CN101216642B - Flat-panel display lead wire structure - Google Patents
Flat-panel display lead wire structure Download PDFInfo
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- CN101216642B CN101216642B CN200810055740XA CN200810055740A CN101216642B CN 101216642 B CN101216642 B CN 101216642B CN 200810055740X A CN200810055740X A CN 200810055740XA CN 200810055740 A CN200810055740 A CN 200810055740A CN 101216642 B CN101216642 B CN 101216642B
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- lead wire
- metal lead
- contact conductor
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- frame glue
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Abstract
The invention relates to a lead structure of a flat panel display. The lead structure of flat panel display comprises a single-layer structure in a sealant region and a multi-layer structure outside the sealant region. According to the lead structure of the invention, the film thickness of a metal lead is identical to that of an electrode lead in the sealant region to prevent stress between an array substrate and a color-film substrate, thus improving the display effect. The multi-layer metal lead structure outside the sealant region can effectively reduce the resistance of the metal lead, thus facilitating signal transmission.
Description
Technical field
The present invention relates to a kind of pin configuration of flat-panel monitor, the inside and outside metal lead wire in especially a kind of envelope frame glue zone adopts the pin configuration of the flat-panel monitor of different structure.
Background technology
Display screen has a lot of lead-in wires in flat-panel monitor, comprise metal lead wire and contact conductor, metal lead wire requires than higher conducting function, so generally adopt sandwich construction, promptly the metal that different lithography layers are formed links together, these metal lead wires exist the different of height with the contact conductor of the individual layer that connects effective viewing area, the difference of this height acts on the envelope frame glue, can between upper and lower base plate, produce stress, cause the non-uniform phenomenon of effective viewing area, influence the display effect of display.
For example, at Thin Film Transistor-LCD (Thin Film Transistor LiquidCrystal Display, hereinafter to be referred as TFT-LCD) in, comprise array base palte and color membrane substrates, comprise grid sweep trace and data line on the array base palte, in order to save cost, the grid scan-line direction does not have printed circuit board in the practical application, the signal of drive integrated circult chip is from the printed circuit board of data line direction, the circuit of data line direction is connected to the grid sweep trace finishes by metal lead wire.Because the thickness of resistance and metal lead wire is inversely proportional to, in order to reduce the resistance in the signals transmission, metal lead wire generally adopts sandwich construction.In addition, pixel electrode on the array base palte and the public electrode on the color membrane substrates need be introduced effective viewing area by contact conductor, make liquid crystal deflection as required, and in the practical application, contact conductor adopts single layer structure.
Fig. 1 shows the metal lead wire on the display screen and the synoptic diagram of contact conductor, because metal lead wire IL adopts sandwich construction, contact conductor PL adopts single layer structure, therefore at envelope frame glue zone Z1, the thickness height of the Film Thickness Ratio contact conductor PL of metal lead wire IL can produce step.Fig. 2 shows the synoptic diagram of the A-A of Fig. 1 in 5 photoetching processes to the cross section, wherein grid layer 1 and the source-drain electrode layer 3 as metal lead wire is double-decker, be insulation course 2 between grid layer 1 and the source-drain electrode layer 3, grid layer 1 as contact conductor is a single layer structure, the superiors of metal lead wire and contact conductor are passivation layer 4, the thickness H1 of metal lead wire step occurred greater than the thickness H2 of contact conductor between the two, promptly have section difference D1.Fig. 3 shows the synoptic diagram of the A-A of Fig. 1 in 4 photoetching processes to the cross section, wherein grid layer 1 and the source-drain electrode layer 3 as metal lead wire is double-decker, grid layer 1 as contact conductor is a single layer structure, than 5 photoetching processes shown in Figure 2, in 4 photoetching processes shown in Figure 3, owing to also have amorphous silicon layer 5 between grid layer 1 and the source-drain electrode layer 3,, promptly have section difference D2 so bigger step has appearred in the thickness H2 of the thickness H1 of metal lead wire and contact conductor.These sections missionary society produces stress between two substrates, cause the non-uniform phenomenon of effective viewing area, influences the display effect of display.
