CN101247711A - Recirculating loop manufacturing method of high-efficiency heat conduction substrate and high-efficiency heat conduction substrate recirculating loop component - Google Patents
Recirculating loop manufacturing method of high-efficiency heat conduction substrate and high-efficiency heat conduction substrate recirculating loop component Download PDFInfo
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- CN101247711A CN101247711A CNA2007100640351A CN200710064035A CN101247711A CN 101247711 A CN101247711 A CN 101247711A CN A2007100640351 A CNA2007100640351 A CN A2007100640351A CN 200710064035 A CN200710064035 A CN 200710064035A CN 101247711 A CN101247711 A CN 101247711A
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Abstract
The invention provides a method for manufacturing high-efficiency heat-conduction substrate loop. The method includes steps: firstly a metal conductor is alkali washed, secondly an integral forming insulating layer with metal material is processed by anodic oxidation, finally the insulating layer is supplied to a loop for fixing on the insulating layer surface directly by printing circuit method. The loop manufacturing method has better whole structure, increasing heat sinking capability and rapid manufacturing speed. The loop manufacturing method can enhance heat sinking rate, increase service time and efficiency. The invention also provides a high-efficiency heat-conduction substrate loop subassembly manufactured by said manufacturing method.
Description
Technical field
The invention relates to a kind of electric appliance component, refer in particular to a kind of loop facture of high-efficiency heat conduction substrate; The high-efficiency heat conduction substrate loop assembly that the present invention also provides said method to make
Background technology
General conventional metals heat conduction substrate is established the making in loop, see also shown in Figure 1, it is with coating one heat-conducting glue 2 on the aluminium sheet 1, set one copper foil layer on this heat-conducting glue 2, again this copper foil layer is soaked electrolyte and given etching formation loop 3, install and use for an electronic building brick 4 by the loop that the method is made, this electronic building brick 4 as use light-emitting diode, its guide wire 5 can be welded in this loop 3, this electronic building brick 4 can be posted solid in this heat-conducting glue 2, the heat that these electronic building brick 4 turn-on power work produce is transmitted via this heat-conducting glue 2, though this aluminium sheet 1 can conduct heat on this loop 3, but limited these heat-conducting glue 2 heat-conducting effect are not good for metallic aluminium, so it transmits heat, radiating effect also is not so good as the metal ideal, this is easy to cause heat radiation is required harsh electronic building brick such as light-emitting diode, often causes accumulation of heat because of poor heat radiation, cause light-emitting diode to damage influence indirectly or directly and send out worker's function and useful life.
Moreover commonly use this copper foil layer of heat-conducting glue 2 sets on this aluminium sheet 1 of technology, being soaked electrolyte again gives etching and forms this loop 3, not only speed is slow at the etching work progress for Copper Foil, and etching process uses electrolyte, the used waste electrolyte liquid that can produce electrolysis discharges in a large number, and this waste electrolyte also produces water quality environment and pollutes, habitual metallic matrix loop of using etch process, very big disappearance is all arranged and produce environmental pollution in use, manufacturing, need the dealer to make great efforts to improve.
This case inventor is manufacturing and the design of being engaged in illumination and energy equipment relevant device with it for many years, in view of habitual electric appliance component link circuit device also can't be limited to function by efficiently radiates heat, must use new loop device to improve heat radiation function, making can increase useful life and strengthen power, brightness of illumination use, is the exploitation that active research improved, had then the present invention.
Summary of the invention
The objective of the invention is to improve deficiency of the prior art, a kind of loop facture of high-efficiency heat conduction substrate is provided, make that the metallic conductor insulating barrier is the one-body molded connection of aluminum metal material, has the good heat conductive effect, the loop is directly to combine with the metallic conductor insulating barrier, and whole formation good heat conductive structure improves heat-sinking capability.
Secondary objective of the present invention is to provide a kind of conductive paste directly to be printed in insulating barrier, fixed-type loop, and speed of application reduces the loop facture of the high-efficiency heat conduction substrate of manufacture process pollution soon.
Another purpose of the present invention is to provide the high-efficiency heat conduction substrate loop assembly that uses said method to make.
