CN101227811A - Vacuum super thermal conduction heat radiator - Google Patents
Vacuum super thermal conduction heat radiator Download PDFInfo
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- CN101227811A CN101227811A CNA2007100046005A CN200710004600A CN101227811A CN 101227811 A CN101227811 A CN 101227811A CN A2007100046005 A CNA2007100046005 A CN A2007100046005A CN 200710004600 A CN200710004600 A CN 200710004600A CN 101227811 A CN101227811 A CN 101227811A
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Abstract
The invention relates to a vacuum super thermal conductivity radiator, which is applied in thermal conjugations such as a CPU and the like on a machine plate in a computer to radiate heat energy and comprises a rectangular fin module group, a heat conduction module group and a exhaust fan which are thermal-conjugated with the CPU, wherein at least one vacuum super thermal conductivity pipe is used to connect the rectangular fin module group and the heat conduction module group to form stereo frame group morphology configuration and rapid heat energy transmission by a superconducting heat pipe, a shielding case is arranged on a terminal protruding point which connects the rectangular fin module group and the super thermal conductivity pipe to rapidly radiate the heat energy, which is beneficial for manufacturing by combining the superconducting heat pipe and the rectangular fin module group, and ventilating currents are brought away on the rectangular fin module group and the heat conduction module group to radiate through the exhaust fan which is arranged on the rectangular fin module group, which improves the problems of the heat transmitting performance, the time for combining components, the cost, the thermal spread efficiency and the like.
Description
Technical field
Wood invention relates to heat abstractor, but refers to that especially a kind of tool super heat-conductive pipe long distance configuration forms the vacuum super thermal conduction heat radiator of high heat transfer, radiating efficiency, to adapt to computer chassis inside, perhaps connects external space configuration utilization and electronic building brick (as CPU etc.) thermal bonding heat radiation.
Background technology
Electronic building brick in present computer and the peripheral equipment thereof, all be to pass through heat abstractor, to disperse the high heat that electronic building brick is produced in running, on the area of dissipation and heat transfer structure design of heat abstractor, all will directly react its heat transmits and radiating efficiency, so good structure and design are arranged, will promote radiating efficiency and quality.
Known applications is in the heat abstractor of electronic building brick, and typical structure comprises that radiating fin that some monolithics make in conjunction with forming a fin module, is incorporated into a heat pipe, and by heat pipe directly or by fitting in electronic building brick with heat in conjunction with a heat-conducting plate.Other look designing requirement above the fin module or the side fan unit is set to form heat abstractor, combine to disperse the heat energy of generation with electronic building brick.
The fin-type heat abstractor of above-mentioned known typical, the multinomial restriction that exists at aspects such as heat transmitting, combination of components and thermal transpiration efficient and not enough as follows:
1, links the heat pipe of transferring heat energy between heat-conducting plate and fin module, be generally to pass the heat transmission conduit that liquid is formed by the single heat of capillary structure collocation, has the characteristic that the backflow of internal heat transfer liquid palpus could drive thermal energy transfer again, also therefore limit heat transference efficiency, also can't satisfy remote configuration utilization.
2, above-mentioned fin module and heat pipe combines, the end of this heat pipe all is to extend and partly expose to the tailpiece radiating fin outside of fin module, and the heat pipe end is the sealing end of a undergauge more, make the heat energy of heat pipe transmission easily concentrate on the sealing end that this exposes, can't obtain to disperse fast and disperse, and influence radiating efficiency.
3, combining of this fin module and heat pipe again, because concrete enforcement is gone up a plurality of heat pipes and is combined with the fin module, in other words, a plurality of heat pipes with procedure for processing that the fin module combines in, each heat pipe that must align is one by one asked itself and fin module and is formed a formation state, is beneficial to integral body and combines closely, the alignment processing procedure is not only time-consuming but also take a lot of work, and the high and production capacity of processing cost also is affected.
