CN102410483B - LED light source suitable for lighting lamp of vehicles and boats - Google Patents

LED light source suitable for lighting lamp of vehicles and boats Download PDF

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Publication number
CN102410483B
CN102410483B CN2011103585117A CN201110358511A CN102410483B CN 102410483 B CN102410483 B CN 102410483B CN 2011103585117 A CN2011103585117 A CN 2011103585117A CN 201110358511 A CN201110358511 A CN 201110358511A CN 102410483 B CN102410483 B CN 102410483B
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light source
led
wafer
led light
fluid
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CN2011103585117A
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CN102410483A (en
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黎昌兴
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黎昌兴
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Abstract

本发明涉及LED照明领域,公开了一种适用于车船前照灯用LED光源。 The present invention relates to the field of LED lighting, it is disclosed which is suitable for travel headlamp LED light source. 在金属基板的顶面设置有一凹坑;绝缘基材铺设在金属基板上顶面区域;在PCB绝缘基材上铺设有走线铜箔。 Provided on a top surface of the metal substrate has a pit; an insulating substrate is laid on the top face of the metal substrate; PCB insulating base material layered with copper traces. 复数个LED晶片固定在凹坑内,各LED晶片的绝缘层与金属基板面接触,各LED晶片的一电极引脚分别焊接于金属基板上,另一电极引脚分别通过各导电引线与走线铜箔电连接;各LED晶片以及导电引线以及荧光粉被共同包裹在硅胶填充部内。 A plurality of LED chip is fixed in the pit, the insulating layer of each LED chip contact with the metal surface of the substrate, an electrode lead of each LED chip are welded to the metal substrate, the other electrode through the conductive pins are lead and copper trace foil is electrically connected; and each LED chip and conductive leads are commonly wrapped in phosphor silica gel filling portion. 应用本技术方案有利于实现大功率的LED强光源,其有利于提高散热性能,其特别适用于车船用前照灯光源。 Application of the technical solution is conducive to a strong light source high power LED, which help to improve heat dissipation performance, which is particularly suitable for travel headlamp light source.

Description

适用于车船照明灯具LED光源 Applied in the travel lighting LED light source

技术领域 FIELD

[0001] 本发明涉及LED照明领域,尤其涉及一种LED光源。 [0001] The present invention relates to a LED lighting, and more particularly relates to an LED light source.

背景技术 Background technique

[0002] 车船用前照灯为对照明要求非常高的一种光源,目前的车船用前照灯主要为钨丝白炽灯,其工作原理为通过钨丝高达3000oC的白炽状态发光而实现照明。 [0002] The headlamp of travel of a light to a very high lighting requirements, the current travel mainly tungsten incandescent headlamp, it works up to incandescence through tungsten 3000oC emitting illumination is achieved.

[0003] 本发明人在进行本发明的研究过程中发现,目前的车船用钨丝白炽前照灯在应用过程中存在以下的缺陷:1、目前的车船用钨丝白炽前照灯的发光效率一般为13-201m/W,照明效率较低;2、目前的车船用钨丝白炽前照灯的寿命较低,其应用寿命一般仅3-10个月不等。 [0003] The present inventors have studied the process of carrying out the present invention found that the current travel incandescent tungsten filament headlamp following defects during application: 1, the luminous efficiency of the current travel incandescent tungsten filament headlamp with typically 13-201m / W, the luminous efficiency is low; 2, travel with the current life of the incandescent tungsten filament headlamp low, only the application life generally ranging 3-10 months.

[0004] 近年来随着LED技术的发展,LED由于其发光效率更高(一般达到120_1601m/W),更加环保节能的优点而备受各国的青睐。 [0004] In recent years, with the development of LED technology, LED luminous efficiency due to the higher (typically reaches a 120_1601m / W), more environmentally friendly energy saving advantages while highly favored countries. 但是由于LED的工作温度要求较低而不可能如钨丝灯一样耐受高温,故在LED的强光源应用上受到极大的限制。 However, due to the lower operating temperature requirements of the LED is not possible to withstand high temperatures, such as tungsten, it is severely limited in application of the LED light intensity.

[0005] 在本发明人近几个年参加的一些大型LED科学会议上获悉,目前的LED照明专家仍然认为对照明强度极高且体积受限的车船用前照灯中应用LED是不可能实现的技术难题。 [0005] In some large LED scientific conferences present inventors to participate in the last few years on informed that the current LED lighting experts still believe the illumination intensity and high volume applications with limited travel LED headlamp is not possible technical problems.

发明内容 SUMMARY

[0006] 本发明实施例第一目的在于提供一种适用于车船前照灯用LED光源,应用本技术方案有利于实现大功率的LED强光源,其有利于提高散热性能,其特别适用于车船用前照灯光源。 [0006] The first embodiment of the present invention is to provide a suitable object to travel headlamp LED light source, the application of the technical solution of high power LED is conducive to a strong light source, which help to improve heat dissipation performance, which is particularly suitable for travel light headlamp.

[0007] 本发明实施例提供的一种适用于车船前照灯用LED光源,包括: [0007] The embodiments of the present invention provides a suitable travel headlamp LED light source, comprising:

[0008] 金属基板、PCB绝缘基材、走线铜箔、硅胶填充部、复数条导电引线以及复数个LED [0008] The metal substrate, PCB insulating base material, copper wiring, silica gel filling portion, a plurality of conductive leads and a plurality of LED

曰曰/T ; Said Said / T;

[0009] 在所述金属基板的顶面设置有一凹坑; [0009] provided on the top surface of the metal substrate has a pit;

[0010] 所述PCB绝缘基材铺设在所述金属基板上除所述凹坑外的顶面区域; [0010] The insulating substrate PCB laying on the top face of the metal substrate other than said outer pits;

[0011] 在所述PCB绝缘基材上铺设有所述走线铜箔; [0011] In the insulating base material layered with the PCB traces foil;

[0012] 所述金属基板、走线铜箔分别可与所述外部直流电流的两供电端子电连接; [0012] The metal substrate, a copper traces respectively connected to the two power supply terminal of the external direct current;

[0013] 复数个所述LED晶片固定在所述凹坑内, [0013] The plurality of LED chip fixed within the pit,

[0014] 各所述LED晶片底面的绝缘层与本所述LED晶片下方的所述金属基板面接触, [0014] The insulating layer of each of the LED wafer bottom surface contact with the metal substrate surface below the LED chip of the present,

[0015] 各所述LED晶片的一电极引脚分别焊接于本所述LED晶片下方的所述金属基板上, [0015] a respective electrode pins of the LED chip are soldered to the metal substrate present below the LED chip,

[0016] 各所述LED晶片的另一电极引脚分别通过各所述导电引线与所述走线铜箔电连接; [0016] The electrode pins of each of the other LED chip are connected through each of the conductive leads of the electrical wiring copper foil;

[0017] 在各所述LED晶片的顶面涂覆有灭光粉层, [0017] In each of the top surface of the LED chip is coated with a powder layer off light,

[0018] 所述硅胶填充部填充在所述凹坑内,各所述LED晶片以及导电引线以及荧光粉被共同包裹在所述硅胶填充部内。 [0018] The silica filler is filled in said recesses, each of the LED chip and conductive leads and the phosphor is commonly enclosed within the silica filler portion.

[0019] 可选地,还包括:散热基座、进流管; [0019] Optionally, further comprising: a heat sink, the intake manifold;

[0020] 在所述散热基座上具有一个封闭的立面,所述金属基板固定在所述散热基座的立面的右侧而与所述散热基座面接触; [0020] closed with a heat sink on the facade, the metal substrate is fixed to the heat sink in contact with the right side surface of the heat dissipation base facade;

[0021] 在所述散热基座的立面左侧向左延伸有复数个左延伸部, [0021] In the left side of the heat sink extends leftward base elevations of the plurality of left extension portion,

[0022] 所有所述左延伸部之间的间隙形成一个迂回通道, [0022] All of the left gap between the extending portion is formed a bypass passage,

[0023] 所述迂回通道的一端与所述进流管的第一端部连接,另一端与外相通。 [0023] One end of the bypass passage and the first end of the intake pipe is connected to the other end in communication with the outside.

[0024] 可选地,在所述散热基座的立面的左侧向左延伸有复数个左延伸部,具体是: [0024] Alternatively, the left side of the heat dissipation base facade extends leftward plurality of left extension portion, in particular:

[0025] 在所述立面的左侧设置有一个中心左延伸部以及一个左延伸管, [0025] disposed on the left side of the facade has a left extension portion and a center left extension tube,

[0026] 所述中心左延伸部位于所述左延伸管的管腔内; [0026] The center of the left extending portion located within the lumen of the left extension pipe;

[0027] 所述迂回通道具体为:所述中心左延伸部与所述左延伸管之间的间隙形成的空间。 [0027] The bypass channel specifically is: the space left gap between the central portion and the left extension extending tube formation.

[0028] 可选地,在所述立面的右端还设置有一个凹腔, [0028] Alternatively, in the facade of a right end provided with a cavity,

[0029] 所述凹腔的开口设置在所述立面的左端部, [0029] The opening provided in the cavity left end portion of the facade,

[0030] 所述凹腔向右延伸形成在所述中心左延伸部内部。 [0030] The cavity extends to the right is formed inside the center of the left extension portion.

[0031] 可选地,在所述散热基座的中心左延伸部的外周延伸有复数个流体疏导叶片, [0031] Alternatively, the outer periphery of the heat sink base center left extension portion extends a plurality of vanes divert the fluid,

[0032] 各所述流体疏导叶片与所述左延伸管的内壁具有间隙; [0032] each of the blades and divert the fluid to the left inner wall of the tube with a gap extending;

[0033] 所述进流管连接在所述中心左延伸部的外周, [0033] The intake pipe connected to an outer periphery of the central portion of the left extension,

[0034] 所述进流管的内壁与所述流体疏导叶片的端部相接触。 [0034] The inner wall of the fluid flow into the tube ends to ease contact with the blade.

[0035] 可选地,在所述左延伸管上的外周还形成吸热材料填充腔, [0035] Alternatively, the outer periphery of the tube on the left is also formed extending endothermic material filling the cavity,

[0036] 在所述吸热材料填充腔内填充有吸热材料, [0036] The filling material in the endothermic heat absorbing material filled into the cavity,

[0037] 在所述吸热材料填充腔的外周还设置有隔热层。 [0037] further provided on the outer periphery of the heat sink material filling the cavity with a heat-insulating layer.

[0038] 可选地,所述吸热材料为:水、或者高分子水凝胶、或者油液体。 [0038] Alternatively, the heat sink material is: water, hydrogel or polymer, or a liquid oil.

[0039] 可选地,还包括流体疏导管、以及流体接纳部; [0039] Optionally, further comprising a fluid pipe grooming, and a fluid receiving portion;

[0040] 所述进流管的第二端部与所述流体疏导管的一端连接, [0040] The intake pipe second end of one end of the tube is connected to divert the fluid,

[0041] 所述流体疏导管的另一端与所述流体接纳部的第二开口部连接, [0041] The other end of the second opening portion of the fluid receiving portion is connected to a fluid pipe grooming,

[0042] 所述流体接纳部沿第一开口端到所述第二开口端的通道呈圆弧状由宽变窄, [0042] The fluid receiving portion along a first open end to the second open end of the channel width is narrowed by a circular arc,

[0043] 所述第一开口端为与所述第二开口部相对的开口端部。 [0043] The open end of the first portion and the second opening end portion opposite to the opening.

[0044] 可选地,所述复数个LED晶片由:第一晶片矩阵以及第二晶片矩阵组成,所述第一晶片矩阵、第二晶片矩阵分别由:复数个LED焊接在一起的所述LED晶片构成;所述第一晶片矩阵、第二晶片矩阵之间的间距为:0.2-6毫米之间的一数值。 [0044] Alternatively, the plurality of LED chip: a first wafer and a second wafer matrix is ​​a matrix of the matrix first wafer, the second wafer from the matrix are: welding together a plurality of the LED LED constituting the wafer; wafer spacing between said first matrix, the second matrix is ​​the wafer: a value between 0.2 to 6 mm.

[0045] 可选地,所述第一晶片矩阵的中心线、和/或第二晶片矩阵的中心线偏离本所述LED光源所在的前照灯的光照基准轴线的距离:等于或大于0毫米小于或等于6毫米。 [0045] Alternatively, the center line of the first wafer matrix, and / or the second distance from the reference wafer matrix headlamp illumination axis according to said LED light source is located: equal to or greater than 0 mm less than or equal to 6 mm.

[0046] 可选地,所述金属基板为铜块,或者铝块,或者铜铝合金块。 [0046] Alternatively, the metal substrate is a copper block, or a block of aluminum, an aluminum alloy or a copper block.

[0047] 可选地,所述第一晶片矩阵、第二晶片矩阵之间的间距为:1-3毫米之间的一数值。 The spacing between the [0047] Alternatively, the first wafer matrix, the second matrix is ​​the wafer: a value between 1-3 mm.

[0048] 可选地,所述第一晶片矩阵、第二晶片矩阵为:两呈平行关系的直线状、弧线状,或者矩形;或者, [0048] Alternatively, the matrix first wafer, the second wafer matrix: two linearly parallel relationship, arc-shaped, or rectangular; or

[0049] 所述第一晶片矩阵、第二晶片矩阵为:两呈正交关系的直线状、弧线状,或者矩形。 [0049] The matrix of the first wafer, the second wafer matrix: two linearly orthogonal relationship, arc-shaped, or rectangular. [0050] 由上可见,由于本实施例在LED晶片的固定直接在金属基板的凹坑上焊接LED晶片,使LED晶片底面的绝缘层直接与金属基板面-面接触,LED晶片的一电极极引脚直接焊接在金属基板上,另一电极引脚通过导线引线与铺设在PCB绝缘基材上的走线铜箔电连接,在应用时,金属基板以及走线铜箔为各LED晶片引入直流工作电源。 [0050] As seen above, in this embodiment, since the LED chip is directly fixed on the metal substrate welded dimple LED wafer, the bottom surface of the insulating layer of the LED chip directly to the surface of the metal substrate - contacting surface, an electrode of the LED chip electrode pins soldered directly to the metal substrate, the other electrode pins electrically connected to the copper traces on the PCB laid through the insulating substrate, a lead wire, upon application, the substrate and the metal foil traces for the introduction of a DC LED chip power supply. 本实施例LED晶片工作过程中产生的热量可通过接触热传导而快速传递到散热性能良好的金属基板上,金属基板将LED晶片上的热量向外散发,故相对于现有技术在常规的PCT基板的走线铜箔上焊接LED晶片的固晶技术方案,应用本技术方案有利于提高散热效果。 This embodiment of an LED wafer heat generated during the operation can be quickly transferred to the good heat dissipation performance of the metal substrate by contacting the heat conductive metal substrate of the LED chip on the heat distributing outwardly with respect to the prior art it is conventional in the substrate PCT traces of copper foil soldered LED solid crystal wafer aspect, the technical solution of the present application help to improve the heat dissipation effect.

