CN101220908A - Modularized semiconductor light source - Google Patents
Modularized semiconductor light source Download PDFInfo
- Publication number
- CN101220908A CN101220908A CNA2007100001644A CN200710000164A CN101220908A CN 101220908 A CN101220908 A CN 101220908A CN A2007100001644 A CNA2007100001644 A CN A2007100001644A CN 200710000164 A CN200710000164 A CN 200710000164A CN 101220908 A CN101220908 A CN 101220908A
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- light source
- source device
- semiconductor light
- conducting plate
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a modularized semiconductor light source device which comprises a light source module, at least one semiconductor chip and a cup cover; the light source module is formed by transversely arranging a heat-conducting plate in a hollow body which forms a light outlet in front and a via hole in the bottom; wherein, the heat-conducting plate is provided with at least one welding surface which is provided with at least one welding pad; the semiconductor chip selectively attaches to the welding surface of the heat-conducting plate and is electrotactically connected with an expected welding pad; the cup cover is combined on the bottom of the body to seal the via hole and is provided with a light-condense reflecting surface. When the semiconductor chip is lighted, the heat energy generated is transferred to the body through the heat-conducting plate, and then the light is reflected by the reflecting surface of the cup cover and is projected out from the light outlet.
Description
Technical field
The present invention relates to a kind of semi-conductor light source device, refer to a kind of modularized semiconductor light source device especially, it is with the combination of a light source module and one glass of cover, and has the modularized semiconductor light source device of optically focused and heat radiation concurrently.
Background technology
By known light supply apparatus, big polyphyly uses light fixture, and various bulbs such as incandescent lamp, Halogen lamp LED or fluorescent lamp for example are with the light emitting source as light supply apparatus.In recent years, advantage such as (LightEmitting Diode is called for short LED) waits that semiconductor chip has that volume is little because light emitting diode, power saving and life-span are grown is to replace traditional light emitting source gradually, and becomes extremely welcome light emitting source.
For the structure of semi-conductor light source device, multicore sheet, high-power LED package have become inevitable trend requirement.For example, patent name is: the 6th, 492, No. 725 patent cases of the U.S. of Concentrically LeadedPower Semiconductor Device Package promptly propose a kind of encapsulating structure of common center, in order to the structure of a plurality of high-power die of encapsulation.This kind encapsulating structure, no doubt can solve a plurality of high-power die of encapsulation and heat dissipation problem, but periphery at this mounting structure, only there is one side can attach semiconductor chip, make the encapsulation quantity of semiconductor chip be restricted, and when semiconductor chip is light emitting diode, also, make its difficult optically focused requirement of satisfying when being applied in semi-conductor light source device because the semiconductor chip of the circumferential distribution of this mounting structure can not be concentrated.
In fact, semiconductor chip is owing to be to start moment, so the immediate current consumption is big, so that each semiconductor chip produces higher temperature, when light supply apparatus that it applies to throw light on, must possess and continue to light and use for a long time, often make the heat energy of semiconductor chip and bonding wire to derive, with the formation state of smouldering, and directly influence service life of semiconductor chip, so to high power semiconductor chip speech, the quality of radiating effect also is the good corrupt big essential factor of product.
Summary of the invention
In view of this, applicant of the present invention this in the experience of being engaged in semi-conductor light source device design and production and marketing for many years, phase can be improved the optically focused of aforesaid semiconductor light supply apparatus and many disappearances of poor heat radiation, through experiment and test repeatedly, and then develops and modularized semiconductor light source device of the present invention.
For reaching above-mentioned main purpose, the invention provides a kind of modularized semiconductor light source device, it comprises: a light source module, tie up to a hollow body inner transverse and one heat-conducting plate is set constitutes, this body the place ahead forms a light-emitting window, and the bottom then has a through hole; And this heat-conducting plate has at least one solder side, and this solder side is provided with at least one weld pad; At least one semiconductor chip is the solder side that optionally is attached at this heat-conducting plate, and is electrically connected to the weld pad of being desired; One glass of cover is to be incorporated into the body bottom surface, and so that through hole is sealed, it has the reflecting surface of an optically focused; To light when semiconductor chip, the heat energy that it generated sees through heat-conducting plate and conducts to body, and by the reflecting surface of this glass cover light is reflected, and is gone out by the light-emitting window projection.
Secondary objective of the present invention is to provide a kind of modularized semiconductor light source device, and wherein this body level is respectively opened a board slot to the relative wall, is one so that link for this heat-conducting plate.Perhaps, the inner fovea part level of this body hollow connects this heat-conducting plate to one.
Another purpose of the present invention is to provide a kind of modularized semiconductor light source device, and wherein this semiconductor chip is a light emitting diode.Moreover this semiconductor chip system is connected to the weld pad of this solder side with lead.Perhaps, this semiconductor chip is a flip-chip, and it directly attaches and be electrically connected to the weld pad of this solder side.
