CN101273679A - Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module - Google Patents

Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module Download PDF

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Publication number
CN101273679A
CN101273679A CNA2006800350475A CN200680035047A CN101273679A CN 101273679 A CN101273679 A CN 101273679A CN A2006800350475 A CNA2006800350475 A CN A2006800350475A CN 200680035047 A CN200680035047 A CN 200680035047A CN 101273679 A CN101273679 A CN 101273679A
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China
Prior art keywords
electronic
component module
formation
absorption surface
surface mounted
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Granted
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CNA2006800350475A
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Chinese (zh)
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CN101273679B (en
Inventor
小山训裕
山本宗祯
上岛孝纪
中川大
木村正树
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A packaging method of an electronic component module by which the electronic component module can be packaged efficiently by suction-holding it using a suction head and low profile can be attained sufficiently under packaged state. Method for manufacturing an electronic apparatus using it, and a low profile electronic component module are also provided. A suction surface composition member (12) is arranged so as to form a suction surface (12a) at a position as high as or higher than the upper end of a transistor 2(2c) which is a surface mounting component of highest profile in an electronic component module (20) mounting surface mounting components 2 (2a, 2b, 2c, 2d) on an electronic component element (1). The electronic component module is held by sucking the suction surface by a suction head and after it is mounted on a mother board (14) of packaging object, a processing for eliminating such a state that the upper end of the suction surface composition member is higher than the upper end of a surface mounting component of highest profile mounted on electronic component element is carried out.

Description

The installation method of electronic-component module, adopt manufacture method and this electronic-component module of the electronic equipment of this method
Technical field
The present invention relates to electronic-component module installation method, adopt manufacture method and this electronic-component module of the electronic equipment of this method, in detail, relate to by adsorb the installation method of the electronic-component module of installing through the operation that is installed on mounting object when keeping electronic-component module with adsorption head, adopt the manufacture method of the electronic equipment of this method, and employed in the method electronic-component module.
Background technology
Figure 11 is the structure chart of expression electronic-component module in the past.This electronic-component module 61 as shown in figure 11, on the electronic device prime field 51 of ceramic substrate that terminal electrode 53 is disposed at lower surface etc., (for example carry surface mounted device (SMD) 52, capacitor 52a, resistance 52b, transistor 52c, coil 52d), upper surface has the structure that has disposed smooth metal cap 56 has disposed surface mounted device 52 with covering face simultaneously.In addition, the electronic-component module as having with electronic-component module 61 same structures of Figure 11 has proposed various structures (with reference to patent documentation 1), and well-known is structure shown in Figure 11.
Yet employed metal cap 56 roughly can be divided into following 2 kinds of functions in above-mentioned electronic-component module 61, promptly comprises:
(a) surface mounted device 52 produces the influence of electro permanent magnetic, but is difficult to be subjected to electro-magnetic screen function from the influence of the electro permanent magnetic of other electronic equipment 52 other electronic equipment,
The function of the absorption surface 54 (Figure 13) when (b) guaranteeing to utilize adsorption head 62 (Figure 13) the attract electrons device blocks 61 that usefulness is installed (, make above-mentioned metal cap 56 smooth upper surfaces become absorption surface 54).
In addition, as shown in figure 12, also know a kind of substituted metal cover 56 and utilize castable resin 57 to come the electronic-component module 61a that obtains behind the sealing surfaces installing device 52 that in this case, the upper surface 57a of castable resin 57 works as absorption surface 54.In addition, in Figure 12, the part that indicates same numeral with Figure 11 is represented identical or suitable part.
In addition, in the time of on being installed in above-mentioned electronic-component module 61 (Figure 11) as the motherboard 55 of mounting object, generally carry out this installation (with reference to Figure 13, Figure 14) in the following order.
(1) with the upper surface of the metal cap 56 of electronic-component module 61 as absorption surface 54, as shown in figure 13, adsorb with adsorption head 62.
(2) utilize adsorption head 62 to keep electronic-component modules 61, it is transported to top as the motherboard 55 of mounting object, and it is carried on the terminal pad electrode 65 of the regulation of having printed scolding tin paste 64 in advance (Figure 14).
(3) send into then in the reflow ovens and under defined terms and heat, make the scolding tin fusion in the scolding tin paste 64, utilize scolding tin 64a that electronic-component module 61 is fixed in terminal pad electrode 65 on the motherboard 55.
But, in recent years, because the improvement of the performance of surface mounted device own and the raising of electronic equipment shielding properties, the situation of the function that does not need above-mentioned (a) among the function that metal cap rises was arranged also.