The object of the present invention is achieved like this:
A kind of loop facture of high-efficiency heat conduction substrate, it lays a loop by making insulating barrier on the metallic conductor on this insulating barrier, be fixed in this metallic conductor for electronic building brick, and this circuit communication power supply uses; It is characterized in that:
At first with this metallic conductor, earlier via comprising cleaning, the preceding step that polishes, this metallic conductor forms a flat surface;
Then this flat surface is handled one-body molded this insulating barrier, this insulating barrier top layer is also made one and can be adhered to easily and be fixedly coupled layer;
Then with electric conducting material with printed circuit methods, this electric conducting material is coated with the articulamentum of being located at this insulating barrier according to the layout in this loop, promptly form loop with high heat conduction substrate.
Wherein, it is after the alkali cleaning that the flat surface of this metallic conductor is cleaned, make one-body molded this insulating barrier with anodized, and this insulating barrier also produces an oxide film.
Wherein, this metallic conductor uses aluminium base, utilizes anode oxidative treatment method to produce a concavo-convex coarse articulamentum on this metallic conductor, and this insulating barrier, articulamentum produce sets the layout of thickness oxide film for this loop of printing.
Wherein, the articulamentum upside of this insulating barrier is criticized the isolation layer processing procedure that covers a good heat conductive and is formed the multilayered thermally-conductive insulation, and this isolation layer is made the layout in this loop for printed circuit methods.
A kind of high-efficiency heat conduction substrate loop assembly, it is by adhering to an insulating barrier on the heat conduction substrate, a loop is bonded on this insulating barrier, can be bonded to this heat conduction substrate and connect this loop for an electronic building brick, this loop connects this electronic building brick of power turn-on, provides current work to use; It is characterized in that:
This heat conduction substrate ties up to establish in the surface and extends oxide-film with one and constitute this insulating barrier, and this insulating barrier top layer also forms a concavo-convex coarse articulamentum;
This loop, with conductive material according to circuit layout all in the articulamentum of this insulating barrier, this this articulamentum of loop fluid-tight engagement, constitute to connect this heat conduction substrate.
Wherein, this heat conduction substrate is provided with most hole slots, this hole slot build-in one good conductor according to this loop configuration; This electronic building brick connects this loop and contacts this good conductor simultaneously and be fixed in this heat conduction substrate.
Wherein, this heat conduction substrate is provided with a bearing according to this loop configuration in desired location, this bearing is put the electronic building brick of photo-electroluminescence and is fixed, this metallic conductor is provided with a heat-conductive assembly and a radiator constitutes multiple layers transmission, gets rid of the heat structure, this electronic building brick connects this loop so that directly transmission heat arrives this metallic object, and this electronic building brick formation is transmitted fast and in a large number, heat extraction.
The loop facture of high-efficiency heat conduction substrate provided by the invention is about the direct set of the insulating barrier of the one-body molded metal material of metallic conductor loop, integral body constitutes good heat conductive and makes the method fast of constructing, and can improve the loop facture that heat-sinking capability increases the high-efficiency heat conduction substrate of illumination life-span and brightness use.Its by at first with a metallic conductor alkali cleaning, again with one of the one-body molded metal material of anodized insulating barrier, directly be bonded to the top layer of this insulating barrier in the printed circuit mode for a loop, make high-efficiency heat conduction substrate provided by the invention loop assembly integral body constitute the good heat conductive structure, improve heat-sinking capability, improve the electronic building brick radiating rate, can increase useful life and effect, and make construction fast.
Description of drawings
The invention will be further described below in conjunction with accompanying drawing.
Fig. 1 is the schematic diagram of habitual matrix loop assembly entire combination.
Fig. 2 is the schematic flow sheet of the present invention's first preferred embodiment.
Fig. 3 forms the metal conductor portion cross-sectional schematic for the manufacturing step of the present invention's first preferred embodiment.
Fig. 4 is the part cross-sectional schematic of the one-body molded insulating barrier of manufacturing step metallic conductor of the present invention's first preferred embodiment.
Fig. 5 is the part cross-sectional schematic that the manufacturing step insulating barrier of the present invention's first preferred embodiment adheres to the loop.