Still a further object of the present invention is to provide a kind of modularized semiconductor light source device, and wherein this solder side comprises first solder side, second solder side or side solder side.
Another object of the present invention is to provide a kind of modularized semiconductor light source device, and it comprises an array lens in addition, its in order to will converge in this glass cover toward light of this light-emitting window direction, further refraction and be distributed in this light-emitting window direction equably.
Another purpose of the present invention is to provide a kind of modularized semiconductor light source device, wherein this glass cover and body bottom surface combine adopt screw togather, chimeric or stick together.In addition, the non-binding position longitudinal extension one outside radiating block of this glass cover.Perhaps, the non-binding position horizontal expansion one outside extension block of this glass cover, it can be further combined with in a radiating subassembly.
Modularized semiconductor light source device provided by the invention is that semiconductor chip at least is attached to heat-conducting plate, for example aluminium base or ceramic substrate, and it can provide enough area of attachment and area of dissipation far and away.In addition, because the setting of cup cover can provide the reflecting effect after semiconductor chip is lighted.If this glass cover is made of metal, the heat energy that it can make semiconductor chip generate sees through heat-conducting plate and body, and then is passed to the cup cover, thereby strengthens area of dissipation.Into person is arranged especially, this glass cover is except can be used as the passing through of current electrode, it also can be by the outside radiating block that is connected with one, perhaps the outside extension block that connects with one combines with the radiating subassembly that adds, make and dispersed fast, reach best heat radiation function as heat energy that semiconductor chip produced such as High Power LEDs.
Description of drawings
Fig. 1 is the three-dimensional exploded view of modularized semiconductor light source device of the present invention;
Fig. 2 is of the present invention group of profile after upright;
Fig. 3 is of the present invention group of stereogram after upright;
Fig. 4 is the stereogram of another embodiment of modularized semiconductor light source device of the present invention;
Fig. 5 is the modularized semiconductor light source device of the present invention stereogram of an embodiment again;
Fig. 6 is another embodiment schematic diagram of cup cover of the present invention;
Fig. 7 is an embodiment schematic diagram again of cup cover of the present invention.
The specific embodiment
For further disclosing concrete technology contents of the present invention, at first see also accompanying drawing, wherein, Fig. 1 is the three-dimensional exploded view of modularized semiconductor light source device of the present invention, Fig. 2 is of the present invention group of profile after upright, Fig. 3 is of the present invention group of stereogram after upright, Fig. 4 is the stereogram of another embodiment of modularized semiconductor light source device of the present invention, Fig. 5 is the modularized semiconductor light source device of the present invention stereogram of an embodiment again, Fig. 6 is another embodiment schematic diagram of cup cover of the present invention, and Fig. 7 is an embodiment schematic diagram again of cup cover of the present invention.
As shown in Figure 1 to Figure 3, basically, modularized semiconductor light source device of the present invention is by 1, one glass of cover 2 of a light source module, and at least one semiconductor chip 3 combines.
This heat-conducting plate 12 has in order to optionally to attach semiconductor chip 3 at least, for example at least one solder side 120 of light emitting diode, for example first solder side 121, second solder side 122 or side solder side 123 etc.These solders side 120 have at least one weld pad 124 as wiring respectively.This at least one semiconductor chip 3 is flip-chip (Flip Clip) when implementing, so can attach respectively and be electrically connected on the weld pad 124 of each solder side 120 of this heat-conducting plate 12, to utilize the wiring of these weld pads 124, with current electrode as these semiconductor chips 3.Be with 1 group of, this light source module upright after, remove can allow semiconductor chip 3 light luminous, the heat energy that generated of these semiconductor chips 3 also can see through heat-conducting plate 12 and conduct to body 1 simultaneously, dispels the heat assisting.
In addition, in order to improve the radiating effect of these semiconductor chips 3, this heat-conducting plate 12 is embedded with thermal conductivity factor and is a good embedded radiating block 125 than heat-conducting plate 12 in order to attach the position of semiconductor chip 3.The material of this embedded radiating block 125 is good with copper, and chimeric mode then is to hollow out this heat-conducting plate 12, gives close-fitting mode again and makes.
In previous embodiment, though at least one solder side 120 of this heat-conducting plate 12 is pasted with the semiconductor chip 3 of upside-down mounting.So haveing the knack of this skill person such as all knows, on first solder side 121, second solder side 122 or the side solder side 123 of the solder side 120 of this heat-conducting plate 12, can attach more semiconductor chip 3 respectively, use the luminous intensity that increases this modularized semiconductor light source device.Wherein, the semiconductor chip 3 that is attached does not exceed with aforesaid flip-chip, it also can be general chip, be connected to respectively on the weld pad 124 of these solders side 120 with lead, and these weld pads 124 preferably should be positioned on the focus of body 11 arcwall faces 11 or contiguous focus place again.
