CN101262210B - Piezoelectric vibrator and fabricating method thereof - Google Patents
Piezoelectric vibrator and fabricating method thereof Download PDFInfo
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- CN101262210B CN101262210B CN2008100893720A CN200810089372A CN101262210B CN 101262210 B CN101262210 B CN 101262210B CN 2008100893720 A CN2008100893720 A CN 2008100893720A CN 200810089372 A CN200810089372 A CN 200810089372A CN 101262210 B CN101262210 B CN 101262210B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
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Abstract
The present invention relates to piezoelectric vibrators and a fabricating method. The piezoelectric vibrators, such as a resonator used as a timing element, discriminator, filter or the like, and fabricating methods thereof. The piezoelectric vibrators of the present invention may be fabricated by forming a piezoelectric body of piezoelectric sheets, of which the thickness is controlled, and simultaneously sintering the sheets along with cover layers, on which grooves are formed. Also, the piezoelectric vibrator of the present invention is fabricated by laminating the piezoelectric sheets, of which the thickness is controlled, providing internal electrodes between the sheets, and forming external electrodes insulated from the internal electrodes.
Description
The application is that former national applications number is 038228580 (international application no is PCT/KR2003/001965), and national applications day is on September 26th, 2003, and former denomination of invention is divided an application for " piezoelectric vibrator with and manufacture method ".
Technical field
The present invention relates to a kind of piezoelectric vibrator,, be used as timing element, discriminator, filter etc. such as a kind of resonator, with and manufacture method, particularly relate to a kind of piezoelectric vibrator of the lamination that fits, and have high and stable frequency of oscillation, with and manufacture method.
Background technology
For the integrated circuit (IC) that can use the main element in the various electronic components, need a pulse reference clock that is used for IC, development according to the IC technology, various electronic components can be controlled most microprocessor separately by single large-scale integrated (LSI) circuit that similarly is the single-chip microprocessor.Most microprocessor is to be used as timing element with ceramic resonator, because the resonator of pottery is stable, non-adjustable and tight, and cost of manufacture is low, and its application is extensive day by day.
Recently, when the usefulness of electronic component and speed improvement, need to increase the resonator frequency of oscillation, therefore need exploitation to have resonator than high oscillation frequency, producing stable vibration, when electronic component become more tight the time, also need resonator closely.
As shown in Figure 1, a kind of known ceramic resonator comprises a single flat ceramic piezoelectric body 101, and polished its thickness that makes corresponds to sintering desired frequency later on; Electrode 102 is to utilize film to form processing procedure to form on the surface, up and down of piezoelectric body 101; The cover layer 103 of insulation wherein is formed with vibration groove 104; And outer electrode 105, be formed on piezoelectric body and the cover layer outside.In this example, electrode 102 can be a different shape, so can cause energy trapping, the manufacture method of this known ceramic resonator as shown in Figure 2, at first, utilize general powder casting method will as ceramic powders piezoelectric body 101 pressings of piezoelectric body be cast as square, this piezoelectricity give birth to embryo main body (greenbody) can be sintered, with the rhombus saw cut, and polishing up to the frequency of thickness corresponding to expection.Utilize sputter being processed into formation electrode 102 on the piezoelectric body 101 with certain thickness; Then piezoelectric body is carried out one adjustment (polling) and handle, this adjusts to handle and can allow the piezoelectric body of pottery that piezoelectricity is arranged, and by applying electric field to the electrode of piezoelectric ceramics main body, can allow eelctric dipole arrange along same direction.Shown in Fig. 2 (b), wherein utilize epoxy 110 will have the cover layer 103 of vibration groove 104 to bind in the up and down of piezoelectric body part, be formed with electrode on it; Use general powder casting method with piezoelectricity or living embryo main body of dielectric ceramic powder sintering and produce cover layer.In this example, cover layer is to form with casting, it has been designed to vibration groove and has been formed on the cover layer, as shown in the figure, after binding piezoelectric body and up and down cover layer, cut the chip component 106 that main body after the bonding among Fig. 2 (c) just can obtain a unit, outer electrode 105 is formed on the outside of chip unit, each is connected with each electrode 102 in being formed on unit chip component 106, shown in Fig. 2 (d).Fig. 1 is the sectional structure chart along chip component cross section I-I.Then, cast or surface mount packaged chip element is finished ceramic resonator with epoxy, because the frequency of oscillation in the resonator with MHz band can be inversely proportional to its thickness, in order to increase frequency of oscillation, the thickness of piezoelectric body just must approach, therefore in order to make single flat type piezoelectric resonator have high frequency of oscillation, must utilize the thickness that grinds piezoelectric body to continue to reduce, but because a lot of problems are arranged in the manufacturing process of reality, similarly be to be difficult on the whole surface of piezoelectric body of grinding to obtain uniform flatness, and when handling, break, so known method is met just before the restriction of making the high-frequency resonance device, so manufacturing speed reduces and the cost of manufacture increase.
Because these reasons, just develop a kind of resonator of higher coordination vibration (harmonic vibration) of the high progression vibration that utilizes single flat type piezoelectric main body.
Plain filter with MHz band uses because the energy trapping of thickness vibration or the vibration of thickness shearing, if electrode is formed on the whole surface of piezoelectric substrate, just be difficult to obtain splendid resonance characteristics by the higher coordination vibration of contour vibration (profilevibration).If but electrode has on the surface that is formed on piezoelectric substrate of part, between the zone that has the regional of electrode and do not have electrode to exist, have interface, because the standing wave of vibration can occur near in the electrode zone that has a common boundary, catch the energy trapping of vibrational energy also can produce.Though a plurality of electrodes can be formed in the substrate with predetermined space or above-mentioned space, energy trapping can provide independently resonance characteristics, in this example, used energy trapping, the thickness shearing vibration frequency range that adopts can be between 2-8Mz, and the thickness vibration frequency range that adopts can be between 8-16MHz.In any case,, can adopt the resonator of the thickness vibration that uses the vibration of the 3rd and the 5th utmost point because actual application similarly is the high-frequency that Mobile Communications node, CD-ROM, HDD etc. need to surpass 20MHz; That is to say, the higher coordination vibration of wavelength 2L/n (n is an integer) that comprises lowest vibration frequency (fundamental) ripple of wavelength 2L can occur on the piezoelectric substrate of thickness L, offset each other because n is the vibration meeting of even number, having only n is that the vibration of odd number can occur; That is to say that three grades, Pyatyi, seven grades etc. comprise that the vibration of lowest vibration frequency can produce.The resonance frequency of higher coordination vibration can be created in the lowest vibration frequency wave f of integer
1, the manifestation mode of three grades of vibrations and Pyatyi vibration is respectively as f for instance
3=3f
1With f
5=5f
1
That is to say, piezoelectric body is with the vibration of the vibration mode regularity of lowest vibration frequency, wherein the thickness of piezoelectric body is the wavelength of half, and vibration can be the odd-multiple of lowest vibration frequency, it similarly is three times, five times, seven times etc., use higher coordination vibration, can obtain surpassing the resonator of 16MHz, but because use the resonator of higher coordination vibration to have little amplitude, it is higher that the driving voltage of rectilinear oscillation can become, and frequency is because the situation that the vibration of the vibration of lowest vibration frequency is jumped can take place.
In addition, even vibrate above three grades when the higher coordination of use, because in order to obtain surpassing the frequency of oscillation of 50MHz, the thickness of piezoelectric body must approach, but operability or workability can regress therefore very difficult making piezoelectric element.
Summary of the invention
The objective of the invention is to, provide a kind of new piezoelectric vibrator with and manufacture method, technical problem to be solved is to make it have the frequency of oscillation of expection and stable oscillating characteristic, but simultaneously also thin and combine closely with workability, thereby is suitable for practicality more.
Another object of the present invention is to, a kind of manufacture method of new piezoelectric vibrator is provided, technical problem to be solved is to make it can increase processing procedure speed and reduction cost of manufacture, but it is simplified and has excellent workability and an improved operability, the piezoelectric vibrator that has various structures with making, thus be suitable for practicality more.
A further object of the present invention is, a kind of chip stable, complete, combination is provided, and technical problem to be solved is to make its oscillating characteristic of being dwindled the unit chip and being obtained expecting by one chip by the making capacitor, thereby is suitable for practicality more.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
In order to achieve the above object, can reach by utilizing the piezoelectric body that forms piezoelectric sheet according to the making of piezoelectric vibrator of the present invention, wherein control thickness, and while is along these thin slice sintering cover layers, fluted formation on it.In addition, the making of piezoelectric vibrator of the present invention can utilize the lamination piezoelectric sheet to reach, and wherein control thickness provides internal electrode between thin slice, and formation and the internal electrode outer electrode of keeping apart.
More specifically, for the piezoelectric vibrator of the present invention that reaches above-mentioned purpose comprises a piezoelectric sheet, be formed on the up and down internal electrode on the zone of piezoelectric sheet, cover layer and outer electrode, one of them cover layer is formed on each zone, up and down of the piezoelectric sheet that is formed with internal electrode, each outer electrode all is connected with each internal electrode, the cover layer that is formed on the piezoelectric sheet has vibration groove, the making of piezoelectric sheet is to utilize the thin slice that forms pulpous state to form, and the making of vibrator can form by while sintering piezoelectric sheet and cover layer, in such example, vibration groove can be between piezoelectric sheet and cover layer.
Cover layer can comprise one deck first cover layer that wherein is formed with a through hole and one deck second cover layer that covers through hole, vibrator may further include first and second surperficial outer electrode, it is formed on the tectal surface, and each all is connected with each outer electrode, and one the 3rd surperficial outer electrode, it is the mid portion that is formed at tectal surface, and can not be connected with outer electrode, and wherein the outer side covers layer farthest of vibrator is a dielectric medium.This vibrator may further include at least one dielectric sheet, wherein be formed with internal electrode, wherein dielectric sheet by lamination and with the top of vibrator with and/or the lower part combine, in such example, vibrator is the form of three nodes, that is to say that outer electrode can be connected with a capacitor part of mid portion with the internal electrode of piezoelectric and at the two ends of vibrator respectively.