Summary of the invention
One of main purpose of the present invention, a kind of tool super heat-conductive pipe is being provided, but long distance or stereoscopic configurations fin module and thermal bonding are in the heat conduction module of electronic building brick (as CPU), form the heat abstractor of high heat transfer, radiating efficiency, with in response to computer chassis inside, perhaps connect external space configuration utilization and the heat radiation of electronic building brick (CPU etc.) thermal bonding.
Another main purpose of the present invention is providing a kind of heat abstractor, is incorporated into super heat-conductive pipe by a cage and combines end with the fin module and stretch out a little, makes the terminal heat energy of super heat-conductive pipe obtain to disperse fast and disperse, to improve heat dissipation.
Of the present invention another main day, a kind of heat abstractor is being provided, nationality covers in the tailpiece position of fin module in conjunction with the super heat-conductive pipe end by isolation, and the smooth effect when forming combination in order to avoid the Rapid Combination of alignment is simplified manpower and man-hour, also reduces cost.
A main day more of the present invention, a kind of heat abstractor is being provided, by being provided with top board at its heat conduction module one end, smooth effect when being beneficial to make up, can exempt from the Rapid Combination of alignment, simplify manpower and man-hour, also reduce cost, and the heat conduction dead space of super heat-conductive pipe end that minimizing links, increase heat conduction amount.
For reaching above-mentioned purpose, vacuum super thermal conduction heat radiator of the present invention comprises:
A fin module is made of some radiating fin collection groups, and each radiating fin end face is provided with at least one through hole;
A radiator fan is arranged at above-mentioned fin module top;
A heat conduction module, and,
At least one super heat-conductive pipe, an end are linked to above-mentioned fin module, and the other end is linked to above-mentioned heat conduction module;
Above-mentioned super heat-conductive pipe links above-mentioned fin module and heat conduction module, forms the configuration of three-dimensional frame group form, and fast heat is fitted in electronic building brick institute transferring heat energy by super heat-conductive pipe and be sent to the fin module, disperses by the radiator fan high efficiency.
The present invention can comprise a cage, and this cage is incorporated into an end of above-mentioned fin module, and stretches out a little in the terminal thermal of fin module with the end of above-mentioned super heat-conductive pipe, forms the terminal thermal energy dissipation of super heat-conductive pipe and disperses.
In a preferred embodiment of the present invention, this super heat-conductive pipe comprises:
One metal outer pipe;
One fine metal mesh, volume is located at above-mentioned metal outer pipe inside;
The thin Metal Ball of plural number is laid between above-mentioned outer tube and fine metal mesh;
And, the superconduction mixing material;
The thin Metal Ball of above-mentioned metal outer pipe, fine metal mesh and plural number is through sintering process and vacuum treatment, form the conductor tube of vacuum, agravic and pressure, and fill in its inside by multiple superconduction liquid material proportion and transfer the superconduction mixing material that mixes, can be freely in any position transferring heat energy back and forth, with reach fast, remote thermal energy transfer.
In a preferred embodiment of the present invention, more comprise: plant the ratio allotment of superconduction liquid more than the composition superconduction mixing material that can fill in by this super heat-conductive pipe inside, and be applicable to the different temperatures scope quick transferring heat energy of subzero tens of degree Celsius to thousands of degree.
The present invention by super heat-conductive pipe with fin module and the combination of heat conduction module, form three-dimensional frame group form configuration, but the long distance configuration forms the fin-type heat abstractor of high heat transfer, radiating efficiency, adapts to the inner or even external space configuration utilization and the heat radiation of electronic building brick thermal bonding of computer chassis.
Its specially designed super heat-conductive pipe inside is filled in by multiple superconduction liquid material proportion and is transferred the superconduction mixing material that mixes, super heat-conductive pipe can be disposed in arbitrarily angled, direction, improved traditional single liquid heat conduit greatly and be subjected to the angle limits that hot gas rises and refluxes, the configuration that can adapt to multidirectional is used.
