CN101188675A - Optical device module and method for fabricating the same - Google Patents
Optical device module and method for fabricating the same Download PDFInfo
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- CN101188675A CN101188675A CNA2007101672171A CN200710167217A CN101188675A CN 101188675 A CN101188675 A CN 101188675A CN A2007101672171 A CNA2007101672171 A CN A2007101672171A CN 200710167217 A CN200710167217 A CN 200710167217A CN 101188675 A CN101188675 A CN 101188675A
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- flexible base
- base plate
- solid
- state image
- image pickup
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Endoscopes (AREA)
Abstract
The invention discloses an optical device module and the production method, providing an optical device module containing a flexible substrate installed with the a plurality of adjacent optical elements and an electronic part electrically connected with the optical element, as an integral capable of being produced with low cost. The invention is a solid state pick-up device (1) containing a first pick-up element (2), a first flexible substrate (8) connected with the first pick-up element, a second pick-up element (3) and a second flexible substrate (18) connected with the second pick-up element. The solid state pick-up elements (2, 3) are configured into the adjacent state to be vertical by shiny side. The incident light rips into the second solid state pick-up element (3) and rips into the second solid state pick-up element (2) after being reflected by a reflector (6). Two flexible substrates (8, 18) are provided with an electronic part 5a. The first flexible substrate (8) is bent at two bending parts (10a, 10b) and faces to the second flexible substrate (18) to be connected electrically.
Description
Technical field
The present invention relates to a kind of optical device module and manufacture method thereof, particularly a kind of optical device module and manufacture method thereof that comprises a plurality of flexible base plates that a plurality of optical elements are installed and are connected electrically in the electronic unit on this optical element.
Background technology
In recent years, make in exploitation all the time to have the optical device module that the optical element that is subjected to light, lighting function and its drive circuit become one, this optical device module comprises the optical picking-up head that for example is used for reading DVD etc., is used in the camera module of mobile phone etc.Miniaturization requirement for the element that is mounted in it in adapting to also just requires the further miniaturization of these optical device modules.
As one of above-mentioned optical device module example is exactly the exploitation of device for solid photography (photographing module), in the exploitation device for solid photography, utilize electric charge coupled mode imaging apparatus (CCD), static induction transistor imaging apparatus (SIT), electric charge modulation type imaging apparatus solid-state image pickups such as (CMD) to make used for optical elements, most of situation is that these device for solid photography are loaded in the small-sized camera unit.These device for solid photography are loaded into the leading section that has solidified that is inserted into the insertion tube in the small-sized camera unit and use like this.Because so small-sized camera unit is used on the situation of excavating traces, the stenosis when confirming disaster, the situation of watching art work inside etc., therefore requires the external diameter of leading section to want thin and short and small.From this viewpoint, how to make solid-state image pickup more miniaturization just become extremely important.And in order to realize the small-sized camera unit of low price, the assembling operation efficient, the reduction manufacturing cost that improve device for solid photography have also just become an important research project.
Up to the present, have open as the device for solid photography of seeking miniaturization, cost degradation, disclosed this device for solid photography (for example, open flat 11-271646 communique with reference to the spy) structure be such, with the lead-in wire of flexible base plate that IC, chip part etc. have been installed on the certain edges thereof of solid-state image pickup convex curved and connect, more together with the mutual gluing in the back side of IC and solid-state image pickup.
Figure 14 is the concept map of analysing and observe that shows in the structure of the device for solid photography shown in the above-mentioned conventional example.
As shown in figure 14, solid-state image pickup 902, semiconductor element (IC chip) 903, chip part 904 are being installed on the flexible base plate 901, after reconnecting external signal line 905, three positions flexible base plate 901 is carried out right-angle bending respectively, allow the lower surface portion of solid-state image pickup 902 and IC chip 903 upper surface part in opposite directions, and their gluings are fixed together with bonding agent 922.Then, the side surface part of chip part 904 and the crooked opposing part gluing of substrate 901 are fixed together, constitute the very little electronics introscope device for solid photography of shape with the bonding agent that does not show.Open in the flat 11-271646 communique the spy, owing to be by flexible base plate 901 is curved rectangle, the mutual gluing in the back side of IC chip 903 and solid-state image pickup 902 is constituted together, so can under the situation that operating efficiency is descended, seek miniaturization, cost degradation.