[0051] 在本实施例中,作为本实施例的一种较优实施方式,可以将各LED晶片的负极焊接在金属基板上,将各LED晶片的正极通过引线与凹坑外的走线铜箔电连接(可以但不限于通过焊接方式导电连接)。 [0051] In the present embodiment, as an embodiment according to the present embodiment Jiaoyou manner, the negative electrode of each LED chip is soldered on the metal substrate, the positive electrode of each LED chip and outer lead by pits copper traces foil is electrically connected (electrically conductive connection may be, but not limited to, by welding). 在应用时,将外部直流电源的正极输入端子与走线铜箔电连接,负极输入端子与金属基板电连接。 In use, the positive input terminal connected to the external DC power copper electrical traces, a negative input terminal electrically connected to the metal substrate. 此时在电性能上,负极块状金属基板的体积较粗,故相对于现有技术在常规的PCT基板的走线铜箔上焊接LED晶片的固晶技术方案,应用本技术方案有利于增强电流的稳定性,提高LED晶片的光照稳定性以及使用寿命。 At this time, on the electrical properties, the coarser the bulk volume of the negative electrode metal substrate, so that the prior art solid crystal aspect welding LED chip on the wiring substrate PCT conventional copper foil, applying the present technical solution conducive to enhancing current stability, improved light stability and the lifetime of the LED die.

[0052] 另外,作为本实施例的一种应用可选方案,也可以将各LED晶片的正极焊接在金属基板上,将各LED晶片的负极通过引线与凹坑外的走线铜箔电连接。 [0052] Further, as an application of the alternative embodiment according to the present embodiment, may be a positive electrode of each LED chip is soldered on the metal substrate, the negative electrode of each LED chip is electrically connected by a wiring copper foil and the outer lead wire pit . 在应用时,将外部直流电源的负极输入端子与走线铜箔电连接,正极输入端子与金属基板电连接。 In use, the negative input terminal of the external DC power supply electrically connected to the copper foil and the trace, the metal substrate and an input terminal connected to the positive electrode. 该可选方案的选用根据实际应用场景选择。 This alternative is selected based on the actual application scenario.

[0053] 需要说明的是,相对于现有技术传统的LED固定方式:在PCB绝缘基材上铺设的正、负极走线铜箔上固定焊接LED晶片,本发明实施例直接在实心金属基板表面焊接LED晶片的技术方案突破了目前技术人员的惯性思维,克服了技术偏见。 [0053] Incidentally, the prior art with respect to the conventional LED stationary manner: an insulating base material laid on a PCB positive, negative LED wafer down on fixed line welding foil, in the embodiment of the present invention is directed to a solid surface of the metal substrate welding LED wafer technology solutions break through the inertia of current thinking and technical personnel, to overcome the technical prejudice.

[0054] 综上,采用本实施例技术方案,有利于提高散热效率,改善LED光源的工作稳定性,延长寿命。 [0054] In summary, the technical solution of the present embodiment, help to improve the heat dissipation efficiency and improve operation stability of the LED light source and prolong life. 经过本发明人的大量试验,本实施例技术方案特别适用于车船用前照灯的强光源应用,使车船用前照灯采用LED实现成为可能。 After extensive testing by the present invention, the technical solution of the present embodiment is particularly suitable for application of strong light headlamp travel of the travel implement LED headlamp may be employed.

[0055] 附图说明 [0055] BRIEF DESCRIPTION OF DRAWINGS

[0056] 此处所说明的附图用来提供对本发明的进一步理解,构成本申请的一部分,并不构成对本发明的不当限定,在附图中: [0056] The drawings described herein are provided for further understanding of the present invention, constitute a part of this application, without unduly limiting the present invention, in the drawings:

[0057] 图1为本发明实施例1提供的一种LED光源的LED晶片固定结构的纵向剖面结构示意图; [0057] FIG. 1 is a schematic longitudinal sectional structure of the fixed structure of the LED light source is an LED chip according to an embodiment of the present invention provides;

[0058] 图2为本发明实施例2提供的第一种LED强光源剖面不意图:LED晶片固定金属基板与散热基座轴心平行地在安装在散热基座上; [0058] FIG 2 a first embodiment of an LED light source intensity sectional Example 2 of the present invention is not intended to provide: LED chip and the heat sink fixed to the metal substrate in parallel to the axis is mounted to the heat sink;

[0059] 图3为本发明实施例2提供的第二种LED强光源剖面示意图:LED晶片固定金属基板与散热基座轴心垂直地在安装在散热基座上; [0059] FIG. 3 is a schematic cross-sectional view a second LED light source provides a strong embodiment of the invention Example 2: LED chip fixed to the metal substrate and the heat sink mounted in the axis perpendicular to the heat sink;

[0060] 图4是本发明实施例2提供的第三种LED强光源剖面示意图:多个LED晶片固定金属基板分别安装在散热基座立面的右端面以及周围侧面; [0060] FIG. 4 is a cross-sectional view a third embodiment of an intense light source LED 2 provides a schematic diagram of the embodiment of the present invention: a plurality of LED chips are mounted on the fixed metal substrate and around the sides of a right end surface of the heat dissipating base facade;

[0061] 图5是本发明实施例2提供的第四种LED强光源剖面示意图:LED晶片固定金属基板安装在散热基座的大端面立面上; [0061] FIG. 5 is a schematic cross-sectional view a fourth embodiment LED light intensity provided by the embodiment of the present invention, 2: LED chip substrate is mounted on the fixed metal facade large end face of the heat sink;

[0062] 图6是本发明实施例2中图2、3、4、5提供的一种LED强光源的AA剖面结构不意图; [0062] FIG. 6 is an AA cross-sectional structure of an LED of FIG 2,3,4,5 strong light provided in Example 2 of the present invention is not intended;

[0063] 图1是本发明实施例2中图2中的散热基座的纵向剖面结构示意图;[0064] 图8是本发明实施例2中提供的另一种设有吸热材料填充腔及隔热层的散热结构的纵向剖面结构示意图; [0063] FIG. 1 is a schematic longitudinal cross-sectional structure of the heat sink of Example 2 in FIG. 2 embodiment of the present invention; [0064] FIG. 8 is the embodiment of the present invention provide another embodiment 2 is provided with the endothermic material fills the cavity and a longitudinal cross-sectional structure of the heat insulating layer is a schematic structure;

[0065] 图9是本发明实施例3中提供的一种流体疏导接纳装置的轴向剖面结构示意图; [0065] FIG. 9 is a schematic axial cross-sectional structure of an embodiment 3 provided in the fluid receiving device according to divert embodiment of the present invention;

[0066] 图10是本发明实施例3中提供的一种由图1所示结构以及图9所示装置组成的一种LED强光源的纵向剖面结构不意图; [0066] FIG. 10 is a longitudinal cross-sectional structure of a LED light source intensity in an embodiment 3 provided by the device configuration shown in FIG. 1 and FIG. 9 embodiment the composition of the present invention is not intended;

[0067] 图11是本发明实施例4中提供的一种由图8所不散热基座以及图1所不LED晶片固定结构、图9所示装置构成的LED强光源纵向剖面结构示意图; [0067] FIG. 11 is a heat sink in FIG. 8 and FIG not an LED chip without fixing structure schematic longitudinal sectional structure, shown in Figure 9 an LED device constituting one kind of an intense light source provided in Example 4 of the present invention;

[0068] 图12是本发明实施例5中第I种LED强光源的中LED晶片在金属基板上的位置设置不意图; [0068] Figure 12 is an LED wafer of Example I 5 types of LED light source embodiment of the present invention is a strong position disposed on the metal substrate is not intended;

[0069] 图13是本发明实施例5中第2种LED强光源的中LED晶片在金属基板上的位置设置不意图; [0069] FIG. 13 is an LED wafer in Example 5, two kinds of LED light intensity of the embodiment of the present invention disposed on a position of the metal substrate is not intended;

[0070] 图14为本实施例5提供的第3种LED光源的中LED晶片在金属基板上的位置设置不意图; [0070] FIG. 14 is disposed in the position of the three kinds of LED chip LED light source according to Embodiment 5 provided on the metal substrate is not intended;

[0071] 图15为本实施例5提供的第4种LED光源的中LED晶片在金属基板上的位置设置示意图 The LED chip [0071] 15 fourth LED light sources provided in Example 5 of the present embodiment in a position disposed on the metal substrate a schematic

[0072] 图16为本实施例5提供的第5种LED光源的中LED晶片在金属基板上的位置设置不意图; [0072] FIG 16 is provided in the present position of the LED light source LED wafer fifth embodiment of Example 5 provided on the metal substrate is not intended;

[0073] 图17为本实施例5提供的第6种LED光源的中LED晶片在金属基板上的位置设置不意图; The LED chip [0073] FIG 17 A sixth embodiment of the LED light source 5 is provided in the present embodiment a position disposed on the metal substrate is not intended;

[0074] 图18为本实施例5提供的第7种LED光源的中LED晶片在金属基板上的位置设置不意图; It is not intended to set the position of the LED light source seventh embodiment in the LED chip 5 provided on the metal substrate [0074] 18 of the present embodiment;

[0075] 图19为本实施例5提供的第8种LED光源的中LED晶片在金属基板上的位置设置不意图; The LED chip [0075] Figure 19 an eighth embodiment of the LED light source to provide a position 5 of the present embodiment is provided on the metal substrate is not intended;

[0076] 图20为本实施例5提供的第9种LED光源的中LED晶片在金属基板上的位置设置不意图; [0076] FIG 20 A ninth embodiment of the LED light sources 5 provided in the present embodiment the position of the LED chip disposed on the metal substrate is not intended;

[0077] 图21为本实施例5提供的第10种LED光源的中LED晶片在金属基板上的位置设置不意图; The LED chip [0077] 21 LED light source tenth embodiment 5 of the present embodiment is provided in a position disposed on the metal substrate is not intended;

[0078] 图22为本实施例5提供的第11种LED光源的中LED晶片在金属基板上的位置设置不意图; The LED chip [0078] FIG. 22 types of LED light source 11 Example 5 of the present embodiment is provided in a position disposed on the metal substrate is not intended;

[0079] 图23为本实施例5提供的第12种LED光源的中LED晶片在金属基板上的位置设置不意图; It is not intended to set the position of the LED light source twelfth embodiment in the LED chip 5 provided on the metal substrate [0079] 23 of the present embodiment;

[0080] 图24为本实施例5提供的第13种LED光源的中LED晶片在金属基板上的位置设置不意图; [0080] FIG. 24 is disposed in the position of the LED chip LED light source according to the thirteenth embodiment 5 provided on the metal substrate is not intended;

[0081] 图25为本实施例5提供的第14种LED光源的中LED晶片在金属基板上的位置设置不意图; The LED chip 14 kinds of LED light sources 5 provided in Example [0081] FIG. 25 of the present embodiment is provided at a position on the metal substrate is not intended;

[0082] 图26为本实施例5提供的第15种LED光源的中LED晶片在金属基板上的位置设 [0082] FIG. 26 types of LED light source 15 provided in Example 5 of the present embodiment is provided in the position of the LED chip on a metal substrate,

置示意图。 Home FIG.

[0083] 具体实施方式 [0083] DETAILED DESCRIPTION

[0084] 下面将结合附图以及具体实施例来详细说明本发明,在此本发明的示意性实施例以及说明用来解释本发明,但并不作为对本发明的限定。 [0084] and the following with reference to specific embodiments of the present invention will be described in detail, in this exemplary embodiment of the present invention serve to explain and illustrate the present invention but are not intended to limit the present invention.

[0085] 实施例1: [0085] Example 1:

[0086] 图1为本实施例提供的一种LED光源的LED晶片固定结构纵向剖面示意图。 LED chip fixing structure [0086] FIG 1 An LED light source according to the present embodiment provides a longitudinal cross-sectional view.

[0087] 参见图1所示,本实施例提供的LED光源100包括:金属基板101、PCB绝缘基材102、走线铜箔103、硅胶填充部104、复数条导电引线106、以及复数个LED晶片105。 [0087] Referring to FIG. 1, LED light source 100 is provided in this embodiment comprises: a metal substrate 101, PCB insulating substrate 102, copper traces 103, silica gel filling portion 104, a plurality of conductive leads 106, and a plurality of LED wafer 105.

[0088] 该金属基板101为一实心块状(一般为矩形,但也不限于为圆形或者其他非常规形状,具体可根据实际应用设计)。 [0088] The metal substrate 101 is a solid block (generally rectangular, but is not limited to a circular shape or other unconventional shapes, specifically designed according to the actual application).

[0089] 该金属基板101可以选用铜基板、铝基板、或者铜铝合金基板,还可以为其他导电、导热性能良好的金属材料基板。 [0089] The metal substrate 101 can use a copper substrate, an aluminum substrate, a copper or aluminum alloy substrate, may also be other good electrical and thermal conductivity of the metallic material of the substrate. 本发明人的试验发现采用铜基板的散热效果较佳,而铝基板的成本较低。 It was found by the present inventors using the preferred cooling effect of the copper substrate, aluminum substrate at relatively low costs.

[0090] 在金属基板101的顶面设置有一凹坑1011,PCB绝缘基材102铺设固定在金属基板101上除凹坑1011外的顶面区域,在PCB绝缘基材102上铺设有多个走线铜箔103。 [0090] In the top surface of the metal substrate 101 is provided with a dimple 1011, the insulating substrate 102 laid PCB fixing region other than the top surface 1011 of the pits on the metal substrate 101, 102 is provided with a plurality of walking in the insulating base plated PCB copper wire 103.

[0091] 在金属基板101的凹坑1011内固定有多个LED晶片105,这些LED晶片105底面的绝缘层1051与其下方的金属基板101面-面接触,各LED晶片105的一电极引脚被直接焊接(见图中的108示意)在本晶片下方的金属基板101上,各LED晶片105的另一电极引脚通过焊接的导电引线106而与铺设在凹坑1011外,PCB绝缘基材102上的走线铜箔103电连接。 [0091] In the pit the metal substrate 101, a plurality of LED 1011 is fixed to wafer 105, the bottom surface of the LED wafer 105 to its insulating layer 1051 below the surface of the metal substrate 101 - contact surfaces, each of the LED chip 105 is an electrode pin directly soldered (108 schematically in the figure) on the metal substrate present below the wafer 101, the other electrode of each LED chip 105 through the conductive pins 106 with the wire bonding laid outside the pits 1011, PCB insulating substrate 102 electrical traces 103 on the copper foil.