Again, in order to achieve the above object, the step of manufacturing of foundation vibrator provided by the invention comprises the living embryo thin slice of a plurality of piezoelectricity of making the pulpous state making with predetermined composition; Utilization forms the through hole as vibration groove in the predetermined thin slice of giving birth to the embryo thin slice, form first upper caldding layer and first lower caldding layer; Through the through hole that forms in the predetermined thin slice of giving birth to the embryo thin slice at piezoelectricity as burning gallery, to form second upper caldding layer and second lower caldding layer; A predetermined thin slice that uses described piezoelectricity to give birth to the embryo thin slice forms initiatively thin slice of a vibration; Internal electrode on vibration initiatively forms one between thin slice and first upper caldding layer, and at vibration following internal electrode of formation between thin slice and the first time active cover layer initiatively; Difference lamination first upper caldding layer and first lower caldding layer on the zone, up and down of vibration active thin slice, and difference lamination difference lamination second upper caldding layer and second lower caldding layer on the zone, up and down of first upper caldding layer and first lower caldding layer; While sintering laminate; And the formation outer electrode, each all is connected with each internal electrode on laminate.
Form the tectal step in first up and down and can comprise that one organic thickener of usefulness is filled in the step in the tectal at least one through hole in first up and down; And the step of sintering laminate comprises the step of utilizing heat treatment to remove organic substance together simultaneously.The step that forms internal electrode comprises the initiatively step of the up and down internal electrode on the surface, up and down of thin slice of one printing vibration, in such example, form the step of internal electrode down and can comprise that one printing is filled with the step of following internal electrode of first lower caldding layer of organic thickener.
Moreover in order to achieve the above object, the step of manufacturing of foundation vibrator provided by the invention comprises the living embryo thin slice of a plurality of piezoelectricity of making the pulpous state making with predetermined composition; Form a lower caldding layer and form a following internal electrode thereon as organic pattern of vibration groove by printing on the predetermined thin slice of giving birth to the embryo thin slice with organic thickener at piezoelectricity; , and the organic pattern of corresponding described vibration groove form a through hole as burning gallery; Form a vibration active thin slice and form an organic pattern thereon through internal electrode in the formation on the predetermined thin slice of giving birth to the embryo thin slice at piezoelectricity as vibration groove; Burning gallery through forming on the predetermined thin slice of giving birth to the embryo thin slice at piezoelectricity corresponding to the organic pattern that is used as vibration groove forms upper caldding layer; Lamination lower caldding layer, vibration in regular turn be thin slice and upper caldding layer initiatively; Remove organic substance with the formation vibration groove by the heat treated laminate, and while sintering laminate; And the formation outer electrode, each outer electrode is connected with each internal electrode on the laminate.
Cover layer can comprise the through hole as burning gallery, can link up with environment facies by these through hole organic substances, these internal electrodes and outer electrode can be similarly to be that glass printing (screen printing) or thin film deposition similarly are that sputter, evaporation, chemical vapour deposition (CVD) or colloid are coated with and form by using thick thin film deposition.
In addition, in order to achieve the above object, according to the invention provides a kind of vibrator, comprise internal electrode,, it is not connected with outer electrode on the vibrator by the pattern of the internal electrode in the control vibrator.
In addition, in order to achieve the above object,, comprise that a lamination unit has two piezoelectric sheets at least according to the invention provides a kind of vibrator; Internal electrode is formed between the piezoelectric sheet of lamination; And outer electrode is formed on the outside of lamination unit; Wherein by the pattern of control internal electrode, internal electrode is not connected with outer electrode.
Each outer electrode can be formed on each of lamination unit upper and lower with lateral region on, vibrator may further include insulator on the up and down of lamination unit portion zone, wherein can form a vibration groove on insulator; Vibrator may further include conductive channel, pass the lamination unit and can not be connected with inner member, and each is connected with each outer electrode; Vibrator may further include three node electrodes has vibration groove to form on thereon the surface in of insulator; Vibrator can comprise that the piezoelectric element of at least one dielectric medium and lamination combines.In such example; dielectric medium is a flat board lamination or single; a conduct has the dielectric medium substrate of the capacitor of node can be installed on the lower part of lamination unit, and over cap that is used for protected location can be installed in the top of lamination unit.And; a dielectric base that is formed with outer electrode can be installed on the lower part of lamination unit; and an over cap that is used for protected location may be installed in the top of lamination unit, and this lamination unit and insulator can be that the epoxy that has of giving birth to embryo is used for protected location.
In addition, in order to achieve the above object, according to the manufacture method that the invention provides a kind of vibrator, its step comprises the living embryo thin slice of a plurality of piezoelectricity of making the pulpous state making with predetermined composition; Giving birth to the internal electrode that formation can not be connected with outer electrode on the embryo thin slice; Lamination is formed with at least two thin slices of internal electrode on it; The sintering laminate; And form the outer electrode that is not connected in the outside of laminate with internal electrode.
In addition, in order to achieve the above object, according to the manufacture method that the invention provides a kind of vibrator, its step comprises the living embryo thin slice of a plurality of piezoelectricity of making the pulpous state making with predetermined composition; Form through hole at the two ends of giving birth to the embryo thin slice; The formation internal electrode when through hole is filled with the thickener of conduction, can not contact with through hole, and can not be connected with outer electrode by internal electrode on the embryo thin slice giving birth to; Lamination at least two thin slices; The sintering laminate; And form in the outside of laminate and not to be connected and and the outer electrode that is connected with the conducting paste of through hole with internal electrode.
Internal electrode can form on the part surface of thin slice, so internal electrode can have distance with the edge of thin slice, the formation of internal electrode and outer electrode is that to utilize thick thin film deposition similarly be glass printing, or thin thin film deposition similarly is sputter, evaporation, chemical vapour deposition (CVD) or colloid coating.
Via as can be known above-mentioned, the invention relates to a kind of piezoelectric vibrator with and manufacture method.This piezoelectric vibrator such as a kind of resonator, is used as timing element, discriminator, filter etc.The making of piezoelectric vibrator of the present invention can utilize the piezoelectric body that forms a kind of piezoelectric sheet, controls its thickness, simultaneously along thin slice sintering cover layer, can be formed with groove on it then.In addition, the making of piezoelectric vibrator of the present invention can utilize the lamination piezoelectric sheet, controls its thickness, and internal electrode is provided between thin slice, and the outer electrode of formation and internal electrode insulation isolation.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is a kind of profile of common single flat resonator;
Fig. 2 is a kind of exemplary view of making common single flat resonator;
Fig. 3 is the exemplary view according to a kind of manufacture method of first embodiment of the invention;
Fig. 4 is the exemplary view according to a kind of manufacture method of second embodiment of the invention;
Fig. 5 is the exemplary view according to a kind of manufacture method of third embodiment of the invention;
Fig. 6 is the exemplary view according to a kind of manufacture method of fourth embodiment of the invention;
Fig. 7 is the diagram according to a kind of resonator of fifth embodiment of the invention;
Fig. 8 is a kind of equivalent electric circuit diagram with resonator of built-in capacitor;
Fig. 9 a to Fig. 9 e be according to the structure of a kind of resonator of sixth embodiment of the invention with and the diagram of manufacture method;
Figure 10 a and Figure 10 b be according to the structure of a kind of resonator of seventh embodiment of the invention with and the diagram of manufacture method;
Figure 11 is a kind of vibration diagram of single flat resonator;
Figure 12 a and Figure 12 b are the vibration diagrams according to a kind of resonator of a wiring diagram;
Figure 13 a and Figure 13 b be according to the structure of a kind of resonator of eighth embodiment of the invention with and the diagram of manufacture method;
Figure 14 a to Figure 14 d be according to the structure of a kind of resonator of the ninth embodiment of the present invention with and the diagram of manufacture method;
Figure 15 a and Figure 15 b be according to the structure of a kind of resonator of the tenth embodiment of the present invention with and the diagram of manufacture method;
Figure 16 a and Figure 16 b be according to the structure of a kind of resonator of the 11st embodiment of the present invention with and the diagram of manufacture method;
Figure 17 is a kind of resonator structure according to twelveth embodiment of the invention;
Figure 18 is a kind of resonator structure according to thriteenth embodiment of the invention; And
Figure 19 is a kind of resonator structure according to fourteenth embodiment of the invention.
101,311,1301,1401,1501,1601,1701,1801,1901: piezoelectric body
102: electrode 104,315,412: vibration groove
1003,1508,1808: vibration groove
105,316,317,414,415,705,706,707,708: outer electrode
908,909,1008,1009,1010,1809,1810,1811,1902: outer electrode
110: epoxy resin 106: chip component
103,301,302,304,305,401,403,501,502: cover layer
504,505,601,603,703,904,906,907: cover layer
306,506,604,1412: through hole
307: thickener
308,309,405,406,702,902,1002,1005: internal electrode
1006,1007,1302,1402,1502,1602,1702,1802: internal electrode
303,312,410,701,901,913,914,915,1001,1004: piezoelectric sheet
1014,1015,1311,1411,1509,1510,1511,1615: piezoelectric sheet
310,408: give birth to embryo rectangular 402,503,602: vibration is thin slice initiatively
409: unit chip (piezoelectric element) R: piezoelectric resonator part
C, C1, C2, C
L, C
U: capacitor part
905,910,911,912,1004,1016,1017: the dielectric medium thin slice
1018,1011,1012,1616,1617: the dielectric medium thin slice
1303,1403,1503,1603,1703,1803: top electrode
1304,1404,1504,1604,1704,1804: bottom electrode
1305,1306,1505,1506,1605,1606: the side electrode
1705,1706,1805,1806: the side electrode
1307,1407,1612,1709,1903: external node
1309,1409: over cap 1507: insulator
1310,1410,1613: dielectric base 1308,1611,1707: the conductive bond agent
1406: conductive channel 1413: determine the space
1512: go up insulating lid 1513: following insulating lid
1607,1708,1807: dielectric body 1609: capacitor side electrode
1608: inner capacitor electrode 1610: outer electrode under the dielectric medium
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the piezoelectric vibrator that foundation the present invention is proposed with and its embodiment of manufacture method, structure, manufacture method, step, feature and effect thereof, describe in detail as after.
Such as resonator according to the example of vibrator of the present invention, with and preparation method thereof will be in the detailed explanation of following do.
(embodiment 1)
See also shown in Figure 3ly, will describe in detail according to a kind of manufacture process that runs through the resonator of cellular type of the present invention.
The present invention uses a kind of as piezoelectric vibrator, can be used for the undressed material powder that industry is made, perhaps the unprocessed material powder that also can form with the piezoelectricity that similarly is expections such as PZT, PLZT.In order to prepare living embryo thin slice, by being that the cement at the end stirs and mixes with above-mentioned piezoelectric body ceramic powders and ethanol and as the PVB of additional agent, and with a kind of spherical grinder it is ground and to make slurry in 24 hours, use cast strip, scalpel etc. that slurry is made a plurality of piezoelectricity with expection thickness and give birth to embryo thin slice (301 to 305), in this example, can similarly be that the various parameters in viscosity, the scalpel wait the thickness of controlling the living embryo thin slice of piezoelectricity by the state of adjusting slurry.
