CN104154491A - Light distribution structure of flexible curved-surface bottom plate based on CSP chips and manufacturing method thereof - Google Patents
Light distribution structure of flexible curved-surface bottom plate based on CSP chips and manufacturing method thereof Download PDFInfo
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- CN104154491A CN104154491A CN201410323564.9A CN201410323564A CN104154491A CN 104154491 A CN104154491 A CN 104154491A CN 201410323564 A CN201410323564 A CN 201410323564A CN 104154491 A CN104154491 A CN 104154491A
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Abstract
The invention discloses a light distribution structure of a flexible curved-surface bottom plate based on CSP chips. The light distribution structure comprises the flexible plastic bottom plate, a metal circuit layer and the CSP chips. The invention further discloses a manufacturing method of the light distribution structure of the flexible curved-surface bottom plate based on the CSP chips. The manufacturing method comprises the following steps that firstly, simulation design is carried out on the shape of a free curved surface; secondly, surface treatment is carried out on the flexible plastic curved-surface bottom plate; thirdly, the distribution of the CSP chips is deigned, and meanwhile driving circuits of the different CSP chips are debugged and simulated; fourthly, according to the distribution of the CSP chips, the layout of the circuit layer is designed; fifthly, the circuit layer is manufactured based on the photolithography process; sixthly, the CSP chips are welded to welding points, the radian of the positions, with the CSP chips, of the flexible curved surface is adjusted, and the needed light distribution effect is achieved. The light distribution structure has the advantages of being simple, low in cost and the like.
Description
Technical field
The present invention relates to a kind of CSP chip LED light distribution structure, particularly light distribution structure of a kind of flexible curved surface base plate based on CSP chip and preparation method thereof.
Background technology
LED is a kind of light emitting semiconductor device that has obvious directionality, realize good LED illuminating effect, be unable to do without good optical design.The main way of secondary optics processing, is exactly by various types of optical lenses, reflectorized material, and optics diffusion material is realized, and has determined the system light efficiency of illuminating device.Be limited to the reason of the materials such as optical lens, all LED optical systems, after the materials such as above-mentioned optical lens, inevitably can cause the very big loss (conventionally reaching 10%-30% left and right) of luminous intensity.And the product that existing market is popular is all the product that profile is fixed, light type is fixing.Further, weatherability, the high-temperature stability of secondary optics material have extra long life to CSP chip system at present, often become one of major influence factors.
CSP (being chip size packages) is the chip encapsulation technology of LED a new generation, CSP chip is compared with common LED chip, it is better that this chip has heat radiation performance, high lumen density, and reach higher lumen value at same sampling device, omit routing processing procedure, production reliability promotes, high packaging density, adopts SMD laminating, simplifies substrate, the advantages such as laminating type tool elasticity.
Free form surface, aspect secondary optical design, is applied to design toroidal lens or increases curved surface reflection cup/reverberation bowl to LED light fixture.And flexible free form surface base plate luminous intensity distribution is once light-distribution, by the radian on curved surface, LED is carried out to luminous intensity distribution, overcome the little and large problem of light loss of LED illumination light-emitting angle, and improved by the LED luminous intensity distribution different from the conventional light source low problem of illuminator capacity usage ratio of bringing that distributes.
Summary of the invention
Primary and foremost purpose of the present invention is to provide a kind of light distribution structure of the flexible curved surface base plate based on CSP chip, the LED light fixture of this light distribution structure to CSP chip luminous intensity distribution, its flexible plate not only plays and supports CSP chip, simplify fitting structure, reduce the effect of whole lamp system thermal resistance.
Another object of the present invention is to provide a kind of preparation method of the light distribution structure of preparing the described flexible curved surface base plate based on CSP chip, this preparation method makes the light fixture can be according to service condition, and bending fold plastic supporting base, to reach various light distribution requirements.
Primary and foremost purpose of the present invention is achieved through the following technical solutions: a kind of light distribution structure of the flexible curved surface base plate based on CSP chip, comprise: flexiplast base plate, metallic circuit layer and CSP chip, on described flexiplast base plate, be provided with metallic circuit layer, CSP chip is connected on metallic circuit layer.
Described flexiplast base plate adopts high heat-conducting plastic to make, and has flexibility.
Described CSP chips welding is on metallic circuit layer.
Described CSP chip adopts CSP encapsulation, and at least two described CSP chip portfolios use.
As preferably, described light distribution structure also comprises drive circuit, and described CSP chip is connected with drive circuit, and described drive circuit is used for controlling CSP chip.
A kind of light distribution structure of the flexible curved surface base plate based on CSP chip has free curve flexibility plastic bottom board, described flexiplast base plate is high heat-conducting plastic, have flexible folding characteristic, be furnished with metallic circuit layer on the free form surface of described base plate, CSP chips welding is on metallic circuit layer.