[0092] 在各LED晶片105的顶面涂覆有荧光粉,该荧光粉在涂覆后固化成型地包裹在LED晶片105的顶面形成荧光粉层107,具体的荧光粉的调制以及涂覆工艺可以但不限于参考现有的工艺进行。 [0092] with a phosphor coating on the top surface of each LED chip 105, after coating the phosphor Curing wrapped phosphor layer 107 is formed on the top surface of the LED chip 105, the specific modulation and phosphor coating process may be but is not limited to the conventional technology of the reference. 荧光粉层107可以对LED晶片105发出的光线进行调光,对外发出预定颜色的光线,譬如黄光、白光等,一般在应用中白光居多。 The phosphor layer 107 may be made to emit light from the LED wafer 105 of dimming external light emits a predetermined color, such as yellow, white, etc., in general the majority of applications, a white light.

[0093] 硅胶填充部104填充在凹坑1011内,作为外露的可透光的保护层而覆盖在凹坑1011的顶面,该硅胶填充部104充盈填充凹坑1011,而凹坑1011内的各LED晶片105、导电引线106以及荧光粉层107均被严严实实地共同包裹在硅胶填充部104内。 [0093] The silica gel filler portion 104 filled in the recesses 1011, as the exposed light-permeable protective layer to cover the top surface 1011 of the recesses, filling the silica filler portion 104 filled pits 1011, while the inner dimple 1011 each LED chip 105, a phosphor layer 106 and the conductive leads 107 are wrapped tightly together in a silica gel filled portion 104.

[0094] 在应用时,将外部直流电源的负极与金属基板101电连接,外部直流电源的正极与走线铜箔103电连接。 [0094] In use, the negative electrode and the metal substrate 101 is electrically connected to an external DC power supply, a positive external DC power supply lines is electrically connected to the copper foil 103 away. 在通电时,走线铜箔103成为电源正极,位于底部的大面积金属基板101成为电源负极,共同为焊接在金属基板101表面上的LED晶片105提供工作电源,为各LED晶片105引用工作电流,LED晶片105在电驱动下发出光线,光线经荧光粉层107、硅胶填充部104后对外射出,实现照明。 When energized, the copper foil 103 to become a positive power supply line, a large area at the bottom of the metal substrate 101 becomes the negative power supply, as the supply of welding together on a surface of the metal substrate 101 of the LED chip 105, 105 each LED operating current reference wafer , LED chip 105 emits light under an electric drive, the external light is emitted after 107, the phosphor layer silica gel filling portion 104, the illumination achieved.

[0095] 由上可见,由于本实施例在LED晶片105的固定直接在金属基板101上焊接LED晶片105,使LED晶片105底面的绝缘层1051直接与金属基板101面-面接触,各LED晶片105的一电极引脚直接焊接在金属基板101上,各LED晶片105的另一电极引脚通过导线引线与铺设在PCB绝缘基材102内的走线铜箔103电连接,在应用时,金属基板以及走线铜箔为各LED晶片引入直流工作电源。 [0095] seen from the above, since the present embodiment, in fixing the LED chip 105 directly on a metal substrate 101 welded LED chip 105, the LED chip 105 bottom surface of the insulating layer 1051 directly to the metal substrate 101 surface - the contact surface, each of the LED chip a lead electrode 105 is welded directly on the metal substrate 101, the other electrode of each LED chip by conductor pins 105 and lead wires laid in the insulating substrate 102. PCB traces 103 electrically connected to the copper foil, at the time of application, metal introducing the substrate and the copper traces DC operating power for the LED chip. 本实施例LED晶片105工作过程中产生的热量可通过接触热传导而快速传递到散热性能良好的金属基板101上,金属基板101将LED晶片105上的热量外散发,故相对于现有技术在常规的PCT基板的走线铜箔103上焊接LED晶片105的固晶技术方案,应用本技术方案有利于提高散热效果。 The present embodiment the heat of an LED wafer 105 generated during the operation can be quickly transferred to the good thermal properties of the metal substrate 101 is conducted through the contact heat, the metal substrate 101 of the outer heat from the LED chip 105 for distributing, so with respect to the prior art in a conventional PCT traces 103 on the substrate foil welding LED wafer 105 solid crystal aspect, the application of the present technology will help improve the heat dissipation effect.

[0096] 作为本实施例的一种可选应用实施方案,可以将各LED晶片105的正极焊接在金属基板上,将各LED晶片105的负极通过引线与凹坑1011外的走线铜箔103电连接。 [0096] As an alternative application of the embodiment of the present embodiment, each LED chip may be the positive electrode 105 is welded on a metal substrate, the negative electrode of each LED chip 105 via trace leads outside the pit copper foil 103 1011 the electrical connection. 在应用时,将外部直流电源的负极输入端子与走线铜箔103电连接,正极输入端子与金属基板101电连接。 In use, the negative input terminal of the external DC power supply and the copper traces 103 electrically connected to the input terminal and the metal substrate 101 is electrically connected to the positive electrode. 该可选方案的选用根据实际应用场景选择。 This alternative is selected based on the actual application scenario.

[0097] 作为本实施例的一种较优应用实施方案,可以将各LED晶片105的负极焊接在金属基板101上,将各LED晶片105的正极通过引线与凹坑1011外的走线铜箔103电连接(可以但不限于通过焊接方式导电连接)。 [0097] As an application of the present embodiment Jiaoyou embodiment, each LED chip may be a negative electrode 105 is welded on a metal substrate 101, the positive electrode of each LED chip 105 via trace leads outside the pit and the copper foil 1011 electrical connector 103 (but not to be electrically conductively connected by welding). 在应用时,将外部直流电源的正极输入端子与走线铜箔103电连接,负极输入端子与金属基板101电连接。 In use, the positive input terminal of the external DC power supply and the copper traces 103 electrically connected to the negative input terminal and the metal substrate 101 is electrically connected. 此时在电性能上,负极块状金属基板101的体积较粗,故相对于现有技术在常规的PCT基板的走线铜箔上焊接LED晶片的固晶技术方案,应用本技术方案有利于增强电流的稳定性,提高LED晶片105的光照稳定性以及使用寿命。 At this time, on the electrical properties, the coarser the bulk volume of the negative electrode metal substrate 101, so the prior art solid crystal aspect welding LED chip on the wiring substrate PCT conventional copper foil, the technical solution of the present application in favor enhanced stability of the current, the LED chip 105 to improve the light stability and lifetime.

[0098] 另外,相对于现有技术传统的LED固定方式:在PCB绝缘基材102上铺设的正负极走线铜箔103上固定焊接LED晶片105,本发明实施例直接在实心金属基板101表面焊接LED晶片105的技术方案突破了目前技术人员的惯性思维,克服了技术偏见。 [0098] Further, the prior art with respect to the conventional LED fixation: the insulating substrate 102 on a PCB laid down on the positive and negative foil 103 is fixed to the welding line LED wafer 105, embodiments of the invention the metal substrate 101 directly to the solid surface mount LED chip 105 aspect surmount the inertia of thinking of the art overcome a technical prejudice.

[0099] 综上,采用本实施例技术方案,有利于提高散热效率,改善LED光源的工作稳定性,延长寿命。 [0099] In summary, the technical solution of the present embodiment, help to improve the heat dissipation efficiency and improve operation stability of the LED light source and prolong life. 经过本发明人的大量试验,本实施例技术方案特别适用于车船用前照灯的强光源应用,使车船用前照灯采用LED实现成为可能。 After extensive testing by the present invention, the technical solution of the present embodiment is particularly suitable for application of strong light headlamp travel of the travel implement LED headlamp may be employed.

[0100] 实施例2: [0100] Example 2:

[0101] 参照图2-8,本实施例在应用实施例1所示的LED光源(在以下实施例中记为LED光源模块)的基础上,为了进一步提高其散热性能以适应实际应用而进一步增设了LED光源附件,具体结构如下: [0101] Referring to FIG 2-8, the present embodiment the LED light source shown in Example 1 is applied (in the example referred to as LED light source module of the following embodiment) on the basis, in order to further improve the heat radiation performance to exact further additional LED light source attachment, a specific configuration is as follows:

[0102] 本实施例的LED强光源主要由:实施例1所示的LED晶片固定结构100以及用于固定金属基板的散热基座201以及用于为散热基座201接入流体的进流管202组成。 [0102] LED light intensity according to the present embodiment is mainly composed of: Example LED chip 100 and the heat sink fixing structure for fixing the metal substrate 201 of FIG. 1 and the intake tube 201 is used to access fluid in the heat sink 202 components.

[0103] 以图2-8为例,各部件的结构以及连接关系如下: [0103] In FIGS. 2-8, for example, structural members and their connection relationship is as follows:

[0104] 在散热基座201上具有一个封闭的立面2011(所谓封闭具体是:立面2011在该立面的表面无与左侧连通的通孔从而使得该立面的左右两侧不相通)。 [0104] 201 to the heat sink having a closed facade 2011 (in particular the so-called closed: 2011 facade surface of the facade of the non-through hole communicating with the left side of the left and right so that the sides do not communicate facade ).

[0105] 实施例1中焊接有LED晶片的金属基板的底面固定在散热基座的立面的右侧而与散热基座面-面接触。 [0105] Example 1 is welded to the bottom surface of the metal substrate of the LED chip is fixed on the right side of the facade of the heat sink with the heat sink surface - the contact surface. 使金属基板上的热量可以快捷地通过面接触热传导到散热基座201上。 The heat on the metal substrate may be quickly transmitted to the heat sink 201 through the thermal surface contact.

[0106] 散热基座201的立面2011的左侧向左延伸有至少两个左延伸部2012、2013(2012、2013),这些左延伸部2012、2013之间的间隙形成一个迂回通道2014,迂回通道2014的一端与进流管202连接,另一端与外连通。 [0106] The left heat dissipating base 201 extends leftward 2011 facade with at least two left extension portions 2012, 2013 (2012, 2013), the gap between the left extension portions 2012, 2013, 2014 forming a bypass passage, One end of the bypass passage 2014 is connected to the intake tube 202, and the other end communicates with the outside. 流体可以从进流管202进入,流经迂回通道2014,从迂回通道2014与外连通的出口端流向外部。 Fluid can enter from the inlet conduit 202, flows through the bypass passage 2014 flows to the outside from the outlet end of the bypass passage communicating with the outer 2014.

[0107] LED强光源的工作原理是: [0107] LED light is strong works:

[0108] 在本散热基座201的立面2011的一侧面,LED光源模块的金属基板以及走线铜箔分别引入外部的直流电源,金属基板以及整个散热基座作为电源的负极,走线铜箔作为电源的正极,LED晶片在电驱动下点亮而对外照明。 [0108] In one aspect of the present heat dissipating base 201 facade 2011, the metal substrate and the LED light source module, a copper foil traces are introduced external DC power source, the metal substrate and the heat sink as a whole a negative power, copper traces foil as the positive electrode of the power supply, LED lighting and the wafer in the illumination of external electric drive.

[0109] 在LED晶片工作过程中,各LED晶片产生的热量通过面接触传导至其背面的金属基板,金属基板通过面接触传导而将热量传导到其背面的散热基座201,散热基座对外散发。 [0109] In the LED chip during operation, heat generated by each LED chip is conducted to the surface thereof contacting the back surface of the metal substrate, a metal substrate to conduct heat to the heat sink by surface contact with the back surface of the conductive 201, the external heat sink distributed.

[0110] 在散热基座201的立面2011的左侧,空气或者液体等流体从进流管202进入,流体流入迂回通道2014,在流经迂回通道2014中,流体与散热基座201的左延伸部2012、2013的表面接触,从迂回通道2014的另一端流出,在流体在迂回通道2014流通过程中,流体充分与散热基座201接触,将散热基座201上的热量通过流体带出,实现流体巡回散热,进一步提闻散热效果。 [0110] enters the left fluid such as air or liquid heat sink 2011 facade 201 from intake tube 202, the fluid flows into the bypass passage 2014, flowing through the bypass passage 2014 in fluid communication with heat sink 201 of the left extending surface of the contact portion 2012, 2013, out of the other end of the bypass passage 2014, 2014 of the fluid in circulation in the bypass passage, the fluid 201 in contact with the heat sink sufficiently, the heat from the heat sink 201 through the fluid out, effecting a fluid cooling circuit, the cooling effect is further improved smell.

[0111] 在本实施例中,散热基座201的立面2011是封闭的直立端面,立面2011的左右两侧不相通,故可以使得流体的流动局限于散热基座201左侧的迂回通道2014最终流向外界,而不会流到本散热基座201右侧,从而保证立面右侧固定的LED晶片的电性安全性。 [0111] In the present embodiment, the vertical surface of the heat susceptor 201 is closed upright end faces 2011, 2011 of the left and right sides of the facade does not communicate, it is possible that the flow of cooling fluid is restricted to the left side of the base 201 bypass passage 2014 ultimately to the outside, but does not flow right side of the heat sink 201, thus ensuring the safety of electrically fixed to the right vertical surface of the LED chip.

[0112] 在应用时,可以当将本实施的技术方案应用于汽车或者摩托车的LED车灯,将本实施例图27所示的LED光源固定在汽车或者摩托车的车头,在LED光源的外周安装灯罩便可作为汽车或摩托车等车用前照灯使用。 [0112] In use, when the can aspect of the present embodiment is applied to a car or motorcycle LED lights, LED light source shown in FIG. 27 cases of the present embodiment will be secured to the front car or motorcycle, the LED light source peripheral mounting lampshade you can use the headlamp as a vehicle such as a car or motorcycle. 在应用时,使进流管202的外接开口部朝前,这样在汽车或者摩托车开动的过程中,车体行进过程中的产生大量相对向后流动的空气流体从进流管202,空气流体流经流体疏导管202,流入LED光源的进流管202,流经迂回通道2014,经过迂回通道2014后流到外接的空气中,将散热基座201上的热量带走,实现利用自然的流体流动而实现流体巡回散热。 In use, the intake flow opening of the external tube portion 202 forward, so that in the course of a car or motorcycle actuated, the travel of the vehicle body during the generation of a relatively large amount of air flowing back fluid from the intake manifold 202, air stream a fluid inlet conduit to ease flow through the tube 202 flows in the LED light source 202, 2014, 2014 through the bypass passage flows to the external air flowing through the bypass passage, heat is taken away in the heat sink 201, to achieve a fluid using a natural Circuit cooling fluid flow is achieved.