Fig. 6 is installed on the part cross-sectional schematic in loop on the metallic conductor for the light-emitting diode of the present invention's first preferred embodiment.
Fig. 7 is installed on the part enlarged diagram in loop on the metallic conductor for the light-emitting diode of the present invention's first preferred embodiment the 6th figure.
Fig. 8 is the schematic flow sheet of the present invention's second preferred embodiment.
Fig. 9 is the part cross-sectional schematic that the schematic flow sheet isolation layer of the present invention's second preferred embodiment adheres to the loop.
Figure 10 is the metallic conductor set transmission of the present invention's the 3rd preferred embodiment, the part cross-sectional schematic of heat extraction structure.
Figure 11 is the light-emitting diode bond conductor set transmission of the present invention's the 4th preferred embodiment, the part cross-sectional schematic of heat extraction structure.
Figure 12 is the light-emitting diode bond conductor multiple layers transmission of the present invention's the 4th preferred embodiment, the part cross-sectional schematic of heat extraction structure.
Embodiment
The loop facture of high-efficiency heat conduction substrate of the present invention provided by the invention sees also shown in Fig. 2,3, first preferred embodiment, and its manufacture method step and general structure system comprises that a metallic conductor 20, a conductive paste 40 and a light-emitting diode 60 form:
At first with this metallic conductor, earlier via comprising cleaning, the preceding step that polishes, this metallic conductor forms a flat surface;
Then this flat surface is handled one-body molded this insulating barrier, this insulating barrier top layer is also made one and can be adhered to easily and be fixedly coupled layer;
Then with electric conducting material with printed circuit methods, this electric conducting material is coated with the articulamentum of being located at this insulating barrier according to the layout in this loop, promptly form loop with high heat conduction substrate.
The cleaning of the flat surface of this metallic conductor is alkali cleaning, and after the alkali cleaning, make one-body molded this insulating barrier with anodized, this insulating barrier also produces an oxide film.
This metallic conductor uses aluminium base, utilizes anode oxidative treatment method to produce a concavo-convex coarse articulamentum on this metallic conductor, and this insulating barrier, articulamentum produce sets the layout of thickness oxide film for this loop of printing.
The articulamentum upside of this insulating barrier is criticized the isolation layer processing procedure that covers a good heat conductive and is formed the multilayered thermally-conductive insulation, and this isolation layer is made the layout in this loop for printed circuit methods.
The present invention's inventive method system is finished by following steps, see also shown in Fig. 2,3, at first metallic conductor 20 1 sides of aluminum are cleaned dust removal soil, and carry out surface clean with akaline liquid, and removal surface and oil contaminant, and then these metallic conductor 20 sides are polished, and scratch brushing forms a flat surface 21.
Again this metallic conductor 20 is carried out anodized, see also shown in Figure 4ly, this flat surface 21 produces the insulating barrier 22 of a thickness at the above oxide film of 3 μ m, utilizes current strength control to make these insulating barrier 22 top layers form coarse composition surface 24.
This insulating barrier 22 carries out clear water earlier and cleans after the anodized construction is finished, and bestows drying again, can supply next program and carry out the printed circuit construction.
At last on the insulating barrier 22 with this metallic conductor 20, in the printed circuit mode, see also shown in Figure 5, electric conducting material is coated this insulating barrier 22, electric conducting material of the present invention uses metal ingredient one conductive paste 40 to coat the composition surface 24 of these insulating barrier 22 upper sides, and this conductive paste 40 anchors on this composition surface 24 and extends to form a loop 41 according to circuit layout.
This conductive paste can be: joined in the engineering plastic by the metal material powder of good conductivity and make.This metal material can be the powder of materials such as gold, silver, copper, tin, and engineering plastic can be materials such as silica gel or PU, joins in the silica gel of normal temperature thickness for example, and adding weight ratio can be metal dust: engineering plastic is 1: (3-8).After being coated to conductive paste on the insulating barrier, 120-300 ℃ of heating its curing is got final product it.