In addition, in recent years, the miniaturization of electronic equipments such as mobile phone constantly developed, and was accompanied by this situation, and the requirement of hanging down the back of the bodyization (low profile) for the electronic module that is adopted in the electronic equipment has also uprised.
Yet, in electronic device module in the past, as shown in figure 14, between the lower surface of surface mounted devices such as capacitor 52a, resistance 52b, transistor 52c, coil 52d and metal cap 56, has space G, and because metal cap 56 itself has thickness T, so exist the problem that this part (that is, space G and thickness T) uprises the goods height.
And, owing to also need the lateral separation between metal cap 56 and capacitor 52a, resistance 52b, the surface mounted devices such as transistor 52c, coil 52d, the carried area that carries surface mounted device to electronic device prime field 51 diminishes, so can hinder the miniaturization of goods.
Promptly, because the existence of the above-mentioned space G and the thickness T of metal cap 56 etc., only by realizing the slimming of electronic device prime field 51, and the miniaturization of capacitor 52a, resistance 52b, surface mounted devices such as transistor 52c, coil 52d, it is very difficult making the enough low back ofs the bodyization of having of electronic-component module integral body.
In addition, the situation with the electronic-component module 61a behind the castable resin 57 sealing surfaces installing devices of Figure 12 is compared with the situation of using metal cap, though can increase the carried area (area of plane) of surface mounted device, but the upper end of specific surface installing device wants high because the upper surface 57a of castable resin 57 becomes, so exist owing to the distance D between the upper end of the upper surface 57a of castable resin 57 and surface mounted device makes the problem that the goods height uprises.
Patent documentation 1: Japanese patent laid-open 5-190380 communique
The present invention is used to address the above problem and designs, purpose is to provide the installation method of electronic-component module, this installation method can use adsorption head to adsorb and keep electronic-component module, and can efficiently it be installed on the mounting object, can realize the low back of the bodyization sufficient in the installment state simultaneously; And the manufacture method of the electronic equipment of this method of employing is provided, and the electronic-component module that under installment state, can realize enough low back ofs the bodyization.
Summary of the invention
In order to address the above problem, the present invention adopts following structure.
That is, the installation method of the electronic-component module of claim 1 is characterized in that, comprising:
Surface electronic-component module, that carried an above-mentioned surface mounted device side that constitutes in that surface mounted device is equipped on the electronic device prime field, in high position, the upper end of specific surface installing device, utilize state that adsorption head adsorbs the absorption surface of usefulness to dispose the operation of absorption surface member of formation with formation;
Keep described electronic-component module by utilizing adsorption head to adsorb above-mentioned absorption surface, and with the operation of its lift-launch on mounting object; And
After carrying described electronic-component module on the mounting object, the state that is higher than the upper end that is installed in the above-mentioned surface mounted device in the above-mentioned electronic device prime field for the upper end of removing above-mentioned absorption surface member of formation, remove above-mentioned absorption surface member of formation, perhaps make the operation of its distortion.
In addition, the installation method of the electronic-component module of claim 2 in the formation of the invention of claim 1, also possesses following characteristics, that is, above-mentioned absorption surface member is organic member, removes this member or makes the operation of its distortion be at least
(a) make above-mentioned organic Build Out operation by heating;
(b) operation that the volume of above-mentioned organic member is reduced by heating;
(c), not to make the change in volume of above-mentioned organic member but make a operation among the operation that its shape changes by heating.
In addition, the installation method of the electronic-component module of claim 3 is in the formation of the invention of claim 1 or 2, also possesses following characteristics, promptly, above-mentioned electronic-component module is being carried on the mounting object that printed the scolding tin paste, it is installed under the situation of mounting object by reflow soldering, the reflow process with the operation that makes the operation that is printed on the scolding tin fusion among the lip-deep scolding tin paste of mounting object and remove above-mentioned absorption surface member of formation or make its distortion during as the above-mentioned electronic-component module of welding on mounting object is implemented simultaneously.
In addition, the installation method of the electronic-component module of claim 4 is in the formation of the invention of claim 3, also possesses following characteristics, promptly, earlier stage up to above-mentioned reflow process, above-mentioned absorption surface member of formation exists with solid form, because the temperature of scolding tin in the above-mentioned reflow process and generating gasification, liquefaction, softening and volume any situation among reducing.
In addition, in the formation of the installation method of the electronic-component module of claim 5 each invention in claim 1 to 4, also possess following characteristics, that is, above-mentioned absorption surface member of formation is formed by naphthalene.