Summary of the invention
The pin configuration that the purpose of this invention is to provide a kind of flat-panel monitor is in order to solve in the prior art because metal lead wire and contact conductor exist section official post envelope frame glue zone to produce the problem of stress.
The pin configuration of flat-panel monitor of the present invention provides following technical scheme by some embodiment:
A kind of pin configuration of flat-panel monitor, comprise the metal lead wire and the contact conductor that is connected grid layer another part that connect source-drain electrode layer and grid layer, contact conductor is an individual layer, in envelope frame glue zone, the number of plies of metal lead wire is identical with the number of plies of contact conductor, and metal lead wire is an individual layer, and the thickness of described metal lead wire is identical with the thickness of described contact conductor.A kind of pin configuration of flat-panel monitor comprises the metal lead wire and the contact conductor that is connected effective viewing area that connect the grid sweep trace, and in envelope frame glue zone, the number of plies of described metal lead wire is identical with the number of plies of described contact conductor.
A kind of pin configuration of flat-panel monitor, comprise metal lead wire that connects sweep trace and the contact conductor that is connected public electrode, metal lead wire connects the part corresponding with the source-drain electrode layer in source-drain electrode layer and the grid layer, contact conductor connects grid layer another part, described contact conductor is an individual layer, in envelope frame glue zone, described metal lead wire is an individual layer.
A kind of pin configuration of flat-panel monitor comprises the metal lead wire and the contact conductor that is connected effective viewing area that connect the grid sweep trace, and described contact conductor is an individual layer, in envelope frame glue zone, described metal lead wire is an individual layer, and outside envelope frame glue zone, described metal lead wire is a multilayer.
A kind of pin configuration of flat-panel monitor comprises the metal lead wire and the contact conductor that is connected effective viewing area that connect the grid sweep trace, and described contact conductor is an individual layer, in envelope frame glue zone, described metal lead wire is an individual layer, and outside envelope frame glue zone, described metal lead wire is double-deck.
The present invention by will sealing frame glue zone metal lead wire and the thickness of contact conductor be taken as identical, can avoid in the prior art because the inconsistent stress problem that causes of both thickness, and metal lead wire envelope frame glue still is multilayer outside the zone, can reduce the resistance in the signals transmission effectively.
Description of drawings
Fig. 1 is the structural representation of prior art metal lead wire and contact conductor;
Fig. 2 is the schematic cross-section of the A-A direction of Fig. 1 in 5 photoetching processes of prior art;
Fig. 3 is the schematic cross-section of the A-A direction of Fig. 1 in 4 photoetching processes of prior art;
Fig. 4 is the structural representation of the pin configuration embodiment of flat-panel monitor of the present invention;
Fig. 5 is the schematic cross-section of the A-A direction of pin configuration Fig. 4 of flat-panel monitor of the present invention;
Fig. 6 is the schematic cross-section of the B-B direction of pin configuration Fig. 4 of flat-panel monitor of the present invention.
Embodiment
Further specify technical scheme of the present invention below in conjunction with the drawings and specific embodiments.
Fig. 4 is the structural representation of the pin configuration embodiment of flat-panel monitor of the present invention.As shown in Figure 4, metal lead wire I L is a single layer structure at envelope frame glue zone Z1, be sandwich construction in envelope frame glue zone with exterior domain Z2, and contact conductor PL is single layer structure at All Ranges.
Referring to the schematic cross-section of the A-A direction of Fig. 4 shown in Figure 5, metal lead wire and contact conductor in envelope frame glue zone are individual layer (metal lead wire and contact conductor are grid layer 1).Therefore the thickness H2 at thickness H1 that seals frame glue regional metal lead-in wire and contact conductor is identical, the section of existence is not poor, can effectively reduce because metal lead wire and inconsistent array base palte that causes of contact conductor thickness and the stress between the color membrane substrates, and then eliminate the non-uniform phenomenon of viewing area, improve the display effect of liquid crystal display.