Construct by above-mentioned steps, the present invention can utilize the form of construction work of printed circuit, directly this conductive paste 40 is coated the composition surface 24 of these insulating barrier 22 upper sides, exempted commonly use the loaded down with trivial details and time-consuming construction procedure of electrolyte etching, and these loop 41 peripheral Copper Foils of etching cause material deterioration inside and copper mud to cause environmental pollution, the present invention can produce the good matrix of heat-conducting effect very soon and supply this loop 41 and carry out layout construction to causing product to use.High-efficiency heat conduction substrate loop assembly, it is by adhering to an insulating barrier on the heat conduction substrate, a loop is bonded on this insulating barrier, can be bonded to this heat conduction substrate and connect this loop for an electronic building brick, this loop connects this electronic building brick of power turn-on, and current work use table is provided; This heat conduction substrate ties up to establish in the surface and extends oxide-film with one and constitute this insulating barrier, and this insulating barrier top layer also forms a concavo-convex coarse articulamentum; This loop, with conductive material according to circuit layout all in the articulamentum of this insulating barrier, this this articulamentum of loop fluid-tight engagement, constitute to connect this heat conduction substrate.
This heat conduction substrate is provided with most hole slots, this hole slot build-in one good conductor according to this loop configuration; This electronic building brick connects this loop and contacts this good conductor simultaneously and be fixed in this heat conduction substrate.
This heat conduction substrate is provided with a bearing according to this loop configuration in desired location, this bearing is put the electronic building brick of photo-electroluminescence and is fixed, this metallic conductor is provided with a heat-conductive assembly and a radiator constitutes multiple layers transmission, gets rid of the heat structure, this electronic building brick connects this loop so that directly transmission heat arrives this metallic object, and this electronic building brick formation is transmitted fast and in a large number, heat extraction.
The flat surface 21 of this metallic conductor 20 of the present invention is bestowed anodized, produce the insulating barrier 22 of aluminum oxide film rete on this flat surface 21, the aluminum oxide film film thickness of this insulating barrier 22 is greater than 3 μ m when above, see also shown in Fig. 4,5, these insulating barrier 22 bottoms form seamless articulamentum 23, it is one-body molded that this articulamentum 23 and this metallic conductor 20 constitute, and this articulamentum 23 and this metallic conductor 20 are that the aluminum metal material is one-body molded to have a good heat-conducting effect; The property alumina molecule forms coarse composition surface 24 among these articulamentum 23 surfaces, and the alumina molecule on this composition surface 23 forms the micro concavo-convex space.
These conductive paste 40 coatings are the composition surface 24 of insulating barrier 22, see also shown in Figure 3, this conductive paste 40 embeds the concavo-convex space internal fixation of the alumina molecule on this composition surface 24, this conductive paste 40 can firmly form this loop 41 attached to this insulating barrier 22, these insulating barrier 22 bottoms form seamless articulamentum 23 and constitute one-body molded with this metallic conductor 20, articulamentum 23 thickness of this insulating barrier 22 are when 3 μ m, this articulamentum 23 has 1/2 thickness can bear the ability of 500V voltage, the present invention also can be increased to 5 μ m or thicker with the articulamentum 23 aluminium oxide thickness of this insulating barrier 22 by actual needs, this can improve the voltage that this insulating barrier 22 bears electric current, in order to do being fit to the actual needs that use.
This loop 41 of the present invention directly invests the insulating barrier 22 of these metallic conductor 20 oxide films; This metallic conductor 20 and this insulating barrier 22 constitutes one-body molded and is that aluminum metal material characteristic is one-body molded to have a good thermal conduction characteristic, both constitute the effect that direct connection has good heat conduction, this is led this insulating barrier 22 of a cream 40 sets and also constitutes integrated structure, promptly this conductive paste 40, insulating barrier 22, metallic conductor 20 constitute integrated structure, do not have lapping defect, integral body has the good heat conductive characteristic, promptly this loop 41 is bonded to the integrated structure of insulating barrier 22 formations of this metallic conductor 20, and integral body has the good heat conductive characteristic.