[0113] 再比如,当将本实施的技术方案应用于轮船上的大功率电气或者LED强光源时,将本实施例图2-7所示的LED光源固定在轮船上的确定位置,以实现LED照明作用。 [0113] As another example, when the aspect of the present embodiment is applied to a ship on the high-power electrical strong light source or LED, the LED light source is fixed to determine the present position of the ship on the embodiment shown in FIGS. 2-7 embodiment, in order to achieve LED lighting effect. 将进流管202的外接开口部置入轮船的底部使朝前伸入水下(或者将进流管202的外接开口部安装在轮船的船身上位于水上方,使其开口超前)。 The external opening of the tube 202 is placed into the bottom of the ship so that the inflow forwardly extending into the underwater (or hull external opening of the tube 202 is attached to the ship located above the inflow water, the opening ahead of it). 在轮船前进的过程中,在轮船前进的过程中,相对向后流动的大量海水流体流入散热装置本体100的进流管202 (或者相对向后流动的大量空气流体流入散热装置本体100的进流管202),流体流经迂回通道2014,经过迂回通道2014后流到外接的空气中,将散热基座201上的热量带走,实现利用自然的流体流动而实现流体巡回散热。 Inlet conduit 202 (or relatively large air stream flowing rearward during advancement of the ship, during the ship advances, a lot of water flowing rearwardly relative to the fluid flow into the heat sink body 100 flows into the heat dissipation device main body 100 of the inflow tube 202), the fluid flows through bypass passage 2014, the air passes through the bypass passage 2014 flows to the external of the heat from the heat sink 201 away, to achieve the fluid flow is achieved using the natural cooling fluid circuit.

[0114] 再比如,当将本实施的技术方案应用于固定定着的大功率LED光源时,可以通过气泵或者水泵的动力系统,在泵力的作用下,空气或者液体等流体流入进流管202,流经迂回通道2014,经过迂回通道2014后流到外接的空气中,将散热基座201上的热量带走,实现流体巡回散热。 [0114] As another example, when the aspect of the present embodiment is applied to a predetermined fixed high-power LED light source, the power system by the air pump or the pump, and the pump power, fluid such as air or liquid flows into the intake pipe 202 , flowing through the bypass passage 2014, through the external air to flow in the bypass passage 2014, heat is carried away on the heat sink 201, the heat dissipation effect fluid circuit.

[0115] 综上,应用本实施例技术方案,可以利用外部的流体(比如空气或者水等)而对大功率强光LED光源模块散热,相对于现有技术中的传统散热的方式(比如但不限于制冷等),本实施例散热解决方案更加环保、节能。 The [0115] Fully, the technical solution of embodiments of the present application, may utilize external fluid (such as air or water, etc.) and high-power LED light source module radiating light, with respect to a conventional prior art cooling manner (such as, but is not limited to refrigeration and the like), thermal solution of the present embodiment is more environmental friendly.

[0116] 特别地,在汽车、摩托车、轮船的照明光源上的应用本实施例方案,可以仅利用外接的空气或者水流而自动实现散热,而不需额外的任何制冷装置,实施环保、简单易行。 [0116] In particular, the illumination source used in automobiles, motorcycles, boats embodiment of the present embodiment the program may be utilized only air or water-cooling external and automatically, without any additional refrigeration apparatus, environmental protection embodiment, a simple easy.

[0117] 实施例1中LED晶片固定金属基板的安装位置可以根据实际的需要而定。 [0117] Example 1 LED mounting position of the wafer holding metal substrate embodiment may be based on actual needs. 比如:如图2、6所示,可以在散热基座201的立面2011右侧设置一个向右延伸伸出的右延伸体,在该右延伸体的一表面紧贴安装该LED晶片固定金属基板,使LED晶片在该向右延伸体的端面对外水平向下发出光线实现照明。 For example: As shown in FIG 2, 6, may extend in the right-dissipating base 201 disposed on the right side elevation of a 2011 extending rightward projecting, in a surface of the right extension member of the LED chip is mounted against the fixed metal the substrate, the LED chip emits light downward illumination of the horizontal end surface of the foreign body extending rightward. 在LED晶片工作过程中产生的热量由LED晶片通过面接触传导到金属基板,由金属基板接触传导传输到散热基座201上,在散热基座201的端面左侧,流体从流体接纳部201进入,流经流体疏导管202,流经散热基座201的迂回通道2014从而实现流体巡回散热。 The heat generated during operation of the LED chip from the LED chip by surface contact to the conductive metal substrate, a metal substrate is transmitted by conduction to the heat sink contacts 201, 201 on the left end surface of the heat sink, fluid from the fluid into the receiving portion 201 , to divert the fluid flowing through the tube 202 flows through the bypass passage 201 of the heat sink 2014 to achieve a fluid cooling circuit.

[0118] 如图3、6所示,还可以在散热基座201的立面2011的右侧设置向右延伸的右延伸体,在该右延伸体的右端面安装本实施例LED晶片固定金属基板,该金属基板上的LED晶片在该向右延伸伸出的右侧端面上向右对外发出光线实现照明。 [0118] As shown in FIG. 3, 6, may also be in the right extension member 201 provided on the right side of the heat dissipating base facade 2011 extending to the right of the right end of the right extension member mounting surface of the LED chip according to the present embodiment is fixed metal substrate, LED chip on the metal substrate to emit light to the right of the right end of the external surface of the illumination of the right projecting extension. 图3所示LED光源的流体巡回散热原理同上。 Figure 3 shows the fluid circuit of the LED light source radiating principle above.

[0119] 如图4、6所示,还可以不在散热基座201立面2011的右侧设置右延伸体,而在在该立面2011的左直立端面以及其四周侧面均紧贴安装有图1所示的LED晶片固定金属基板,各面上金属基板的LED晶片向右以及向四周呈立体状地发出光线对外实现照明。 [0119] As shown in FIG. 4, 6, heat sink 201 may not facade right right extension member 2011 is provided, is mounted in close contact with both the facade FIG left vertical end surface 2011 and side surfaces around it LED chip is fixed to the metal substrate shown in FIG 1, LED chip to the right of the respective surfaces of the metal substrate and the illumination of outside light is emitted to the four Zhoucheng Li body shape. 图4所示LED光源的流体巡回散热原理同上。 Figure 4 shows the fluid circuit of the LED light source radiating principle above.

[0120] 如图5、6所示,可以在散热基座201的立面2011的大面积的右端面上安装LED晶片固定金属基板上的LED晶片向右发出光线对外实现照明。 [0120] As shown in FIG 5 and 6, LED chip may be mounted on the metal substrate is fixed on the right end LED chip base 201 of the vertical surface of the heat of the large area surface 2011 emits illumination of outside light to the right. 图5所示LED光源的流体巡回散热原理同上。 Cooling fluid circuit diagram LED light source 5 shown above.

[0121 ] 需要说明的是,在安装应用时,可以在本实施例中图2-8所示的LED强光源的外周固定灯罩,在灯罩的反射可使光线向灯罩的光轴定向射出,以符合应用需要。 [0121] Incidentally, when installing the application, the globe can be fixed to the outer circumference of the LED light intensity shown in FIG. 2-8, the light reflective lampshade can exit the optical axis orientation of the globe in the present embodiment, in order to meet the application needs.

[0122] 参见图2-7所示,在本实施例中,散热基座201中位于立面2011左侧的迂回通道2014(与散热效果密切相关)结构可以但不限于采用以下的设计方式: [0122] Referring to Figures 2-7, in the present embodiment, the heat sink 201, 2014 (closely related to the heat radiation effect) located at the left side of the facade bypass passage 2011 may be, but is not limited to the structure of the following design methods:

[0123] 位于散热基座201的立面2011左端设置的复数个左延伸部2012、2013具体是:中心左延伸部2012以及左延伸管2013。 [0123] positioned heat sink facade 2,011,201 left of the left end of the plurality of extension portions 2012, 2013 provided in particular: center of the left and the left extension portion 2012 extending tube 2013.

[0124] 中心左延伸部2012设置在散热基座201的中心轴线上,并且向左延伸突出。 [0124] center of the left extension portion 2012 is provided on the central axis of the heat sink 201, and extends leftward protrusion. 左延伸管2013呈右端封闭而左端开口的管状,中心左延伸部2012位于左延伸管2013的管腔内,此时迂回通道2014为:中心左延伸部2012与左延伸管2013之间的间隙形成的近似环状的空间。 Left and right extension tube 2013 was closed and the left end of the tubular opening, the center left extension portion 2012 at the left of the extension tube within the lumen 2013, in which case bypass passage is 2014: 2013 is formed a gap between the center of the left extension portion and the left extension tube 2012 the substantially annular space.

[0125] 参见图2所示,还可以在散热基座201的立面2011的左端设置一向右凹陷的凹腔2015,该凹腔2015的开口设在立面2011的左端部,即凹腔2015向右延伸在中心左延伸部2012的内部,凹腔2015与本散热基座201左侧的流体迂回通道2014独立而不连通。 A left end portion [0125] Referring to FIG. 2, may also be provided at a left end elevation of the heat sink 201 is a rightward recess 2011 of the cavity 2015 of the cavity 2015 of the opening 2011 provided in the facade, i.e. the cavity 2015 left and right extending inside the central extending portion 2012 of the cavity 2015 of the fluid present on the left side and the heat sink 201 without the bypass passage 2014 communicates independently. 中心左延伸部2012整体形成左端开口的类“U”形。 Center of the left extending portion 2012 integrally formed in a left end opening of the class "U" shape. 采用该设计可以具有以下的进一步有益效果: With this design may further have the following advantages:

[0126] 一方面,散热基座采用图2所示的凹腔设计,可以如图2所示地将该实施例1中所示的LED晶片固定金属基板的无LED晶片部分伸进本散热基座201的右侧凹腔2015内,固定在凹腔2015的内壁。 [0126] In one aspect, use of the heat dissipating base cavity design shown in FIG. 2, the LED chip 2 is fixed to the metal substrate shown in Example 1 of the present non-LED wafer portion extending into the heat radiation substrate may FIG. Block 201 in the right side of the cavity 2015, 2015 secured to the inner wall of the cavity. 这样可以加大金属基板与散热基座201的接触面积进一步加快热量散发,提高散热效果; This can increase the heat sink 201 and the metal substrate contact area to further accelerate the heat dissipation and improve the heat dissipation effect;

[0127] 另一方面,该散热基座采用图2所示的凹腔设计,还有利于减轻本散热基座201的重量,节省材料成本; [0127] On the other hand, the use of heat dissipating base cavity design shown, as well as help reduce this heat sink 201 in FIG. 2 by weight, material cost savings;

[0128] 再一方面,散热基座采用图2所示的凹腔2015设计,还可以将LED光源模块上的控制电路、供电电路等部件藏于该凹腔2015内,便于产品设计,提高整体LED光源的结构紧凑性,使得整体外观更加美观。 [0128] In another aspect, the cavity using the heat sink 2015 shown in FIG. 2 design, the control circuit part further on the LED light source module, a power supply circuit and the like may be hidden in the cavity 2015, to facilitate the design, enhance the overall compactness of the LED light source, so that the overall appearance more beautiful.

[0129] 参见图3、4、5所示,为了降低设备的制造成本,也可以将中心左延伸部2012设置成实心而不具有凹腔2015的结构。 [0129] Referring to FIG. 3, 4, in order to reduce the manufacturing cost of the apparatus, the center may be left extension portion 2012 is provided as a solid having a structure without the cavity 2015. 此时可以将LED光源模块上的控制电路、供电电路等部件安装于散热基座201的立面2011的端面上或者其他便于安装的位置。 At this time, the control circuit part may be an LED light source module, the power supply circuit and the like is attached to the base end face of the heat dissipation, or other mounting locations 201 facilitate facade 2011.

[0130] 需要说明的是,在本实施例中,可以但不限于将LED晶片固定金属基板的附加控制电路等安装在本散热基座201的立面2011右端空间。 [0130] Incidentally, in the present embodiment, but it may be additional control circuitry not limited to a metal substrate other fixed LED chip 2011 mounted on the heat dissipating base of the present facade 201 of the right space. [0131] 参见图2-5所示,在具体实施时,可以在本散热基座201的立面2011右端面上设置一走线凹槽20111,该走线凹槽20111与迂回通道2014不相通,走线凹槽20111由LED晶片固定金属基板经过走线凹槽20111而与外部的电气部件电连接。 [0131] Referring to Figures 2-5, in the specific embodiment, a cable may be provided in the groove 2011 20111 a right end surface of the facade of the present heat sink 201, the trace groove 2014 20111 does not communicate with the bypass passage , alignment recess groove 20111 through 20111 and the wiring connected to an external electrical component electrically by a fixed metal substrate of the LED wafer.

[0132] 参见图2-8所示,为了进一步提高本流体散热部件的散热效果,还可以在该散热基座201的中心左延伸部2012的外周延伸设置有多个流体疏导叶片2016(参见图6中的翅片式流体疏导叶片2016),各流体疏导叶片2016与外周的左延伸管2013具有间隙而不相连接,各流体疏导叶片2016位于迂回通道2014内,但不会对迂回通道2014形成通道阻塞而起到流体疏导的作用。 [0132] Referring to Figure 2-8, in order to further enhance the heat dissipation effect of the heat radiating member is fluid, but also the outer peripheral portion 2012 may extend in the left center of the heat dissipating base 201 is provided with a plurality of fluid extending grooming blade 2016 (see FIG. 6-fin type fluid grooming blade 2016), each fluid grooming blade 2016 and the left outer periphery of the extension tube is connected without a gap 2013, 2016 of each vane positioned to divert the fluid within the bypass channel 2014, but not to the bypass passage 2014 formed obstruction and play a role to ease fluid.

[0133] 在连接时,将进流管202连接在中心左延伸部2012的外周,使进流管202的内壁与流体疏导叶片2016的顶端端部相接触。 [0133] When connected, the inlet conduit 202 is connected to the outer periphery of the central portion 2012 of the left extension the inner wall of the fluid tube 202 to divert the flow of feed to the top end of the blade 2016 is in contact. 各相邻的两流体疏导叶片2016之间形成有一凹槽2017,当流体从进流管202流入时,任意相邻流体疏导叶片2016之间构成的凹槽2017可以构成进流疏导槽,流体分流道各进流疏导槽流过,最后从迂回通道2014与左延伸管的内壁之间的空间通道流到外部,实现通过流体巡回流动增强本LED强光源的散热效果。 Each groove 2017 has a fluid formed between two adjacent vanes divert 2016, when the fluid flows from the inlet manifold 202, any fluid grooming groove formed between adjacent vanes 2016 may constitute the feed stream 2017 drainage groove, the fluid diverter each feed channel stream flows through the drainage groove, and finally flows to the outside from the space between the inner wall of the bypass channel and the left channel 2014 extending tube, achieving enhanced by the strong light of the present LED flow circuit fluid cooling effect.