In the manufacturing process of thin slice, with perforator a plurality of through holes 306 are formed on thin slice 302,304, these a plurality of through holes 306 can be different shapes, such as rectangle, circle or oval, all can aim at the internal electrode of vibrator so these a plurality of through holes 306 can be positioned.By inserting in through hole 306 with glass printing similarly is the thickener 307 that carbon paste (paste) or PVB-or PVA-organic thickener of being the end etc. can toast, produce the first up and down cover layer 302,304, the filling of these through holes is to be caved in by pressing because give birth to the embryo thin slice after lamination and before reducing for fear of these through holes.The following internal electrode 308 that is formed for vibrator on the thin slice 302 of these thin slices can be finished first lower caldding layer, through hole can be filled with thickener therein, through hole in thin slice 302 can be aimed at preposition, wherein descending internal electrode 308 can be these metalloids such as gold, platinum, with the thick film deposition that similarly is screen painting, or similarly be the metal electrode of the thin film deposition formation of sputter, evaporation, chemical vapour deposition technique or colloid coating.By the last internal electrode 309 that forms vibrator on piezoelectric sheet 302 and form a vibration active thin slice, wherein do not form through hole, and its thickness can be controlled in tens of microns, the precalculated position of piezoelectric sheet 303 can be corresponding to following internal electrode, internal electrode 309 can be metal electrodes such as the gold that utilizes sputter, platinum on it, or utilizes the conducting paste of glass printing printing.Be filled in the first up and down cover layer 304 of through hole except above-mentioned organic thickener, beyond 302 the production method, the first up and down cover layer 304,302 can simply make and not need organic thickener, that is to say that the first up and down cover layer can form by form a plurality of through holes in thin slice, the up and down internal electrode can be formed on the surface, up and down of piezoelectric sheet, wherein be not formed with through hole, and its thickness can be controlled, and all can aim at through hole so the up and down internal electrode can form them.But, the first up and down cover layer 304,302 making can utilize at the first up and down cover layer 304, inserting organic thickener in 302 the through holes in one of them forms, for instance, the making of first lower caldding layer can form by the following internal electrode 308 of only inserting organic thickener and formation vibrator in the through hole of first lower caldding layer 302.
It is rectangular 310 to utilize the above-mentioned thin slice of producing of lamination to produce living embryo that comprises a plurality of unit chip, is second lower caldding layer 301, first lower caldding layer 302, vibration initiatively thin slice 303, first upper caldding layer 304 and second upper caldding layer 305 in regular turn.
Give birth to embryo rectangular 310 and can and cut into unit chip 311 by pressing, for by firing unit chip to remove cement and the various organic substances in thin slice and through hole, it is following with baking that this unit chip can be heated to 300 degree Celsius, then form at a sintering temperature piezoelectricity by increasing temperature, utilize while sintering vibration thin slice and cover layer to finish piezoelectric unit 311, organic substance in the tectal through hole in up and down follow in thin slice equally can be burned with remove, allow the vibration groove 315 of vibrator vibration so can form.
On the two ends of the piezoelectric element 311 of above-mentioned sintering and making, form outer electrode 316,317 and carry out set-up procedure and finish piezoelectric vibrator, so outer electrode can be respectively and internal electrode 308,309 are connected, and in order to provide piezoelectricity can utilize electric field to aim at a direction by eelctric dipole.Fig. 3 (d) is the section of structure of the piezoelectric vibrator finished, wherein staggered face similar to shown in Fig. 2 (d).
Because internal electrode 308,309 can be formed on the surface, up and down of thin piezoelectric sheet 312, the resonator of making of aforesaid way can have high frequency of oscillation corresponding to the thickness of thin piezoelectric sheet, thus wherein thickness can be controlled the thickness that can reach expection and not need when making the piezoelectric body of thin slice similarly be extra fabrication steps such as grinding.In addition, because the element that obtains is to utilize lamination piezoelectric sheet and cover layer and carry out sintering simultaneously, but work ratio can improve and processing procedure can be simplified, and therefore can make the element of various structures easily.
(embodiment 2)
See also shown in Figure 4ly, below will describe a kind of fabrication steps in detail according to the applied resonator of organic material provided by the invention.
Use the mode identical, make a plurality of piezoelectricity life embryo thin slices 401 with predetermined thickness with embodiment 1.
Using on the thin slice 401 in the thin slice of above-mentioned making similarly is that carbon paste, PVB-or PVA-are organic thickener that can toast at the end, adopt the organic pattern 404 of glass printing formation as vibration groove, these organic patterns can be different shapes, similarly be rectangle, circle and ellipse etc., these organic patterns can have predetermined thickness, so after baking, can be formed with the vibration groove of desired depth, can aim at the internal electrode of vibrator so add the location vibration groove.The making of lower caldding layer 401 is by forming the following internal electrode 405 as vibrator on the thin slice of organic pattern, wherein descends internal electrode can utilize the metal electrodes such as gold, platinum of sputter, or utilizes that conducting paste forms in the glass printing printing.The vibration initiatively making utilization of thin slice 402 is formed for internal electrode 406 on the vibrator on a piezoelectric sheet, with its THICKNESS CONTROL at aforesaid tens of micron, utilize aforesaid way on last internal electrode, to form organic pattern 407 then, wherein go up metal electrodes such as gold that internal electrode 406 can utilize sputter, platinum, or utilize that conducting paste forms in the glass printing printing.
The making that contains the living embryo rectangular 408 of a plurality of unit chip is above-mentioned in regular turn by lower caldding layer 401, vibration initiatively thin slice 402, the thin slice that constitutes with upper caldding layer 403 by lamination.
Give birth to embryo rectangular 408 and can and cut into unit chip 409 by pressing, for remove fire after the unit chip between the thin slice with among various cements and organic substance, chip unit can be heated to 300 degree Celsius with the baking of getting off, then utilize the temperature while sintering vibration thin slice and the overlaminate electric device under the temperature that a sintering piezoelectricity is formed that increase, finish piezoelectric element.Because burning is used for vibration groove when removing organic substance in the thin slice between the cover layer of up and down organic pattern 404,407 also can be processed be in the lump fallen, so can form the vibration groove 412 that allows vibrator vibrate.
On piezoelectric element 409 two ends of aforesaid way making and sintering, form outer electrode 414,415 and promptly finish piezoelectric vibrator by carrying out set-up procedure, outer electrode can be respectively and internal electrode 405,406 are connected, and for provide piezoelectricity can apply an electric field by eelctric dipole towards same direction.Fig. 4 (d) is the section of structure of the piezoelectric vibrator finished, wherein section plane similar to shown in Fig. 2 (d).
Because internal electrode 405,406 can be formed on the surface, up and down of thin piezoelectric sheet 410, the resonator of making of aforesaid way can have high frequency of oscillation corresponding to the thickness of thin piezoelectric sheet.In addition, because the element that obtains is to utilize lamination piezoelectric sheet and cover layer and carry out sintering simultaneously, but work ratio can improve and processing procedure can be simplified, and therefore can make the element of various structures easily.
(embodiment 3)
See also shown in Figure 5ly, below will describe in detail and a kind ofly run through the fabrication steps that cellular type has the resonator of burning gallery according to provided by the invention.
Use the mode identical, make a plurality of piezoelectricity life embryo thin slices with predetermined thickness with embodiment 1.In addition, first lower caldding layer 502 of present embodiment, vibration active thin slice 503 and first upper caldding layer 504 can be the same with first lower caldding layer 302, vibration active thin slice 303 and first upper caldding layer 304 of embodiment 1.Burrow with two thin slices of drilling machine on the thin slice of making then and form one deck second upper caldding layer 505 and one deck second lower caldding layer 501, wherein have a plurality of through holes 506 as burning gallery.In this example, can be positioned as the through hole 506 of burning gallery, so can aim on first with first lower caldding layer 504,502 in as the through hole of vibration groove.
The rectangular making of living embryo that contains a plurality of unit chip is by the above-mentioned thin slice that is made of second lower caldding layer 501, first lower caldding layer 502, vibration active thin slice 503, first upper caldding layer 504 and second upper caldding layer 505 in regular turn of lamination.
The rectangular meeting of this living embryo is by pressing and cut into unit chip, fire unit chip various cements and the organic substance between thin slice and through hole later in order to remove, chip unit can be heated to 300 degree Celsius with the baking of getting off, then utilize the temperature while sintering vibration thin slice and the overlaminate electric device under the temperature that a sintering piezoelectricity is formed that increase, finish piezoelectric element.In this example, because burning is when removing organic substance in the thin slice, the organic substance in through hole can be burned and be removed easily and pass burning gallery, allows the vibration groove of vibrator vibration so can form.
Epoxy with sealing usefulness is sealed the up and down burning gallery of the piezoelectric element of aforesaid way making, and the fabulous outer electrode that allows of formation external electric is connected with internal electrode on the two ends of piezoelectric element, promptly finishes piezoelectric vibrator.
Because internal electrode can be formed on the surface, up and down of thin piezoelectric sheet, the resonator of making of aforesaid way can have high frequency of oscillation corresponding to the thickness of thin piezoelectric sheet.In addition,, and utilize lamination thin slice and structure sheaf and carry out sintering simultaneously, but therefore work ratio can improve and can make the element of various structures easily because various organic substance can be removed fast by burning gallery.
(embodiment 4)
See also shown in Figure 6ly, below will describe a kind of fabrication steps in detail according to the applied resonator of organic material provided by the invention.
Use the mode identical, make a plurality of piezoelectricity life embryo thin slices with predetermined thickness with embodiment 1.In addition, except the following and upper caldding layer 601 in the present embodiment, the 603rd, beyond punching, one deck lower caldding layer 601 of present embodiment, vibration active thin slice 602 and one deck upper caldding layer 603 can be the same with lower caldding layer 401, vibration active thin slice 402 and the upper caldding layer 403 among the embodiment 2.That is to say, the making of lower caldding layer 601 is before forming organic pattern and following internal electrode, the a plurality of through holes 604 that utilize drilling machine to form as burning gallery form, the generation type of wherein organic pattern and following internal electrode is as described in the embodiment 2, is to form by the upper caldding layer 603 that utilizes drilling machine to punch on the thin slice of making as the formation of a plurality of through holes 604 of burning gallery.In this example, can be positioned as the through hole 604 of burning gallery, and aim at initiatively organic pattern of thin slice of vibration.
