CN101290418B - Substrate treating device - Google Patents
Substrate treating device Download PDFInfo
- Publication number
- CN101290418B CN101290418B CN2008100930611A CN200810093061A CN101290418B CN 101290418 B CN101290418 B CN 101290418B CN 2008100930611 A CN2008100930611 A CN 2008100930611A CN 200810093061 A CN200810093061 A CN 200810093061A CN 101290418 B CN101290418 B CN 101290418B
- Authority
- CN
- China
- Prior art keywords
- substrate
- cleaning treatment
- junction
- conveyance
- conveyance unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Abstract
This invention provides a substrate processing device which cannot cause the large and complication of the device and is able to enable the providing position and the position of taking out of the substrate to be the same. The substrate processing device includes: a roller conveyor (8) that conveys the substrate back and forth in straight line corresponding to the horizontal direction; a loader section (2) that is configured to one end side of the roller conveyor and provides an unsettled substrate; a washing treating part (11) which carries out washing processing of the unsettled substrate which was supplied from this loader section and conveyed by the roller conveyor; a humidifying knife (21) for utilizing the treating solution to humidify the substrate before providing the unsettled substrate to the washing treating part; a drying knife (22) for injecting gas to dry the substrate when taking out the unsettled substrate treated by the washing treating part by the roller conveyor; and an unloader part (3) that is configured at the other end side of the roller convey and for storing the substrate treated by the drying knife.
Description
Technical field
The present invention relates to a kind of substrate board treatment, untreated substrate is offered cleaning treatment portion from loading part, and carry out herein being stored in unloading portion after the cleaning treatment.
Background technology
On the substrate of the glass that is used for display panels, be formed with circuit pattern.On substrate, form circuit pattern, adopt lithography technique.Lithography technique as everyone knows, stopping off on described substrate, and by being formed with the masterplate of circuit pattern, to this protective seam irradiates light.
Then, remove the non-irradiated part of light or light-struck part of protective seam, and the part of removing protective seam is carried out etching.And, will from substrate, remove the series of processes repeated multiple times of protective seam after the etching, on described substrate, form circuit pattern thus.
In this lithography technique, substrate that will cleaning treatment is crossed in cleaning treatment portion offers into dry-cure portions such as mould handling part or excimer laser annealing portion and carries out dry-cure.
In the past,, as described in patent documentation 1, a plurality of handling parts are configured to row, and provided and the conveyance substrate, and reason portion carries out processing to substrate successively throughout from the one end substrate being carried out in the treating apparatus of various processing.And, take out of from this last handling part at the substrate that the handling part that is arranged in the other end for the treatment of apparatus (rearmost end) is handled.
But according to this structure, the position that treating apparatus is provided the position of untreated substrate and takes out of the substrate of handling becomes an end and the other end for the treatment of apparatus.Therefore, when the substrate that treating apparatus was handled offered next operation, energy efficiency was not carried out this operation well sometimes, or worker's burden increases.
Therefore, be configured at a plurality of process chambers row treating apparatus the side or above configuration return and use conveyor, the substrate that will handle in the process chamber of the other end for the treatment of apparatus by described conveying device returns to the distolateral for the treatment of apparatus.
[patent documentation 1] TOHKEMY 2004-063201 communique
If the side for the treatment of apparatus or above dispose conveyor, then can with the substrate in described treating apparatus, handled from another of this treating apparatus distolateral return to one distolateral, therefore much at one, so can improve operability and alleviate worker's burden to position that treating apparatus provides the position of substrate and receives the substrate of handling.
But, if the substrate that will handle return to and side is provided and, then needs the space that is provided with for this reason conveyor and the treating apparatus difference configuration of coming, therefore may cause the whole maximization of device or complicated, this is not desirable.Especially, the conveyor that causes being used for the conveyance substrate owing to the tendency that exists substrate to maximize also maximizes recently, thereby the whole maximization of device becomes obvious.
Summary of the invention
The invention provides a kind of substrate board treatment, this device utilizes identical conveyance unit to carry out taking out of of the substrate handled to the conveyance of the substrate of handling part with at handling part, do not make thus that device is whole to maximize, just can carry out providing and taking out of in same position to the substrate of cleaning treatment portion.