[0134] 在本实施例中,流体疏导叶片2016可以但不限于沿中心左延伸部2012外周间隔均匀翅片分布,也可以根据流体的流通效果以及散热效果将这些流体疏导叶片2016设置成不均匀分布或者伸出长度不均匀的模式,但是这些设计均不超出本发明实施例的范围。 [0134] In the present embodiment, the blade 2016 may divert the fluid but are not limited extension along the center of the left outer circumferential portion 2012 spaced fins uniformly distributed, and the effect may be The flow effect of the fluid cooling fluid to divert these blades 2016 arranged unevenly or non-uniform distribution of the length of the projecting patterns, but these designs without departing scope of the embodiments of the present invention.

[0135] 综上,在中心左延伸部2012的外周设置翅片式的流体疏导叶片2016,有利于进一步加大流体与散热基座201的接触面积,提高散热效果。 [0135] In summary, the fin-like outer periphery of the fluid in the center of the left extending portion 2012 of the grooming blade 2016 will help to further increase the contact area between the fluid and the heat sink 201, to improve the heat dissipation effect.

[0136] 在本实施例中,可以将中心左延伸部2012设置在散热基座201的轴线上,使中心左延伸部2012的左延伸长度长于左延伸管2013,这样使流体在迂回通道2014中与散热基座接触的表面面积更大,有利于进一步提高散热效果。 [0136] In the present embodiment, the center may be left extension portion 2012 disposed on the axis of the heat sink 201, the central portion 2012 of the left extension extends a length longer than the left left extension pipe 2013, so that the fluid in the bypass passage 2014 a larger surface area in contact with the heat sink, help to further improve the heat dissipation effect.

[0137] 另外,本实施例的迂回通道2014的形成除了可以采用图2-8所示的技术方案实现之外,还可以采用以下结构实现(未图示): [0137] Further, the present embodiment is formed in the bypass passage 2014 in addition to technical solution illustrated in Figures 2-8 may be employed, also may be employed to achieve a structure (not shown):

[0138] 在左延伸管的内壁设置复数个向中心延伸的内翅片式的流体疏导叶片2016,这些流体疏导叶片2016与中心延伸部独立而不相连接,进流管连接在中心延伸体外,进流管的外壁与流体疏导叶片2016相抵触,流体从进流管进入,到达散热基座的立面右端面,而从进流管的外周流经各流体疏导叶片2016而流到外接,带走散热基座的热量,实现散热。 [0138] In the left inner wall of the extension tube within a plurality of fluid fin extending toward the center of the blade 2016 grooming, grooming blade 2016 of these fluids with the central portion of independent and not connected to the extension, the connection intake pipe extends centrally vitro, the fluid flow into the outer wall of the tube 2016 grooming blade conflict, fluid from the intake manifold, a right end surface of the heat reaching the facade of the base, the fluid flows through the respective intake pipe from the outer periphery of divert blade 2016 and flows to the external, with heat away heat sink and dissipate heat.

[0139] 需要说明的是,在本发明中以图6中所示的整体呈圆管形(即其横切面呈圆形)为例对本发明的LED强光源进行举例说明,但是并不局限于此。 [0139] Incidentally, in FIG tubular cylindrical overall (i.e. cross-section which is circular) as shown in Example 6 of the present invention, the LED light intensity will be illustrated in the present invention, but are not limited to, this. 本发明实施例的LED光源还可以采用整体呈方形、半圆柱形、或者以上任意的结合的结构,即本发明实施例的巡回LED光源横截面可以呈矩形、椭圆形、半圆形或圆形与矩形的结合形状、或者其他的异形结构实现。 LED light source of the present embodiment of the invention may also be employed in conjunction with the overall structure of a square, semi-cylindrical, or of any of the above, i.e., the present invention is an LED light source circuit cross section embodiment may be rectangular, oval, semi-circular or circular binding rectangular shape, or other shaped structure to achieve.

[0140] 为了进一步加强本LED光源的散热效果,还可以在图7所示LED强光源中的散热基座中左延伸管的外周设置吸热材料填充腔801,在该吸热材料填充腔801内填充有吸热材料,在该吸热材料填充腔801的外周设置有隔热层802,而形成图8所示的散热结构。 [0140] To further enhance the heat dissipation effect of the LED light source, the outer periphery may also be left extension tube disposed in the endothermic material fills the cavity 801 shown in FIG. 7 LED light source radiating a strong base, in the endothermic material fills the cavity 801 is filled with heat absorbing material within the outer periphery of the filling chamber 801 of the endothermic material is provided with an insulating layer 802 to form the heat dissipation structure shown in Fig.

[0141] 在图8所示结构的散热结构上固定安装LED晶片固定金属基板与图2-6中的图示以及描述同理,在此不再赘述。 [0141] LED chip is fixedly mounted on the heat sink fixed to the metal substrate configuration as shown in FIG. 8 with the structure illustrated in Figures 2-6 and described in the same way, are not repeated here.

[0142] 当将本LED光源放置在温度较高的空间,比如车头等位置时,采用图8所示的散热基座,可以避免外部的热辐射到本LED光源上使散热基座的温度升高从而影响整个LED光源的散热效果。 [0142] When the present LED light source is placed at a higher temperature of the space, and other locations such as front, with the heat sink base shown in FIG. 8, external heat radiation can be avoided to the temperature of the LED light source on this heat dissipation base liter thus affecting the entire high heat dissipation effect of the LED light source. 即: which is:

[0143] 采用图8示结构有利于进一步保证将LED晶片的温度控制在其正常工作范围内。 [0143] The configuration shown in FIG. 8 is conducive to further ensure that the temperature of the LED chip is controlled within its normal operating range.

[0144] 需要说明的是,应本实施例的技术方案还可以进一步扩展,比如,可以根据当前的应用需要,比如根据照明强度以及照明功率对本实施例技术方案进行组合扩展:比如,将图2-8所示的LED光源作为单元,将复数个上述的热装置本体进行排列组合构成散热装置本体100阵列。 [0144] Incidentally, the technical solution should present embodiment may also be further extended, for example, may, for example be combined extension of the present embodiment of the technical solution according to the intensity of illumination and a lighting power according to the current application needs: for example, FIG 2 -8 as shown in the LED light source unit, a plurality of the above-described heating device main body 100 constituting the array of permutations and combinations heat sink body.

[0145] 实施例3: [0145] Example 3:

[0146] 参见图9、10、11所示,为了进一步提高本实施例提供的LED光源的应用便利性,使其更加适用于车船用前照灯,并且降低散热成本。 [0146] Referring to Figure 10, 11, in order to further enhance the convenience of the application of the LED light source according to an embodiment, to make it more suitable for travel headlamp, and reduce cooling costs.

[0147] 本实施例与实施例2中图2-6所不LED光源所不同之处在于:本实施例LED光源还包括流体疏导接纳装置900。 [0147] The present embodiment is different from the embodiment 2 in FIG. 2-6 embodiment in that the LED light source is not: the LED light source of the present embodiment further comprises a fluid receiving device 900 grooming.

[0148] 参见图9所示,流体疏导接纳装置900包括:流体疏导管901以及流体接纳部902。 As shown in [0148] Referring to FIG. 9, the receiving apparatus 900 to divert a fluid comprising: a fluid tube 901 and to divert the fluid receiving portion 902.

[0149] 其中,流体疏导管901的一端(记为流体输送口9011)与实施例2中的进流管202的外端部(记为第二端部)连接,另一端与流体接纳部902的第二开口部连接。 [0149] wherein one end of the tube 901 to divert fluid (referred to as a fluid delivery port 9011) and the outer end portion (referred to as second end portion) is connected in Example 2 intake tube 202 of embodiment, the other end of the fluid receiving portion 902 a second opening portion is connected. 该流体接纳部902的沿第一开口端(第二开口端的对端开口部)到第二开口端的通道平滑地由宽变窄变化,形成圆弧状的边缘,使流体接纳部902整体呈:外大内窄的大喇叭状。 Along a first open end (end of the opening of the second open end) of the fluid receiving portion 902 to the second open end of the channel changes smoothly from the narrowed width, an arc-shaped edge of the fluid receiving portion 902 as a whole: large outer shape narrow loudspeakers.

[0150] 在进行设计时,可以将本流体接纳部902的第二开口端的横截面积设计为第一开口部的横截面积的11-360倍。 [0150] During design, the cross-sectional area may present a second open end in fluid receiving portion 902 is designed to 11-360 times the cross-sectional area of ​​the first opening.

[0151] 在本实施例中该流体疏导管901可以但不限于为刚性管、软性管,并且可以将其设计成刚性直管,也可以将其设置成刚性弯道管,还可以将其设置成弯曲程度可以调节的软性管,具体可以根据实际安装以及应用便利性设计。 [0151] In the present embodiment, the tube 901 may divert the fluid, but is not limited to a rigid pipe, flexible pipe, and may be designed as a rigid straight pipe, it may be arranged to bend a rigid tube, which may also be arranged to adjust the degree of curvature of the flexible tube may be, specifically, the actual installation and use convenience of the design.

[0152] 参见图10所示,流体疏导接纳装置900是一个为实施例2中的LED光源接入和输送用以散热的流体的机构。 [0152] Referring to FIG. 10, the fluid receiving means 900 is a grooming of Example 2 LED in the light source and the access mechanism for heat transport fluid.

[0153] 在应用时,将流体疏导管901的流体输送口9011与进流管202连接。 [0153] In use, divert the fluid delivery port 901 fluid tube 9011 is connected to the intake tube 202. 其流体的流向为:流体疏导接纳装置900的流体接纳部902进入,通过流体疏导管901,由流体疏导管901的流体输送口9011输送至进流管202,流经散热基座201内的迂回通道2014,从而实现流体在巡回散热装置中巡回流通而实现散热。 Fluid flow which is: receiving fluid to divert the fluid receiving portion 902 enters the device 900 through the tube 901 to divert the fluid from the fluid delivery port 901 to ease delivery tube 9011 to the inlet conduit 202, flows through the heat sink in a circuitous 201 channel 2014, thereby achieving a fluid circuit circulating the liquid in the heat sink and dissipate heat.

[0154] 参见图10所示,采用本本实施例的LED光源,由于流体疏导接纳装置900采用内径由宽到窄的喇叭口状的流体接纳部902,大量接纳的流体进入流体接纳部902之后,流体经过的管道空间相对以相对其进入流体接纳部902喇叭口时变窄,流体以高速通过流体输口进入进流管202,流经迂回通道2014而流出,有利于进一步加快热量的带出,提高散热效果。 [0154] Referring to Figure 10, an embodiment of the LED light source books, divert the fluid from the inside diameter of the receiving apparatus 900 to the narrow width of the flared portion 902 receiving the fluid, a large amount of fluid enters the fluid receiving portion 902 after the receiving, through the conduit relative to the fluid space when it enters the fluid receiving portion relative to the bell mouth 902 is narrowed, a high speed fluid entering the fluid input port through the inlet conduit 202, flows through the bypass passage 2014 flows out, is conducive to further accelerate the heat out, improve heat dissipation.

[0155] 另外,采用图10所示的LED光源,增加流体疏导接纳装置900的增设,可以使LED光源的设计更加简单,有利于LED光源的应用推广实施。 [0155] Further, using the LED light source shown in FIG. 10, an additional increase divert fluid receiving device 900, the LED light source can make the design more simple, promotion embodiment conducive to the application of the LED light source.

[0156] 比如,在应用时,可以当将本实施的技术方案应用于汽车或者摩托车的车前灯,将本实施例的LED光源模块的相关部件固定在汽车或者摩托车的车头,以作为汽车车前灯使用,将流体疏导管901的流体输送口9011与进流管202连接,使流体接纳部902的第二开口端朝前。 LED light source module related components [0156] For example, in the application, can be a technical solution of the present embodiment is applied to a car or motorcycle headlight, the present embodiment is fixed to the front of a car or motorcycle, as automobile headlights use, divert the fluid tube 901 to the fluid delivery port 9011 is connected to the intake tube 202, the fluid receiving portion 902 of the second open end facing forward. 在汽车或者摩托车开动的过程中,流体接纳部902接纳车体行进过程中的产生相对向后流动的大量空气流体,流体流经流体疏导管901,流入进流管202,流经散热基座201中的迂回通道2014,经过迂回通道2014后流到外接的空气中,将散热基座201上的热量带走,实现流体巡回散热。 In the car or motorcycle during actuation, the fluid receiving portion 902 receive the traveling vehicle body to produce the relative flow during large rearward air stream, divert the fluid flowing through the fluid pipe 901, flows into the inlet conduit 202, flows through the heat sink bypass passage 201 in 2014, after the bypass passage 2014 flows to the external air, the heat on the heat sink 201 away, to achieve a fluid cooling circuit.

[0157] 再比如,还可以将将本实施的技术方案应用于轮船上的大功率电气或者LED强光源上,将本实施例的LED光源模块以及相关部件固定在轮船上的确定位置,以实现LED光源模块的照明作用,将流体疏导管901与进流管202连接,将流体接纳部902置入轮船的底部,使流体接纳部902的第一开口部朝前伸入水下(或者将进流管202的外接开口部安装在轮船的船身上位于水上方,使其开口超前)。 [0157] As another example, can be further aspect of the present embodiment is applied to the high-power electrical strong light source or an LED on the ship, LED light source module and associated components of the embodiment of the present embodiment will be secured in the determined position of the ship, in order to achieve LED light source module of the illumination effect, the fluid tube 901 to ease the intake manifold 202 is connected to the bottom of the fluid into the receiving portion 902 of the ship, the fluid receiving opening portion of the first forward portion 902 extending into the underwater (or intake Ship external flow tube opening portion 202 is attached to the ship's body located above the water, so that the opening ahead). 在轮船前进的过程中,在轮船前进的过程中,大喇叭状流体接纳部902接纳相对向后流动的大量海水流体,海水流体(或者相对向后流动的大量空气流体)流经内径由宽到窄设计的流体疏导管901,流入进流管202,流经散热基座201的迂回通道2014,经过迂回通道2014后流到外接的空气中,将散热基座201上的热量带走,实现流体巡回散热。 In the course of the ship advance, during advance of the ship, a lot of water large flared fluid receiving portion 902 to receive fluid flowing rearwardly relative to seawater fluid (or a relatively large amount of air flow of the fluid backward) flows from the inner diameter to the width narrow designed to divert fluid pipe 901, flows into the inlet conduit 202, flows through the bypass passage 201 of the heat sink 2014, after the air bypass passage 2014 flows to the external of the heat from the heat sink 201 away, to achieve fluid tour cooling.