In addition, in the formation of the installation method of the electronic-component module of claim 6 each invention in claim 1 to 5, also possesses following characteristics, promptly, a plurality of surface mounted devices are carried in above-mentioned electronic device prime field, on than higher position, the upper end of the highest surface mounted device among above-mentioned a plurality of surface mounted devices, form above-mentioned absorption surface simultaneously.
In addition, the manufacture method of electronic equipment of the present invention is as described in the claim 7, it is a kind of manufacture method that on mounting object, has the electronic equipment of electronic-component module, it is characterized in that, have and utilize the method described in each in the claim 1 to 6, the operation of electronic-component module is installed on above-mentioned mounting object.
In addition, electronic-component module of the present invention is as described in the claim 8, be a kind of surface mounted device to be carried in the electronic device prime field and the electronic-component module that constitutes, it is characterized in that, installed surface one side of carrying above-mentioned surface mounted device, on than higher position, the upper end of above-mentioned surface mounted device, have the absorption surface member of formation that is configured with solid state, utilize adsorption head to adsorb the absorption surface of usefulness thereby form; Above-mentioned absorption surface member of formation is with the melt temperature according to employed scolding tin in the installation of being undertaken by scolding tin, can generating gasification, the condition of liquefaction, softening and volume any situation among reducing constitutes.
In addition, the electronic-component module of claim 9 is in the formation of the invention of claim 8, also possesses following characteristics, promptly, carry a plurality of surface mounted devices in above-mentioned electronic device prime field, above-mentioned absorption surface is formed on the higher position, upper end than the highest surface mounted device among above-mentioned a plurality of surface mounted devices.
In the installation method of electronic-component module of the present invention, the electronic-component module that constitutes surface mounted device being equipped in the electronic device prime field, carried surface one side of surface mounted device, on higher position, the upper end of specific surface installing device, utilize adsorption head to adsorb the form configuration absorption surface member of formation of the absorption surface of usefulness with formation, hold the absorption surface of this absorption surface member of formation with adsorption head, after the maintenance electronic-component module attaches it on the mounting object, the state that is higher than the upper end of the surface mounted device of lift-launch in the electronic device prime field for the upper end of eliminating the absorption surface member of formation, remove the absorption surface member of formation or make its distortion, therefore, in installation procedure, by utilizing adsorption head to adsorb the absorption surface of absorption surface member of formation, thereby can use automatic erector etc., control to install effectively easily and positively.In addition, after installing, the upper end that can positively eliminate the absorption surface member of formation is higher than the state of the upper end of the surface mounted device of lift-launch in the electronic device prime field, and realizes the final low back of the bodyization of goods.
In addition, after carrying electronic-component module on the mounting object, when absorption surface and the highest surface mounted device upper end are contour, in order to realize the low back of the bodyization of electronic-component module, do not need to make especially the absorption surface member of formation the upper end, be that the position of absorption surface reduces.But, in this case, can not hinder the carrying out of removing the absorption surface member of formation or making the processing of its distortion certainly yet.
As the absorption surface member of formation, for example can use with the resin material of any phenomenon among generating gasification, liquefaction, softening and volume reduce by heating organic member as representative.
For example, as the material that gasifies by heating, but the illustration naphthalene.
Naphthalene is without liquid and directly from the solid-state sublimability material that becomes gaseous state, the absorption surface member that is suitable as among the present invention uses.
In addition, as the material of sublimability, other paracide of also can giving an example.
In addition,, be not limited only to sublimate, also can adopt the material that is varied to gaseous state through liquid state as absorption surface member of formation of the present invention.
And, as absorption surface member of formation of the present invention, can use by heating makes volume reduce the resin of (contraction), for example the polymerization reaction by resin itself etc. makes the material of volume contraction, perhaps for example sneaks into earlier bubble, the degasification when utilizing heating then and cumulative volume is reduced and the material that constitutes etc. in resin.
In addition, even do not remove and material that volume also can not reduce, so long as liquefy (fusion) or softening material also can use by heating, for example synthetic resin or natural resin, category of glass composition etc.That is, can use by heating fusion softening, take place to flow, can remove the various materials that the upper end is higher than the state of the surface mounted device upper end of lift-launch in the electronic device prime field by this.
In addition, the absorption surface member of formation is organic member, as removing this member or making the operation of its distortion, (a) makes its disappearance by heating organic member; (b) by heating organic member its volume is reduced; (c) not that its volume is changed by heating above-mentioned organic member, but the method that its shape is changed; By adopting at least a among above-mentioned 3 kinds of methods, the upper end that can eliminate the absorption surface member of formation effectively is higher than the state of the upper end of the surface mounted device of lift-launch in the electronic device prime field, makes the present invention have actual effect.