Described CSP chip is CSP encapsulation.
Described plastic supporting base preferably adopts high heat conduction engineering plastics to make, as DSM heat-conducting plastic PA46.
The lower surface of described free form surface base plate is plastic heat radiation fin.
Described free form surface can, according to different purposes, different luminous intensity distribution needs, reach optimal light distribution effect.
Direct plated with copper circuit layer on described free form surface, copper circuit layer forms circuit and connects and solder joint, for CSP chip provides circuit lead, realizes on the other hand CSP chips welding on the one hand.The wiring of circuit and solder joint position determined by free form surface concrete shape, and CSP chip is directly welded on solder joint.
Another object of the present invention is achieved through the following technical solutions: a kind of preparation method of flexible plate LED light fixture, it is characterized in that, and comprise the following steps:
Step 1, utilize optical analysis software simulation method, effect according to actual needs, carries out board design to the shape of free form surface, simultaneously the bond pad locations to Random Curved Surface Designing CSP chip;
Step 2, flexiplast curved surface base plate is carried out to surface treatment, so-called surface treatment can be to apply with plated film metal and have the coating of affinity or corona discharge activation processing is carried out in plastic supporting base surface on plastic supporting base surface;
The distribution of step 3, design CSP chip is debugged simulation to the drive circuit of different CSP chips simultaneously;
Step 4, according to the distribution of CSP chip, the arranging of the principle design line layer of combined circuit analysis; Described line layer is metal film, and described metal film adopts vacuum coating technology to make, and described metal film is copper film or aluminium film;
Step 5, with gold-tinted lithography process make line layer, described gold-tinted lithography process comprises photoresistance coating, exposure process, developing procedure, etching procedure and striping operation;
Step 6, by CSP chips welding to solder joint.According to bright dipping situation, adjust the radian at the each CSP chip of flexible curved surface place simultaneously, reached optimal light distribution effect.
Principle of the present invention: the free form surface of the light distribution structure of the flexible curved surface base plate based on CSP chip of the present invention can be according to different purposes, different luminous intensity distribution needs, by first simulating the method for rear fine setting, reach optimal light distribution effect, and described free form surface base plate lower surface is radiating fin.The present invention has not only reduced the light loss problem of secondary light-distribution, and under CSP chip and the two combination of flexible curved surface base plate, annexs the function of heat spreader structures and shell.The present invention simultaneously also provides a kind of flexible light, make up the defect that OLED exists on flexible light, and adopt high heat-conducting plastic as substrate, simplify the structure, save cost, and reduce the system thermal resistance of whole light fixture, under multiple CSP chips are combined with flexible curved surface plastic bottom board, there is better heat dispersion.
Compared with prior art, the present invention has the following advantages and beneficial effect:
(1) the present invention is based on nonimaging optics Theoretical Design free form surface, by first simulating the method for rear fine setting, to the CSP chip place to CSP encapsulation on curved surface radian carry out luminous intensity distribution, overcome the little limitation of common CSP chip light emitting angle, also common chip lumen density and the lower shortcoming of lumen value have been overcome simultaneously, improve the low problem of illuminator capacity usage ratio, obtained traditional optical design and be difficult to the illumination homogeneity realizing.Because CSP chip is less compared with common chip, radian regulates simpler again.
(2) the present invention has removed the use of secondary optics material, once forms three-dimensional optical system, has not only reduced the light loss problem of secondary light-distribution, and has saved cost.
(3) the present invention forms layer of metal line layer by vacuum coating technology and gold-tinted lithography process at plastic supporting base upper surface, is connected with circuit for the CSP chip that welds CSP encapsulation.And free form surface base plate adopts high heat-conducting plastic to make by injection molding process, not only rough surface is little, and can realize replacement Aluminium Radiator, and have the function of substrate and shell concurrently, touch the hidden danger such as electric leakage safety and also decrease, also comprise simultaneously lightweight, easy to process, design freedom large, good insulation preformance, advantage that efficiency is high.
(4) curved surface base plate of the present invention has served as aluminium base, radiator and the reflector (reverberation bowl) of traditional LED light fixture, realizes three-in-one function.The intermediate link that has reduced heat radiation, makes the heat dissipation channel of light fixture shorter, and thermal resistance significantly reduces, with the CSP chips incorporate of CSP encapsulation after, better heat-radiation effect.Therefore light fixture better reliability, thereby the light decay that the temperature rise of reduction light fixture causes.
(5) the present invention can be according to the spatial light intensity distribution of light source and the specific illumination of required realization, design any distribution curve flux light source making new advances, accurately controlled LED Uniform Illumination free form surface base plate of any lighting angle, thereby overcome the deficiency of plane bottom plate.
