CN101288873A - Air blasting method for removing dust from the sensitive chip and its device - Google Patents
Air blasting method for removing dust from the sensitive chip and its device Download PDFInfo
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- CN101288873A CN101288873A CNA2007100740491A CN200710074049A CN101288873A CN 101288873 A CN101288873 A CN 101288873A CN A2007100740491 A CNA2007100740491 A CN A2007100740491A CN 200710074049 A CN200710074049 A CN 200710074049A CN 101288873 A CN101288873 A CN 101288873A
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Abstract
The invention discloses a blow-wash method used for the dedusting of photosensitive chips, comprising the steps as follows: 1) delivering the photosensitive chip into a dedusting position in a dedusting box where a blowing nozzle is arranged; 2) carrying out the blow-washing operation to the photosensitive chip by using the blowing nozzle and using a pumping device to pump the dedusting box simultaneously; 3) delivering the photosensitive chip out of the dedusting box. By adopting the method of the invention, the secondary pollution of the photosensitive chip is avoided, thus obviously improving the dedusting effect and greatly improving the yield of automatic encapsulating of the photosensitive chip. The invention also discloses a photosensitive chip dedusting device which uses the blow-wash method, and comprises the dedusting box and the blowing nozzle; the blowing nozzle is arranged inside the dedusting box; the dedusting box is also provided with an opening used for the entrance and exit of the photosensitive chip and the pumping device. Therefore, the secondary pollution of the photosensitive chip is avoided, and the yield of automatic encapsulating of the photosensitive chip is greatly improved.
Description
Technical field
The present invention relates to a kind of device that is used for the method for sensitive chip dedusting and uses this method, relate in particular to a kind of blow-washing method and device thereof that is used for the sensitive chip dedusting.
Background technology
Sensitive chip is mainly used in the camera technique field, is used to obtain data and passes to processor, is the key element in the equipment such as video camera, and its quality will directly influence the quality of whole video camera.Along with the raising of camera pixel,, must guarantee the cleaning of packaging environment for the photosensitive area that prevents sensitive chip in the module encapsulation process is subjected to effect of dust; Particularly after process COB (Chip On Board) technology, the dust removing on photosensitive area surface and the assurance of processing environment cleanliness factor are the most key.
In recent years, mobile phone technique constantly develops, and camera also begins a large amount of being applied on the mobile phone.Because the cell phone appearance size is to develop towards little, thin, smart direction always, the package dimension of corresponding mobile phone cam also just must develop to miniaturization, the straight-through yield rate after the therefore very difficult assurance encapsulation.In the prior art,, mainly contain washed with de-ionized water and deionization wind and wash two kinds camera chip surface dirt sweep-out method mode.For the method for using washed with de-ionized water, be mainly used in the production line of handwork, for the production line that encapsulates fully automatically, this method will be difficult to be suitable for; For using ion wind purge mode, then both can use at the manual production line, also can use at the full automation streamline, be the dust collection method of main flow therefore.Particularly, as shown in Figure 1, use the method for ion wind purge may further comprise the steps: 1) to send in the dust cleaning case 3 ', move to dedusting place that is provided with blow gun 34 ' in this dust cleaning case 3 ' again by the inlet 31 ' pcb board 2 ' that will be packaged with sensitive chip; 2) use blow gun 34 ' that described sensitive chip is carried out purge; 3) this pcb board 2 ' is retracted the original place and also sent described dust cleaning case 3 ' by outlet 32 '.
Though above-mentioned dedusting method has adopted dust cleaning case 3 ' to form the space of a relative closure, make and to the sensitive chip dedusting time, be not subjected to the external world and other artificial factor, but, this method can not form airflow flowing in dust cleaning case 3 ', and can not discharge outside the dust cleaning case 3 ' from the dust that sensitive chip blows out, can only swim in this dust cleaning case 3 ', this very easily causes the secondary pollution of sensitive chip, thereby the consequence that dedusting was lost efficacy occurs.Therefore, this method is difficult to reach the requirement of encapsulation standard, influences the yield rate of product.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of blow-washing method that is used for the sensitive chip dedusting, can effectively prevent the secondary pollution of sensitive chip, and can significantly improve dust removing effects, thereby improve the yield rate of sensitive chip automation encapsulation greatly.
Another technical problem to be solved by this invention is to provide a kind of device that uses said method.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:
A kind of blow-washing method that is used for the sensitive chip dedusting is provided, and it may further comprise the steps: 1) described sensitive chip is sent into dedusting place that is provided with blow gun in the dust cleaning case; 2) use blow gun that described sensitive chip is carried out purge, and use air extractor that described dust cleaning case is bled simultaneously; 3) this sensitive chip is sent described dust cleaning case.
