CN101277787B - 具有直接装载台板的抛光设备和方法 - Google Patents

具有直接装载台板的抛光设备和方法 Download PDF

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Publication number
CN101277787B
CN101277787B CN200680036363.4A CN200680036363A CN101277787B CN 101277787 B CN101277787 B CN 101277787B CN 200680036363 A CN200680036363 A CN 200680036363A CN 101277787 B CN101277787 B CN 101277787B
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CN
China
Prior art keywords
polishing
substrate
platen
polishing head
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200680036363.4A
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English (en)
Chinese (zh)
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CN101277787A (zh
Inventor
陈宏清
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Applied Materials Inc
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Applied Materials Inc
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN200680036363.4A 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法 Expired - Fee Related CN101277787B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/241,254 2005-09-30
US11/241,254 US7198548B1 (en) 2005-09-30 2005-09-30 Polishing apparatus and method with direct load platen
PCT/US2006/036940 WO2007041020A1 (en) 2005-09-30 2006-09-21 Polishing apparatus and method with direct load platen background

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201310076001XA Division CN103203685A (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法

Publications (2)

Publication Number Publication Date
CN101277787A CN101277787A (zh) 2008-10-01
CN101277787B true CN101277787B (zh) 2014-07-09

Family

ID=37517023

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201310076001XA Pending CN103203685A (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法
CN200680036363.4A Expired - Fee Related CN101277787B (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201310076001XA Pending CN103203685A (zh) 2005-09-30 2006-09-21 具有直接装载台板的抛光设备和方法

Country Status (4)

Country Link
US (1) US7198548B1 (enExample)
JP (1) JP5225089B2 (enExample)
CN (2) CN103203685A (enExample)
WO (1) WO2007041020A1 (enExample)

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CN102084466B (zh) * 2008-07-01 2013-09-11 应用材料公司 模块化底板半导体抛光器结构
US8528886B2 (en) * 2009-02-02 2013-09-10 Corning Incorporated Material sheet handling system and processing methods
US8442659B2 (en) * 2009-02-18 2013-05-14 Mei, Llc Rotary actuator position sensor
JP6073222B2 (ja) * 2010-08-06 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保定リングを用いた基板縁部調整
CN102240927B (zh) * 2011-05-30 2014-01-08 清华大学 利用化学机械抛光设备进行化学机械抛光的方法
US9227293B2 (en) * 2012-11-21 2016-01-05 Applied Materials, Inc. Multi-platen multi-head polishing architecture
WO2016010865A1 (en) * 2014-07-18 2016-01-21 Applied Materials, Inc. Modifying substrate thickness profiles
JP6403015B2 (ja) * 2015-07-21 2018-10-10 東芝メモリ株式会社 研磨装置および半導体製造方法
CN105598827B (zh) * 2016-01-05 2018-05-22 天津华海清科机电科技有限公司 化学机械抛光机
CN108818299B (zh) * 2018-06-06 2023-08-18 太仓鉴崧实业有限公司 一种交叉运转的磨盘结构及其工作方法
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
US12251785B2 (en) * 2018-09-07 2025-03-18 Hangzhou Sizone Electronic Technology Inc. Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unit
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
JP7763244B2 (ja) 2020-09-08 2025-10-31 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ処理のための基板ハンドリングシステム及び方法
CN112223109A (zh) * 2020-09-27 2021-01-15 湖北匠达智能装备有限公司 一种阀板自动上料装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
CN115091340B (zh) * 2022-07-25 2025-12-19 上饶市名创智能科技有限公司 全自动智能抛光机
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments
CN117754441B (zh) * 2024-01-23 2024-06-28 邢台永庆轴承有限公司 一种轴承套圈双面自动抛光设备及抛光方法

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CN1132676A (zh) * 1995-02-15 1996-10-09 大宇电子株式会社 抛光衬底上形成的介质层的装置
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus

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JPH0825122B2 (ja) * 1988-01-08 1996-03-13 九州電子金属株式会社 薄円板状被加工物の加圧盤に対する位置決め装置
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JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
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US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
JP3132468B2 (ja) * 1998-05-20 2001-02-05 日本電気株式会社 半導体ウェハ研磨装置及びその研磨方法
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US6413145B1 (en) * 2000-04-05 2002-07-02 Applied Materials, Inc. System for polishing and cleaning substrates
US6942545B2 (en) * 2001-04-20 2005-09-13 Oriol, Inc. Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
KR100939096B1 (ko) * 2001-05-29 2010-01-28 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템
JP2006319249A (ja) * 2005-05-16 2006-11-24 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの製造方法により製造された半導体デバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1132676A (zh) * 1995-02-15 1996-10-09 大宇电子株式会社 抛光衬底上形成的介质层的装置
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus

Also Published As

Publication number Publication date
US7198548B1 (en) 2007-04-03
CN101277787A (zh) 2008-10-01
JP2009509782A (ja) 2009-03-12
WO2007041020A1 (en) 2007-04-12
CN103203685A (zh) 2013-07-17
JP5225089B2 (ja) 2013-07-03
US20070077861A1 (en) 2007-04-05

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