And, other conventional example as the device for solid photography of having sought miniaturization also has open, disclosed device for solid photography (for example, open the 2000-210252 communique with reference to the spy) structure be such, promptly, solid-state image pickup is connected on the terminal of bottom of flexible base plate, this flexible base plate is bent to box shape, on the face of this box-shaped inboard electronic unit is installed.Open in the 2000-210252 communique the spy, because it all is the casing of rectangular shape that flexible base plate is bent into each face, electronic unit is installed in the substrate inner face side of casing, thus can make the image unit miniaturization, thus can seek thin footpathization, the miniaturization of leading section.
Summary of the invention
The technical problem that-invention will solve-
Above-mentioned two device for solid photography have all used a solid-state image pickup, and resulting image only is a black and white image.
Yet, excavate traces, when confirming disaster stenosis situation, what watch that the situation etc. of art work inside needs down is coloured image.And, also require except device for solid photography, to install together again infrared light sources, linear measure longimetry LASER Light Source.Under these circumstances, just be necessary to install a plurality of solid-state image pickups and constitute a camera unit, and further install light source.If utilize a plurality of spies to open flat 11-271646 communique and the special device for solid photography of opening in the 2000-210252 communique, and install light-emitting component together and constitute a camera unit, then because though camera head one by one is very little, but such camera head by former state ground use a plurality of after, it is big that camera unit itself will become.Besides, carry out being set to after the strict adjustment in the lens barrel so that optical axis unanimity separately, this also is unusual difficulty again.
Open the device for solid photography that obtains after disclosing the combination of three solid-state image pickups in the clear 56-98881 communique the spy, but the peripheral circuit that drives these solid-state image pickups is not done any record.In the device for solid photography of reality, be assembled in the lens barrel again after solid-state image pickup and the circuit board that drive circuit is installed are become one, although open flat 11-271646 communique and the special technology that discloses the device for solid photography miniaturization after making these integrated in the 2000-210252 communique of opening, to technology not explanation so far with adjacent a plurality of solid-state image pickups, circuit board miniaturization together the spy.
-in order to the technical scheme of technical solution problem-
The present invention makes for addressing the above problem just, its purpose is: a kind of flexible base plate that comprises the electronic unit that adjacent a plurality of optical elements is installed and is electrically connected with this optical element is provided, and does as a whole small-sized and can the low-cost optical device module of making.
For addressing the above problem, optical device module of the present invention, it comprises: a plurality of optical elements, the flexible base plate that is connected with described optical element, the speculum or the prism of direction that is installed in the electronic unit on the described flexible base plate and changes the optical axis of at least one described optical element.Described flexible base plate has a plurality of, and simultaneously each this flexible base plate connects with different described optical element respectively; A plurality of described optical elements are adjacent each other; The optical axis of at least one described optical element has been changed direction by described speculum or prism and has become parallel with other the optical axis of described optical element; At least one flexible base plate in the described flexible base plate is electrically connected with other described flexible base plate by bending.
Here, a plurality of optical elements are adjacent mutually, not only comprise the situation that optical element is in contact with one another, and also comprise across prism, speculum etc. and mutually adjacent situation of optical element.And, as long as the distance between the part that gets recently of two optical elements just can be regarded it as adjacent in the length of side on the longest limit of optical element.
Here the optical axis of at least one optical element is reflected that mirror or prism have changed direction and parallel with the optical axis of other optical element, means that the optical axis of the light that incides optical device module or penetrate from optical device module is the relation that is parallel to each other.Here parallel is not proper parallel on the mathematics, and mean the back depth of parallelisms that can use as optical device module such as scale error with component parts of considering optical device module, assembly error, so long as can not cause the problem in the practicality to get final product with the proper parallel degree that departs from mutually of mathematics.
According to above formation, the light of incident is distributed to speculum or the adjacent a plurality of optical elements of prism, be connected with a flexible base plate on each optical element, at least one flexible base plate is bent flexible base plate is connected with each other, and is miniaturized on the whole so have the optical device module of a plurality of optical elements.
In a certain desirable embodiment, described a plurality of optical elements comprise first solid-state image pickup and second solid-state image pickup; Different described flexible base plates is connected with two described solid-state image pickups respectively; First prism is fixed on the sensitive surface of described first solid-state image pickup; Second prism is fixed on the sensitive surface of described second solid-state image pickup; Described first and second prism is fixed with each other.