(6) the present invention is by adopting flexiplast base plate, realize LED light fixture have the same with OLED can flexing flexible characteristic, the open market of LED light fixture.The present invention had both had the flexible frivolous outward appearance of OLED, and had retained the advantages such as LED high-luminous-efficiency, long life.
Brief description of the drawings
Fig. 1 is that the light distribution structure of the flexible curved surface base plate based on CSP chip of the embodiment of the present invention 1 is dispersed the schematic diagram of illumination.
Fig. 2 is the schematic diagram of the light distribution structure spotlighting of the flexible curved surface base plate based on CSP chip of the embodiment of the present invention 2.
Fig. 3 is the schematic diagram after the light distribution structure curved surface of the flexible curved surface base plate based on CSP chip of the embodiment of the present invention 2 is adjusted.
Fig. 4 is the schematic diagram after the light distribution structure curved surface of the flexible curved surface base plate based on CSP chip of the embodiment of the present invention 2 is adjusted.
Fig. 5 is the light distribution structure preparation method process of the flexible curved surface base plate based on CSP chip of the embodiment of the present invention 1.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited to this.
Embodiment 1
As shown in Figure 1, the CSP chip flexible curved surface base plate LED wide angle lighting fitting of this enforcement, comprise copper wire layer 2, flexiplast curved surface base plate 3 and radiating fin 4 that CSP chip 1, circuit connect, the upper surface of described flexiplast curved surface base plate 3 is coated with the copper wire layer 2 being connected with circuit for welding CSP chip 1, CSP chip 1 be welded in the solder joint in copper wire layer 2.Described flexiplast curved surface base plate 3 can change in certain radian, can change radian to design according to light distribution requirements, the curvature at CSP chip 1 place can change within the specific limits.The present embodiment 1 is designed to example with wide-angle, and described flexiplast curved surface base plate 3 is for convex surface designs, to reach the object of wide-angle luminescence, and the curvature of CSP chip 1 weld all to press demand determined through calculating.Described flexiplast curved surface base plate 3 has higher surface smoothness.Need described copper wire layer 2 to be connected with the drive circuit of controlling each CSP chip 1.Described radiating fin 4 prepares by existing flexiplast injection molding process and one processing and forming technology with flexiplast curved surface base plate 3, interval, thickness and structure between each fin all equates, fin profile is streamlined, contributes to cross-ventilation, improves radiating effect.Final illuminating effect changes and the 3 radians variations of flexiplast curved surface base plate in the curvature at described CSP chip 1 place, coordinates integrated drive electronics simultaneously, common realization.
As shown in Figure 5, be the light distribution structure preparation method process of the flexible curved surface base plate based on CSP chip, this preparation process comprises the steps:
Step 1, utilize optical analysis software simulation method, effect according to actual needs, carries out board design to the shape of free form surface, designs the bond pad locations of free form surface CSP chip simultaneously;
Step 2, flexiplast curved surface base plate is carried out to surface treatment, so-called surface treatment can be to apply with plated film metal and have the coating of affinity or corona discharge activation processing is carried out in plastic supporting base surface on plastic supporting base surface;
The distribution of step 3, design CSP chip is debugged simulation to the drive circuit of different CSP chips simultaneously;
Step 4, according to the distribution of CSP chip, the arranging of the principle design line layer of combined circuit analysis; Described line layer is metal film, and described metal film adopts vacuum coating technology to make, and described metal film is copper film or aluminium film;
Step 5, with gold-tinted lithography process make line layer, described gold-tinted lithography process comprises photoresistance coating operation, exposure process, developing procedure, etching procedure and striping operation;
Step 6, by CSP chips welding to solder joint, simultaneously according to bright dipping situation, adjust the radian at the each CSP chip of flexible curved surface place, reach optimal light distribution effect.
Embodiment 2
The present embodiment is except following characteristic, and all the other features are with embodiment 1.
As shown in Figure 2, the CSP chip flexible curved surface base plate LED spotlight lamp of the present embodiment 2, described flexiplast curved surface base plate 3, for reaching optically focused requirement, adopts concave design.As shown in Figure 3 and Figure 4, be the CSP chip flexible curved surface base plate LED light fixture of the embodiment of the present invention 2 designed mechanism after curved surface adjustment according to demand.
Above-described embodiment is preferably embodiment of the present invention; but embodiments of the present invention are not limited by the examples; other any do not deviate from spirit of the present invention actual with principle under do change, modification, substitute, combination, simplify; all should be equivalent substitute mode, within being included in protection scope of the present invention.
Claims (6)
1. a light distribution structure for the flexible curved surface base plate based on CSP chip, comprising: flexiplast base plate, metallic circuit layer and CSP chip, it is characterized in that, and on described flexiplast base plate, be provided with metallic circuit layer, described CSP chip is connected on metallic circuit layer.