The present invention is a kind of substrate board treatment, utilizes the treating fluid treatment substrate, and this device is characterised in that, comprising: the conveyance unit comes and goes conveyance with described substrate point-blank with respect to horizontal direction; The junction is disposed at the distolateral of this conveyance unit; Loading part is disposed at an end of a side of this junction, and the untreated substrate that will take in by described junction offers the described distolateral of described conveyance unit; Cleaning treatment portion utilizes treating fluid to providing from this loading part and carrying out cleaning treatment by the untreated substrate of described conveyance unit conveyance; Moistening handling part before untreated substrate being offered described cleaning treatment portion, utilizes treating fluid that this substrate is moistening; Dried portion when taking out of returning to described loading part side at the described substrate that described cleaning treatment portion handles by described conveyance unit, carries out dried to this substrate gas jet; And unloading portion, be disposed at the other end of a described side of described junction side by side with described loading part, by described junction the described substrate of being handled by dried portion is stored.
According to the present invention, owing to come and go the conveyance substrate, so just can on same position, carry out taking out of of the substrate handled to the supply of the substrate of handling part with at handling part by a conveyance unit by the conveyance unit.
Description of drawings
Fig. 1 is the structure diagram of the treating apparatus of expression an embodiment of the invention.
Fig. 2 is the side view that expression is arranged on the rotary body of cleaning treatment portion.
Symbol description
1 junction, 2 loading parts, 3 unloading portions
4 robot devices (handing-over unit), 6 moistening handling part 7 casees
8 roller paths (conveyance unit), 9 carrying rollers, 11 cleaning treatment portions
12 rotary bodies, 14 backing rolls, 16 positive and negative drive sources
21 liquid cuttves (moistening handling part), 22 air knives (dried portion)
23 dry-cure portions
Embodiment
Below, with reference to description of drawings an embodiment of the invention.
Fig. 1 is the structure diagram of expression an embodiment of the invention, and this treating apparatus has junction 1.End in a side of this junction 1 disposes loading part 2, and in the other end, disposes unloading portion 3 side by side and mutually opposed to each other with described loading part 2.Be provided with accumulator (Stocker) S1 that has accommodated untreated substrate W at loading part 2, be provided with the accumulator S2 of the substrate W that storage handled as described later in unloading portion 3.
Be provided with the robot device 4 of conduct handing-over unit in described junction 1.This robot device 4 has base portion 4a.This base portion 4a drives to the direction of representing with arrow Y in figure.Can be provided with driving shaft 4b drivingly in described base portion 4a upper edge sense of rotation or above-below direction.On this driving shaft 4b, be connected with a plurality of arm 4c that can rotate successively, on the arm 4c on top, be provided with hand 4d.
Thus, described robot device 4 can take out untreated substrate W from the accumulator S1 of described loading part 2, and offers the moistening handling part 6 that the other end of an end and described junction 1 is provided with mutually opposed to each other.
Described moistening handling part 6 has the case (Chamber) 7 that an end is connected with described junction 1, the untreated substrate W mounting that provides by robot device 4 from described loading part 2 in being located at described case 7, as an end of the roller path 8 of conveyance unit.Described roller path 8 is by constituting with parallel axes and with a plurality of carrying rollers 9 and the backing roll described later 14 of predetermined distance configuration.
In the other end of described case 7, the distolateral cleaning treatment portion 11 that is formed with of another of promptly described roller path 8.This cleaning treatment portion 11 has rotary body 12.This rotary body 12 reaches sense of rotation along the vertical direction by Z θ drive source 13 and drives as shown in Figure 2.
On the fabric width direction both ends of described cleaning treatment portion 11, the described backing roll 14 at the fabric width direction both ends of the substrate W that supporting is come by carrying roller 9 conveyances of described roller path 8 on the level identical and by positive and negative drive source 16 with the carrying roller 9 of described conveyor 8, with described carrying roller 9 along optionally being driven in rotation on positive veer and the reverse direction.
Also conveyance will be to the position corresponding to rotary body 12 to backing roll 14 if will join by the substrate W that carrying roller 9 conveyances come, and the down position that then described rotary body 12 is represented with solid line from Fig. 2 by Z θ drive source 13 is urged to the lifting position of representing with dot-and-dash line.Thus, described rotary body 12 receptions remain on the substrate W on the described backing roll 14 and rise.