Its fin module is terminal in conjunction with the cage of being made by the high thermal conductivity coefficient material, and stretches out a little in the terminal thermal of fin module with the end of super heat-conductive pipe, makes terminal the concentrated heat energy of super heat-conductive pipe can be disperseed and disperse the raising heat dissipation fast; And be beneficial to the combination processing of super heat-conductive pipe and fin module, and must time-consumingly again not take a lot of work each super heat-conductive pipe of alignment and fin module can convenient the combinations, and costs such as manpower and man-hour have been saved in the production efficiency raising.
Description of drawings
Fig. 1 is the assembly partial exploded view of one embodiment of the invention;
Fig. 2 is the decomposing schematic representation of one embodiment of the invention heat conduction module and super heat-conductive pipe combination;
Fig. 3 is the radial cross-section of super heat-conductive pipe one embodiment of the present invention;
Fig. 4 is the axial sectional drawing of super heat-conductive pipe one embodiment of the present invention;
Fig. 5 is the operating state schematic diagram of one embodiment of the invention.
Embodiment
Drag routine accompanying drawing that the technology contents of invention is described in detail below in conjunction with the present invention's one preferable reality.
Seeing also shown in Fig. 1-5, is the schematic diagram of vacuum super thermal conduction heat radiator assembly decomposition of the present invention and each combining structure, combination.Wherein, the formant sequence number is described as follows: fin module 1, heat conduction module 2, super heat-conductive pipe 3, radiator fan 4, cage 5, radiating fin 11, fastener 12, through hole I3, pedestal 21, cover piece 22, caulking groove 23, top board 24, metal outer pipe 31, fine metal mesh 32, thin Metal Ball 33, superconduction liquid 34, distribution table facial mask 35 stretches out a little 36.
As shown in the figure: super thermal conduction heat radiator of the present invention includes: a fin module 1 and thermal bonding are in the heat conduction module 2 of CPU (not illustrating among the figure), and by at least one vacuum superconductive heat pipe 3 above-mentioned fin module 1 of binding and heat conduction modules 2, form three-dimensional frame group form configuration, an and radiator fan 4, be incorporated into above-mentioned fin module 1 top, to constitute a tool superconducting pipe, but the long distance configuration forms the fin-type radiator structure of high heat transfer, radiating efficiency, with in response to computer chassis inside, perhaps connect external space configuration utilization and electronic building brick (as CPU etc.) thermal bonding heat radiation.
Above-mentioned fin module 1, the radiating fin 11 that system is made with the high thermal conductivity coefficient material by multi-disc, utilize the fastener 12 spacing arrangement collection group one of moulding to constitute, each sheet radiating fin 11 end face is provided with at least one through hole 13, promptly combine the end of extension in addition in fin module 1 one ends with above-mentioned super heat-conductive pipe 3, be combined with a cage 5, preferable is the tabular kenel of being made by the high thermal conductivity coefficient material, super heat-conductive pipe 3 terminal concentrated heat energy can be disperseed and disperse function fast, improve heat dissipation.
In addition, this cage 5 is on other concrete function is used, also have and super heat-conductive pipe 3 is incorporated into fin module 1 end stretches out a little, in forming a smooth effect man-hour in conjunction with adding, must time-consumingly again not take a lot of work each super heat-conductive pipe 3 of alignment with the fin moon module 1 can convenient the combination, reach costs such as quick combination, saving manpower and man-hour.
Described heat conduction module 2 is that the pedestal 21 made by the high thermal conductivity coefficient material combines with cover piece 22 and constitutes, shown in the 2nd figure, to form hollow inside, perhaps caulking groove 23 designs in order in conjunction with one of above-mentioned super heat-conductive pipe 3 end transferring heat energy, are provided with top board 24 in said base 21 1 ends in addition, smooth effect when being beneficial to super heat-conductive pipe 3 combinations, the Rapid Combination that can exempt to align is simplified manpower and man-hour, also reduces cost, and the heat conduction dead space of super heat-conductive pipe 3 ends that minimizing links, increase heat conduction amount.