In addition, pass through to heat the method that organic member makes its disappearance as above-mentioned (a), though illustration make all methods of evaporation or distillation (that is, making its gasification) of organic member, also can use method or other method of utilizing dissolution with solvents to remove whole organic member.
In addition, the method that volume that heating makes organic member reduces of passing through as above-mentioned (b), though illustration make the part evaporation of organic member or make the method for its distillation, perhaps use the method for the resin that volume reduces by heating etc., but also can adopt method etc. or other method of a part of utilizing dissolution with solvents to remove organic member.In addition, in the present invention, the method that the volume of organic member is reduced by heating is a kind of form in the notion of [distortion of absorption surface member of formation] among the present invention.
In addition, be not to make the change in volume of organic member but the method that makes its distortion as the heating of passing through of above-mentioned (c), though illustration make the softening or fusion (liquefaction) of organic member with the method that changes its shape etc., also can adopt other method.
In addition, electronic-component module is equipped on the mounting object that printed the scolding tin paste, weld by refluxing, thereby it is installed under the situation on the mounting object, the operation of the scolding tin fusion in the scolding tin paste that is printed in the mounting object surface will be made, and the reflow process of the operation of removing above-mentioned absorption surface member of formation or making its distortion when electronic-component module is welded in mounting object is when implementing simultaneously, special operation is not set, just can be used for eliminating absorption surface formation structure upper end and be higher than the processing of lift-launch, thereby make the present invention have more actual effect at the state of the surface mounted device upper end of electronic device prime field.In addition, in the installation of electronic-component module,, also can adopt the welding method of the type of flow though can adopt the welding method of utilizing reflux type.
In addition, as the absorption surface member of formation, by adopting till the earlier stage of reflow process, promptly till finishing, installation procedure exists with solid-state form always, meeting generating gasification under the scolding tin temperature in reflow process, liquefaction, the material of any situation among softening and volume reduces, in reflow process, remove the absorption surface member of formation, its volume is reduced or make its distortion, thereby can positively eliminate the state that absorption surface member of formation upper end is higher than the surface mounted device upper end of lift-launch in the electronic device prime field, can make the present invention have actual effect more like this.
In addition, if deform under the temperature of absorption surface member of formation when keeping or carrying electronic-component module etc. etc., then in installation procedure, can not utilize adsorption head to adsorb, so, also wish it is existed with solid-state form even in the stage of keeping or carrying.That is, wish that electronic-component module guarantees can be stabilized in solid-state state under the temperature (being generally 50～80 ℃) at goods.
In addition, the absorption surface member of formation adopts the member that is made of naphthalene, by like this, for example in the reflow process when electronic-component module is welded in mounting object, can be easily and positively remove the absorption surface member of formation or its volume is reduced, thereby can positively eliminate the state that absorption surface member of formation upper end is higher than the surface mounted device upper end of lift-launch in the electronic device prime field, make the present invention have actual effect more.
Naphthalene is that fusing point is that 81 ℃, boiling point are 217 ℃ sublimate, and fusing point guarantees the temperature height than the goods of common electronic-component module, and under reflux temperature generating gasification, therefore be suitable as the absorption surface member of formation and use.
In addition, in the electronic device prime field, carry a plurality of surface mounted devices, on than higher position, the upper end of the highest surface mounted device among a plurality of surface mounted devices, form under the situation of absorption surface simultaneously, can not have influence on any surface mounted device among a plurality of surface mounted devices that carried, can more positively utilize adsorption head to adsorb absorption surface.
But in the present invention, the position that absorption surface is set is not limited only to the position higher than the highest surface mounted device upper end, also absorption surface can be arranged on than on the low position, the highest surface mountable member upper end.
For example, the highest surface mounted device is installed in a part of zone of electronic device prime field, in major part, install under the situation than its low surface mounted device, on than high position, the upper end that is installed on the surface mounted device in the major part, form absorption surface, by like this, when even the upper end of the highest surface mounted device is positioned at than the higher position of this absorption surface, utilize adsorption head to adsorb this absorption surface problem that also has nothing special.
Therefore, in the present invention, height, the allocation position of absorption surface can be decided, promptly installing device lift-launch face arbitrary shape can be formed according to different situations.
In addition, because electric equipment manufacturing method of the present invention has: the operation of utilizing the installation method of electronic-component module of the present invention, electronic-component module being installed on mounting objects such as motherboard, keep electronic-component module that it is installed on mounting object so can utilize adsorption head positively to adsorb, make electronic equipment effectively with electronic-component module, productivity is improved, electronic equipment can be provided at low cost.