Be provided with four engaging pawls 17 on described rotary body 12, this engaging pawl 17 is sticked in from the pars intermedia on four limits of the substrate W of backing roll 14 receptions.Thus, after rotary body 12 rises and receives substrate W, be driven in rotation by described Z θ drive source 13, this moment, described substrate W and described rotary body 12 rotated integratedly.
A pair of pipeline thrower 18 is set as treating fluid supply unit to the substrate W inject process liquid L that is driven in rotation above described rotary body 12.From the nozzle bore 18a of the described duct injection device 18 upper surface inject process liquid to the substrate W that is driven in rotation, then described substrate W is carried out cleaning treatment.
Substrate W finishes cleaning treatment, and then described rotary body 12 stops the rotation, and is driven into down position by Z θ drive source 13.At this moment, the position of rotation of rotary body 12 is identical with the angle that makes substrate when described backing roll 14 rises, and promptly utilizes not shown angle detecting sensor to control, substrate W can be joined to backing roll 14.
Described substrate W before being about to be moved into described cleaning treatment portion 11, by the liquid cutter (Aqua knife) 21 that constitutes moistening handling part, the identical liquid for the treatment of fluid of jet surface and the described substrate W of cleaning treatment thereon.Thus, utilize the processed liquid of upper surface of the substrate W that treating fluid handles moistening equably.
If upper surface processed liquid before moving into cleaning treatment portion 11 of substrate W is moistening, then when substrate W was moved into cleaning treatment portion 11, even treating fluid drips down from duct injection device 18, its drop also was diffused on the plate face of substrate W easily.
Therefore, before the entire process of beginning substrate W, only prevent part that the treating fluid of substrate W drips down, clean spot ground treatment substrate W so utilize the treating fluid that sprays from duct injection device 18 not produce by excess processes.
In addition, 21 pairs on liquid cutter is moved into the substrate W inject process liquid of described cleaning treatment portion 11, and to the substrate W that takes out of from cleaning treatment portion 11 inject process liquid not.
Handle and utilize the gas that purifies to carry out dried in cleaning treatment portion 11 to the substrate W of junction 1 conveyance, the gas of described purification by from be disposed between described cleaning treatment portion 11 and the junction 1, constitute as the non-active gas such as nitrogen of air knife 22 injections of dried portion.
That is, air knife 22 is configured to the angle with respect to the conveyance direction inclination regulation of substrate W, and to spraying its direction gas opposite with the conveyance direction from cleaning treatment portion 11 to the substrate W of junction 1 conveyance.
Thus, at the upstream side plug-flow of the residual treating fluid of the upper surface of substrate W to the conveyance direction of this substrate W.Its result is carried out dried by the upper surface of carrying roller 9 conveyances substrate W of 1 to the junction.
Receive and carried out cleaning and dried and conveyance substrate W by being located at robot device 4 on this junction 1 to this junction 1, and offer on the opposite side of described junction 1 with described moistening handling part 6 also row arrangement, become dry-cure portions 24 such as mould handling part or excimer laser annealing portion.
Offer the substrate W of dry-cure portion 24, be carried out to herein after the dry-cure such as mould or annealing, taken out of by described robot device 4.The substrate W that takes out of from dry-cure portion 24 by described robot device 4 is stored in described loading part 2 and is disposed at side by side the accumulator S2 of the described unloading portion 3 on the side of described junction 1.
In addition, robot device 4 then takes out untreated substrate W and offers moistening handling part 6 from loading part 2 if the substrate W that will handle in moistening handling part 6 offers dry-cure portion 24.Then, carry out the handing-over of substrate W in the following order: after will being stored in unloading portion 23 at the substrate W that dry-cure portion 24 handles, will offer dry-cure portion 24 at the substrate W that moistening handling part 6 is handled.
According to the treating apparatus of this formation, can make the carrying roller 9 of formation roller path 8 of moistening handling part 6 and the backing roll 14 of cleaning treatment portion 11 optionally rotate driving by positive and negative drive source 16 to positive veer and reverse direction.