The rectangular making of living embryo that contains a plurality of unit chip is above-mentioned in regular turn by lower caldding layer 601, vibration initiatively thin slice 602, the thin slice that constitutes with upper caldding layer 603 by lamination.
The rectangular meeting of this living embryo is by pressing and cut into unit chip, for remove with the burning unit chip in thin slice and down with upper caldding layer and the cement and the various organic substance that vibrate between the active thin slice, chip unit can be heated to 300 degree Celsius with the baking of getting off, then utilize the temperature while sintering vibration thin slice and the overlaminate electric device under the temperature that a sintering piezoelectricity is formed that increase, finish piezoelectric element.In this example, because in the time of the organic substance that burns and remove in the thin slice, organic substance between the thin slice can be burned and be removed easily and pass burning gallery at cover layer and vibration, on the position that organic pattern exists, can produce the space, so can form the vibration groove that allows vibrator vibrate.
Epoxy with sealing usefulness is sealed the up and down burning gallery of the piezoelectric element of aforesaid way making, and the fabulous outer electrode that allows of formation external electric is connected with internal electrode on the two ends of piezoelectric element, promptly finishes piezoelectric vibrator.
Because internal electrode can be formed on the surface, up and down of thin piezoelectric sheet, the resonator of making of aforesaid way can have high frequency of oscillation corresponding to the thickness of thin piezoelectric sheet.In addition,, and utilize lamination thin slice and structure sheaf and carry out sintering simultaneously, but therefore work ratio can improve and can make the element of various structures easily because various organic substance can be removed fast by burning gallery.
(embodiment 5)
In order to allow the piezoelectric element vibration, need a capacitor, a kind of resonator that makes in conjunction with capacitor can be used as a kind of resonator that built-in capacitor is arranged, and this has the resonator of built-in capacitor to give a detailed account below.
Fig. 7 is a kind of resonator with built-in capacitor according to embodiment 5.
The resonator with built-in capacitor of embodiment 5 comprises a piezoelectric resonator part R and a capacitor part C.Piezoelectric resonator part R comprises the piezoelectric sheet 701 with piezoelectricity, be formed on the lip-deep internal electrode 702 in up and down of piezoelectric sheet, be formed on the surface, up and down of piezoelectric sheet and wherein be formed with the cover layer 703 of vibration groove, and being formed on outer electrode 705 on piezoelectric sheet and the cover layer opposite end, each all is connected with each internal electrode; Capacitor part C comprises a dielectric medium main body, at this cover layer 703 is exactly as the dielectric medium function, first and second surperficial outer electrode 706,707 are formed on the surface of dielectric body and are connected with outer electrode respectively, and one the 3rd surperficial outer electrode 708, be formed in the middle of the surface of dielectric body and keep apart with outer electrode 705.
This piezoelectric resonator partly has internal electrode to be formed on the surface, up and down of piezoelectric sheet, wherein with THICKNESS CONTROL high oscillation frequency to obtain expecting within tens of microns, plate dielectric medium can be formed on the surface, up and down of piezoelectric sheet and have vibration groove, and outer electrode each all be connected with each internal electrode, and be formed on piezoelectric sheet and tectal two opposite ends; The structure of capacitor part is that three surperficial outer electrodes can be formed on any one surface of up and down dielectric medium, can be formed with vibration groove on it.
Manufacture method with resonator of built-in capacitor will be in the detailed explanation of following do.
Use the method making piezoelectric body identical with embodiment 1 to 4, the up and down cover layer of piezoelectric body is to constitute with the dielectric medium with predetermined composition, that is to say, use the dielectric medium original material powder that can be used for commercial Application, it has predetermined dielectric medium and forms.Give birth to the embryo thin slice in order to prepare dielectric medium, utilization interpolation cement is in the dielectric medium ceramic powders and use general pulpous state manufacture method to produce slurry, with scalpel or similar instrument slurry is made the dielectric with predetermined thickness and give birth to the embryo thin slice, give birth to the up and down cover layer that the embryo thin slice is made vibrator with the dielectric of the method use identical with embodiment 1 to 4, element body then is by lamination, cuts with the step of while sintering and make.
Equivalent electric circuit by Fig. 8 can see, the resonator of finishing with built-in capacitor includes resonator and capacitor in the unit chip that with dashed lines indicates, capacitor C1 wherein, and C2 can be connected respectively to two ends of resonator.
Because there is the resonator of the built-in capacitor of this spline structure to have internal electrode on thin surface, piezoelectric sheet up and down, can obtain high oscillation frequency corresponding to the thickness of thin piezoelectric sheet; Because the cover layer that is formed with vibration groove is to form with dielectric medium, cover layer can be used as capacitor in addition, so capacitor can be included in the unit chip, so can make element closely, so just can apply to electronic component closely easily.
(embodiment 6)
Fig. 9 is a kind of resonator with built-in capacitor according to embodiment 6.The resonator with built-in capacitor of embodiment 6 comprises a piezoelectric resonator part R and a capacitor part C.Piezoelectric resonator part R comprises the piezoelectric sheet 901 with piezoelectricity, be formed on the lip-deep internal electrode 902 in up and down of piezoelectric sheet, be formed on the surface, up and down of piezoelectric sheet and wherein be formed with the cover layer 904 of vibration groove, and being formed on side outer electrode 908 on piezoelectric sheet and the cover layer opposite end, each all is connected with each internal electrode; Capacitor part C comprises a dielectric medium thin slice 905; Be formed on the dielectric medium thin slice and each all is connected to first inner capacitor electrode 906 of side outer electrode 908; And be formed on the dielectric medium thin slice, separate with side outer electrode 908, and be connected to second inner capacitor electrode 907 that is formed on the intermediary outside electrode 909 on piezoelectric sheet and the tectal front side.
This piezoelectric resonator partly has internal electrode to be formed on the surface, up and down of thin piezoelectric sheet, wherein with THICKNESS CONTROL high oscillation frequency to obtain expecting within tens of microns, the cover layer that then has vibration groove to form thereon can be formed on the surface, up and down of piezoelectric sheet, this capacitor department branch and piezoelectric resonator partly combine, the dielectric medium thin slice that wherein has inner capacitor electrode to form thereon can be by lamination, and controls its capacitance by adjusting the internal electrode pattern on the dielectric medium thin slice and the dielectric medium thin slice quantity of lamination.
Capacitor part C can paste piezoelectric resonator part R shown in Fig. 9 a below part, upper section shown in Fig. 9 b or the up and down quadrate part branch shown in Fig. 9 c.
See also shown in Fig. 9 d, the manufacture method with resonator of built-in capacitor will be in the detailed explanation of following do.
Use the method identical with embodiment 1 to 4 to form piezoelectric sheet and form electrode thereon, make as piezoelectric resonator piezoelectric sheet 913,914,915 partly being used for, upper caldding layer 915 can be piezoelectricity material or dielectric material.
In order to make capacitor part, use industrially, have the dielectric medium original material powder that predetermined dielectric medium is formed; Give birth to the embryo thin slice in order to prepare dielectric medium, utilization interpolation cement is in the dielectric medium ceramic powders and use general pulpous state manufacture method to produce slurry, slurry is made dielectric medium thin slice 910,911,912 with scalpel or similar instrument with predetermined thickness.
The making of first dielectric medium 911 is by forming first inner capacitor electrode 906 on the above-mentioned dielectric medium thin slice of making in the unit chip of separating at dashed lines, first inner capacitor electrode can be separated mutually each other, its each can be connected with each outer electrode 908 of side at the every side of unit chip; In addition, the making of the second dielectric medium thin slice 912 is that utilization formation second inner capacitor electrode 907 on another dielectric sheet forms, wherein second inner capacitor electrode 907 can be connected with the intermediary outside electrode 909 on the front side of unit chip, and have at interval with the unit chip two ends, inner capacitor electrode on the per unit chip and outer electrode structure are shown in Fig. 9 e.
Dielectric medium thin slice 910 to 912 can be by lamination with piezoelectric sheet 913 to 915, the dielectric medium thin slice can be controlled according to the predetermined capacitance of reaching by the dielectric medium thin slice quantity of lamination by lamination on the piezoelectric resonator or lower part or up and down two parts.
The making of unit chip element body is to cut with the dielectric medium thin slice and the piezoelectric resonator of sintering lamination partly form simultaneously by using with the same method of embodiment 1 to 4.
Side outer electrode 908 can be formed on the two ends of unit chip element body, and wherein each side outer electrode 908 is connected with each internal electrode 902 and each first inner capacitor electrode 906 of piezoelectric resonator part; The intermediary outside electrode 909 that is connected to second inner capacitor electrode 907 can be formed on the front side in the outside of unit chip element; Then, can finish piezoelectric vibrator by carrying out set-up procedure, for provide piezoelectricity can apply electric field by eelctric dipole towards same direction.
Equivalent electric circuit by Fig. 8 can see, the resonator of finishing with built-in capacitor includes resonator and capacitor in the unit chip that with dashed lines indicates, capacitor C1 wherein, and C2 can be connected respectively to two ends of resonator.In such example, the resonator of the built-in capacitor in Fig. 9 c can have maximum capacitance, because on the parallel individual nodes that is connected to resonator that has that two capacitors are separated by.
Because there is the resonator of the built-in capacitor of this spline structure to have internal electrode on thin surface, piezoelectric sheet up and down, can obtain high oscillation frequency corresponding to the thickness of thin piezoelectric sheet; In addition because the resonator of built-in capacitor is the piezoelectric resonator part and the laminate of dielectric sheet, wherein there is internal electrode to be formed on the dielectric sheet as capacitor, capacitor can be included in the unit chip, therefore element closely can be made, so just electronic component closely can be applied to easily.