Be with, when these semiconductor chips 3 are given in power supply, it can be lighted and luminous, because of cup covers the reflecting surface 21 that 2 inside have optically focused,, and converge toward the direction of light-emitting window 112 and throw and go out so light can be in this reflecting surface 21 optically focused and reflection.
In fact, the purpose of this glass cover 2 settings is to strengthen the light reflecting effect of this light source module 1.Only not to exceed, if this glass cover 2 is made with metal, it also has the function of heat radiation, as shown in Figure 6, the non-binding position longitudinal extension one outside radiating block 22 of this glass cover 2, the heat energy that these semiconductor chips 3 are generated sees through embedded radiating block 125 and is passed to heat-conducting plate 12 and body 11, and be passed to this glass cover 2 and outside radiating block 22 thereof at last, use the increasing area of dissipation, in order to do the heat energy that significantly reduces these semiconductor chips 3, make that heat energy is unlikely excessively to be gathered in these semiconductor chips 3, and cause damage, and then increase the service life.
As shown in Figure 7, be this glass cover 2 embodiment schematic diagram again, wherein, the non-binding position horizontal expansion one outside extension block 23 of this glass cover 2, as previously mentioned, the heat energy that these semiconductor chips 3 are generated can be passed to this outside extension block 23, and should be incorporated into a radiating subassembly 4 in addition by outside extension block 23, uses to enlarge area of dissipation more, in order to do the heat energy that significantly reduces these semiconductor chips 3, make that heat energy is unlikely excessively to be gathered in these semiconductor chips 3, and cause damage, and then increase the service life.
As shown in Figure 4, it is another embodiment schematic diagram of modularized semiconductor light source device of the present invention, wherein, these heat-conducting plate 12 belows have a V-notch 126, it can increase this solder side 120, for example the length of side solder side 123 can make these semiconductor chips 3 can tune on the focus or the advantage of contiguous focal position simultaneously.
Fig. 5 is the modularized semiconductor light source device of the present invention schematic diagram of an embodiment again, and its difference with previous embodiment is that this heat-conducting plate 12 and body 11 are one-body molded, and it can utilize metal casting for it, also can obtain the effect identical with previous embodiment.
Therefore, each solder side 120 when heat-conducting plate 12, for example be pasted with a plurality of semiconductor chips 3 respectively on first solder side 121, second solder side 122 or the side solder side 123, various wirings design on its these solders side 120 of can arranging in pairs or groups, and the circuit of controlling this modularized semiconductor light source device, reach purpose at different these light supply apparatuses of applications.For example, when the present invention is applied in auto bulb, semiconductor chip 3 as the high beam main light source can be attached to the focal position of heat-conducting plate 12 corresponding to this reflecting surface 21, and will be as the semiconductor chip 3 of dipped headlights light source, be attached to heat-conducting plate 12 focus the place ahead corresponding to this reflecting surface 21, and the wiring of using this heat-conducting plate 12, be connected to respectively on the different control circuits of light supply apparatus, to control whether lighting of dipped headlights or high beam light source respectively.
In addition, if when this modularized semiconductor light source device is applied to stage lighting, except these semiconductor chips 3 can be attached to 12 pairs of heat-conducting plates should the focal position of reflecting surface 21, also these semiconductor chips 3 can be attached to 12 pairs of heat-conducting plates should the focus of reflecting surface 21 around, and the wiring of using heat-conducting plate 12, with on the focus or focus around semiconductor chip 3 be connected to respectively on the different control circuits of light supply apparatus, to control whether lighting of these semiconductor chips 3 respectively, reach the purpose of dynamic control stage lighting.Wherein, be attached at the light that the semiconductor chip 3 in focus left side is produced, will be partial to right-hand projection, and the light that the semiconductor chip 3 that is attached at the focus right side is produced, then can be partial to the left projection, so the control circuit of this light supply apparatus of can arranging in pairs or groups is dynamically controlled stage lighting light.
In addition, for the light that light supply apparatus of the present invention is produced can distribute more equably, the light-emitting window 122 of this body 11 can be in conjunction with an array lens 5.As shown in the figure, the concavees lens 51 that these array lens 5 structures are arranged by array are constituted, so that cup cover 2 is converged light toward light-emitting window 112 directions, and further refraction and be distributed in the direction of light-emitting window 112 more equably.Certainly, have the knack of this skill person such as and all know, the structure of this array lens 5 also can be made of the convex lens of array arrangement, can reach the light that the divergent light source device is produced equally, makes the purpose that is distributed in light-emitting window 112 more equably.