Therefore, the untreated substrate W that takes out from loading part 2 by robot device 4 carrying roller 9 by roller path 8 can be offered cleaning treatment portion 11, and can give a distolateral robot device 4 who is disposed at roller path 8 by described carrying roller 9 conveyances and handing-over the substrate W that crosses in cleaning treatment portion 11 cleaning treatment.
That is, can be with identical roller path 8 by described robot device 4, distolaterally carry out providing and taking out of at one of described moistening handling part 6 to the substrate W of moistening handling part 6.Therefore, return to other roller path with the substrate W that will handle at moistening handling part 6 and to compare when side is provided, can seek the miniaturization of device and the simplification of mechanism.
Untreated substrate W is being moved into cleaning treatment portion 11 and is utilizing before treating fluid carries out cleaning treatment, by liquid cutter 21 to this substrate W inject process liquid.The upper surface of the substrate W of injected treating fluid is in whole by moistening state.
Therefore, before being provided to cleaning treatment portion 11 and beginning to carry out the processing for the treatment of fluid, even treating fluid is dropped on the substrate W from duct injection device 18, its drop also can be diffused on the plate face of moistening substrate W.
Thus, can prevent substrate W the plate face, carry out excessive processing from the drip down processed liquid of part of drop of duct injection device 18, therefore after the position of regulation is arrived in substrate W conveyance, handle from duct injection device 18 inject process liquid, thereby just can carry out uniform cleaning treatment the whole plate face of substrate W.
Substrate W to carrying out in cleaning treatment portion 11 taking out of after the cleaning treatment is carrying out dried by air knife 22 in the way of junction 1 conveyance.Therefore, even 6 couples of substrate W carry out cleaning treatment at moistening handling part, can not receive the substrate W that is stained with treating fluid robot device 4 yet, thus can prevent because of on the robot device's 4 who receives substrate W hand 4d, be stained with treating fluid, this treating fluid is bonded on substrate W that is carried out dried or the substrate W that carries out dry-cure in dry-cure portion 24 etc. and pollutes those substrates W.
By Z θ drive source 13, the rotary body 12 of cleaning treatment portion 11 is not only driven along sense of rotation, and can drive along the vertical direction.Therefore, if offered the substrate W of moistening handling part 6 is handed off on the backing roll 14 of cleaning treatment portion 11 by carrying roller 9 conveyances of roller path 8 by robot device 4, then drive described rotary body 12 to ascent direction, just can give rotary body 12 from described backing roll 14 handing-over this moment.
That is, need be for substrate W is not given roller path 8 and possesses special-purpose handing-over unit to the rotary body 12 of cleaning treatment portion 11 or from rotary body 12 handing-over from roller path 8 handing-over.Therefore, can carry out handing-over with simple reliable in structure ground to the substrate W of described rotary body 12.
In an above-mentioned embodiment, the situation that dry-cure portion and moistening handling part are set up in parallel has been described, but, has had only the situation of moistening handling part also to be suitable for there not being dry-cure portion.
Claims (3)
1. a substrate board treatment utilizes the treating fluid treatment substrate, and this device is characterised in that, comprising:
The conveyance unit comes and goes conveyance with described substrate point-blank with respect to horizontal direction;
The junction is disposed at the distolateral of this conveyance unit;
Loading part is disposed at an end of a side of this junction, and the untreated substrate that will take in by described junction offers the described distolateral of described conveyance unit;
Cleaning treatment portion utilizes treating fluid to providing from this loading part and carrying out cleaning treatment by the untreated substrate of described conveyance unit conveyance;
Moistening handling part before untreated substrate being offered described cleaning treatment portion, utilizes treating fluid that this substrate is moistening;
Dried portion when taking out of returning to described loading part side at the described substrate that described cleaning treatment portion handles by described conveyance unit, carries out dried to this substrate gas jet; And
Unloading portion is disposed at the other end of a described side of described junction side by side with described loading part, by described junction the described substrate of being handled by dried portion is stored.
2. substrate board treatment as claimed in claim 1 is characterized in that,
Have under the dry gas atmosphere dry-cure portion that the substrate of being handled by described cleaning treatment portion is handled, described junction before described unloading portion, offers described dry-cure portion in the substrate storage that will be handled by described cleaning treatment portion.