(embodiment 7)
According to embodiment 7, Figure 10 a illustrates a kind of resonator of built-in capacitor, and the resonator of the built-in capacitor of embodiment 7 comprises a piezoelectric resonator part R, a following capacitor part C
L, and one go up capacitor part C
U
Piezoelectric resonator part R comprises a piezoelectric sheet 1001 with piezoelectricity, be formed on the internal electrode 1002 on the up and down part of piezoelectric sheet, be formed on the up and down part of piezoelectric sheet and wherein be formed with the cover layer of vibration groove 1003, and be formed on the relative two sides of piezoelectric sheet and each side outer electrode 1008,1009 that is connected with each internal electrode 1002.Following capacitor part C
LComprise a dielectric medium thin slice 1004; Be formed on the surface of dielectric medium thin slice, and first inner capacitor electrode 1005 that is connected with side outer electrode 1008; And one be formed on the dielectric medium thin slice and separate with side outer electrode 1008,1009, and be connected to second inner capacitor electrode 1007 that the intermediary outside electrode 1010 that is formed on the piezoelectric body front side is connected.Last capacitor part C
UComprise another piezoelectric sheet 1004; The 3rd inner capacitor electrode 1006 that is formed on the piezoelectric body front side; And be formed on the dielectric medium thin slice, be separated by with side outer electrode 1008,1009 and leave, and be connected to second inner capacitor electrode 1007 of intermediary outside electrode 1010.
Piezoelectric resonator partly has the up and down part of internal electrode at thin piezoelectric sheet, wherein, then on the part of the up and down of piezoelectric sheet, be formed with the cover layer (dielectric layer just) of vibration groove with THICKNESS CONTROL high oscillation frequency to obtain expecting within tens of microns.
This capacitor department branch and piezoelectric resonator partly combine, the dielectric medium thin slice that wherein has inner capacitor electrode to form thereon can be by lamination, and controls its capacitance by adjusting the internal electrode pattern on the dielectric medium thin slice and the dielectric medium thin slice quantity of lamination.Specifically, capacitor part comprises down capacitor part, is bonded together with the lower part of piezoelectric resonator, and links together with any one node (outer electrode just) of piezoelectric resonator; And go up capacitor part, can be bonded together with the top of piezoelectric resonator, and link together with other nodes (outer electrode just) of piezoelectric resonator.
See also shown in Figure 10 b, the manufacture method with resonator of built-in capacitor will be in the detailed explanation of following do.
Use the method identical to form piezoelectric sheet and also form electrode thereon with embodiment 1 to 4, to be used for making dielectric medium thin slice 1014 as the piezoelectric resonator part, 1015, up and down cover layer 1016,1013 can be dielectric material, and in order to as the part of capacitor and as cover layer.
In order to make capacitor part, use industrially, have the dielectric medium original material powder that predetermined dielectric medium is formed; Give birth to the embryo thin slice in order to prepare dielectric medium, utilization interpolation cement is in the dielectric medium ceramic powders and use general pulpous state manufacture method to produce slurry, with scalpel or similar instrument slurry is made the dielectric medium with predetermined thickness and give birth to embryo thin slice 1011 to 1013,1016 to 1018.
The making of the first dielectric medium thin slice 1012 is can be connected outer electrode 1008 on the every side of unit chip by forming first inner capacitor electrode, 1005, the first inner capacitor electrodes on the above-mentioned dielectric medium thin slice of making in the unit chip of separating at dashed lines; The second dielectric medium thin slice 1013,1016 making is that utilization formation second inner capacitor electrode 1007 on other dielectric sheet forms, wherein in unit chip, second inner capacitor electrode 1007 can be connected with the intermediary outside electrode 1010 on the front side of unit chip, and has at interval with the unit chip two ends; The making of other the 3rd dielectric medium thin slice 1017 is that utilization formation the 3rd inner capacitor electrode 1006 on another dielectric medium thin slice forms, wherein in unit chip, the 3rd inner capacitor electrode 1006 can be connected with the outer electrode 1008 on other sides of unit chip.
Dielectric medium thin slice and piezoelectric sheet can be by laminations, be to constitute dielectric sheet 1011, the first dielectric medium thin slice 1012, the second dielectric medium thin slice 1013, the dielectric medium thin slice 1014 of capacitor down in regular turn, 1015, the second dielectric medium thin slice 1016, the 3rd dielectric medium thin slice 1017 and formation go up the dielectric sheet 1018 of capacitor, in such example, can be controlled according to the predetermined capacitance of reaching by the dielectric medium thin slice quantity of lamination.
The making of unit chip element body is to cut with the dielectric medium thin slice and the piezoelectric resonator of sintering lamination partly form simultaneously by using with the same method of embodiment 1 to 4.
Side outer electrode 1008 can be formed on the two ends of unit chip element body with side outer electrode 1009, wherein side outer electrode 1008 can be connected with the internal electrode 1002 and first inner capacitor electrode 1005 of piezoelectric resonator part, and wherein side outer electrode 1009 can be connected with the internal electrode 1002 and the 3rd inner capacitor electrode 1006 of piezoelectric resonator part, the preceding of element body and or near zone on have the intermediary outside electrode 1010 that is connected to the second capacitor outer electrode 1007 and form.Then, finish piezoelectric vibrator by set-up procedure, wherein for provide piezoelectricity can apply electric field by eelctric dipole towards same direction.
Equivalent electric circuit by Fig. 8 can see that the resonator of finishing with built-in capacitor includes resonator and capacitor in the unit chip that with dashed lines indicates, and wherein capacitor can be connected respectively to two ends of resonator.
Because there is the resonator of the built-in capacitor of this spline structure to have internal electrode on thin surface, piezoelectric sheet up and down, can obtain high oscillation frequency corresponding to the thickness of thin piezoelectric sheet; In addition because the resonator of built-in capacitor is the piezoelectric resonator part and the laminate of dielectric sheet, wherein there is internal electrode to be formed on the dielectric sheet as capacitor, capacitor can be included in the unit chip, therefore element closely can be made, so just electronic component closely can be applied to easily.
(embodiment 8)
Have among the several in the above embodiment of vibrator of high oscillation frequency and mention, wherein the making of vibrator is to form by while sintering piezoelectric body, piezoelectric body be by the piezoelectric sheet of accurate control thickness with and on be formed with vibration groove cover layer make, comprise that at ensuing embodiment the vibrator with high oscillation frequency in the present embodiment is a plurality of piezoelectric sheets by the accurate control thickness of lamination, between piezoelectric sheet, form internal electrode, and the pattern of control internal electrode.
At first, see also Figure 11, shown in Figure 12 a and Figure 12 b, the vibrator of the design producing that utilizes the control internal electrode or the vibration principle of resonator will be described.As shown in figure 11, allow the frequency of oscillation of the flat resonator of list of thickness T be fa, the whole thickness of resonator is 2T in this example, be together with two resonator laminations, the thickness of each is T, shown in Figure 12 a and Figure 12 b, the frequency of oscillation of resonator can change along with the twice of the electrode cable in two laminations resonator together.Frequency that is to say that if the target shown in the polarity of up and down electrode and Figure 12 a is different, wavelength can increase can twice, so the frequency of oscillation of the fundamental of resonator vibration can become 1/2fa, so can become the frequency shown in Figure 11 half.But, if the polarity of top electrode is different with the polarity of bottom electrode, shown in Figure 12 b, if and target (or internal electrode) does not set up lead, because can being recharged to make, the surface, up and down of element electrically becomes (+) and (-) respectively, just as electric field is applied on the capacitor, and wavelength meeting thereby reduce by half, therefore the frequency of oscillation of resonator can become fa, and the frequency of being mentioned with Figure 11 is the same.That is to say,, can obtain identical frequency of oscillation, therefore can utilize the resonator that single flat type piezoelectric main body attenuation of resonator is obtained having high oscillation frequency though resonator lamination number of plies amount together increases.In addition because utilize will have same thickness single flat type piezoelectric main body lamination together, but can obtain expecting the element of thickness and workability, and the connection by control electrode can be manufactured with the vibrator of preset frequency and thickness.
See also shown in Figure 13 a, a kind of resonator of present embodiment will be described.
Resonator comprises a piezoelectric body 1301 with piezoelectricity; Be formed on the internal electrode 1302 on the piezoelectric body; A top electrode 1303 and a bottom electrode 1304 are respectively formed at the up and down part of piezoelectric body, and upper/lower electrode is applied power supply; Side electrode 1305,1306 is connected respectively to top electrode 1303 and bottom electrode 1304; External node 1307; And over cap 1309.Internal electrode 1302 is not connected with top electrode 1303, bottom electrode 1304 and side electrode 1305,1306; Side electrode 1305,1306 can be formed on two relative edges of piezoelectric body; Top electrode 1303 can be connected respectively to side electrode 1305 and side electrode 1306 with bottom electrode 1304, and each also all is connected to each external node 1307 on two relative edges of piezoelectric body; Over cap 1309 can coat whole piezoelectric body protection is provided.
Piezoelectric body is the piezoelectric sheet structure of a lamination; wherein thickness can be controlled in tens of microns to obtain high frequency of oscillation; internal electrode can be printed on the part of thin slice or the almost whole surface; so internal electrode can separate with the end of thin slice; with not with thin piezoelectric sheet on side; the up and down outer electrode links together; understand further the lower part of piezoelectric body and dielectric base 1310 combines; by form through hole in the dielectric base both sides; external node 1307 can be formed in the through hole; these external nodes can have in the conductive bond agent 1308 in the both sides of piezoelectric body; link together with side and last outer electrode and side and following outer electrode, the piezoelectric body that is formed with whole electrodes can coat and protection by protected crown cap 1309.
See also shown in Figure 13 b, the manufacturing process of such resonator is described.
Use the method identical with embodiment 1, making has the piezoelectricity of predetermined thickness and gives birth to embryo thin slice 1311, utilization similarly is thick film such as a glass printing deposition or such as thin film depositions such as sputter, evaporation, chemical vapour deposition (CVD) or colloid coatings, in thin slice, form internal electrode 1302, so can separate not to be connected with the end of thin slice with the edge of thin slice.In such example, the distance between the spacer defection between internal electrode 1302 and the chip edge and other opposite sides of internal electrode 1302 and thin slice is different.
The thin slice that is formed with internal electrode on it with the predetermined quantity lamination together, so the space interval between internal electrode 1302 and the side electrode 1305 can and internal electrode 1302 and side electrode 1306 between different after, by laminate being cut into the lamination piezoelectric body 1301 that unit element (indicating as dotted line) comes production unit's element, heating to remove the various joint compositions in the laminate, after the baking laminate, with the temperature that increases sintering laminate under the sintering temperature that piezoelectricity is formed.
The top electrode 1303 that is formed on above-mentioned piezoelectric body of making 1301 outsides can't link together with the internal electrode 1302 of laminate with bottom electrode 1304, side electrode 1305,1306 can be formed on the both sides of piezoelectric body, and link together with the up and down electrode respectively, in such example, upper and lower and the formation side outer electrode are by similarly being thick film deposition such as glass printing or such as thin film depositions such as sputter, evaporation, chemical vapour deposition (CVD) or colloid coatings.Figure 13 b (c) is a profile that the complete element that outer electrode forms is arranged, similar among its section and Fig. 2 (d).