In addition, electronic-component module of the present invention has under the melt temperature of the scolding tin that is adopted when utilizing scolding tin to install can generating gasification, liquefaction, the absorption surface member of formation of any situation that softening and volume reduces, lift-launch face one side that this member is carrying surface mounted device, on the position that is higher than the surface mounted device upper end, set with solid-state, thereby forming utilizes adsorption head to adsorb the absorption surface of usefulness, so in installation procedure, by adsorb the adsorption plane of absorption surface member of formation with adsorption head, can use automatic erector to wait effectively installs, and, for example in the reflow process when installing with the method for reflow soldering, can be easily and positively remove the absorption surface member of formation, and its volume is reduced or be out of shape, thereby can eliminate the state that absorption surface member of formation upper end is higher than the surface mounted device upper end of lift-launch in the electronic device prime field effectively.
Therefore, can provide a kind of can be in installation method of the present invention employed electronic-component module.
In addition, by in the electronic device prime field, carrying a plurality of surface mounted devices, form absorption surface on the higher position, the highest surface mounted device upper end among than a plurality of surface mounted devices, can not have influence on any surface mounted device among a plurality of surface mounted devices that carried, can more positively utilize adsorption head to adsorb absorption surface, make the present invention have actual effect more.
Description of drawings
Fig. 1 is the figure of structure of the electronic-component module main body of the expression electronic-component module that constitutes the embodiment of the invention 1.
Fig. 2 is the figure of structure of the electronic-component module of the expression embodiment of the invention 1.
Fig. 3 is that explanation is used adsorption head absorption, kept the electronic-component module of the embodiment of the invention 1, and it is installed on figure as the method for the motherboard of mounting object.
Fig. 4 is that expression is used adsorption head absorption, kept the electronic-component module of the embodiment of the invention 1, and it is equipped on figure as the state of the motherboard of mounting object.
Fig. 5 is the electronic-component module that adsorption head absorption, the maintenance embodiment of the invention 1 are used in expression, and it is equipped on motherboard as mounting object, remove the absorption surface member of formation then, handle again, thereby the upper end of having eliminated the absorption surface member of formation is higher than the figure of the state that is installed in the highest surface mounted device upper end in the electronic device prime field.
Fig. 6 is the figure of electronic-component module structure of the expression embodiment of the invention 2, and being expression is equipped on state diagram as the motherboard of mounting object with it.
Fig. 7 represents the electronic-component module of the embodiment of the invention 2 is equipped on the motherboard, the volume of absorption surface member of formation is reduced, handle again, thereby the upper end of having eliminated the absorption surface member of formation is higher than the figure of the state that is equipped on the highest surface mounted device upper end in the electronic device prime field.
Fig. 8 is the figure of the electronic-component module structure of the expression embodiment of the invention 3.
Fig. 9 represents the electronic-component module of the embodiment of the invention 3 is equipped on motherboard, make the distortion of absorption surface member of formation then, handle again, thereby the upper end of having eliminated the absorption surface member of formation is higher than the figure of the state that is equipped on the highest surface mounted device upper end in the electronic device prime field.
Figure 10 is the figure of variation of the electronic-component module of the expression embodiment of the invention 3.
Figure 11 is the figure of electronic-component module in the past that expression has the metal cap of sealing surfaces installing device.
Figure 12 is that expression replaces metal cap and utilizes the figure of the electronic-component module that obtains behind the castable resin sealing surfaces installing device.
Figure 13 is the figure that electronic-component module that expression will be in the past is installed on the installation method of mounting object such as motherboard.
Figure 14 is the figure that electronic-component module that expression will be in the past is installed on the installation method of mounting object such as motherboard.
Label declaration
1 electronic device prime field (ceramic substrate)
2 surface mounted devices
The 2a capacitor
2b resistance
The 2c transistor
The 2d coil
6 terminal electrodes
10 electronic-component module main bodys
The 12a absorption surface
13 adsorption heads
14 motherboards
15 terminal pad electrodes
16 scolding tin pastes
20 electronic-component modules
T 1More be partial to the height of upside than the upper surface of electronic device prime field
T 2The identical height of height with the highest surface mounted device
T 3Take place volume reduce and be out of shape after the height of absorption surface member of formation
Embodiment
Represent embodiments of the invention below, and the place as feature of the present invention is described in further detail.
Embodiment 1
(1) at first, as shown in Figure 1, prepare electronic-component module main body 10, the structure of this electronic-component module main body is: be formed for the terminal electrode 6 that is connected with motherboard as mounting object on lower surface one side of electronic device prime field (in the present embodiment for ceramic substrate) 1, and on upper surface one side of this electronic device prime field 1, carried surface mounted device 2 (for example, capacitor 2a, resistance 2b, transistor 2c, coil 2d).