When it installs electronic building brick such as light-emitting diode 60, see also Fig. 6, shown in 7, a positive pole 63 extends with the electrode member 62 of this light-emitting diode 60 in system, negative pole 64 connects this loop 41, this light-emitting diode 60 is bonded to this metallic conductor 20, the heat that these light-emitting diode 60 energisings produce is delivered to this loop 41 by bottom and electrode member 62 respectively, utilize this loop 41 to be bonded to that the insulating barrier 22 of this metallic conductor 20 is one-body molded to have a good heat conductive characteristic, the heat that this light-emitting diode 60 produces can be delivered to this metallic conductor 20 heat radiations very fast, moreover this metallic conductor 20 can one extends or sets firmly a radiator 26.
Be the unhabitual silica gel of the present invention, the heat-conducting glue multilayer connects the generation contact-making surface, the applying that these contact-making surfaces are only simple, it is not good to engage incomplete heat-conducting effect, the present invention does not also habitually practise the silica gel of insulating barrier, the heat-conducting glue moulding, habitual limited silica gel, the feature heat-conducting effect of heat-conducting glue own is not as metallic aluminium, habitual substrate loop forms the disappearance that thermal resistance strengthens, so the insulating barrier 22 of this metallic conductor 20 of the present invention produces fusion contact fully in oxidation processes, its contact-making surface fusion forms the one-body molded good contact-making surface that has, this insulating barrier 22 has the characteristic of metallic aluminium good heat conductive, and its thermal conduction characteristic is very good.
This conductive paste 40 of the present invention is distributed in these insulating barrier 22 sets with the printed circuit methods layout and constitutes this loop 41, can save and utilize copper aluminium to want etched engineering, can significantly reduce the engineering time, increase production efficiency, reduce cost, more can eliminate the industrial pollution that etching produces.
The present invention's second embodiment, see also shown in Figure 8, with the preceding first embodiment broadly similar, the flat surface 21 of this metallic conductor 20 is carried out anodized, is made the insulating barrier 22 of oxide film, these insulating barrier 22 bottoms form seamless articulamentum 23 and constitute one-body molded with this metallic conductor 20, it does not exist together is that the present invention is according to the said method processing procedure, the isolation layer 29 of a good heat conductive material is covered on 23 batches on the composition surface of these articulamentum 23 upsides, and this processing procedure forms the multilayered thermally-conductive insulation of combining closely of this metallic conductor 20, this insulating barrier 22, this isolation layer 29.
This isolation layer 29 of these insulating barrier 22 upper stratas of the present invention forms the protection top layer; this insulating barrier 29? can prevent that scratch from exposing, also improving greatly the insulation effect; can provide simultaneously mechanical automation to prevent that scratch is exposed; directly utilize these conductive paste 40 coatings of printed circuit methods to be this isolation layer 29; see also shown in Figure 9ly, this conductive paste 40 can be firmly made the layout in these loops 41 attached to this isolation layer 29.
The present invention's the 3rd embodiment, see also shown in Figure 10, with preceding first and second embodiment broadly similar, it does not exist together is that the present invention makes the loop member according to said method, it provides when electronic building brick such as light-emitting diode 60 are installed, and this isolation layer 29 of these insulating barrier 22 upper stratas forms protection top layers, it is exposed to prevent to add the man-hour scratch, can provide mechanical automation to accelerate process velocity simultaneously, 20 pairs of this metallic conductors should loop 41 certain bits install a groove seat 24, one good conductors 25 these groove seats 24 of embedding; This light-emitting diode 60 of the present invention is fixed in this metallic conductor 20, and the electrode member 62 of this light-emitting diode 60 extends a positive pole 63, negative pole 64 connects this loop 41; This position, light-emitting diode 60 bottom contacts this good conductor 25.
The present invention utilizes this metallic conductor 20, insulating barrier 22 and this loop 41 form integrated structure, this metallic conductor 20 uses aluminium simultaneously, this good conductor 25 uses copper material, utilize the copper heat absorption good, the characteristic difference that the aluminium heat radiation is good, the heat that these light-emitting diode 60 work produce is via this good conductor 25 and this insulating barrier 22 and the 41 fast Absorption transmission of this loop, and distribute fast by this metallic conductor 20, this metallic conductor 20 can be established this radiator 26 simultaneously, this metallic conductor 20, more can be provided with a heat-conductive assembly 27 between the radiator 26, this heat-conductive assembly 27 is lateral transport fast, get rid of heat, this metallic conductor 20, heat-conductive assembly 27 and radiator 26 form the upper, middle and lower multiple layers transmission, get rid of heat, the heat that this light-emitting diode 60 produces is except being delivered to this metallic conductor 20, more can utilize this heat-conductive assembly 27 and radiator 26 good heat conductive, the characteristic of heat radiation, this light-emitting diode 60 sees through above-mentioned heat transfer, heat radiation can be in a large number and the heat of inside is spread out of distribute fast.