Cutting step be that power supply is fed on two outer electrodes of the piezoelectric body that electrode forms, so the piezoelectricity dipole can be in the same way, at the piezoelectric body device that will cut after on the dielectric base, use the conductive bond agent at each outer electrode at piezoelectric body two ends and pasted each external node, wherein external node can be formed in the through hole in two ends of dielectric base; Usually can use the protection crown cap to cover the piezoelectric body that is installed on the dielectric base and just finish resonator element later on.
There is the resonator of this spline structure on thin piezoelectric sheet, to form internal electrode, can obtains high oscillation frequency corresponding to thin piezoelectric sheet thickness; Can obtain having the element of predetermined thickness in addition by the lamination piezoelectric sheet, but can improve workability, so just can apply to electronic component closely easily.
(embodiment 9)
See also shown in Figure 14 a to Figure 14 d, will be at the resonator in the following explanation embodiments of the invention 9.
See also shown in Figure 14 a, the resonator of present embodiment comprises a piezoelectric body 1401 with piezoelectricity; Internal electrode 1402; Top electrode 1403 and bottom electrode 1404 are respectively formed on the surface, up and down of piezoelectric body, and can apply power supply thereon; External node 1407; And over cap 1409 that coats whole piezoelectric body.Internal electrode 1402 can be formed in the element body, and can not be connected with top electrode 1403 and bottom electrode 1404; External node 1407 can be connected with last and bottom electrode respectively by conductive channel 1406, and wherein conductive channel can pass piezoelectric body and keep apart with internal electrode.
Piezoelectric body is the laminate of piezoelectric sheet, wherein thickness can be controlled in tens of microns to obtain high frequency of oscillation, internal electrode can be printed on the part or approaching whole surface of thin slice, so internal electrode can be not adjacent with the up and down outer electrode on thin piezoelectric sheet, and can keep apart with the conductive channel as through hole; The lower part of piezoelectric body can be further in conjunction with dielectric base 1410; utilization forms through hole in the dielectric base both sides; can in through hole, form external node 1407; each external node can be pasted each up and down outer electrode of the both sides, below of piezoelectric body by the conductive bond agent, and 1409 coverings of piezoelectric body meeting protected seam and the protection that form all electrodes are lived.
The manufacturing process of such resonator will elaborate following.
Use the method identical with embodiment 1, making has the piezoelectricity of predetermined thickness and gives birth to embryo thin slice 1411, arrange in front that with perforator a plurality of living embryo thin slice both sides that make form the through hole 1412 as conductive channel, internal electrode and conducting paste can be formed on the thin slice of through hole, so internal electrode can not contact with conductive channel, internal electrode and through hole inside can be printed simultaneously.In such example, internal electrode can be printed on definite space 1413 on the almost whole surface on the thin slice that the conductive channel by through hole rises, shown in Figure 14 c; Or with the separated sheet segment of the conductive channel of through hole surface on, shown in Figure 14 d.
The lamination predetermined quantity have internal electrode to form thereon thin slice after, it is cut into unit element (shown in dotted line) to produce the lamination piezoelectric body as the identical element line, after utilizing the heated baking laminate, increasing temperature sintering laminate under a precise dose in order to remove the various joint compositions in laminate.Top electrode and bottom electrode can be formed on the laminate outside of sintering, and it can't be connected to the internal electrode of each laminate.In this example, each up and down electrode all can be kept apart with internal electrode, and is connected with the conducting paste of each through hole, apply power supply to the outer electrode of piezoelectric body to carry out set-up procedure, make the piezoelectricity dipole can same in the past direction.With above-mentioned piezoelectric body device after on the dielectric base, use the conductive bond agent to pass through conductive channel, each outer electrode of piezoelectric body is pasted on the external node of dielectric base, and wherein node can be formed in the through hole in dielectric base two ends.Then, in order to coat piezoelectric body, can use the protection crown cap to cover piezoelectric body usually and finish resonator element with over cap.
There is the resonator of this spline structure on thin piezoelectric sheet, to form internal electrode, can obtains high oscillation frequency corresponding to thin piezoelectric sheet thickness; Can obtain having the element of predetermined thickness in addition by the lamination piezoelectric sheet, but can improve workability, so just can apply to electronic component closely easily.
(embodiment 10)
See also shown in Figure 15 a, will be at the resonator in the following explanation embodiments of the invention 9.
The resonator of embodiment 10 comprises a piezoelectric body 1501 with piezoelectricity; Be formed on the internal electrode 1502 on the piezoelectric body; Top electrode 1503 and bottom electrode 1504 are respectively formed on the surface, up and down of piezoelectric body, and can apply power supply thereon; Side electrode 1505,1506 can be connected respectively to top electrode 1503 and bottom electrode 1504; And insulator 1507, have vibration groove on it and form.Internal electrode 1502 not can with top electrode 1503, bottom electrode 1504 and side electrode 1505,1506 are connected, each side electrode 1505,1506 can be formed on each relative edge of piezoelectric body, and insulator 1507 can be formed on the up and down part of piezoelectric body.
Piezoelectric body is the laminate of piezoelectric sheet, wherein thickness can be controlled in tens of microns to obtain high frequency of oscillation, internal electrode can be printed on the part or approaching whole surface of thin slice, so in order not to be connected with side, up and down electrode on the piezoelectric sheet, internal electrode can separate with the end of thin slice; The insulator 1507 that is formed on the up and down part of piezoelectric body is general insulation board, wherein is formed with vibration groove 1508 and allows vibrator vibrate well.
The manufacturing process of such resonator will elaborate following.
Use the method identical with embodiment 1, making has the piezoelectricity of predetermined thickness and gives birth to embryo thin slice 1509, utilize glass printing printing internal electrode 1502 on the above-mentioned thin slice, to produce a plurality of first piezoelectric sheets 1509, so internal electrode can not be connected with the edge of thin slice; On the upper surface of a piezoelectric sheet, print out top electrode 1503, to produce second piezoelectric sheet 1510, so top electrode only can be connected with the outer electrode on a lateral edges of thin slice; And bottom electrode 1504 is printed on the lower surface of another piezoelectric sheet to make the 3rd piezoelectric sheet 1511, so bottom electrode can be connected on the outer electrode at another relative edge edge of thin slice, the formation vibration groove forms up and down insulating lid 1512,1513 on the insulation board of general insulation characterisitic having.
Above-mentioned piezoelectric sheet and insulating lid can be by laminations, in regular turn for following insulating lid 1513, the 3rd piezoelectric sheet 1511, a plurality of first piezoelectric sheet 1509, second piezoelectric sheet 1510 and last insulating lid 1512, shown in Figure 15 b.The making by the element body of lamination as unit element is that it is cut into identical element line (shown in dotted line), after utilizing the heated baking laminate, increasing temperature sintering laminate under a precise dose in order to remove the various joint compositions in laminate.Make element by forming the side outer electrode, wherein each can be connected with each up and down electrode of piezoelectric body, can be formed with vibration groove on laminate two surfaces that comprise insulator.
The making of element is with insulating lid and piezoelectric body lamination sintering together and simultaneously, but element can be made the vibrator with vibratile insulator that a kind of utilization sticks together insulating lid and piezoelectric body, its insulating lid is to separate making with piezoelectric body, that is to say that the production method of piezoelectric body is identical with embodiment 8.Then, form the up and down electrode on the surface, up and down of the piezoelectric body of sintering, wherein the up and down electrode can not be connected to the internal electrode in the piezoelectric body; The formation vibration groove is made into insulating lid on the insulation board of general insulation characterisitic having, on the up and down part on the piezoelectric body that the up and down electrode is arranged, put insulating lid, comprising that forming the side outer electrode on the piezoelectric body both sides of insulator makes element, wherein each side electrode can be connected to each up and down electrode.
There is the resonator of this spline structure on thin piezoelectric sheet, to form internal electrode, can obtains high oscillation frequency corresponding to thin piezoelectric sheet thickness; Can obtain having the element of predetermined thickness in addition by the lamination piezoelectric sheet, but can improve workability, so just can apply to electronic component closely easily.
(embodiment 11)
The resonator of the built-in capacitor that shows in Figure 16 a and Figure 16 b according to present embodiment comprises a piezoelectric resonator part and a capacitor part.Piezoelectric resonator partly comprises the piezoelectric body 1601 with piezoelectricity; Be formed on the internal electrode 1602 in the piezoelectric body; A top electrode 1603 and a bottom electrode 1604 are respectively formed on the surface, up and down of piezoelectric body, and can apply power supply thereon; And first and second side electrode 1605,1606 is connected respectively to top electrode 1603 and bottom electrode 1604.Internal electrode 1602 can not be connected with top electrode 1603, bottom electrode 1604 and side electrode 1605,1606, and first and second side electrode 1605,1606 can be respectively formed on two relative edges of piezoelectric body.
Capacitor part comprises outer electrode 1610 under 1607, one capacitor sides of dielectric body outer electrode 1609, inner capacitor electrode 1608 and the dielectric medium.Inner capacitor electrode 1608 can be formed in the dielectric medium main body, and is connected to capacitor side outer electrode 1609 on the front side surface of the main body by lamination; Outer electrode 1610 can be formed on the lower part of dielectric medium main body under the dielectric medium, and separates with capacitor side outer electrode; The top electrode of resonator part and a bottom electrode of capacitor part can be by lamination one of the side electrode of main body be connected to one of external node 1612; Other side electrodes of other of the bottom electrode 1604 (top electrode of capacitor part just) of resonator part and capacitor part main body that outer electrodes can be by lamination down are connected to another external node; The internal electrode of capacitor part can be connected to other external nodes 1612 by the side outer electrode 1609 of capacitor.
Piezoelectric resonator partly is the laminate of the piezoelectric sheet that approaches, and wherein piezoelectric resonator partly has the up and down part of internal electrode at thin piezoelectric sheet, wherein with THICKNESS CONTROL high oscillation frequency to obtain expecting within tens of microns.The internal electrode of piezoelectric resonator part can be printed on the part of thin slice or near on the whole surface, for not with thin piezoelectric sheet on side, up and down outer electrode link together, internal electrode can with the edge of thin slice separately; Capacitor part is the laminate of dielectric medium thin slice, and it can be controlled the thin dielectric substance thin slice of lamination and come the control capacitance amount in order to reach predetermined capacitance; In order to be connected to external node by capacitor side outer electrode, the internal electrode of capacitor part can be printed on the heat insulating lamella of conducting paste.
