High power light-emitting diode illuminating source heat radiating device
Technical field
The present invention relates to a kind of heat abstractor of leading of electric light source, particularly relate to a kind of high power light-emitting diode illuminating source heat radiating device.Large-power light-emitting diodes light source secondary heat abstractor in use
Background technology
We know, semiconductor lighting is one of the high-tech sector of tool development prospect in this century.As the new type of solid state light source, semiconductor light sources will become the leap again after incandescent lamp, fluorescent lamp on the human illumination history.At present, semiconductor lamp, particularly road lamp, in order to reach the needs of illumination, after a plurality of high-power chip group encapsulates must be concentrated, just can reach designing requirement, but the shortcoming of bringing is, LED contact junction temperature, temperature raises, and as can not effectively suppressing temperature rise, junction temperature is led loose among air fast, to directly have influence on service life and the luminous efficiency of LED, even LED is burnt.At present, use producer mostly, do not resolving when leading heat sink conception, the high-power chips that adopt single 1W more, light source directly is fixed on the heat radiation lamp body, though such way is easy to heat radiation because of power is lower, but luminous intensity is not enough, the effective range deficiency, can not use as the viaduct lamp source, but we also know, the light emitting diode of prior art, and most electric energy will be converted into heat energy, LED device for many high-power chip group encapsulates, the dissipated power that it is big, big caloric value and demanding light extraction efficiency just can't adopt the heat dissipating method of LED device of single 1W and material to solve, loose among air if can not effectively lead the heat that LED produced after the high-power group encapsulates, high-power group encapsulates led chip temperature is easy to too high, causes luminous efficiency seriously to descend, even burns light emitting diode.When doing street lighting after the large-power light-emitting diodes group encapsulates at present,, and can't adopt and realize because of heat dissipation problem can't resolve.
Summary of the invention
Technical problem to be solved by this invention is to overcome above-mentioned the deficiencies in the prior art, provides a kind of rational in infrastructure, the high power light-emitting diode illuminating source heat radiating device of heat conduction, good heat dissipation; Be used for high-power LED illuminator spare, have high efficiency, long-life advantage.
For achieving the above object, the heat abstractor of leading of large-power light-emitting diodes light source of the present invention comprises the heat sink body of fine copper heat conduction, fine aluminium fin and the fine aluminium dead ring that is used for installing on the top LED source; Multiple tracks fine aluminium fin is packed in heat sink external week of fine copper heat conduction by the fine aluminium dead ring.The fine aluminium fin is made by pure aluminum plate.Lead the requirement of heat radiation according to light source, the heat sink body of fine copper heat conduction, fine aluminium fin and the welcome increasing of fine aluminium fin or dwindle it and lead area of dissipation can be produced the heat abstractor of leading that varies in size.So design, the material fine copper that adopts a kind of high thermal conductivity be as the heat sink body of heat conduction, and the high heat that is beneficial to light source can be led rapidly and be passed on heat sink body.And then adopt a kind of material fine aluminium of high heat dispersion, make fin, some fastening being flush-mounted on the heat sink body of heat conduction of fin, form radiator by designing requirement, by radiator the heat on the heat sink body of heat conduction is led rapidly by fin then and loose among air.To reach heat conduction efficient, rapid, that continue.
As optimization, be shaped on louvre or radiating groove or louvre and radiating groove on the fin.Can all be shaped on louvre on all fin, all be shaped on radiating groove, but a slice or several be shaped on louvre and another sheet or several and be shaped on radiating groove, also can be shaped on louvre and radiating groove simultaneously in a slice.Can produce stripe shape groove, Scroll-type groove, strip-type hole, Scroll-type hole, circular cylindrical void, selenodont wave groove of different geometries etc. on each sheet fin according to demand.So design about can forming, the heat loss through convection of the left and right sides, makes high heat on the light source lead by the heat sink body of high heat conduction and passes on fin, again by fin rapidly with lasting the shedding among air of heat.
As optimization, the distribution mode of described louvre is selected from radiation strip spaced apart, radiation turbine wire spaced apart, multiple tracks concentric ring-shaped spaced apart; The distribution mode of radiating groove is selected from the multiple tracks concentric ring-shaped of the deep-slotted chip breaker composition of radiation bar-shaped trough shape, radiation turbine groove shape, butt joint at interval.So design, each sheet fin all have radial pattern or stripe shape poroid to chute, its shape has stripe shape groove, Scroll-type groove, strip-type hole, Scroll-type hole, circular cylindrical void, selenodont wave groove.The hole slot of different shape can form about the steam flow, left and right sides heat loss through convection, can obviously improve radiating efficiency.