[0158] 再比如,还可以将本实施的技术方案应用于固定定着的大功率LED光源上,具体是通过气泵或者水泵的动力系统,在泵力的作用下,空气或者液体等流体从流体疏导管901的流体接纳部902流进而流经流体疏导管901,流入进流管202,流经迂回通道2014,经过迂回通道2014后流到外接的空气中,将散热基座201上的热量带走,实现流体巡回散热。 [0158] As another example, the further aspect of the present embodiment can be applied to a given fixed with high-power LED light source, in particular power system through an air pump or the pump, and the pump power, fluid such as air or liquid from the fluid grooming a fluid receiving portion 902 of flow tube 901 and thus divert the fluid flowing through pipe 901, flows into the inlet conduit 202, 2014, 2014 through the bypass passage flows to the external air flowing through the bypass passage, the heat from the heat sink 201 away to achieve cooling fluid circuit.

[0159] 另外,在本实施例中,其流体疏导接纳装置900中的流体接纳部902的通道横截面积沿本流体接纳部902的第一开口端到与流体疏导管901的连接的第二开口端呈弧形平滑地宽到窄变化。 [0159] Further, in the present embodiment, the fluid passage which divert the fluid receiving portion 902 of the receiving apparatus 900 in cross-sectional area along a first fluid receiving opening of this end portion 902 is connected to the fluid tube 901 to divert a second arcuate opening end to a narrow width changes smoothly. 使得入口接纳进来的流体经过的管道空间相对以相对其进入流体接纳部902喇叭口时变窄,进来的流体以高速通过流体输口进入进流管202,流经迂回通道2014而流出,有利于进一步加快热量的带出,提高散热效果。 Conduit receiving space such that the incoming fluid through inlet relative to the fluid when it enters the receiving portion relative to the bell mouth 902 is narrowed, the incoming fluid flow at high speed into the inlet pipe 202, flows through the bypass passage 2014 flows out through the fluid input port, facilitate further accelerate the heat out and improve heat dissipation.

[0160] 另外,如果当前的LED光源由实施例2中图2-8所示的多个LED光源作为单元组成LED光源矩阵时,还可以将本实施例的流体疏导管901设置成一进多出的形式,即具有一个流体接纳部902,具有多个流体输送口9011,该流体输送口9011的个数与散热基座201的个数相同,将流体疏导管901的各流体输送口9011分别与各进流管202相连接即可。 [0160] Further, if the current LED light source in the plurality of LED light source shown in FIG. 2 in Example 2-8 as a matrix LED light source units, can divert the fluid tube 901 is arranged to embodiment a multiple-out form, i.e. having a fluid receiving portion 902 having a plurality of fluid delivery ports 9011, and the fluid delivery port number 9011 of the same number of heat sink 201 of each tube 901 to divert the fluid delivery port 9011, respectively each intake tube 202 is connected to. 在应用时,流体从流体疏导管901 —端部的流体接纳部902统一进入,从流体疏导管901另一端部的多个流出口分别流进阵列中的各进流管202,流经各散热基座201内的迂回通道2014而与散热基座201充分接触,从而从各散热基座201连接的的出流管流出,从而将各散热基座201的热量带出,实现散热。 In use, divert the fluid from the fluid tube 901 - the fluid receiving portion into the end portion 902 uniform, respectively, flows into the respective intake pipe array 202 to divert the fluid flow outlet from the plurality of the other end of the tube 901, flows through each of the heat 2014 and the bypass passage 201 in sufficient contact with the heat sink base 201, thereby flowing out from the outlet pipe 201 is connected to each heat sink, whereby the heat of the heat dissipating base 201 out, to achieve heat dissipation.

[0161] 实施例4: [0161] Example 4:

[0162] 参见图11所示,图11是本实施例提供的一种由图8所示散热结构以及图1所示LED晶片固定结构以及图9所示装置构成的LED强光源纵向剖面结构示意图。 [0162] Referring to Figure 11, the LED 11 is a schematic longitudinal sectional structure of a light intensity provided by the apparatus of the present embodiment shown in FIG. 8 and the heat dissipation structure shown in FIG. 1 and the LED chip fixing structure configured as shown in FIG. 9 .

[0163] 其与实施例3所不同之处仅在于: [0163] 3 only in that it differs from the Example:

[0164] 在散热基座601的外周还设置有吸热材料填充腔801 (填充有吸热材料,可以但不限于为水、或者高分子水凝胶、或者油液体)本发明人在试验发现,通过该吸热材料填充腔801以及隔热层802的增设,可以避免外部的热量辐射到散热基座上使散热基座的温度升高而影响整个LED光源的散热效果,进一步保证LED晶片的环境温度控制在其工作范围内,具体参见实施例1中与图9相关的记载。 [0164] In the outer periphery of the heat dissipating base 601 is also provided with a filling chamber 801 of the endothermic material (hydrogel or oil filled with a liquid absorbing material, but is not limited to water, or polymer) of the present invention is found in the test , by adding the heat-absorbing material fills the cavity 801 and the insulating layer 802, heat is radiated to the outside to avoid the temperature of the heat sink rises to affect the overall heat dissipation effect of the LED light source to the heat sink, the LED die to further ensure controlling the ambient temperature within its operating range, in Example 1 in FIG. 9 and related description Referring specifically to FIG.

[0165] 而选用水作为吸热材料存在原料成本低,获取容易,且流动性好的优点。 [0165] and the choice of water present as the endothermic material of low cost raw materials, easy to obtain, and the advantages of good fluidity.

[0166] 实施例5:[0167] 将本实施例的LED强光源应用于汽车、摩托车轮船或者其车船用的车前灯时,在本LED强光源的外周安装当前车船灯需要规格的灯罩(灯罩结构根据不同的车船机械结构设计以及规范设定,本实施例未图示,灯罩的结构具体可以参见现有技术的结构),使本实施例的LED强光源位于该灯罩内,LED晶片发出的光在灯罩对光的聚焦以及反射等作用下,往灯罩开口部照射。 [0166] Example 5: [0167] The LED light source of the present embodiment is strongly applied to headlights in automobiles, motorcycles, or travel with the boat, the outer periphery of this strong light source mounted LED lamp current travel specifications required shade (depending on the structure of shade travel mechanical design and specifications set, the present embodiment not shown, reference may be made to the structure of the lampshade structure of the prior art), an intense light source of the present embodiment LED located within the lamp, LED chip emitted light shade under the effect of light reflection and a focus, an opening portion is irradiated to the globe.

[0168] 图12为应用实施例2所不结构的第一种LED强光源的中LED晶片在金属基板上的位置设置示意图。 Position [0168] Example 2 FIG. 12 is a first configuration of a LED light source does not apply a strong embodiment of the LED chip disposed on the metal substrate of FIG.

[0169] 参见图12,在本实施例的金属基板上,多个LED晶片沿与待安装的灯罩的光轴(记为X轴)正交的Y轴方向上排成一排1201,将该结构的LED光源装配到车船用前照灯的灯罩,使LED晶片的中心基本位于光轴上,调整LED晶片到本灯罩的光轴距离后,该LED光源可以作为前照灯的远灯或者近灯之一,该排LED发出的光经过灯罩的反射后往光轴方向发出。 [0169] Referring to FIG 12, on a metal substrate according to the present embodiment, a plurality of LED chips to the optical axis of the lamp cover to be mounted (referred to as X axis) 1201 arranged in a row perpendicular to the Y-axis direction, the LED light source mounting structure headlamp shade to travel, the central LED chip substantially on the optical axis, to adjust the LED chip of the present shade from the optical axis, the LED light source can be used as a headlight lamp far or near after issuing one of the lamp optical axis direction, the row of the reflected light emitted by the LED through the globe.

[0170] 图13为本实施例提供的第二种LED光源的中LED晶片在金属基板上的位置设置示意图。 [0170] FIG 13 a second embodiment of the LED light source provided in the present embodiment the position of the LED chip disposed on the metal substrate of FIG. 在图13中,在金属基板上,多个LED晶片沿X轴方向排成一排1301,同理,将该结构的LED光源装配到车船用前照灯的灯罩,使LED晶片的中心基本位于光轴上,调整LED晶片到本灯罩的光轴距离后,该LED光源可以作为前照灯的远灯或者近灯之一,该排LED发出的光经过灯罩的反射后往光轴方向发出。 In FIG 13, on a metal substrate, a plurality of LED chips 1301 arranged in a row along the X-axis direction. Similarly, the shade headlamp mounting structure of the LED light source to travel, the LED is located substantially center of the wafer on the optical axis, to adjust the LED chip of the present shade from the optical axis, the LED light source can be used as far or near one headlamp lamp, the reflected light passes through the lamp cover emits exhaust emitted by the LED to the optical axis direction.

[0171] 图14为本实施例提供的第三种LED光源的中LED晶片在金属基板上的位置设置示意图。 [0171] Figure 14 provides a third embodiment LED light source of the present embodiment the position of the LED chip disposed on the metal substrate of FIG. 参见图14,在图14中,在金属基板上,多个LED晶片沿Y轴方向排成两排,该两排LED构成类似圆弧状1401。 Referring to FIG. 14, in FIG. 14, on a metal substrate, a plurality of LED chips in the Y-axis direction in two rows, the two rows of LED arcuate configuration similar to 1401. 在安装时,将该结构的LED光源装配到车船用前照灯的灯罩,使LED晶片的中心基本位于光轴上,调整LED晶片到本灯罩的光轴距离后,该LED光源可以作为前照灯的远灯或者近灯之一,该排LED发出的光经过灯罩的反射后往光轴方向发出。 During installation, the mounting structure of the LED light source to the headlamp shade travel, the central LED chip substantially on the optical axis, to adjust the LED chip of the present shade from the optical axis, the LED light source can be used as a front-illuminated light one far or near the lamp lights, the row of light emitted by the LED emitted towards the optical axis after reflection shade.

[0172] 图15为本实施例提供的第四种LED光源的中LED晶片在金属基板上的位置设置示意图。 [0172] FIG 15 a fourth embodiment of the LED light source provided in the present embodiment the position of the LED chip disposed on the metal substrate of FIG. 参见图15,在金属基板上,多个LED晶片在光轴上排列构成矩形状1501,使得整体LED晶片基本呈电光源对外发发光。 15, on a metal substrate, a plurality of LED chips, arranged in a rectangular shape on the optical axis 1501, such that substantially the entire LED die emitting outgoing light source. 在安装时,将该结构的LED光源装配到车船用前照灯的灯罩,使LED晶片的中心基本位于光轴上,调整LED晶片到本灯罩的光轴距离后,该LED光源可以作为前照灯的远灯或者近灯之一,该排LED发出的光经过灯罩的反射后往光轴方向发出。 During installation, the mounting structure of the LED light source to the headlamp shade travel, the central LED chip substantially on the optical axis, to adjust the LED chip of the present shade from the optical axis, the LED light source can be used as a front-illuminated light one far or near the lamp lights, the row of light emitted by the LED emitted towards the optical axis after reflection shade.

[0173] 图16为本实施例提供的第五种LED光源的中LED晶片在金属基板上的位置设置示意图。 The LED chip fifth embodiment of the LED light source provided [0173] FIG. 16 of the present embodiment in a position disposed on the metal substrate. FIG. 参见图16,其与图11-14所不同之处主要在于LED晶片的排布不同。 Referring to FIG. 16, 11-14 differs from the FIG differ mainly in the arrangement of the LED wafer.

[0174] 在图16中,在金属基板上多个LED晶片在光轴上排列构成分别由连续的多个LED晶片构成的两矩阵:记为第一晶片矩阵1601、第二晶片矩阵1602。 [0174] In FIG. 16, a plurality of LED chips on the metal substrate are arranged on the optical axis constituting the matrix are constituted by two successive plurality of LED chip: matrix referred to as a first wafer 1601, a second wafer 1602 matrix. 第一晶片矩阵1601、第二晶片矩阵1602之间具有一定的间距L。 The first wafer matrix 1601, having a certain distance between the second wafer matrix 1602 L.

[0175] 在图16中,第一片晶片矩阵1601、第二晶片矩阵1602在X轴方向分别呈两排平行的直线。 [0175] In FIG. 16, a first matrix 1601 wafers, the second wafer 1602 are arranged in two rows of the matrix line parallel to the X axis direction. 在安装时,将该结构的LED光源装配到车船用前照灯的灯罩,使LED晶片的中心基本位于光轴上,调整LED晶片矩阵到本灯罩的光轴焦点的距离,应用图16的LED光源可以在一个前照灯中同时设置远灯以及近灯。 During installation, the mounting structure of the LED light source to the headlamp shade travel, the central LED chip substantially on the optical axis, to adjust the optical axis of the LED wafer focal distance matrix of the present shade, LED Application 16 the light source may be simultaneously provided near and far lights a lamp in a headlight. 在电路设置时通过外加控制电路中的开关电路切换而使第一晶片矩阵、第二晶片矩阵分别独立发光,譬如在第一晶片矩阵、第二晶片矩阵发出的光经过灯罩的反射聚焦后往光轴方向发出。 When the first switching circuit provided by the switch matrix circuit wafer external control circuit, each independently emitting a second wafer matrix, such as reflected light focused through a first wafer after lampshade matrix, the second wafer to the light emitted from matrix issued axial direction. [0176] 为了更好地适配目前标准的车船用前照灯的灯罩,使本实施例的远灯、近灯的具备较好的远距离、近距离照明效果,本发明人在进行本发明的研究中发现,将为第一晶片矩阵16041、第二晶片矩阵1602的间距L设置为0.2-6毫米为佳,特别地,设置为1_3毫米更佳。 [0176] In order to better fit the current standard headlamp shade travel with the embodiment according to the present embodiment is far lights, approach lights have better long-range, short-range lighting effects, the present invention carrying out the present invention study found that, for the first matrix 16041 wafer, the second wafer set the distance L matrix 1602 preferably 0.2-6 mm, particularly, more preferably set 1_3 mm.

[0177] 在安装时,使在光轴后端作为远灯使用的第一晶片矩阵的中心基本在光轴焦点上,使作为远灯使用的第二晶片矩阵的位于光轴方向焦点的前端一定的距离(该距离记为第一晶片矩阵、第二晶片矩阵的间距L)即可。 [0177] When installed, the rear end of the central optical axis of the lamp as far wafer used in the first matrix substantially focus on the optical axis so that the front focal point of the optical axis direction of the second wafer is used as a matrix constant lamp far the distance (the distance matrix is ​​referred to as a first wafer, the second wafer spacing matrix L) to.