Adopt after such method, bleed in dust cleaning case by using air extractor, its inner air is flowed, and can discharge the blow gun dust that purge comes out from sensitive chip outside the dust cleaning case timely, avoided the secondary pollution of sensitive chip, thereby improved dust removing effects significantly, and improved the sensitive chip yield rate of encapsulation automatically greatly.After the test of dust tester proved, adopts method of the present invention, the cleanliness factor in the dust cleaning case was brought up to 100 grades by 1000 grades, has significantly improved the effect of dedusting.
Described step 2) air extractor in is installed on the position of described dust cleaning case and blow gun place plane parallel.The air-flow that blow gun blows out will have bounce-back after running into the pcb board that is packaged with sensitive chip, and this air extractor just can be discharged the dust cleaning case outside smoothly with this air-flow and the dust that is mingled with thereof, and more effectively prevents that dust from resting on dust cleaning case sensitive chip is carried out secondary pollution.
Described step 2) also on the described dust cleaning case plane relative, air extractor is set in blow gun.Because porose on the pcb board, from then on the air-flow that blow gun blows out spills some in the hole, and air extractor then can further prevent the appearance of sensitive chip secondary pollution with this part air-flow and the dust that is mingled with discharge dust cleaning case outside thereof just.
Before described step 1), on the inwall of described dust cleaning case, to be provided with earlier the dust sticky pad.In time not discharging the outer residual dust of dust cleaning case like this can be adsorbed by the dust sticky pad, and can not rebound everywhere with floating, further the cleannes of purifying and dedusting case inside.
What the blow gun in the described step 1) adopted is the pin hole blow gun.Further, this pin hole blow gun is row's formula pin hole gas outlet.Like this, the pin hole gas outlet helps improving the removing effect at interval than comparatively dense.
The present invention also provides a kind of sensitive chip dust arrester that uses aforementioned blow-washing method, and it comprises dust cleaning case and blow gun, and described blow gun is arranged on dust cleaning case inside, also is provided with the opening and the air extractor of coming in and going out for described sensitive chip on this dust cleaning case.
Adopt after such structure, just can use air extractor in dust cleaning case, to bleed, its inner air is flowed, and can discharge the blow gun dust that purge comes out from sensitive chip outside the dust cleaning case timely, avoid the secondary pollution of sensitive chip, improved the sensitive chip yield rate of encapsulation automatically greatly.
Respectively be provided with an air extractor on the position of described dust cleaning case and blow gun place plane parallel and on the plane relative with blow gun.Behind the intact sensitive chip of gasflow clean-up that blow gun blows out, will fast and effeciently be discharged to the dust cleaning case outside like this, and avoid sensitive chip to be secondary polluted.
The inwall of described dust cleaning case also is provided with the dust sticky pad.Can further improve the cleannes in the dust cleaning case effectively with the dust absorption that remains in the dust cleaning case like this.
Description of drawings
Fig. 1 is the principle schematic of the sensitive chip dedusting under the prior art;
Fig. 2 is the dust-cleaning principle schematic diagram of a preferred embodiment of the present invention.
The specific embodiment
In order to make technical problem to be solved by this invention, technical scheme and beneficial effect clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
See also Fig. 2, the blow-washing method to the sensitive chip dedusting in a preferred embodiment of the present invention may further comprise the steps:
1) sensitive chip is encapsulated on the pcb board 2, in dust cleaning case 3, offers the inlet 31 that passes through for this sensitive chip and export 32, and enter the mouth 31 and export 32 between transmission track 33 is set; Then, the streamline track by the outside will be packaged with the pcb board 2 of sensitive chip to be delivered in the inlet 31 of dust cleaning case 3, and is parked on the transmission track 33 between the entry and exit 32,31.
2) described pcb board 2 is moved to dedusting place that is provided with blow gun 34 in this dust cleaning case 3.During concrete enforcement, one turning device 35 can be set in dust cleaning case 3, and, when pcb board 2 arrives transmission tracks 33, will touch the pcb board 2 that turning device 35 will be packaged with sensitive chip after the sensor sensing action and turn to the dedusting position that is provided with blow gun 34 by sensor control.