As optimization, the cross section of the heat sink body of fine copper heat conduction is circle or ellipse or square or rectangular, and the fine aluminium fin is corresponding with it circle or ellipse or square or rectangular.So design,
As optimization, fin is flush-mounted on the heat sink body of fine copper heat conduction by the lock ring ring is fastening.So design, the fine aluminium fin after several pure aluminum plate punch formings is by the spacing that designs, be inlaid on the heat sink body of fine copper post heat conduction closely.Each sheet aluminum thermal fin all uses fine aluminium lock ring ring fastening, and the fine aluminium fin is fastened on the heat sink body of fine copper heat conduction firmly.Be that the pure aluminum plate fin is inlaid on the heat sink body of fine copper heat conduction, and with fine aluminium lock ring ring with its banding.Has the structural strength height, the high advantage of heat transfer efficiency between the connector.
As optimization, equidistantly distribute between the fin.So design helps guaranteeing radiating efficiency.
After adopting technique scheme, some fine aluminium fin of setting-in closely again on the heat sink body of the heat conduction of high power light-emitting diode illuminating source heat radiating device of the present invention utilize the heat sink body of heat conduction efficiently rapidly the high heat of illuminator to be led and pass on fin.Against existing technologies, can realize heat radiation quick, thorough, that continue, guarantee the normal working life of light source.Novel structure of the present invention, volume is little, in light weight to have flexibility, has advantages such as good heat dissipation, efficient height, life-span are long.It is suitable for making the heat abstractor of leading of high-power, long-life, diode light-source that luminous efficiency is high, and as the illuminating lamp of all size, auto lamp etc., a plurality of combinations are particularly suitable for doing overhead high-power illumination street lamp.
Description of drawings
Fig. 1 is the main TV structure schematic diagram of high power light-emitting diode illuminating source heat radiating device of the present invention;
Fig. 2 is the main TV structure schematic diagram behind the equipped led light source of high power light-emitting diode illuminating source heat radiating device of the present invention;
Fig. 3 is the plan structure schematic diagram of first kind of louvre structure of fin in the high power light-emitting diode illuminating source heat radiating device of the present invention;
Fig. 4 is the plan structure schematic diagram of second kind of louvre structure of fin in the high power light-emitting diode illuminating source heat radiating device of the present invention;
Fig. 5 is the plan structure schematic diagram of the third louvre structure of fin in the high power light-emitting diode illuminating source heat radiating device of the present invention;
Fig. 6 is the plan structure schematic diagram of the 4th kind of louvre structure of fin in the high power light-emitting diode illuminating source heat radiating device of the present invention;
Fig. 7 is the plan structure schematic diagram of the 5th kind of louvre structure of fin in the high power light-emitting diode illuminating source heat radiating device of the present invention;
Fig. 8 is the plan structure schematic diagram of the 6th kind of louvre structure of fin in the high power light-emitting diode illuminating source heat radiating device of the present invention.
The specific embodiment
Illustrate further below in conjunction with accompanying drawing and instantiation
As illustrated in fig. 1 and 2, the heat abstractor of leading of large-power light-emitting diodes light source of the present invention comprises the heat sink body 2 of fine copper heat conduction, fine aluminium fin 3 and the fine aluminium dead ring 4 that is used for installing on the top large-power light-emitting diodes light source 1; Seven road fine aluminium fin 3 are packed in heat sink body 2 peripheries of fine copper heat conduction by fine aluminium dead ring 4.Fin 3 is flush-mounted on the heat sink body 2 of fine copper heat conduction so that the mode of equidistant distribution is fastening by lock ring ring 4.
Certainly, in order further to improve radiating efficiency, can also be shaped on louvre 31 or radiating groove 32 or louvre 31 and radiating groove 32 on the fin.The cross section of fine copper heat conduction is heat sink body 2 can be circle or ellipse or square or rectangular, and fine aluminium fin 3 can be corresponding with it circle or ellipse or square or rectangular.
As shown in Figure 3, the distribution mode of described radiating groove 32 (elongated slot) is a radiation bar-shaped trough shape.
As shown in Figure 4, the distribution mode of described radiating groove 32 (elongated slot) is a radiation turbine groove shape.
As shown in Figure 5, the distribution mode of described louvre 31 (circular hole) is a radiation strip spaced apart.
As shown in Figure 6, the distribution mode of described louvre 31 (circular hole) is a radiation turbine wire spaced apart.
As shown in Figure 7, the distribution mode of described louvre 31 (circular hole) is three Kong Weiyi group multiple tracks concentric ring-shaped spaced apart.
As shown in Figure 8, the distribution mode of described radiating groove 32 (elongated slot) is the multiple tracks concentric ring-shaped of the deep-slotted chip breaker composition of butt joint at interval.