * | 2002-06-10 | 2006-04-04 | Visteon Global Technologies, Inc. | Liquid cooled metal thermal stack for high-power dies |
CN2629393Y (zh) * | 2003-06-20 | 2004-07-28 | 艾默生网络能源有限公司 | 一种模块电源 |
Also Published As
Publication number | Publication date |
---|---|
DE602007003822D1 (de) | 2010-01-28 |
US7916491B2 (en) | 2011-03-29 |
BRPI0802084A2 (pt) | 2009-02-10 |
EP2006160B1 (en) | 2009-12-16 |
CN101312625A (zh) | 2008-11-26 |
ATE452052T1 (de) | 2010-01-15 |
EP2006160A1 (en) | 2008-12-24 |
US20080310131A1 (en) | 2008-12-18 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Italy corbetta Patentee after: Magneti Marelli Powertrain SPA Address before: Italy Cole beta Patentee before: Magneti Marelli Powertrain SPA |
|
C56 | Change in the name or address of the patentee |
Owner name: MAGNETI-MARELLI DYNAMICAL SYSTEM COMPANY Free format text: FORMER NAME: MAGNETI MARELLI POWERTRAIN SPA |
|
CP01 | Change in the name or title of a patent holder |
Address after: Italy corbetta Patentee after: Magneti Marelli Powertrain S.p.a Address before: Italy corbetta Patentee before: Magneti Marelli Powertrain SPA |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120516 Termination date: 20170521 |