3) trigger the cleaning of blowing of pcb board 2 that 34 pairs of blow guns are packaged with sensitive chip, and use 41,42 pairs of described dust cleaning cases 3 of air extractor to bleed simultaneously.Bleed in dust cleaning case 3 by using air extractor 41, its inner air is flowed, and blow gun 34 dust that purge comes out from the pcb board 2 that is packaged with sensitive chip can be discharged outside the dust cleaning case 3 timely, avoided the secondary pollution of sensitive chip, thereby improved dust removing effects significantly, and improved the sensitive chip yield rate of encapsulation automatically greatly.During concrete enforcement, described blow gun 34 can adopt the pin hole blow gun, and is preferred, and this pin hole blow gun is row's formula pin hole gas outlet, and the pin hole gas outlet is provided with the intensive removing effect that will more help improving at interval.
4) pcb board 2 that will be packaged with sensitive chip is retracted the original place and is sent described dust cleaning case 3.During concrete enforcement, overturn this pcb board 2 that is packaged with sensitive chip again to described transmission track 33 places, and deliver to next process via the outlet 32 of dust cleaning case 3 and encapsulate by turning device 35.
The air-flow that blow gun 34 blows out will have bounce-back after running into the pcb board 2 that is packaged with sensitive chip, in order effectively this air-flow and the dust that is mingled with thereof to be discharged dust cleaning case 3 outsides smoothly, prevent that dust from resting on 3 pairs of sensitive chips of dust cleaning case and carrying out secondary pollution, as a preferred embodiment of the present invention, described step 2) is on the position of described dust cleaning case 3 and blow gun 34 place plane parallel, promptly on the bottom surface 36 air extractor 41 is set.In addition, also can be simultaneously on the relative plane 37 of described dust cleaning case 3 and blow gun 34, air extractor 42 be set, because it is porose on the pcb board 2, from then on the air-flow that blow gun 34 blows out spills some in the hole, and 42 of air extractors can further prevent the appearance of sensitive chip secondary pollution with this part air-flow and the dust that is mingled with discharge dust cleaning case 3 outsides thereof just.
As further preferred embodiment of the present invention, in the described step 1) dust sticky pad 1 can be set on the inwall of described dust cleaning case 3 earlier.Not having in time to discharge dust cleaning case 3 outer residual dusts like this can be adsorbed by dust sticky pad 1, and can not rebound everywhere with floating, further the cleannes of purifying and dedusting case 3 inside.During concrete enforcement, be in described dust cleaning case 3, on the inwall near three sides 37,38,39 of described sensitive chip and end face 40 dust sticky pad 1 to be set, can more effectively adsorb like this dust.
In order further to prove the dust removing effects of the inventive method, we adopt the dust tester to do corresponding contrast experiment, and measurement data is as follows.
Illustrate: lustration class mainly is the 0.5um size dust number that is evaluated in per 1 cubic feet, is not more than 100 such as the 0.5um dust, and its definition rank is 100 grades, does not allow below 100 grades greater than the 5um dust to exist.
From the subordinate list data as can be seen, the cleanliness factor of dust cleaning case 3 inside is brought up to 100 grades by 1000 grades behind employing the present invention, and the above bulky grain dust of little 5um exists.In addition, it can also be seen that employing dust sticky pad 1 can reach better control effect to dust.Automatic assembly line to encapsulation camera module process in, because the pixel of sensitive chip is less, very responsive to dust, generally all can bring assorted point into and cause inefficacy greater than the above dust of 5um the camera image, after tested, after adopting the present invention, the fraction defective that is caused by the dust introducing drops to 2% by 8% of beginning, and effect is very obvious.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (12)
1, a kind of blow-washing method that is used for the sensitive chip dedusting, it may further comprise the steps: 1) described sensitive chip is sent into dedusting place that is provided with blow gun in the dust cleaning case; 2) use blow gun that described sensitive chip is carried out purge; 3) this sensitive chip is sent described dust cleaning case; It is characterized in that: also use air extractor that described dust cleaning case is bled described step 2) simultaneously.
2, the blow-washing method that is used for the sensitive chip dedusting according to claim 1 is characterized in that: before described step 1), earlier described sensitive chip is encapsulated on the pcb board.
3, the blow-washing method that is used for the sensitive chip dedusting according to claim 2 is characterized in that: the air extractor described step 2) is installed on the position of described dust cleaning case and blow gun place plane parallel.
4, the blow-washing method that is used for the sensitive chip dedusting according to claim 3 is characterized in that: also on the described dust cleaning case plane relative with blow gun air extractor is set described step 2).