Piezoelectric resonator part and capacitor department branch and are then handled with same step by lamination together.They in addition, also they separately can be made, and then combine, that is to say that piezoelectric resonator and capacitor can stick together again after separate making.
On the lower part of the resonator of built-in capacitor, can place a dielectric base 1613; form through hole; its position is to make each through hole to contact with the outer electrode of the resonator of built-in capacitor to form three external nodes 1612; dielectric base 1613 has external node and is formed in the through hole; these three external nodes can be connected on other outer electrode by conductive bond agent 1611, and the crown cap that the resonator that wherein forms the built-in capacitor of all electrodes can be used to protection component coats protection and lives.
The manufacturing process that has the resonator of built-in capacitor like this will be done explanation following.
Use the mode identical with embodiment 1, making has the piezoelectricity of predetermined thickness and gives birth to embryo thin slice 1615, utilize glass printing printing internal electrode 1602 on the above-mentioned thin slice, so internal electrode can not be connected with the edge of thin slice, in such example, the spacing distance between internal electrode 1602 and chip edge can and other opposite edges at internal electrode 1602 and thin slice between distance different.
In order to make capacitor part, use industrially, have the dielectric medium original material powder that predetermined dielectric medium is formed; Give birth to the embryo thin slice in order to prepare dielectric medium, utilization interpolation cement is in the dielectric medium ceramic powders and use general pulpous state manufacture method to produce slurry, slurry is made the dielectric medium thin slice 1616,1617 with predetermined thickness with scalpel or similar instrument.
The making of first dielectric medium 1616 be on the above-mentioned dielectric medium thin slice made from internal electrode 1608 in the conducting paste printing, so internal electrode can be connected with the outer electrode of the front side of element body; The making of second thin slice 1617 is printing top electrodes 1604 (just resonator part bottom electrode) on the above-mentioned heat insulating lamella of making, so top electrode can link together with the outer electrode on one of both sides of element body.
After first dielectric sheet 1616 and second dielectric sheet 1617 of lamination predetermined quantity, follow the piezoelectric sheet 1615 of lamination predetermined quantity, be printed with the internal electrode of resonator on it, so that the spacing distance between internal electrode and the first side electrode 1605 can be with between internal electrode and the second side electrode 1606 is different.Afterwards, the making of the lamination element of unit element is that it is cut into unit element (shown in dotted line), at heating lamination element it is toasted with after removing the various joint compositions in the lamination element, increase the element that temperature arrives sintering lamination under the accurate sintering temperature.
Except the method for while sintering laminate, the resonator of built-in capacitor also can be with formations that sticks together of resonator part and capacitor part, wherein will make resonator respectively with the capacitor manufacture method of general lamination according to the resonator manufacture method of embodiment 8 and partly form with capacitor part and with its lamination and sintering together.
Top electrode 1603 can be formed on the lamination element with bottom electrode 1610, the outside of the just above-mentioned built-in capacitor resonator of producing with diverse ways, and it can't be connected with the internal electrode of laminate.Top electrode 1603 can form and be connected with the both sides of laminate, and bottom electrode 1610 can link together with one of laminate both sides in formation, and in the middle of being isolated in; First side electrode 1605 can be formed on one side of lamination element of up and down electrode, one of bottom electrode of its top electrode 1603 that can be connected to the resonator part and capacitor part; Second side electrode 1606 can be formed on the another side of lamination element, and it can be connected to another of bottom electrode of the bottom electrode 1604 (top electrode of capacitor part just) of resonator part and capacitor part; Capacitor side outer electrode 1609 (the 3rd side outer electrode just) can be formed on the front side of lamination element, and it can link together with the internal electrode of capacitor part.On two outer electrodes of the combination that is formed with electrode and lamination element, apply power supply to carry out set-up procedure, so the piezoelectricity dipole can same in the past direction.The individual elements of in this example, separately making can be binded and make in conjunction with the element of lamination, after adjusting the resonator part, the resonator part is joined together with capacitor department branch.
The lamination element of above-mentioned making can be placed on the dielectric base; wherein external node 1612 can be formed in the through hole in the dielectric base; in dielectric base, to form three nodes; indivedual first and second side outer electrodes that two nodes are used conductive bond agent 1611 and lamination element two ends are connected together; middle external node can be connected to the 3rd side outer electrode in lamination element front side; last in order to be coated with the resonator of built-in capacitor with over cap; usually can use, on the lamination element, cover protective money and belong to the resonator that lid is just finished built-in capacitor.
Equivalent electric circuit by Fig. 8 can see that the resonator of finishing with built-in capacitor includes resonator and capacitor in the unit chip that with dashed lines indicates, and wherein capacitor can be connected respectively to two ends of resonator.
Because there is the resonator of the built-in capacitor of this spline structure to have internal electrode on thin piezoelectric sheet, can obtain high oscillation frequency corresponding to the thickness of thin piezoelectric sheet; In addition because can obtain the element of predetermined thickness, but workability can be improved, therefore element can be made easily with various structures by the lamination piezoelectric sheet.In addition, because have the resonator of built-in capacitor is a kind of kenel that comprises the unit chip of capacitor, but this steady operation, simple single-chip element with minimum can be made of simple manufacture method, and can simply be applied to electronic component closely.
(embodiment 12)
See also shown in Figure 17ly, the resonator of the built-in capacitor of embodiment 12 will be illustrated in down.
The resonator of the built-in capacitor of the present embodiment in Figure 17 comprises a piezoelectric resonator part and a capacitor part.Piezoelectric resonator partly comprises the piezoelectric body 1701 with piezoelectricity; Be formed on the internal electrode 1702 in the piezoelectric body; Be respectively formed on the up and down part of piezoelectric body and can apply a power supply top electrode 1703 and bottom electrode 1704 thereon; And side electrode 1705,1706, it can be connected respectively to top electrode 1703 and bottom electrode 1704.Internal electrode 1702 can not be connected with top electrode 1703, bottom electrode 1704 and side electrode 1705,1706, and side electrode 1705,1706 can be formed on respectively on two relative edges of piezoelectric body.
Capacitor part comprises a dielectric medium main body 1708 and the capacitor node electrode 1709 in the through hole of dielectric medium main body (external node just).Node electrodes (external node just) is used conductive bond agent 1707 and is connected with the upper and lower of piezoelectric resonator main body and side electrode.
Piezoelectric resonator partly is a kind of laminate of thin piezoelectric sheet, with THICKNESS CONTROL high oscillation frequency to obtain expecting within tens of microns, the internal electrode of piezoelectric resonator part can be printed on the part of thin slice or near on all surfaces, so in order not to be connected with side, up and down outer electrode on the thin piezoelectric sheet and can to have with the edge of thin slice at interval.Because capacitor part is to have the dielectric medium substrate that three through holes pass substrate; and wherein can form node electrodes; two capacitors can be separately connected on the individual nodes of resonator, utilize the protection crown cap to coat and protect the resonator of the built-in capacitor that is formed with whole electrodes.
Manufacture method with resonator of built-in capacitor will be in the detailed explanation of following do.
Use the piezoelectric body of the method formation lamination identical with embodiment 1, the outside at laminate forms top electrode and the bottom electrode that is not connected with the internal electrode of laminate, both sides in piezoelectric body form the side electrode that is connected respectively to the up and down electrode, apply power supply to two outer electrodes of the piezoelectric body that is formed with electrode to carry out set-up procedure, so the piezoelectricity dipole can be in the same way.The piezoelectricity of above-mentioned making boils to know from experience and is placed in the dielectric medium substrate; wherein capacitor node electrode (external node just) can be formed in the intrabasement through hole of dielectric medium with as three nodes; with cement 1,611 two node electrodes of dielectric medium substrate can be connected to respective sides outer electrode in the two ends of laminate element; generally all can use conducting metal to cover piezoelectric body and finish resonator element, to coat piezoelectric body with over cap.
Equivalent electric circuit by Fig. 8 can see that the resonator of finishing with built-in capacitor includes resonator and capacitor in the unit chip that with dashed lines indicates, and wherein capacitor can be connected respectively to two ends of resonator.
Because there is the resonator of the built-in capacitor of this spline structure to have internal electrode on thin piezoelectric sheet, can obtain high oscillation frequency corresponding to the thickness of thin piezoelectric sheet; Because utilize the lamination piezoelectric sheet can obtain the element of predetermined thickness, can improve workability in addition.Because the dielectric medium on the lower part of piezoelectric body is as capacitor and substrate, capacitor can simply be included in the unit element in addition, therefore can make simple and minimum single-chip element, and apply to electronic component closely easily.
(embodiment 13)
See also shown in Figure 180ly, the resonator of the built-in capacitor of embodiment 13 will be illustrated in down.
The resonator of the built-in capacitor of the present embodiment in Figure 18 comprises a piezoelectric resonator part and a capacitor part.Piezoelectric resonator partly comprises the piezoelectric body 1801 with piezoelectricity; Be formed on the internal electrode 1802 in the piezoelectric body; Be respectively formed on the up and down part of piezoelectric body and can apply a power supply top electrode 1803 and bottom electrode 1804 thereon; And side electrode 1805,1806, it can be connected respectively to top electrode 1803 and bottom electrode 1804.Internal electrode 1802 can not be connected with top electrode 1803, bottom electrode 1804 and side electrode 1805,1806, and side electrode 1805,1806 can be formed on respectively on two relative edges of piezoelectric body.Capacitor part comprises a dielectric medium main body 1807; First and second surperficial outer electrode 1809,1810 can be formed on the surface of dielectric medium main body and is connected to the side outer electrode; And one the 3rd surperficial outer electrode 1811, can be formed on is separated by on the surface of dielectric body and with the side outer electrode leaves.
Piezoelectric resonator partly is that a kind of flat board is a dielectric medium, and each has vibration groove 1808, is formed at the up and down part of piezoelectric resonant part, and a dielectric medium of up and down dielectric medium (capacitor part just) has surperficial outer electrode, as mentioned above.Piezoelectric resonator partly is the laminate of the piezoelectric sheet that approaches, with THICKNESS CONTROL high oscillation frequency to obtain expecting within tens of microns, the internal electrode of piezoelectric resonator part can be printed on the part of thin slice or near on all surfaces, so in order not to be connected with side, up and down outer electrode on the thin piezoelectric sheet and can to have with the edge of thin slice at interval.The structure of capacitor part is to be printed with three surperficial outer electrodes on the surface of dielectric medium, and dielectric medium wherein is formed with vibration groove 1808, conducting paste is arranged to be connected on other external node.