(2) then, make naphthalene (C as aromatic hydrocarbon 10H 8) flow into electronic-component module main body surface one side 10, that carried surface mounted device 2 with liquid state, after making its curing, lapped face is the upper surface among Fig. 2, makes it smooth, forms to have with this and utilizes adsorption head to adsorb the absorption surface member of formation 12 of the absorption surface 12a of usefulness.By like this, obtain the electronic-component module 12a of structure shown in Figure 2, among this module 12a, carry lift-launch surface one side of surface mounted device 2 (capacitor 2a, resistance 2b, transistor 2c, coil 2d), be higher than as the position configuration of the upper end of the transistor 2c of the highest surface mounted device the absorption surface 12a that absorption surface member 12 utilizes adsorption head 13 (with reference to Figure 13) to be adsorbed with formation.In addition, the naphthalene that constitutes absorption surface member of formation 12 in this electronic-component module 20 is that absorption surface member of formation 12 can positively be removed in reflow process near the normal temperature and goods guarantee to exist with solid-state form under the temperature (for example 75 ℃), the material of generating gasification under the scolding tin temperature in following reflow process.
(3) then, as shown in Figure 3, Figure 4, the upper surface of the absorption surface member of formation 12 of the electronic-component module 20 that utilizes adsorption head 13 to adsorb to have absorption surface member of formation 12 is surperficial 12a, by like this, can keep electronic-component module 20, and it is equipped on motherboard 14 as mounting object.At this moment, scolding tin paste 16 in printing in advance on the terminal pad electrode 15 of motherboard 14.
(4) then, stop to utilize the absorption that adsorption head 13 carries out and adsorption head 13 is risen, then electronic-component module 20 is sent in the reflow ovens with motherboard 14, by under about 220 ℃, 5 minutes condition, carrying out heat treated, make the scolding tin fusion in the scolding tin paste 16, as shown in Figure 5, the terminal electrode 6 of electronic-component module 20 is connected and be fixed on the terminal pad electrode 15 of motherboard 14, absorption surface member of formation 12 gasifications that are made of naphthalene are removed.
As mentioned above, in the installation method of the electronic-component module of this embodiment 1, in installation procedure, by utilizing adsorption head 13 to adsorb the absorption surface 12a of absorption surface member of formation 12, can utilize the adsorption head 13 of automatic erector etc. to control electronic-component module easily and positively and install 20, attach it to effectively on the motherboard 14.
In addition, in the reflow soldering operation when mounted, because 12 gasifications of absorption surface member of formation positively are removed, so as shown in Figure 5, can make electronic-component module 20 under the state that forms absorption surface member of formation 12, than the upper surface of the electronic device prime field 1 height T of upside more 1(Fig. 5) be reduced to and the identical height T of height as the transistor 2c of the highest surface mounted device 2, can realize the significantly low back of the bodyization of electronic-component module.
Embodiment 2
Fig. 6 is the figure of structure of the electronic-component module 20 of the expression embodiment of the invention 2, and being expression is installed on figure as the state of the motherboard of mounting object with it, the figure of the state of Fig. 7 after to be expression be installed in the electronic-component module 20 of Fig. 6 on the motherboard 14.
In addition, in Fig. 6 and Fig. 7, the part that indicates same numeral with Fig. 1～5 is represented identical or suitable part.
The structure of the electronic-component module 20 of this embodiment 2 is: absorption surface member of formation 12 volume in the operation of reflow soldering reduces, and to make it be lower than the highest surface mounted device that is installed in the electronic device prime field 1 be the upper end of transistor 2c.
In addition, the electronic-component module 20 of this embodiment 2, as described in the situation of embodiment 1, except following described structure, other structure, manufacture method, installation method are identical with the situation of the foregoing description 1, and this structure is: in the reflow soldering operation, do not remove whole absorption surface member of formation 12, but by reducing its volume, making its upper end be lower than the highest surface mounted device that is installed in the electronic device prime field 1 is the upper end of transistor 2c.
In addition, in this embodiment 2,, also be the naphthalene (C that adopts as aromatic hydrocarbon as absorption surface member of formation 12 10H 8).
Naphthalene is to heat and the material of generation distillation, if heating-up temperature uprises or heating time is elongated, then as described in the situation of above-mentioned embodiment 1, all generating gasification and complete obiterations, but by adjusting heating-up temperature or heating time, can only remove the part of absorption surface member of formation 12, can become the residual state of in addition part, promptly form the state that volume reduces.