5, according to the described blow-washing method that is used for the sensitive chip dedusting of the arbitrary claim of claim 1 to 4, it is characterized in that: before described step 1), the dust sticky pad is set on the inwall of described dust cleaning case earlier.
6, the blow-washing method that is used for the sensitive chip dedusting according to claim 5 is characterized in that: described dust sticky pad is arranged in the dust cleaning case on the inwall near three sides of sensitive chip and end face.
7, the blow-washing method that is used for the sensitive chip dedusting according to claim 1 is characterized in that: what the blow gun in the described step 1) adopted is the pin hole blow gun.
8, the blow-washing method that is used for the sensitive chip dedusting according to claim 7 is characterized in that: described pin hole blow gun is row's formula pin hole gas outlet.
9, a kind of sensitive chip dust arrester comprises dust cleaning case and blow gun, and described blow gun is arranged on dust cleaning case inside, also is provided with the opening of coming in and going out for described sensitive chip on this dust cleaning case, it is characterized in that: also be provided with air extractor in described dust cleaning case.
10, sensitive chip dust arrester according to claim 9 is characterized in that: described air extractor is arranged on the position of dust cleaning case and blow gun place plane parallel.
11, sensitive chip dust arrester according to claim 10, it is characterized in that: described air extractor also is arranged on the plane relative with blow gun.
12, according to the described sensitive chip dust arrester of the arbitrary claim of claim 9 to 11, it is characterized in that: the inwall of described dust cleaning case also is provided with the dust sticky pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100740491A CN101288873A (en) | 2007-04-16 | 2007-04-16 | Air blasting method for removing dust from the sensitive chip and its device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100740491A CN101288873A (en) | 2007-04-16 | 2007-04-16 | Air blasting method for removing dust from the sensitive chip and its device |
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| Publication Number | Publication Date |
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| CN101288873A true CN101288873A (en) | 2008-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2007100740491A Pending CN101288873A (en) | 2007-04-16 | 2007-04-16 | Air blasting method for removing dust from the sensitive chip and its device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102233341A (en) * | 2010-04-22 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Dedusting device |
| CN102814304A (en) * | 2012-08-22 | 2012-12-12 | 上海功源电子科技有限公司 | Full-automatic material strip cleaner |
| CN104542347A (en) * | 2015-01-20 | 2015-04-29 | 山东凤祥股份有限公司 | Poultry house water-free cleaning system |
| CN105477945A (en) * | 2016-01-25 | 2016-04-13 | 天津市中环三峰电子有限公司 | Purification dedusting box for camera production |
| CN106961794A (en) * | 2017-03-23 | 2017-07-18 | 捷开通讯(深圳)有限公司 | Splicing case |
| CN109244012A (en) * | 2018-09-06 | 2019-01-18 | 北京时代民芯科技有限公司 | A kind of tooling and method for the cleaning of cmos image sensor circuit |
| CN109290289A (en) * | 2018-11-29 | 2019-02-01 | 大江南电子科技（昆山）有限公司 | The dedusting mechanism of lateral wall type plate putting machine |
| CN115684609A (en) * | 2022-12-30 | 2023-02-03 | 港龙生物技术（深圳）有限公司 | Biochip pretreatment operation system and method |
-
2007
- 2007-04-16 CN CNA2007100740491A patent/CN101288873A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102233341A (en) * | 2010-04-22 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Dedusting device |
| CN102814304A (en) * | 2012-08-22 | 2012-12-12 | 上海功源电子科技有限公司 | Full-automatic material strip cleaner |
| CN104542347A (en) * | 2015-01-20 | 2015-04-29 | 山东凤祥股份有限公司 | Poultry house water-free cleaning system |
| CN105477945A (en) * | 2016-01-25 | 2016-04-13 | 天津市中环三峰电子有限公司 | Purification dedusting box for camera production |
| CN106961794A (en) * | 2017-03-23 | 2017-07-18 | 捷开通讯(深圳)有限公司 | Splicing case |
| CN109244012A (en) * | 2018-09-06 | 2019-01-18 | 北京时代民芯科技有限公司 | A kind of tooling and method for the cleaning of cmos image sensor circuit |
| CN109290289A (en) * | 2018-11-29 | 2019-02-01 | 大江南电子科技（昆山）有限公司 | The dedusting mechanism of lateral wall type plate putting machine |
| CN115684609A (en) * | 2022-12-30 | 2023-02-03 | 港龙生物技术（深圳）有限公司 | Biochip pretreatment operation system and method |
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Open date: 20081022 |