Referring to the schematic cross-section of the B-B direction of Fig. 4 shown in Figure 6, shown in the figure is 4 photoetching situations (principle under 5 photoetching situations is identical), and metal lead wire is a single layer structure at envelope frame glue zone Z1, is double-decker in envelope frame glue zone with exterior domain Z2.Because the resistance and the thickness of metal lead wire are inversely proportional to, therefore, metal lead wire is got double-decker outside envelope frame glue zone, can effectively reduce the resistance of metal lead wire, reduces the wasting of resources of signals transmission.Present embodiment can also all be taken as individual layer with the metal lead wire that reaches noneffective display area in the envelope frame glue zone, only is taken as multilayer in effective viewing area.
Present embodiment, metal lead wire adopts the different numbers of plies in envelope frame glue zone with outside the envelope frame glue zone, metal lead wire is an individual layer in envelope frame glue zone, identical with the thickness of the contact conductor of individual layer, because the thickness of metal lead wire and contact conductor is consistent in the envelope frame glue zone, can avoid improving display effect because array base palte that both thickness cause when inequality and the stress between the color membrane substrates make the demonstration phenomenon of viewing area even; And the metal lead wire of present embodiment adopts multilayer outside envelope frame glue zone, rather than and seal the same individual layer that is taken as in the frame glue zone, can effectively reduce the resistance of metal lead wire like this, be beneficial to the transmission of signal.The single or multiple lift structure that the lead-in wire of above-mentioned flat-panel monitor adopts can utilize prior art to form.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (3)
1. the pin configuration of a flat-panel monitor, comprise metal lead wire that connects sweep trace and the contact conductor that is connected public electrode, metal lead wire connects the part corresponding with the source-drain electrode layer in source-drain electrode layer and the grid layer, contact conductor connects grid layer another part, it is characterized in that: described contact conductor is an individual layer, in envelope frame glue zone, the number of plies of described metal lead wire is identical with the number of plies of described contact conductor, and described metal lead wire is an individual layer, and the thickness of described metal lead wire is identical with the thickness of described contact conductor.
2. the pin configuration of flat-panel monitor according to claim 1 is characterized in that: outside envelope frame glue zone, described metal lead wire is a multilayer.
3. the pin configuration of flat-panel monitor according to claim 1 is characterized in that: outside envelope frame glue zone, described metal lead wire be a bilayer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810055740XA CN101216642B (en) | 2008-01-08 | 2008-01-08 | Flat-panel display lead wire structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810055740XA CN101216642B (en) | 2008-01-08 | 2008-01-08 | Flat-panel display lead wire structure |
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| Publication Number | Publication Date |
|---|---|
| CN101216642A CN101216642A (en) | 2008-07-09 |
| CN101216642B true CN101216642B (en) | 2011-04-06 |
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| CN200810055740XA Active CN101216642B (en) | 2008-01-08 | 2008-01-08 | Flat-panel display lead wire structure |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI424233B (en) * | 2010-12-23 | 2014-01-21 | Au Optronics Corp | Array substrate, substrate module, and display panel |
| CN103902082B (en) * | 2012-12-27 | 2019-03-15 | 宸鸿光电科技股份有限公司 | Touch panel and its manufacturing method |
| CN108922877A (en) * | 2018-06-29 | 2018-11-30 | 武汉华星光电半导体显示技术有限公司 | Display panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1577413A (en) * | 2003-07-29 | 2005-02-09 | 三星Sdi株式会社 | Flat panel display |
| CN1797157A (en) * | 2004-12-31 | 2006-07-05 | Lg.菲利浦Lcd株式会社 | Liquid crystal display device and fabricating method thereof |
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2008
- 2008-01-08 CN CN200810055740XA patent/CN101216642B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1577413A (en) * | 2003-07-29 | 2005-02-09 | 三星Sdi株式会社 | Flat panel display |
| CN1797157A (en) * | 2004-12-31 | 2006-07-05 | Lg.菲利浦Lcd株式会社 | Liquid crystal display device and fabricating method thereof |
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| CN101216642A (en) | 2008-07-09 |
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Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd. Assignor: BOE Technology Group Co., Ltd. Contract record no.: 2011990000439 Denomination of invention: Flat-panel display lead wire structure Granted publication date: 20110406 License type: Exclusive License Open date: 20080709 Record date: 20110608 |