3. substrate board treatment as claimed in claim 1 is characterized in that,
Described conveyance unit is a roller path, and described cleaning treatment portion has the supporting mass that substrate keeps and rotation drives that will be come by described roller path conveyance.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP107429/2007 | 2007-04-16 | ||
| JP2007107429A JP4976188B2 (en) | 2007-04-16 | 2007-04-16 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101290418A CN101290418A (en) | 2008-10-22 |
| CN101290418B true CN101290418B (en) | 2011-11-02 |
Family
ID=40034748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100930611A Expired - Fee Related CN101290418B (en) | 2007-04-16 | 2008-04-16 | Substrate treating device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4976188B2 (en) |
| KR (1) | KR101415546B1 (en) |
| CN (1) | CN101290418B (en) |
| TW (1) | TWI449098B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4770938B2 (en) * | 2009-02-10 | 2011-09-14 | 東京エレクトロン株式会社 | Substrate processing equipment |
| KR101048073B1 (en) * | 2009-02-17 | 2011-07-11 | 세메스 주식회사 | Substrate processing method and apparatus |
| KR101099534B1 (en) | 2009-08-14 | 2011-12-28 | 세메스 주식회사 | Apparatus for aligning a glass and apparatus for processing a glass including the same |
| JP5224612B2 (en) * | 2010-09-09 | 2013-07-03 | 東京エレクトロン株式会社 | Substrate delivery device and substrate delivery method |
| US20120088370A1 (en) * | 2010-10-06 | 2012-04-12 | Lam Research Corporation | Substrate Processing System with Multiple Processing Devices Deployed in Shared Ambient Environment and Associated Methods |
| CN103466302A (en) * | 2013-10-09 | 2013-12-25 | 上海和辉光电有限公司 | Conveying roll device and clean machine air knife unit with conveying roll device |
| CN107866410B (en) * | 2016-09-26 | 2021-07-06 | 上海新昇半导体科技有限公司 | Integrated method and equipment for cleaning, drying and storing semiconductor crystal box |
| CN109396080B (en) * | 2018-12-24 | 2021-07-13 | 上海特雷通智能家居有限公司 | Dry dust collector of furniture board |
| CN114535197B (en) * | 2022-04-25 | 2022-07-08 | 沈阳和研科技有限公司 | Uniform cleaning device suitable for cleaning structure of precision machine tool equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1808704A (en) * | 2004-12-06 | 2006-07-26 | K.C.科技株式会社 | Substrate disposing device and method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3127073B2 (en) * | 1994-01-17 | 2001-01-22 | 東京エレクトロン株式会社 | Cleaning device and cleaning method |
| JPH10312065A (en) * | 1997-05-13 | 1998-11-24 | Ntn Corp | Developing device for liquid crystal color filter substrate |
| JP4482188B2 (en) * | 1999-12-24 | 2010-06-16 | 芝浦メカトロニクス株式会社 | Rectangular substrate processing equipment |
| JPWO2002049087A1 (en) * | 2000-12-12 | 2004-04-15 | 住友精密工業株式会社 | Swing shower type transfer type substrate processing equipment |
| JP2004063201A (en) * | 2002-07-26 | 2004-02-26 | Shibaura Mechatronics Corp | Treatment apparatus of substrate |
| JP2004119628A (en) * | 2002-09-25 | 2004-04-15 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
-
2007
- 2007-04-16 JP JP2007107429A patent/JP4976188B2/en active Active
-
2008
- 2008-04-15 KR KR1020080034535A patent/KR101415546B1/en not_active IP Right Cessation
- 2008-04-16 CN CN2008100930611A patent/CN101290418B/en not_active Expired - Fee Related
- 2008-04-16 TW TW097113760A patent/TWI449098B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1808704A (en) * | 2004-12-06 | 2006-07-26 | K.C.科技株式会社 | Substrate disposing device and method |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-63201A 2004.02.26 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080093376A (en) | 2008-10-21 |
| CN101290418A (en) | 2008-10-22 |
| KR101415546B1 (en) | 2014-07-04 |
| JP4976188B2 (en) | 2012-07-18 |
| TW200903624A (en) | 2009-01-16 |
| JP2008268284A (en) | 2008-11-06 |
| TWI449098B (en) | 2014-08-11 |
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Granted publication date: 20111102 Termination date: 20190416 |
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