Above-mentioned mentioned super heat-conductive pipe 3, the one end runs through through hole 13 combinations of above-mentioned fin module 1, and its end that exposes to radiating fin 11 through holes 13 stretches out a little 36, just in time thermal is in cage 5, the other end is linked to above-mentioned heat conduction module 2 and top board 24 thereof, and the hot medium that forms fin module 1 and heat conduction module 2 is situated between.
Above-mentioned super heat-conductive pipe 3, as Fig. 3, shown in 4, has a metal outer pipe 31, volume is located at the fine metal mesh 32 of above-mentioned outer tube 31 inside, and the thin Metal Ball 33 of plural number is laid in 32 of above-mentioned outer tube 31 and fine metal mesh and constitutes, and seal by sintering process and vacuum treatment, form vacuum, the conductor tube of agravic and pressure, and fill in multiple superconduction fluent material in conductor tube inside and allocate the superconduction mixing material of forming 34 through ratio, to form the heat pipe of a tool vacuum and the quick transmission characteristic of superconduction, in other words, by metal outer pipe 31, the space that fine metal mesh is 32, and fine metal mesh 32 and thin Metal Ball 33 surfaces of plural number, form a distribution table face mould 35, utilize pushing mutually of distribution table face mould 35 mobile, and superconduction mixing material 34 is in vacuum, under agravic and the no pressure, make an end heat energy of thermal bonding can be fast toward the cold junction transmission, and can be freely in any position transferring heat energy back and forth, to reach quick, remote thermal energy transfer.Wherein, metal outer pipe 31, fine metal mesh 32, the thin Metal Ball 33 of plural number adopt copper or aluminum etc. to make.
At other specific embodiment on, because the formation of above-mentioned distribution table facial mask 35, above-mentioned super heat-conductive pipe 3 can be disposed in arbitrarily angled, direction, to improve the angle limits that known single liquid heat conduit is subjected to hot gas rising backflow, the configuration that can adapt to multidirectional is used, be beneficial to various device and radiating subassembly, as the variation combination of fin module and heat conduction module.
Above-mentioned superconduction mixing material 34 can be transferred to mix through ratio and constitute by multiple different superconduction fluent material, and this superconduction fluent material can adopt NaOH (NaOH), K
2CrO
4(potassium chromate), ethanol (Ethanol), water (H
2O) wait other known superconduction fluent material.
The heat that above-mentioned super heat-conductive pipe 3 is suitable for is transmitted temperature range, be can be by filling in inside, allocate the superconduction mixing material of forming 34 through ratio by multiple superconduction fluent material, utilize the variation allotment of composition material and ratio and set and be applicable to the temperature range of subzero tens of degree Celsius to thousands of degree, all can be fast and reach thermal energy transfer at a distance.
Consulting shown in Figure 5ly, is that the assembling of this novel heat spreader structures improvement is dispersed schematic diagram with the heat transmission.As shown in the figure: this fin module 1 and heat conduction steamed bun group 2, link the three-dimensional frame group form configuration of formation by at least one vacuum superconductive heat pipe 3, the heat energy that heat conduction module 2 thermal bondings are transmitted in electronic building brick (CPU), can be passed to each radiating fin 11 of fin module 1 fast by super heat-conductive pipe 3 heat of high heat transfer efficient, cooperate the radiator fan 4 that is incorporated into fin module 1 top, generation is distinguished and admirable through the heat radiation that fin module and heat conduction module direction blow by fan directional, be with on fin module and heat conduction module heat energy to disperse simultaneously, the radiator that this is novel is also configurable in arbitrarily angled, and the heat energy of acquisition Ultra-High Efficiency thermal resistivity is dispersed.