2. the light distribution structure of the flexible curved surface base plate based on CSP chip according to claim 1, is characterized in that, described flexiplast base plate adopts high heat-conducting plastic to make, and has flexibility.
3. the light distribution structure of the flexible curved surface base plate based on CSP chip according to claim 1, is characterized in that, described CSP chips welding is on metallic circuit layer.
4. the light distribution structure of the flexible curved surface base plate based on CSP chip according to claim 3, is characterized in that, described CSP chip adopts CSP encapsulation, and at least two described CSP chip portfolios use.
5. the light distribution structure of the flexible curved surface base plate based on CSP chip according to claim 3, is characterized in that, also comprises drive circuit, and described CSP chip is connected with drive circuit, and described drive circuit is used for controlling CSP chip.
6. a preparation method who prepares the light distribution structure of the flexible curved surface base plate based on CSP chip described in claim 1, is characterized in that, comprises the following steps:
Step 1, utilize optical analysis software simulation method, effect according to actual needs, carries out board design to the shape of free form surface, designs the bond pad locations of free form surface CSP chip simultaneously;
Step 2, flexiplast curved surface base plate is carried out to surface treatment, so-called surface treatment can be to apply with plated film metal and have the coating of affinity or corona discharge activation processing is carried out in plastic supporting base surface on plastic supporting base surface;
The distribution of step 3, design CSP chip is debugged simulation to the drive circuit of different CSP chips simultaneously;
Step 4, according to the distribution of CSP chip, the arranging of the principle design line layer of combined circuit analysis; Described line layer is metal film, and described metal film adopts vacuum coating technology to make, and described metal film is copper film or aluminium film;
Step 5, with gold-tinted lithography process make line layer, described gold-tinted lithography process comprises photoresistance coating operation, exposure process, developing procedure, etching procedure and striping operation;
Step 6, by CSP chips welding to solder joint, simultaneously according to bright dipping situation, adjust the radian at the each CSP chip of flexible curved surface place, reach needed light distribution effect.
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| CN201410323564.9A CN104154491A (en) | 2014-07-08 | 2014-07-08 | Light distribution structure of flexible curved-surface bottom plate based on CSP chips and manufacturing method thereof |
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| CN201410323564.9A CN104154491A (en) | 2014-07-08 | 2014-07-08 | Light distribution structure of flexible curved-surface bottom plate based on CSP chips and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534337A (en) * | 2015-01-09 | 2015-04-22 | 华南理工大学 | LED panel lamp based on RGB chips and manufacturing method thereof |
| CN105276421A (en) * | 2015-11-20 | 2016-01-27 | 苏州铭冠软件科技有限公司 | Concave surface OLED spot light |
| CN105605436A (en) * | 2015-11-20 | 2016-05-25 | 苏州铭冠软件科技有限公司 | Induction type concave surface OLED spot light |
| TWI556688B (en) * | 2015-04-28 | 2016-11-01 | 佳世達科技股份有限公司 | Lamp having illumination modules with different ratios of luminance adjustment |
| WO2017054239A1 (en) * | 2015-10-02 | 2017-04-06 | 魏晓敏 | Radiator, led light panel and led module |
| CN110538068A (en) * | 2019-09-25 | 2019-12-06 | 江西隆成医疗器械有限公司 | LED light source assembly for thermal moxibustion therapeutic apparatus and preparation method thereof |
-
2014
- 2014-07-08 CN CN201410323564.9A patent/CN104154491A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534337A (en) * | 2015-01-09 | 2015-04-22 | 华南理工大学 | LED panel lamp based on RGB chips and manufacturing method thereof |
| TWI556688B (en) * | 2015-04-28 | 2016-11-01 | 佳世達科技股份有限公司 | Lamp having illumination modules with different ratios of luminance adjustment |
| US9826592B2 (en) | 2015-04-28 | 2017-11-21 | Qisda (SuZhou) Co., ltd | Lamp having illumination modules with different percentage of luminance adjustment |
| WO2017054239A1 (en) * | 2015-10-02 | 2017-04-06 | 魏晓敏 | Radiator, led light panel and led module |
| CN105276421A (en) * | 2015-11-20 | 2016-01-27 | 苏州铭冠软件科技有限公司 | Concave surface OLED spot light |
| CN105605436A (en) * | 2015-11-20 | 2016-05-25 | 苏州铭冠软件科技有限公司 | Induction type concave surface OLED spot light |
| CN110538068A (en) * | 2019-09-25 | 2019-12-06 | 江西隆成医疗器械有限公司 | LED light source assembly for thermal moxibustion therapeutic apparatus and preparation method thereof |
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