[0178] 参见图17示,其与图16所不同之处仅仅在于晶片矩阵的排布不同: [0178] Referring to FIG. 17 shows that 16 differs only in that the different wafers FIG matrix arrangement of:

[0179] 在图17中第一片晶片矩阵1701、第二晶片矩阵1702在Y轴方向均为与Y轴基本 [0179] The first matrix 1701 wafers, the second wafer 1702 are matrix Y-axis direction in FIG. 17 in the Y-axis basic

重合的直线。 Coinciding straight line.

[0180] 与图16中相应描述同理,应用图17的LED光源可以在一个前照灯中同时实现远灯以及近灯。 [0180] and the corresponding description in FIG 16 Similarly, the application of the LED light source 17 of FIG enables simultaneous near and far lights a lamp in a headlight. 其应用安装以及工作原理可以参见上述图16中LED光源的应用描述。 Application of the installation and its operating principle, reference may be applied in the above described FIG 16 LED light source.

[0181] 参见图18,其与图16所不同之处仅仅在于晶片矩阵的排布不同: [0181] Referring to Figure 18, which differs from Figure 16 only in that the matrix arrangement of different wafers:

[0182] 在图18中,第一片晶片矩阵1801、第二晶片矩阵1802分别有多个LED晶片构成方形矩阵,该两方形矩阵1801、1802沿Y轴方向平行。 [0182] In FIG. 18, a first matrix 1801 wafers, the second wafer 1802 are a plurality of LED array chip constituting a square matrix, a square matrix 1801 and 1802 parallel to the two Y-axis direction.

[0183] 与图16同理,应用图18的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0183] Similarly to FIG. 16, FIG apply LED light source 18 can be realized simultaneously and far lights near a headlight lamp. 其应用安装以及工作原理可以参见图16中的相应描述。 Application and installation works can refer to the corresponding description of FIG. 16.

[0184] 参见图19示,其与图16所不同之处仅仅在于晶片矩阵的排布不同: [0184] Referring to FIG. 19 shows that 16 differs only in that the different wafers FIG matrix arrangement of:

[0185] 在图19中,第一片晶片矩阵1901、第二晶片矩阵1902呈两互相正交的直线状。 [0185] In FIG. 19, a first matrix 1901 wafers, the second wafer 1902 are arranged in two matrices mutually orthogonal linearly.

[0186] 与图15同理,应用图19的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0186] Similarly to FIG. 15, FIG apply LED light source 19 may be near and far light while achieving a headlamp lamp. 图19所示LED光源应用安装以及工作原理可以参见上述图16中LED光源的应用描述。 LED light source 19 shown in FIG installation and operation principle can be applied Referring to FIG. 16 above the LED light source described in the application.

[0187] 参见图20,其与图16所不同之处仅仅在于晶片矩阵的排布不同: [0187] Referring to Figure 20, which differs from Figure 16 only in that the matrix arrangement of different wafers:

[0188] 在图20中,第一片晶片矩阵2001、第二晶片矩阵2002分别为:中心线与光轴重合的两方形状,呈相互正交。 [0188] In FIG. 20, a first matrix 2001 wafers, the second wafer 2002 are matrix: a center line coinciding with the optical axis two rectangular shape, form mutually orthogonal.

[0189] 与图16同理,应用图20的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0189] Similarly to FIG. 16, FIG apply LED light source 20 may be near and far light while achieving a headlamp lamp. 图20所示LED光源安装以及工作原理可以参见上述图16中的相应描述。 LED light source 20 shown in FIG installation works and the corresponding description may refer to FIG. 16 described above.

[0190] 参见图21示,其与图16所不同之处仅仅在于晶片矩阵的排布不同: [0190] Referring to FIG. 21 shows that 16 differs only in that the different wafers FIG matrix arrangement of:

[0191] 在图21中,第一片晶片矩阵2101、第二晶片矩阵2002分别为:中心线与光轴重合的两方形状,两矩形在X方向、Y方向上的长度均相同。 [0191] In FIG. 21, a first matrix 2101 wafers, the second wafer 2002 are matrix: a center line coinciding with the optical axis two rectangular shape, two rectangular in the X direction, the length in the Y direction are the same.

[0192] 与图16同理,应用图21的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0192] Similarly to FIG. 16, FIG apply LED light source 21 can be realized simultaneously and far lights near a headlight lamp. 图21所示LED光源应用安装以及工作原理可以参见上述图16中的相应描述。 Figure 21 shows the LED light source is mounted and the principle can be applied to the corresponding description above refer to FIG. 16.

[0193] 参见图22,其与图16所不同之处仅仅在于晶片矩阵的排布不同: [0193] Referring to Figure 22, which differs from Figure 16 only in that the matrix arrangement of different wafers:

[0194] 在图22中,第一片晶片矩阵2201呈中心线与光轴X轴重合的直线状,第二晶片矩阵2202呈中心在X轴上的矩形状。 [0194] In FIG. 22, a first matrix 2201 wafers linearly centerline axis coincident with the optical axis X, a second wafer 2202 as a center of the rectangular matrix shape on the X axis.

[0195] 与图16同理,应用图22的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0195] Similarly to FIG. 16, FIG apply LED light source 22 can be realized simultaneously and far lights near a headlight lamp. 图22所示LED光源应用安装以及工作原理可以参见上述图16中的相应描述。 LED light source 22 shown in FIG installation and operation principle can be applied to the corresponding description above refer to FIG. 16.

[0196] 参见图23示,其与图16所不同之处仅仅在于第一晶片矩阵、第二晶片矩阵的排布不同: [0196] Referring to FIG. 23 shown, which differs from Figure 16 only in that the matrix of the first wafer, the second wafer of different matrices are arranged:

[0197] 在图23中,第一片晶片矩阵2301、第二晶片矩阵2302分别为中心在X轴上的正方形状,相互平行。 [0197] In Figure 23, a first matrix 2301 wafers, the second wafer 2302 are centered on a square matrix shape on the X axis, parallel to each other.

[0198] 与图16同理,应用图23的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0198] Similarly to FIG. 16, FIG applied LED light source 23 can be realized simultaneously and far lights near a headlight lamp. 图23所示LED光源应用安装以及工作原理可以参见上述图16中的相应描述。 As shown in FIG. 23 and the LED light source application installation works can refer to the corresponding description of FIG. 16 described above.

[0199] 参见图24,其与图16所不同之处仅仅在于第一晶片矩阵、第二晶片矩阵的排布不同: [0199] Referring to Figure 24, which differs from Figure 16 only in that the matrix of the first wafer, the second wafer of different matrices are arranged:

[0200] 在图24中,第一片晶片矩阵2401、第二晶片矩阵2402呈:中心均在X轴上两平行的类似弧形。 [0200] In FIG. 24, a first matrix 2401 wafers, the second wafer matrix form 2402: Similar centers are arcuate in two parallel X-axis.

[0201] 与图16同理,应用图24的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0201] Similarly to FIG. 16, FIG apply LED light source 24 can be realized simultaneously and far lights near a headlight lamp. 图24所示LED光源应用安装以及工作原理可以参见上述图16中的相应描述。 LED light source 24 shown in FIG installation and operation principle can be applied to the corresponding description above refer to FIG. 16.

[0202] 参见图25示,其与图16所不同之处仅仅在于第一晶片矩阵、第二晶片矩阵的排布不同: [0202] Referring to FIG. 25 shown, which differs from Figure 16 only in that the matrix of the first wafer, the second wafer of different matrices are arranged:

[0203] 在图25中,第一片晶片矩阵2501、第二晶片矩阵2502呈:中心均在X轴上两平行的弧形。 [0203] In FIG. 25, a first matrix 2501 wafers, the second wafer matrix was 2502: two centers are parallel arcuate in the X-axis.

[0204] 与图16同理,应用图25的LED光源可以在一个前照灯中可同时实现远灯以及近灯。 [0204] Similarly to FIG. 16, FIG apply LED light source 25 can be realized simultaneously and far lights near a headlight lamp. 图25所示LED光源应用安装以及工作原理可以参见上述图16中的相应描述。 LED light source 25 shown in FIG installation and operation principle can be applied to the corresponding description above refer to FIG. 16.

[0205] 参见图26示,其与图12所不同之处仅仅在于LED晶片的排布不同: [0205] Referring to FIG. 26 shown, which differs from Figure 12 only in that a different arrangement of the LED wafer:

[0206] 在图26中,在金属基板上,多个非常规方形的LED晶片顺次排布连接形成一个弧形2601, [0206] In FIG. 26, on a metal substrate, a plurality of square LED chips unconventional arranged sequentially connected to form an arc 2601,

[0207] 与图12同理,应用图26的LED光源可以在一个前照灯中可作为远灯或者近灯应用的安装以及工作原理可以参见上述图11中的相应描述。 [0207] Similarly to FIG. 12, FIG apply LED light source 26 may be mounted as far away light or light near the working principle of application and may refer to the corresponding description in the above-described FIG 11 a headlamp.

[0208] 在LED光源中,在应用时,使第二晶片矩阵基本位于前照灯的基准轴线的焦点上,位于第二晶片矩阵后的第一晶片矩阵位于灯罩根部与焦点之间的位置,此时第二晶片矩阵在车船用前照灯应用时可作为近灯使用,第一晶片矩阵作为远灯使用。 [0208] In the LED light source, when applying the second wafer matrix substantially in focus of the reference axis of the headlight, the matrix is ​​in the first wafer after the wafer is positioned between the matrix of a second shade the roots and the focal point, at this time, the second wafer travel when headlamp matrix application may use as a near-light, a first wafer matrix to use as far lamp.

[0209] 试验数据分析: [0209] Test Data Analysis:

[0210] 第一:分别对现有技术制成的参数为12V35W钨丝前照灯,以及参数为12V35W,采用现有技术的PCT铝箔板支撑的参数为12V35W的LED贴片线路板(记为现有LED光源),采用LED光源(未鼓进流体巡回散热)的前照灯(记为本发明I)、以及采用LED光源(鼓进流体巡回散热)的前照灯(记为本发明2)、进行测试,其中测试环境温度为25±2oC。 [0210] First: parameters are made to the prior art headlamp 12V35W tungsten, and 12V35W parameters, using the prior art aluminum plate support PCT 12V35W parameters for the LED SMD circuit board (referred to as conventional headlamp LED light source), LED light source (not tour cooling fluid into the drum) of the headlamp (referred to the present invention, the I), and the LED light source (cooling drum into the fluid circuit) (referred to the present invention, 2 ), a test, wherein the test environment temperature of 25 ± 2oC.

[0211] 为钨丝前照灯、本发明LED光源前照灯分别加载12V直流电,通电,分别在通电I分钟、2分钟、5分钟、10分钟后,采用上海仪迷杰光电技术有限公司生产、型号为CTLaser 1M/2M,量程为250-1800°C的便携式红外测温仪,对钨丝以及LED晶片的温度进行测试,得到表一所示的数据: [0211] The tungsten headlamp, the LED light source of the present invention is headlamp 12V DC load, are energized, respectively, energization I minute, 2 minutes, 5 minutes, 10 minutes, using photovoltaic technology Jie fans Shanghai Instrument Co. , model CTLaser 1M / 2M, portable infrared thermometer range of 250-1800 ° C, the tungsten wire and the temperature of the LED wafer were tested to obtain the data shown in table I:

[0212] 表一:发光体温度对比表格oC [0212] Table I: comparison table emitter temperature oC

Figure CN102410483BD00181

[0214] 由上可见,本实施例技术方案的散热效果相对于现有技术能够大大提高,特别适用于LED强光源的应用。 [0214] As seen above, the cooling effect of the technical solution of the present embodiment with respect to the prior art can be greatly improved, especially for applications of LED light intensity.

[0215]第二: [0215] Second:

[0216] 分别在钨丝前照灯、采用本发明实施例LED光源作为发光部件的LED前照灯的两端加载测试电源,分别按照GB5948-1998《摩托车灯白炽光源前照灯配光性能》规定的试验规范,测试灯光线投射到GB5948-1998标准中附录A、B规定的配光屏幕上规定区域的照度(单位Lx)。 [0216] tungsten headlamp respectively, using GB5948-1998 "incandescent headlamp light distribution performance of the LED light source embodiment of the present invention as a light emitting member across the LED headlamp loading test power, respectively, according to the motorcycle lights "predetermined test specification, the test light line projected onto the standard GB5948-1998 Appendix a, a predetermined illuminance (unit Lx) a predetermined region on the screen light distribution of B. 在这些前照灯中均分别设有近灯以及远灯。 In both of these headlamps are provided near and far lights lamps.

[0217] 测得的钨丝灯中作为近灯用的钨丝中心轴线D2、远灯钨丝的中心轴线Dl与本钨丝前照灯规定的基准轴线DO的偏差与照度的实验数据如表二所示: [0217] Experimental data illuminance reference axis deviation as tungsten DO D2 near the central axis of the lamp, tungsten lamp central axis Dl away with this headlamp predetermined tungsten Tungsten measured in Table figure II:

[0218] 表二:钨丝灯中轴线D1、轴线D2与基准轴线DO的偏离与照度比对表 [0218] Table II: Tungsten axis D1, D2 with the reference axis offset from the axis of the illuminance ratio DO table

Figure CN102410483BD00191

[0220] 测得的钨丝灯中用于远灯的第一晶片矩阵的中心线Dl'、用于近灯的第二晶片矩阵的中心轴线D2'与本前照灯(其灯罩以及其他的规格与上述钨丝灯相同)规定的基准轴线DO的偏差与照度的实验数据如表三所示: [0220] Tungsten measured for the center line of the first wafer matrix Dl away lamp ', the central axis of the second matrix for the wafer near the lamp D2' of the present headlamp (which shade and other tungsten same specifications above) and the illuminance deviation of the experimental data DO predetermined reference axis as shown in table 3:

[0221] 表三:LED前照灯中轴线D2'、D2'与基准轴线DO的偏离与照度比对表 [0221] Table III: LED headlamp axis D2 ', D2' and the reference axis deviates from the illuminance ratio DO table

Figure CN102410483BD00201

[0223] 对比表二、三可见,现有技术中钨丝灯的灯丝位置设置的限制非常严格,在设计时,任一钨丝的中心线偏离基准轴线均会导致整个前照灯的光照效果不满足国标要求,即导致不合格。 [0223] Comparative Table II, three visible, limitations of the prior art tungsten filament position is set very strict in the design, any of a tungsten wire deviates from the reference centerline axis will cause the lighting effect of the whole headlight does not meet the national standard that would result in disqualification.

[0224] 而采用本实施例的LED光源的设计,充当远灯、近灯的第一晶片矩阵、第二晶片矩阵的中心位置的限制大大宽限,其偏离基准轴线6毫米的情况下,LED光源中的近灯、远灯光束光照效果仍然符合国家标准。 [0224] The use of the LED light source design of the present embodiment, the lamp acting as a far, near a first light matrix wafer, a second wafer center position limits greatly grace matrix, which deviates from the reference axis in the case of 6 mm, an LED light source the approach lights, lighting effects are still far from the light beam in line with national standards.