So via enforcement of the present invention, this modularized semiconductor light source device system semiconductor chip at least is attached to heat-conducting plate, for example aluminium base or ceramic substrate, it can provide enough area of attachment and area of dissipation far and away.In addition, because the setting of cup cover can provide the reflecting effect after semiconductor chip is lighted.If this glass cover system is made of metal, the heat energy that it can make semiconductor chip generate sees through heat-conducting plate and body, and then is passed to the cup cover, thereby strengthens area of dissipation.Into person is arranged especially, this glass cover is except can be used as the passing through of current electrode, it also can be by the outside radiating block that is connected with one, perhaps the outside extension block that connects with one combines with the radiating subassembly that adds, make and dispersed fast as heat energy that semiconductor chip produced such as High Power LEDs, reach best heat radiation function, really belong to a ware big good structure not seen before.
Disclosed person is a kind of of preferred embodiment, and patent right category of the present invention is not all taken off in Ju Bu change or modification and come from technological thought of the present invention and be easy to the person of knowing by inference by the people who has the knack of this skill such as.
Claims (15)
1. modularized semiconductor light source device, it comprises:
One light source module ties up to a hollow body inner transverse and one heat-conducting plate is set constitutes, and this body the place ahead forms a light-emitting window, and the bottom then has a through hole; And this heat-conducting plate has at least one solder side, and this solder side is provided with at least one weld pad;
At least one semiconductor chip is the solder side that optionally is attached at described heat-conducting plate, and is electrically connected to the weld pad of being desired;
One glass of cover is to be incorporated into the body bottom surface, and so that through hole is sealed, it has the reflecting surface of an optically focused.
2. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described heat-conducting plate is aluminium base or ceramic substrate.
3. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described body level is respectively opened a board slot to the relative wall, is one so that link for described heat-conducting plate.
4. modularized semiconductor light source device as claimed in claim 1 is characterized in that, the inner fovea part level of described body hollow connects described heat-conducting plate to one.
5. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described semiconductor chip is a light emitting diode.
6. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described semiconductor chip is connected to the weld pad of described solder side with lead.
7. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described semiconductor chip is a flip-chip, and it directly attaches and be electrically connected to the weld pad of described solder side.
8. modularized semiconductor light source device as claimed in claim 1 is characterized in that, in order to attach described position of semiconductor chip, it is embedded with an embedded radiating block on the described heat-conducting plate.
9. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described solder side comprises first solder side, second solder side or side solder side.
10. modularized semiconductor light source device as claimed in claim 1 is characterized in that, comprises that also an array is in order to converging the lens that are distributed in described light-emitting window direction toward the further refraction of the light of described light-emitting window direction equably in the described cup cover.
11. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described cup cover is that an array type is in order to converging the speculum that is distributed in described light-emitting window direction toward the further reflection of the light of described Way out equably in the cup cover.
12. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described cup cover and body bottom surface combine employing screw togather, chimeric or stick together.
13. modularized semiconductor light source device as claimed in claim 1 is characterized in that, the non-binding position longitudinal extension one outside radiating block of described cup cover.
14. modularized semiconductor light source device as claimed in claim 1 is characterized in that, the non-binding position horizontal expansion one outside extension block of described cup cover, and it can be further combined with in a radiating subassembly.
15. modularized semiconductor light source device as claimed in claim 1 is characterized in that, described heat-conducting plate bottom surface has a V-notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100001644A CN101220908A (en) | 2007-01-09 | 2007-01-09 | Modularized semiconductor light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100001644A CN101220908A (en) | 2007-01-09 | 2007-01-09 | Modularized semiconductor light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101220908A true CN101220908A (en) | 2008-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100001644A Pending CN101220908A (en) | 2007-01-09 | 2007-01-09 | Modularized semiconductor light source |
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| CN (1) | CN101220908A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102087004B (en) * | 2009-12-03 | 2014-06-11 | 马士科技有限公司 | LED (Light Emitting Diode) lamp and reflecting cup therein |
-
2007
- 2007-01-09 CN CNA2007100001644A patent/CN101220908A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102087004B (en) * | 2009-12-03 | 2014-06-11 | 马士科技有限公司 | LED (Light Emitting Diode) lamp and reflecting cup therein |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20081219 Address after: Taiwan City, new Taipei Baoxing road 87 Lane 2 Applicant after: Lide Electronics Co., Ltd. Address before: China Taiwan Taipei county and Zhongshan Road 2 paragraph 351, No. 4 floor, room A Applicant before: ATRT Light Corp. |
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| ASS | Succession or assignment of patent right |
Owner name: LIDE ELECTRON CO., LTD. Free format text: FORMER OWNER: DESHENG ELECTRONICS CO., LTD. Effective date: 20081219 |
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| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20080716 |
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| C20 | Patent right or utility model deemed to be abandoned or is abandoned |