The present invention's the 4th embodiment, see also shown in Figure 11, with preceding first, two embodiment broadly similars, it does not exist together is that 20 pairs of this metallic conductors should loop 41 certain bits install a bearing 28, the chip 61 that this bearing 28 is put this light-emitting diode 60 is affixed, and in electrode member 62 these loops 41 of connection of this light-emitting diode 60, this chip 61 connects this metallic conductor 20, this electrode member 62, this loop 41 connects this metallic conductor 20, this light-emitting diode 60 forms directly whole and this metallic conductor 20 meets the place, this metallic object 20 has broad area and volume, and heat-conducting effect is good, can transmit simultaneously the work calories of this chip 61 fast in a large number, this metallic conductor 20 can be in a large number and the heat of inside is spread out of distribute fast, and this metallic conductor 20 can keep the low temperature situation.
The present invention sees also shown in Figure 12, and this radiator 26 can be established in these metallic conductor 20 bottom sides, more can be provided with a heat-conductive assembly 27 between this metallic conductor 20, the radiator 26, and whole formation is broad and conduct heat, dispel the heat good structure.
Make the loop member by the inventive method, this metallic conductor 20, heat-conductive assembly 27 and radiator 26 multiple layers transmission, get rid of the heat structure, the heat that this light-emitting diode 60 produces is except being delivered to this metallic conductor 20, more can utilize this heat-conductive assembly 27 and radiator 26 heat conduction, the heat radiation good efficacy, this light-emitting diode 60 sees through above-mentioned heat transfer, heat radiation can be in a large number and the heat of inside is spread out of distribute fast, the heat that the chip 61 of this light-emitting diode 60 produces can be directly delivered to this metallic object 20, the heat that produces can be transmitted fast and in a large number, discharge heat radiation, these light-emitting diode 60 smooth and easy eliminating heats are guaranteed normal working temperature, this light-emitting diode 60 can improve luminous efficiency, increases useful life; Lighting luminous intensity, life-span are significantly improved, can the arrange in pairs or groups characteristic of this metallic object 20 and volume, appropriateness of the chip 61 of this light-emitting diode 60 improves power again, this light-emitting diode 60 can raising itself power, can appropriate heat extraction guarantee normal working temperature again, very be fit to make the product of more high-power specification.
The loop facture of high-efficiency heat conduction substrate of the present invention in sum, system with metallic conductor impose alkali cleaning, again with the insulating barrier of the one-body molded metal material of anodized, directly be bonded to this insulating barrier top layer for the loop in the printed circuit mode, whole formation good heat conductive structure improves heat-sinking capability and makes the loop facture fast of constructing, the electronic building brick radiating rate be can improve and illumination life-span and brightness user, the industrial usability of tool increased.
Claims (7)
1. the loop facture of a high-efficiency heat conduction substrate, it lays a loop by making insulating barrier on the metallic conductor on this insulating barrier, be fixed in this metallic conductor for electronic building brick, and this circuit communication power supply uses; It is characterized in that: comprise the steps:
At first with this metallic conductor, earlier via comprising cleaning, the preceding step that polishes, this metallic conductor forms a flat surface;
Then this flat surface is handled one-body molded this insulating barrier, this insulating barrier top layer is also made one and can be adhered to easily and be fixedly coupled layer;
Then with electric conducting material with printed circuit methods, this electric conducting material is coated with the articulamentum of being located at this insulating barrier according to the layout in this loop, promptly form loop with high heat conduction substrate.
2. according to the loop facture of the described high-efficiency heat conduction substrate of claim 1, it is characterized in that the cleaning of the flat surface of this metallic conductor is alkali cleaning, after the alkali cleaning, make one-body molded this insulating barrier with anodized, this insulating barrier also produces an oxide film.