In addition, as the absorption surface member of formation of the electronic-component module 20 that can be used in this embodiment 2 with material, material that promptly volume reduces in reflow process, can use the resin that shrinks by the polymerization reaction equal-volume, for example, sneak into bubble in advance in resin, the deaeration when utilizing heating is used for reducing the material of cumulative volume etc.
In addition, under the situation of the electronic-component module 20 of this embodiment 2, for example electronic-component module 20 is sent into reflow ovens with motherboard 14, by in the temperature that is lower than the foregoing description 1, for example carry out 5 minutes heat treated under 200 ℃ the temperature, its volume is reduced, thereby can make the position of its upper surface become lower than the height of highest face temperature installing device (transistor) 2c.
Under the situation of the electronic-component module 20 of this embodiment 2, after refluxing, residual thickness T 3Absorption surface member of formation 12 (Fig. 7), but owing to the height T of its thickness than the highest surface mounted device (transistor) 2c 2Little, thus as shown in Figure 7, can make electronic-component module 20 under the state that forms absorption surface member of formation 12, than the upper surface of the electronic device prime field 1 height T of upside more 1(Fig. 6) be reduced to and the identical height T of height as the transistor 2c of the highest surface mounted device 2
Embodiment 3
Fig. 8 is the figure of structure of the electronic-component module 20 of the expression embodiment of the invention 3, and to be expression be installed on the figure of the state behind the motherboard 14 with the electronic-component module 20 of Fig. 8 to Fig. 9.
In addition, in Fig. 8 and Fig. 9, the part that indicates same numeral with Fig. 1～5 is represented identical or suitable part.
In the electronic-component module 20 of this embodiment 3, by deform under the reflux temperature, its position, upper end is as the absorption surface member of formation 12 that material constituted below the height of the transistor 2c of the highest surface mounted device, under the state that the upper surface that makes it from electronic device prime field 1 floats, dispose, and the upper surface of absorption surface member of formation 12 is worked as the absorption surface 12a that utilizes adsorption head to adsorb.
In addition, the electronic-component module 20 of this embodiment 3, except as absorption surface member of formation 12, adopt in the operation of reflow soldering, deform and the material of the position step-down of upper end beyond, other structure, manufacture method, installation method are identical with the situation of the foregoing description 1.
In addition, in the electronic-component module 20 of this embodiment 3, as absorption surface member of formation 12 employed materials, can use melt temperature or softening temperature to be higher than the various materials that goods guarantee temperature and are lower than reflux temperature, for example betanaphthol (fusing point: 285 ℃ of 123 ℃, boiling point) etc.
Under the situation of the electronic-component module 20 of this embodiment 3, in the operation of reflow soldering, 12 distortion of absorption surface member of formation, thickness becomes T 3(Fig. 9), because this thickness T 3Height than the highest surface mounted device (transistor) 2c is low, thus as shown in Figure 9, can make electronic-component module 20 under the state that has formed absorption surface member of formation 12, than the electronic device prime field 1 upper surface height T of upside more 1Be reduced to and the identical height T of height as the transistor 2c of the highest surface mounted device 2
In addition, deform as possessing by under the reflux temperature, and the position of its upper end form as the material below the height of the transistor 2c of the highest surface mounted device the electronic-component module of absorption surface member of formation 12, be not limited only to above-mentioned structure shown in Figure 8, as shown in figure 10, its structure can also be: configuration absorption surface member of formation 12 makes its middle body projection in electronic device prime field 1, and makes to liken to and want the upper surface of high absorption surface member of formation 12 for the height of the transistor 2c of the highest surface mounted device and become absorption surface 12a.
Like this too in the structure of Figure 10, absorption surface member of formation 12 is out of shape in the operation of reflow soldering, as shown in Figure 9, because the position of its upper end is at the height T of the transistor 2c of the highest surface mountable member of conduct 2Below, thus as shown in Figure 9, can make electronic-component module 20 under the state that has formed absorption surface member of formation 12, than the electronic device prime field 1 upper surface height T of upside more 1Be reduced to and the identical height T of height as the transistor 2c of the highest surface mounted device 2
In addition, the present invention is not limited only to the foregoing description, concrete shape according to the absorption surface member of formation, collocation method, constitute the structure of the electronic device prime field of electronic-component module, carry the kind of the surface mounted device in the electronic device prime field, be used for being higher than the condition etc. of the state of surface mountable member upper end by the upper end of removing the absorption surface member of formation or make its distortion eliminate the absorption surface member of formation, in scope of invention, can increase various application or distortion.