Can also be such, further comprise light-emitting component, the optical axis of this light-emitting component when the directive outside be injected into described first and second prism at least one prism when the optical axis of described first and second solid-state image pickup parallel.Here said injecting to is meant when the outside when the optical device module directive outside; Incide optical axis when the prism and be meant optical axis when the light of going into to shine from the optical device module outside at first incides prism.
Can be such, described a plurality of optical elements also comprise the 3rd solid-state image pickup; Another different described flexible base plate is connected with described the 3rd solid-state image pickup; Prism is fixed on the sensitive surface of described the 3rd solid-state image pickup; Described prism is fixed at least one prism in described first prism and second prism.
Can be such, optical device module also comprises light-emitting component, the optical axis of this light when the outside of the light directive optical device module that sends from this light-emitting component, the optical axis of this light is parallel when inciding at least one prism described first, second and third prism from the outside of optical device module with light that the optical axis that is parallel to described first, second and third solid-state image pickup is injected this first, second and third solid-state image pickup.
Can between the sensitive surface of described solid-state image pickup and described prism, be provided with transparency protected parts.
Can be provided with the reinforcement resin in the coupling part of described optical element and described flexible base plate.
Preferably, described flexible base plate is made of film carrier tape manufactured using, and film is removed in the coupling part of described optical element and described flexible base plate.
Can be such, have the projected electrode that utilizes scolding tin to form at least one flexible base plate in a plurality of described flexible base plate that is electrically connected mutually, have the through hole of inserting this projected electrode on another flexible base plate.
Can be such, described another flexible base plate be by bending and some is overlapping, and described through hole is formed on the overlapping region.
Can be such, described another flexible base plate be bent and some is overlapping, and described projected electrode is formed on the overlapping region.
Can be such, be arranged on and another described flexible base plate on electrode be electrically connected with described projected electrode.
Preferably such, described flexible base plate is the single face circuit board that only is formed with wiring on a face.In this case, at least one flexible base plate in the described flexible base plate, it is not formed with, and some is bent into overlapping appearance between the face of described wiring, is formed with in the zone by bending of described flexible base plate and the outside external connecting that is connected.
Optical devices of the present invention unit comprises: described optical device module and the shell of taking in described optical device module.
Can be such, in described shell, take in surperficial at least thermal component with electrical insulating property.
The manufacture method of optical device module of the present invention comprises following each operation: a plurality of electronic units are installed in operation on first flexible base plate; First solid-state image pickup is connected to operation on described first flexible base plate; A plurality of electronic units are installed to operation on second flexible base plate; Second solid-state image pickup is connected to operation on described second flexible base plate; Described first and second solid-state image pickup is the adjacent and operation of establishing; With at least one the flexible base plate bending in described first and second flexible base plate with these two operations that flexible base plate is connected with each other; And arrange to go up change described first solid-state image pickup optical axis direction and make the direction of optical axis of described first solid-state image pickup speculum parallel or the operation of prism with the optical axis of described second solid-state image pickup.
The effect of-invention-
Establish because a plurality of optical elements in this optical device module are adjacent, the optical axis of at least one optical element is reflected that mirror or prism have changed direction and is parallel with the optical axis of other optical element, the flexible base plate that is connected on each optical element is to have at least a flexible base plate to be interconnected by bending, so the optical device module with a plurality of optical elements can be done as a wholely to do very for a short time, cost is descended.
The simple declaration of accompanying drawing
Fig. 1 is the schematic isometric of the related device for solid photography of first embodiment.
Fig. 2 (a) is the schematic side view of the related device for solid photography of first embodiment, and 2 (b) and Fig. 2 (c) are the fragmentary cross-sectional views of 2 (a).
Fig. 3 is the figure that obtains after first flexible base plate that first embodiment is related launches.
Fig. 4 (a) is the schematic isometric before first and second flexible base plate that first embodiment is related couples together, Fig. 4 (b) is the cutaway view that the A-A line along among Fig. 4 (a) after connecting is cut open, and Fig. 4 (c) launches the resulting figure in back with second flexible base plate.
Fig. 5 is the phantom of the related camera unit of first embodiment.
Fig. 6 (a) is the schematic isometric of the related device for solid photography of second embodiment, and Fig. 6 (b) launches the resulting figure in back with second first related flexible base plate of embodiment.
Fig. 7 (a) is with the schematic isometric of second first and second related flexible base plate of embodiment before coupling together, and Fig. 7 (b) is the cutaway view that the B-B line along among Fig. 7 (a) after connecting is cut open, and Fig. 7 (c) is the figure after second flexible base plate is launched.