3. according to the loop facture of the described high-efficiency heat conduction substrate of claim 1, it is characterized in that, this metallic conductor uses aluminium base, utilize anode oxidative treatment method to produce a concavo-convex coarse articulamentum on this metallic conductor, this insulating barrier, articulamentum produce sets the layout of thickness oxide film for this loop of printing.
4. according to the loop facture of the described high-efficiency heat conduction substrate of claim 1, it is characterized in that, the articulamentum upside of this insulating barrier is criticized the isolation layer processing procedure that covers a good heat conductive and is formed the multilayered thermally-conductive insulation, and this isolation layer is made the layout in this loop for printed circuit methods.
5. high-efficiency heat conduction substrate loop assembly, it is by adhering to an insulating barrier on the heat conduction substrate, a loop is bonded on this insulating barrier, can be bonded to this heat conduction substrate and connect this loop for an electronic building brick, this loop connects this electronic building brick of power turn-on, and current work use table is provided; It is characterized in that:
This heat conduction substrate ties up to establish in the surface and extends oxide-film with one and constitute this insulating barrier, and this insulating barrier top layer also forms a concavo-convex coarse articulamentum;
This loop, with conductive material according to circuit layout all in the articulamentum of this insulating barrier, this this articulamentum of loop fluid-tight engagement, constitute to connect this heat conduction substrate.
6. according to the described high-efficiency heat conduction substrate of claim 5 loop assembly, it is characterized in that this heat conduction substrate is provided with most hole slots, this hole slot build-in one good conductor according to this loop configuration; This electronic building brick connects this loop and contacts this good conductor simultaneously and be fixed in this heat conduction substrate.
7. according to the described high-efficiency heat conduction substrate of claim 5 loop assembly, it is characterized in that, this heat conduction substrate is provided with a bearing according to this loop configuration in desired location, this bearing is put the electronic building brick of photo-electroluminescence and is fixed, this metallic conductor is provided with a heat-conductive assembly and a radiator constitutes multiple layers transmission, gets rid of the heat structure, this electronic building brick connects this loop so that directly transmission heat arrives this metallic object, and this electronic building brick formation is transmitted fast and in a large number, heat extraction.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100640351A CN101247711A (en) | 2007-02-16 | 2007-02-16 | Recirculating loop manufacturing method of high-efficiency heat conduction substrate and high-efficiency heat conduction substrate recirculating loop component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100640351A CN101247711A (en) | 2007-02-16 | 2007-02-16 | Recirculating loop manufacturing method of high-efficiency heat conduction substrate and high-efficiency heat conduction substrate recirculating loop component |
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| CN101247711A true CN101247711A (en) | 2008-08-20 |
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| CNA2007100640351A Pending CN101247711A (en) | 2007-02-16 | 2007-02-16 | Recirculating loop manufacturing method of high-efficiency heat conduction substrate and high-efficiency heat conduction substrate recirculating loop component |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734665A (en) * | 2012-05-21 | 2012-10-17 | 王定锋 | LED (Light Emitting Diode) lamp module and manufacturing method thereof |
| CN102748606A (en) * | 2012-05-21 | 2012-10-24 | 王定锋 | Light-emitting diode (LED) lamp module with LED chip flipped over on conductive adhesive circuit and manufacturing method thereof |
| CN104619115A (en) * | 2015-02-17 | 2015-05-13 | 王子欣 | Three-dimensional heat-dissipating circuit board and preparation method thereof |
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
-
2007
- 2007-02-16 CN CNA2007100640351A patent/CN101247711A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734665A (en) * | 2012-05-21 | 2012-10-17 | 王定锋 | LED (Light Emitting Diode) lamp module and manufacturing method thereof |
| CN102748606A (en) * | 2012-05-21 | 2012-10-24 | 王定锋 | Light-emitting diode (LED) lamp module with LED chip flipped over on conductive adhesive circuit and manufacturing method thereof |
| CN104619115A (en) * | 2015-02-17 | 2015-05-13 | 王子欣 | Three-dimensional heat-dissipating circuit board and preparation method thereof |
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
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Open date: 20080820 |