Practicality on the industry
As mentioned above, if adopt the present invention, then in installation procedure, adsorb suction by utilizing adsorption head The absorption surface of subordinate list face member of formation can use Auto-mounting device etc. to control easily and positively, has Effect ground is installed. After installing, owing to positively removed the upper end height of absorption surface member of formation State in the upper end of carrying the surface mount device in the electronic device prime field is so can realize goods The final low back of the body.
In addition, carry out at the same time being higher than lift-launch at the electronics device for the upper end of eliminating the absorption surface member of formation The upper end of the surface mountable member in the part prime field and the processing implemented, and weld electronics at mounting object In the situation of the reflow process during device blocks, do not need to arrange special operation, just can implement above-mentioned place Reason.
In addition, by adopting the installation method of electronic-component module of the present invention, can make efficiently and have The electronic equipment of electronic-component module, and can improve productivity.
Therefore, the present invention can be widely used in the various technology of the operation with mounting electronic device module The field is widely applicable for the manufacturing field of the electronic equipment that is equipped with electronic-component module especially.

Claims (9)

1. the installation method of an electronic-component module is characterized in that,
Comprise:
Surface electronic-component module, that carried a described surface mounted device side that constitutes surface mounted device being equipped in the electronic device prime field, on high position, the upper end of specific surface installing device, utilize adsorption head to adsorb the operation of state configuration absorption surface member of formation of the absorption surface of usefulness with formation;
Keep described electronic-component module by utilizing adsorption head to adsorb described absorption surface, and it is equipped on the operation of mounting object; And
After described electronic-component module is equipped on mounting object, the state that is higher than the upper end of the described surface mounted device that is equipped on described electronic device prime field for the upper end of removing described absorption surface member of formation, remove described absorption surface member of formation, perhaps make the operation of its distortion.
2. the installation method of electronic-component module as claimed in claim 1 is characterized in that,
Described absorption surface member is organic member, removes this member or makes the operation of its distortion be at least
(a) make described organic Build Out operation by heating;
(b) operation that the volume of described organic member is reduced by heating;
(c), not to make the change in volume of described organic member but make a operation among the operation that its shape changes by heating.
3. the installation method of electronic-component module as claimed in claim 1 or 2 is characterized in that,
Described electronic-component module is carried on the mounting object that printed the scolding tin paste, welding and it is being installed under the situation of mounting object by backflow, the operation that makes the operation of the scolding tin fusion in the scolding tin paste that is printed on the mounting object surface and remove described absorption surface member of formation or make its distortion reflow process when described electronic-component module is welded in mounting object is being implemented simultaneously.
4. the installation method of electronic-component module as claimed in claim 3 is characterized in that,
Described absorption surface member of formation all exists with solid form up to the earlier stage of described reflow process, according to the scolding tin temperature in the described reflow process and generating gasification, liquefaction, softening and volume any one situation among reducing.
5. as the installation method of each the described electronic-component module in the claim 1～4, it is characterized in that,
It is the member that is made of naphthalene that described absorption surface is installed member of formation.
6. as the installation method of each the described electronic-component module in the claim 1～5, it is characterized in that,
A plurality of surface mounted devices are equipped on described electronic device prime field, and simultaneously the higher position, upper end of the highest surface mounted device forms described absorption surface among than described a plurality of surface mounted devices.
7. the manufacture method of electronic equipment, it is a kind of manufacture method that has the electronic equipment of electronic-component module on mounting object, it is characterized in that,
Possesses each described method of utilizing in the claim 1～6 is installed electronic-component module on described mounting object operation.
8. electronic-component module, it is a kind of electronic-component module that surface mounted device is equipped on the electronic device prime field and constitutes, it is characterized in that,
In lift-launch face one side of having carried described surface mounted device, on than higher position, the upper end of described surface mounted device, have absorption surface member of formation with the solid state configuration, utilize adsorption head to adsorb the absorption surface of usefulness thereby form; Described absorption surface member of formation with can generating gasification according to the melt temperature of employed scolding tin in the installation of being undertaken by welding, the condition of liquefaction, softening and volume any situation among reducing constitutes.
9. electronic-component module as claimed in claim 8 is characterized in that,
In described electronic device prime field, carry a plurality of surface mounted devices, on than higher position, the upper end of the highest surface mounted device among described a plurality of surface mounted devices, form described absorption surface.
CN2006800350475A 2005-09-22 2006-07-28 Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module Active CN101273679B (en)

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EP1928222A1 (en) 2008-06-04
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KR20080034035A (en) 2008-04-17
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US7650692B2 (en) 2010-01-26
US20100085722A1 (en) 2010-04-08
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KR100949473B1 (en) 2010-03-29
CN101273679B (en) 2011-05-04

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