Manufacture method with resonator of built-in capacitor will be in the detailed explanation of following do.
Use the piezoelectric body of the method formation lamination identical with embodiment 10, the outside at laminate forms top electrode and the bottom electrode that is not connected with the internal electrode of laminate, the flat dielectric medium lid meeting device that then is formed with vibration groove 1808 on it is on the part of the up and down of the piezoelectric body of lamination, first and second surperficial outer electrode 1809,1810 each can be connected to each side electrode on one of the two ends of up and down dielectric medium, the 3rd surperficial outer electrode 1811 can separate with the side electrode in the centre, side electrode 1806 can be connected to the top electrode 1803 and first surface outer electrode 1809 of dielectric body, and side electrode 1805 can be formed on each relative edge of laminate that electrode forms, and links together with the bottom electrode 1804 and the second surface outer electrode 1810 of piezoelectric body.
Equivalent electric circuit by Fig. 8 can see that the resonator of finishing with built-in capacitor includes resonator and capacitor in the unit chip that with dashed lines indicates, and wherein capacitor can be connected respectively to two ends of resonator.
Because there is the resonator of the built-in capacitor of this spline structure to have internal electrode on thin piezoelectric sheet, can obtain high oscillation frequency corresponding to the thickness of thin piezoelectric sheet; Because utilize the lamination piezoelectric sheet can obtain the element of predetermined thickness, workability can be improved in addition, therefore the element of various structures can be made easily.In addition because there is the resonator of built-in capacitor to comprise the dielectric medium lid, wherein be formed with vibration groove, and can be used as capacitor, capacitor can be included in the unit element, therefore can make simple and minimum single-chip element, and apply to electronic component closely easily.
(embodiment 14)
May be according to the unit element that indivedual embodiment make with the insulating epoxy packing element beyond the over cap, with protection component.See also shown in Figure 19ly, a kind of three node type elements of present embodiment can elaborate following, and wherein whole element can be insulated epoxy resin and cover and envelope.
Use the method formation identical to have the unit element main body 1901 of outer electrode with embodiment 13; an external node 1903 can be connected to the surperficial outer electrode 1902 that is formed on end of body surfaces; with flexible insulating epoxy to form layer protecting film; casting is formed with the main body of outer electrode and finishes element, and this protection epoxy resin film can be used for coating two node type elements except three above-mentioned node type elements.
On the other hand, the method for above-mentioned making vibrator can be by in the various elements of the high vibration frequency of needs except above-mentioned resonator, and the internal electrode of design isolated is made high-frequency chip component.
Because the workability of above-mentioned vibrator can improve, vibrator can be made various structures except above-mentioned, and above-mentioned in addition vibrator can be made into combined chip easily by the element of expection characteristic is arranged in conjunction with two or more.
Need in various except above-mentioned resonator can make the high frequency chip element on the element of high oscillation frequency by the invention provides as the method for above-mentioned making vibrator.Because the workability of vibrator of the present invention can improve, so can make various structural vibrations devices except above-mentioned mentioning.Above-mentioned in addition vibrator can be made into combined chip easily by the element of expection characteristic is arranged in conjunction with two or more.
As mentioned above, the element body of sintering lamination can allow vibrator obtain stable high oscillation frequency simultaneously, wherein the making of the element body of lamination is that cover layer lamination by will wherein being formed with vibration groove is on the thin piezoelectric sheet of control thickness, because sintering can reduce fabrication steps simultaneously, so can produce with simple steps and have the light of predetermined power characteristic and chip vibrator closely, because the making of vibrator is to utilize the thin piezoelectric sheet of lamination control thickness and form between thin slice not form with the contacted internal electrode of the outer electrode of element, there is the resonator of expection thickness that the stable high oscillation frequency of expection can be arranged in addition.
In addition, because in the experience of making element, can improve workability by simple control element thickness, can make the resonator of various structures, as mentioned above, utilize the present invention to make to have the tight chip resonator of predetermined power characteristic and can make, so productivity ratio can be improved and cost can reduce of fewer fabrication steps of the processing procedure simplifying.
Resonator according to built-in capacitor of the present invention can have stable oscillating characteristic, and by making one chip control frequency easily, wherein capacitor can stick together with resonator.Resonator according to built-in capacitor of the present invention can be made easily by the piezoelectric sheet thickness that control has internal electrode to form, the frequency of oscillation that obtains being scheduled to, by the quantity of dielectric medium thin slice of control lamination and the thickness of dielectric medium thin slice, and capacitor combined with the resonator of various structures, the control capacitance amount has stable oscillating characteristic easily.
In addition, can be made into the tight one chip of various structures and the extra step of needs not according to the resonator of built-in capacitor of the present invention.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (11)
1. vibrator is characterized in that it comprises:
The element of one lamination has two piezoelectric sheets at least;
Internal electrode is formed between the described piezoelectric sheet of lamination; And
Outer electrode relatively is formed on the upper area and lower zone of element of this lamination;
Wherein, described internal electrode can be connected with described outer electrode by the pattern of the described internal electrode of control.
2. vibrator according to claim 1 is characterized in that each described outer electrode wherein also is formed on the side regions of element of this lamination.
3. vibrator according to claim 1 is characterized in that further comprising insulator, be arranged on the zone, up and down of element of this lamination, and vibration groove is respectively formed between the zone, up and down and this insulator of element of this lamination.
4. vibrator according to claim 1 is characterized in that further comprising conductive channel, passes the element of this lamination, and can not be connected with described internal electrode, and each conductive channel all is connected with each described outer electrode.
5. vibrator according to claim 3 is characterized in that further comprising three node electrodes, is arranged at not this vibration groove and forms on another table sheet of this insulator thereon, wherein has this insulator of dielectric medium function to can be used as capacitor.
6. vibrator according to claim 1 is characterized in that comprising dielectric medium at least one lamination or single dull and stereotyped pattern, and described dielectric medium engages with the element of this lamination.
7. vibrator according to claim 3 is characterized in that wherein said insulator is formed with a burning gallery, and described burning gallery is linked up mutually with described vibration groove.
8. vibrator according to claim 1; it is characterized in that wherein a dielectric medium substrate meeting as the capacitor that node is arranged by device on the lower zone of the element of this lamination, and be used for protecting the over cap of the element of this lamination can be on the upper area of the element of this lamination by device.
9. vibrator according to claim 3 is characterized in that wherein element and this insulator of this lamination are coated by epoxy, with element and this insulator of protecting this lamination.
10. the manufacture method of a vibrator is characterized in that it may further comprise the steps:
To have the slurry of predetermined composition, make a plurality of piezoelectricity and give birth to the embryo thin slice;
Give birth to a plurality of internal electrodes of formation on the embryo thin slice at described piezoelectricity;
Lamination is formed with at least two piezoelectricity of described internal electrode on it and gives birth to the embryo thin slice;
Sintering one laminate, wherein this laminate is to be given birth to the embryo thin slices and got by the described piezoelectricity of lamination at least two; And
Each upper area and lower zone in this laminate form at least one outer electrode, make described outer electrode not be connected with described internal electrode.
11. the manufacture method of a vibrator is characterized in that it may further comprise the steps:
To have the slurry of predetermined composition, make a plurality of piezoelectricity and give birth to the embryo thin slice;
The two ends of giving birth to the embryo thin slice at described piezoelectricity form through hole;
On the living embryo thin slice of described piezoelectricity, form internal electrode, when through hole is filled with the thickener of conduction, to allow described internal electrode can not contact described through hole;
Lamination at least two described piezoelectricity are given birth to the embryo thin slice;
Sintering one laminate, wherein this laminate is to be given birth to the embryo thin slices and got by the described piezoelectricity of lamination at least two; And
Each upper area and lower zone in this laminate form at least one outer electrode, allowing described outer electrode not be connected with described internal electrode, and are connected with conducting paste in the described through hole.
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| KR10-2002-0058673A KR100490501B1 (en) | 2002-09-27 | 2002-09-27 | Piezoelectric vibrator and fabricating method therefor |
| KR10-2002-0058673 | 2002-09-27 | ||
| KR1020020058673 | 2002-09-27 | ||
| KR10-2003-0004415 | 2003-01-22 | ||
| KR10-2003-0004415A KR100490502B1 (en) | 2003-01-22 | 2003-01-22 | Piezoelectric vibrator and fabricating method therefor |
| KR1020030004415 | 2003-01-22 |
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| KR100914043B1 (en) * | 2007-08-22 | 2009-08-31 | 한국세라믹기술원 | Magnet forming apparatus and method |
| JP2012106208A (en) * | 2010-11-19 | 2012-06-07 | Seiko Epson Corp | Fine particle separator |
| KR101432438B1 (en) * | 2013-03-29 | 2014-08-20 | 삼성전기주식회사 | Piezo vibration module |
| CN108075033A (en) * | 2017-12-26 | 2018-05-25 | 广东奥迪威传感科技股份有限公司 | Piezoelectric vibrator and preparation method thereof |
| CN113295734B (en) * | 2021-04-27 | 2024-07-26 | 浙江朗德电子科技有限公司 | Microminiature sensor chip |
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| JPH10117119A (en) * | 1996-10-09 | 1998-05-06 | Taiyo Yuden Co Ltd | Piezoelectric effect vibrator |
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| JP2001144581A (en) * | 1998-07-24 | 2001-05-25 | Seiko Epson Corp | Piezoelectric vibrator and its manufacturing method |
| JP2000174581A (en) * | 1998-12-01 | 2000-06-23 | Murata Mfg Co Ltd | Lamination type piezoelectric resonator and its manufacture |
| KR20020008679A (en) * | 2000-07-25 | 2002-01-31 | 이형도 | Smd type piezoelectric ceramic parts |
-
2002
- 2002-09-27 KR KR10-2002-0058673A patent/KR100490501B1/en active IP Right Grant
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2003
- 2003-09-26 CN CN2008100893720A patent/CN101262210B/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1303173A (en) * | 1999-12-20 | 2001-07-11 | 株式会社村田制作所 | Piezoelectric resonator and piezo electric oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100490501B1 (en) | 2005-05-17 |
| CN101262210A (en) | 2008-09-10 |
| KR20040026992A (en) | 2004-04-01 |
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