Simultaneously, by the top board 24 of this heat shield 5 and heat conduction module 2 and super heat-conductive pipe is terminal combines, allow the heat energy that concentrates on end also can on average be disperseed fast, the distinguished and admirable band of heat radiation of the radiator fan 4 of arranging in pairs or groups from.
A kind of super heat-conductive pipe that is used for vacuum super thermal conduction heat radiator of the present invention, comprise the thin Metal Ball of a metal outer pipe, a fine metal mesh and plural number, this fine metal mesh volume is located at metal outer pipe inside, the thin Metal Ball of plural number is distributed between metal outer pipe and the fine metal mesh, the thin Metal Ball of metal outer pipe, fine metal mesh and plural number is through sintering and vacuum treatment, form the conductor tube of vacuum, agravic and pressure, be filled with the superconduction mixing material in this conductor tube inside.Wherein, this superconduction mixing material can be allocated the superconduction mixing material of forming by existing multiple superconduction fluent material through ratio.
Above-mentioned detailed description system specifying at the present invention's one possible embodiments, this embodiment is not in order to limit claim of the present invention, all do not break away from skill of the present invention spirit institute for it equivalence implement or conversion, for example: wait the equivalence embodiment of variation etc., all should be contained in the claim of the present invention.
Claims (10)
1. a vacuum super thermal conduction heat radiator comprises fin module and radiator fan, and this radiator fan is arranged at fin module top, it is characterized in that also comprising:
A heat conduction module; And,
At least one super heat-conductive pipe, an end are linked to above-mentioned fin module, and the other end is linked to above-mentioned heat conduction module;
Above-mentioned super heat-conductive pipe links above-mentioned fin module and heat conduction module, forms the configuration of three-dimensional frame group form, and fast heat is fitted in electronic building brick institute transferring heat energy by super heat-conductive pipe and be sent to the fin module, disperses by the radiator fan high efficiency.
2. according to the vacuum super thermal conduction heat radiator of claim 1, it is characterized in that also comprising: a cage, be located at the not end of above-mentioned fin module, and with the terminal thermal of above-mentioned super heat-conductive pipe in the fin module, form the terminal thermal energy dissipation of super heat-conductive pipe and disperse.
3. according to the vacuum super thermal conduction heat radiator of claim 1, it is characterized in that: wherein, the pedestal that this heat conduction module system is made by the high thermal conductivity coefficient material combines with cover piece and constitutes, to form hollow inside in order to hold transferring heat energy in conjunction with one of above-mentioned super heat-conductive pipe.
4. according to the vacuum super thermal conduction heat radiator of claim 3, it is characterized in that: pedestal one end of this heat conduction module is provided with top board, with the terminal thermal of above-mentioned super heat-conductive pipe in the heat conduction module, forms super heat-conductive pipe and does not hold thermal energy dissipation and disperse.
5. according to the vacuum super thermal conduction heat radiator of claim 3, it is characterized in that: wherein, this heat conduction module internal is provided with at least one caulking groove, to be embedded an end of super heat-conductive pipe.
6. according to the vacuum super thermal conduction heat radiator of claim 1 or 2, it is characterized in that: this super heat-conductive pipe comprises:
One metal outer pipe;
One fine metal mesh, volume is located at above-mentioned outer tube inside;
The thin Metal Ball of plural number is laid between above-mentioned outer tube and fine metal mesh;
And, the superconduction mixing material;
The thin Metal Ball of above-mentioned metal outer pipe, fine metal mesh and plural number is through sintering process and vacuum treatment, forms the conductor tube of vacuum, agravic and pressure, and the superconduction mixing material filled in conductor tube inside constitutes.
7. according to the vacuum super thermal conduction heat radiator of claim 6, it is characterized in that: wherein, this super heat-conductive pipe also comprises: by above-mentioned metal outer pipe through sintering, the space between fine metal mesh, and fine metal mesh and the thin Metal Ball surface of plural number, form a distribution table facial mask, mobile by pushing mutually of distribution table facial mask, with the past fast cold junction transmission of heat energy.