[0225] 综上,采用本实施例技术方案的设计更加方便,且能大大提高成品的合格率,且本实施例的LED光源的装配的可适配性更强。 [0225] In summary, using the technical solution of the present embodiment design is more convenient, and can greatly improve the yield of the finished product, and the LED light source assembly according to the present embodiment may be adapted stronger.

[0226] 第三:分别对现有技术近灯、远灯用鹤丝距离L'为1mm、1.8mm、2mm、2.2mm、3mm, [0226] Third: the prior art approach lights, respectively, far crane filament lamp distance L 'is 1mm, 1.8mm, 2mm, 2.2mm, 3mm,

各钨丝的中心均在前照灯的基准轴线上,的钨丝灯分别两端加载测试电源,分别按照GB5948-1998《摩托车灯白炽光源前照灯配光性能》规定的试验规范,测试灯光线投射到GB5948-1998标准中附录A、B规定的配光屏幕上规定区域的照度(单位Lx),得到表四所示的数据: The center of each test power supply tungsten are loaded on the reference axis of the headlamp, the two ends of each tungsten, respectively, according to GB5948-1998 "motorcycle incandescent light source Headlamp Photometry" predetermined test specification, the test light line projected onto the standard GB5948-1998 Appendix a, a predetermined illuminance (unit Lx) on a predetermined region of the light distribution screen B to obtain the data shown in table 4:

[0227] 表四:鹤丝距离L'为1mm、1.8mm、2mm、2.2mm、3mm与照度比对表 [0227] Table 4: crane wire distance L 'is 1mm, 1.8mm, 2mm, 2.2mm, 3mm and illuminance ratio table

Figure CN102410483BD00211

[0229] 由表四可见,采用现有技术中的钨丝制成的前照灯,其远灯、近灯之间的间距要求严格,其距离范围为1.8-2.2mm之间,导致设计制造的限制较大,略有不慎容易造成不良品,导致不良率高。 [0229] can be seen from Table IV, using the prior art headlamp made of tungsten, which is far lamp, lamp spacing requirements between the near-strict, a distance between the range of 1.8 to 2.2 mm, resulting in the design and manufacture the limit is large, slightly careless likely to cause defective products, resulting in poor rate. 同时其应用的配件的适配性也较差。 Meanwhile adaptation of parts of its application is also poor.

[0230] 分别对现有技术远灯、近灯用的第一晶片矩阵、第二晶片矩阵之间距离L为 [0230] The distance between each pair of prior art lamps far, the first wafer matrix near the lamp, the second wafer to matrix L

0.2mm、1mm、2mm、3mm、6mm的LED强光源(被测样品中各晶片矩阵的中心偏离前照灯的基准轴线的误差±2mm)两端分别加载测试电源,按照GB5948-1998《摩托车灯白炽光源前照灯配光性能》规定的试验规范,测试灯光线投射到GB5948-1998标准中附录A、B规定的配光屏幕上规定区域的照度(单位Lx),得到表五所示的数据: 0.2mm, 1mm, 2mm, 3mm, 6mm of LED light sources (the center of each test sample matrix deviation error of ± wafer reference axis of the headlight 2mm) were loaded at both ends of the test power supply, in accordance with GB5948-1998 "Motorcycle incandescent light source headlamp Photometry "predetermined test specification, the test light line projected onto the standard GB5948-1998 Appendix a, a predetermined illuminance (unit Lx) on a predetermined region of the light distribution screen B, as shown in table V to give the data:

[0231] 表五:鹤丝距离L'为1mm、1.8mm、2mm、2.2mm、3mm与照度比对表 [0231] Table 5: crane wire distance L 'is 1mm, 1.8mm, 2mm, 2.2mm, 3mm and illuminance ratio table

Figure CN102410483BD00221

[0233] 由表五可见,采用本发明采用两个LED晶片矩阵制成的光源,其远灯、近灯之间的间距要求更加宽泛,其距离范围可宽达0.6-6mm之间,故采用本实施例结构的LED光源,有利于大大降低设计制造成本,降低产品的不良率。 [0233] can be seen from Table V, the present invention is a light source made of two matrices LED chip, which is far lamp, the lamp spacing between the near broader requirements, a distance between the wide range 0.6-6mm, so the use of LED light source according to the structure of the present embodiment, the design is conducive to reduce the manufacturing cost significantly, reduce the defect rate of products. 同时其应用的配件的适配性也较优。 Meanwhile adaptation of parts of its application is also better.

[0234] 以上对本发明实施例所提供的技术方案进行了详细介绍,本文中应用了具体个例对本发明实施例的原理以及实施方式进行了阐述,以上实施例的说明只适用于帮助理解本发明实施例的原理;同时,对于本领域的一般技术人员,依据本发明实施例,在具体实施方式以及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。 Described in detail describes the technical solution provided in [0234] the above embodiment of the present invention herein apply the principle of specific examples of embodiments of the present invention and embodiments are set forth in the above embodiments apply only to aid in understanding the present invention the principles of the embodiment; the same time, those of ordinary skill in the art, according to embodiments of the present invention, may make modifications at specific embodiments and application scope, Therefore, the specification shall not be construed as the present invention limits.

Claims (13)

1.一种适用于车船前照灯用LED光源,其特征是,包括: 金属基板、PCB绝缘基材、走线铜箔、硅胶填充部、复数条导电引线以及复数个LED晶片; 在所述金属基板的顶面设·置有一凹坑; 所述PCB绝缘基材铺设在所述金属基板上除所述凹坑外的顶面区域; 在所述PCB绝缘基材上铺设有所述走线铜箔; 所述金属基板、走线铜箔可分别与所述外部直流电流的两供电端子电连接; 复数个所述LED晶片固定在所述凹坑内, 各所述LED晶片底面的绝缘层与本所述LED晶片下方的所述金属基板面接触, 各所述LED晶片的一电极引脚分别焊接于本所述LED晶片下方的所述金属基板上, 各所述LED晶片的另一电极引脚分别通过各所述导电引线与所述走线铜箔电连接; 在各所述LED晶片的顶面涂覆有荧光粉层, 所述硅胶填充部填充在所述凹坑内,各所述LED晶片以及导电引线以及荧光粉被 A suitable light source LED headlamp travel, characterized in that, comprising: a metal substrate, PCB insulating base material, copper wiring, silica gel filling portion, a plurality of conductive leads and a plurality of LED chips; the the top surface of the metal substrate provided with a counter-pit; PCB said insulating substrate is laid on the top surface of the metal substrate other than said outer region of the pit; in the insulating base material layered with the PCB trace copper; the metal substrate, copper traces may be connected to the two power supply terminal of the external direct current; a plurality of said LED chip is fixed to one of the pits, each of the insulating layer and the bottom surface of the LED chip below the surface of the metal substrate of the LED chip according to the contact, a respective electrode pins of the LED chip are soldered to the metal substrate present below the LED chip, each of the other electrode lead of the LED chip are connected by a pin each of the conductive leads of the electrical wiring copper foil; the phosphor layer is coated on a top surface of each of the LED chip, the silica filler is filled in said recesses, each of said LED chip and conductive leads and phosphors are 同包裹在所述硅胶填充部内。 Wrapped in the same silica gel filling portion.
2.根据权利要求1所述的适用于车船前照灯用LED光源,其特征是,还包括:散热基座、进流管; 在所述散热基座上具有一个封闭的立面,所述金属基板固定在所述散热基座的立面的右侧而与所述散热基座面接触; 在所述散热基座的立面左侧向左延伸有复数个左延伸部, 所有所述左延伸部之间的间隙形成一个迂回通道, 所述迂回通道的一端与所述进流管的第一端部连接,另一端与外相通。 According to claim 1 applied in the travel headlamp LED light source, characterized by, further comprising: a heat sink, the intake manifold; having a closed facade on the heat sink base, the fixing the metal substrate in contact with the heat sink on the right side surface of the heat radiating facade base; extends leftward plurality of left extension portion on the left side of the facade heat dissipation base, all of the left the gap between the extending portion is formed a bypass passage, said bypass passage and the first end portion of the inlet end of the flow tube and the other end communicating with the outside.
3.根据权利要求2所述的适用于车船前照灯用LED光源,其特征是, 在所述散热基座的立面的左侧向左延伸有复数个左延伸部,具体是: 在所述立面的左侧设置有一个中心左延伸部以及一个左延伸管, 所述中心左延伸部位于所述左延伸管的管腔内; 所述迂回通道具体为:所述中心左延伸部与所述左延伸管之间的间隙形成的空间。 Applicable claimed in claim 2 travel headlamp LED light source, wherein, in the left side of the heat dissipation base facade extends leftward plurality of left extension portion, in particular: in the setting said left facade having a central portion extending in a left and a left extension tube, located at the center of the left extending portion left within the lumen of the extension tube; a bypass passage is specifically: the center of the left extending portion the gap space between the left extension tube formation.
4.根据权利要求3所述的适用于车船前照灯用LED光源,其特征是, 在所述立面的右端还设置有一个凹腔, 所述凹腔的开口设置在所述立面的左端部, 所述凹腔向右延伸形成在所述中心左延伸部内部。 According to claim 3 in the elevation of said opening is provided suitable for travel headlamp LED light source, wherein, at the right end of the facade is also provided with a cavity, said cavity a left end portion, said cavity extending in the interior portion is formed to extend rightward in the left center.
5.根据权利要求2或3所述的适用于车船前照灯用LED光源,其特征是, 在所述散热基座的中心左延伸部的外周延伸有复数个流体疏导叶片, 各所述流体疏导叶片与所述左延伸管的内壁具有间隙; 所述进流管连接在所述中心左延伸部的外周, 所述进流管的内壁与所述流体疏导叶片的端部相接触。 According to claim 2 or 3, applied in the travel of the LED light source for a headlamp, characterized in that a plurality of fluid extends grooming blades extending outer peripheral portion of the center of the left heat radiating base, each of said fluid grooming blade and the inner wall of the tube has left a gap extension; the intake pipe connected to an outer periphery of the central portion of the left extension, the inner wall of the feed pipe to divert the fluid flow end of the blade contact.
6.根据权利要求3或4所述的适用于车船前照灯用LED光源,其特征是, 在所述左延伸管上的外周还形成吸热材料填充腔, 在所述吸热材料填充腔内填充有吸热材料, 在所述吸热材料填充腔的外周还设置有隔热层。 Applicable according to claim 3 or 4, wherein the LED light source to travel headlamp, characterized in that, on the left outer periphery of the extension pipe further endothermic material filling the cavity formed in the heat sink material fills the cavity is filled with heat absorbing material within the outer periphery of the heat sink material filling chamber is further provided with an insulating layer.
7.根据权利要求6所述的适用于车船前照灯用LED光源,其特征是, 所述吸热材料为:水、或者高分子水凝胶、或者油液体。 According to claim 6 applied in the travel headlamp LED light source, wherein the endothermic material is: water, hydrogel or polymer, or a liquid oil.
8.根据权利要求3或4所述的适用于车船前照灯用LED光源,其特征是, 还包括流体疏导管、以及流体接纳部; 所述进流管的第二端部与所述流体疏导管的一端连接, 所述流体疏导管的另一端与所述流体接纳部的第二开口部连接, 所述流体接纳部沿第一开口端到所述第二开口端的通道呈圆弧状由宽变窄, 所述第一开口端为与所述第二开口部相对的开口端部。 Applicable according to claim 3 or 4, wherein the LED light source to travel headlamp, characterized in that, to ease further comprising a fluid pipe and a fluid receiving portion; the intake pipe portion and the second end of the fluid One end of the tube to ease connection, the other end of the second opening portion of the fluid receiving portion of the fluid pipe connected to divert the fluid receiving portion along a first open end to the second open end of the arcuate passage width is narrowed, the first open end to the second end portion of the opening opposite to the opening.
9.根据权利要求1或2或3所述的适用于车船前照灯用LED光源,其特征是, 所述复数个LED晶片由:第一晶片矩阵以及第二晶片矩阵组成, 所述第一晶片矩阵、第二晶片矩阵分别由:复数个LED焊接在一起的所述LED晶片构成; 所述第一晶片矩阵、第二晶片矩阵之间的间距为:0.2-6毫米之间的一数值。 9. The headlamp applied in the travel 1, 2 or 3, with the LED light source as claimed in claim, wherein said wafer by a plurality of LED: a first wafer and a second wafer matrix is ​​a matrix of the first wafer matrix, the second matrix, respectively, of the wafer: a plurality of LED welded together constituting the LED chip; wafer spacing between said first matrix, the second matrix is ​​the wafer: a value between 0.2 to 6 mm.
10.根据权利要求9之任一所述的适用于车船前照灯用LED光源,其特征是, 所述第一晶片矩阵的中心线、和/或第二晶片矩阵的中心线偏离本所述LED光源所在的前照灯的光照基准轴线的距离:等于或大于0毫米小于或等于6毫米。 10. A claim according to any one of 9 is applied in the travel of the LED light source for a headlamp, characterized in that the center line of the first wafer matrix, and / or the second wafer departing from the matrix of the from the reference axis of the headlamp illumination LED light source is located: equal to or greater than 0 mm 6 mm or less.
11.根据权利要求9所述的适用于车船前照灯用LED光源,其特征是, 所述金属基板为铜块,或者铝块,或者铜铝合金块。 According to claim 9 suitable for the travel of the LED light source for headlight, characterized in that the metal substrate is a copper block, or a block of aluminum, an aluminum alloy or a copper block.
12.根据权利要求9所述的适用于车船前照灯用LED光源,其特征是, 所述第一晶片矩阵、第二晶片矩阵之间的间距为:1-3毫米之间的一数值。 According to claim 9 applied in the travel headlamp LED light source, wherein, the first wafer matrix, the spacing between the second wafer matrix is: a value between 1-3 mm.
13.根据权利要求9所述的适用于车船前照灯用LED光源,其特征是, 所述第一晶片矩阵、第二晶片矩阵为:两呈平行关系的直线状、弧线状,或者矩形;或者, 所述第一晶片矩阵、第二晶片矩阵为:两呈正交关系的直线状、弧线状,或者矩形。 According to claim 9, applicable to the travel of the LED light source for a headlamp, characterized in that the first wafer matrix, the second wafer matrix: two linearly parallel relationship, arc-shaped, or rectangular ; or matrix of the first wafer, the second wafer matrix: two linearly orthogonal relationship, arc-shaped, or rectangular.
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