8. according to the vacuum super thermal conduction heat radiator of claim 6, it is characterized in that: wherein, this superconduction mixing material is transferred to mix through ratio by multiple different superconduction fluent material and is constituted, and this superconduction fluent material can adopt NaOH, K
2CrO
4, ethanol, water etc.
9. vacuum super thermal conduction heat radiator according to Claim 8, it is characterized in that: wherein, this superconduction mixing material can change allotment by the material and the ratio of multiple superconduction liquid, and is applicable to the different temperatures scope quick transferring heat energy of subzero tens of degree Celsius to thousands of degree.
10. a kind of super heat-conductive pipe that is used for the described vacuum super thermal conduction heat radiator of claim 1, it is characterized in that: comprise the thin Metal Ball of a metal outer pipe, a fine metal mesh and plural number, this fine metal mesh volume is located at metal outer pipe inside, the thin Metal Ball of plural number is distributed between metal outer pipe and the fine metal mesh, the thin Metal Ball of metal outer pipe, fine metal mesh and plural number is through sintering and vacuum treatment, form the conductor tube of vacuum, agravic and pressure, be filled with the superconduction mixing material in this conductor tube inside.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100046005A CN101227811B (en) | 2007-01-19 | 2007-01-19 | Vacuum super thermal conduction heat radiator |
| PCT/US2007/005866 WO2007136444A2 (en) | 2006-05-19 | 2007-03-08 | Superconductive heat cooler package of vacuum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100046005A CN101227811B (en) | 2007-01-19 | 2007-01-19 | Vacuum super thermal conduction heat radiator |
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| Publication Number | Publication Date |
|---|---|
| CN101227811A true CN101227811A (en) | 2008-07-23 |
| CN101227811B CN101227811B (en) | 2011-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100046005A Expired - Fee Related CN101227811B (en) | 2006-05-19 | 2007-01-19 | Vacuum super thermal conduction heat radiator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108050496A (en) * | 2018-01-15 | 2018-05-18 | 深圳市天添智能云设备有限公司 | A kind of UVLED curing systems radiator |
| CN111837093A (en) * | 2018-03-14 | 2020-10-27 | 微软技术许可有限责任公司 | Computing system with superconducting and non-superconducting components on a common substrate |
| CN116259595A (en) * | 2023-05-16 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Superconducting quantum computing device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6435266B1 (en) * | 2001-05-01 | 2002-08-20 | Aavid Taiwan Inc. | Heat-pipe type radiator and method for producing the same |
| CN2665800Y (en) * | 2003-11-20 | 2004-12-22 | 业强科技股份有限公司 | Heat radiation pipe |
| CN1749349A (en) * | 2004-09-13 | 2006-03-22 | 郑振胜 | Heat conductive medium |
| CN2855012Y (en) * | 2005-11-24 | 2007-01-03 | 技嘉科技股份有限公司 | Heat sink |
-
2007
- 2007-01-19 CN CN2007100046005A patent/CN101227811B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108050496A (en) * | 2018-01-15 | 2018-05-18 | 深圳市天添智能云设备有限公司 | A kind of UVLED curing systems radiator |
| CN111837093A (en) * | 2018-03-14 | 2020-10-27 | 微软技术许可有限责任公司 | Computing system with superconducting and non-superconducting components on a common substrate |
| CN111837093B (en) * | 2018-03-14 | 2022-07-15 | 微软技术许可有限责任公司 | Computing system with superconducting and non-superconducting components on a common substrate |
| CN116259595A (en) * | 2023-05-16 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Superconducting quantum computing device |
| CN116259595B (en) * | 2023-05-16 | 2023-07-04 | 中诚华隆计算机技术有限公司 | Superconducting quantum computing device |
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| Publication number | Publication date |
|---|---|
| CN101227811B (en) | 2011-05-04 |
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