Fig. 8 (a) is the schematic isometric of the 3rd device for solid photography that embodiment is related, and Fig. 8 (b) is a schematic side view.
Fig. 9 (a) is the schematic isometric of the 4th optical device module that embodiment is related, and Fig. 9 (b) is a schematic side view.
Figure 10 (a) is the schematic isometric of the 5th optical device module that embodiment is related, and Figure 10 (b) is a schematic side view.
Figure 11 (a) is the schematic isometric before first, second that the 5th embodiment is related and the 3rd flexible base plate couple together, and Figure 11 (b) is the cutaway view that the D-D line along among Figure 11 (a) after connecting is cut open.
Figure 12 (a) is the schematic isometric of the 6th optical device module that embodiment is related, and Figure 12 (b) is a schematic side view.
Figure 13 is the phantom of the 7th camera unit that embodiment is related.
Figure 14 is the figure that shows the formation of existing device for solid photography.
Embodiment
Below, embodiments of the invention are described with reference to the accompanying drawings.Remark additionally, for simplicity, in following each accompanying drawing, represent to have in fact the inscape of identical function with same symbol.
(first embodiment)
In first embodiment, the device for solid photography (optical device module) of making optical element with solid-state image pickup and the camera unit (Optical devices unit) that this device for solid photography has been installed are described.
-device for solid photography-
Fig. 1 shows the schematic isometric of the related device for solid photography of this embodiment, and side view is shown in Fig. 2 (a), and the side sectional view of the coupling part of solid- state image pickup 2,3 and flexible base plate 8,18 is shown in Fig. 2 (b) and Fig. 2 (c).
The related device for solid photography 1 of this embodiment comprises: first and second solid- state image pickup 2,3, first and second flexible base plate 8,18 that is electrically connected with solid- state image pickup 2,3 respectively and the speculum 6 of direction that changes the optical axis of the light that incides first solid-state image pickup 2.Electronic unit 5a is installed on first and second flexible base plate 8,18.Be formed with external connecting 12 on first flexible base plate 8, external connection line 11 is connected the there.Device for solid photography 1 is connected with power supply via this external connection line 11, and the signal input also is output.
In this embodiment, make first and second solid- state image pickup 2,3 with CCD (electric charge coupled mode imaging apparatus), first and second solid-state image pickup the 2, the 3rd is distinguished colors for example red (R) different mutually in the three primary colors of perceived light, the element of green (G).
The transparency protected parts 17,17 of protection sensitive surface utilize bonding agent 31,31 to be attached on the sensitive surface of two solid-state image pickups 2,3.Can make transparency protected parts 17,17 with for example Telex (registered trade mark) glass, Pyrex (registered trade mark) glass, quartz.Can enough refractive indexes make bonding agent 31,31 less than propylene resin, polyimide based resin or the epoxylite of transparency protected parts 17,17 etc. ultraviolet hardening or heat-curing type material.Can utilize transparency protected parts 17,17 to prevent on the sensitive surface of dust attached to solid- state image pickup 2,3, improve reliability, picture quality.Element terminal 9 is located at the outer edge of sensitive surface.
Utilize the fixed part (not shown) that two solid- state image pickups 2,3 are arranged to the mutually orthogonal and adjacent state of sensitive surface.In this embodiment, two solid- state image pickup 2,3 adjacent far and near degree are their transparency protected parts 17,17 the side end face is in contact with one another so far away.Enter sensitive surface at two solid- state image pickups 2,3 light from the outside under the open open state.The place ahead at the sensitive surface of first solid-state image pickup 2 is provided with speculum 6, makes the direction of optical axis 20b of the light of the sensitive surface that incides first solid-state image pickup 2 change 90 degree.Because the effect of this speculum 6, the optical axis 20b of light of sensitive surface that incides first solid-state image pickup 2 is just parallel in the outside of device for solid photography 1 with the optical axis 20a of the light of the sensitive surface that incides second solid-state image pickup 3.In other words, in optical axis 20b, the 20a unanimity of two solid-state image pickups in the outside of device for solid photography 12,3.Under the structure with such position relation, two solid- state image pickups 2,3 just are positioned to very miniaturization.
First and second flexible base plate 8,18 is substrates of pliability, insulating properties and be formed with the metal line (not shown) on their surface.Particularly, the flexible base plate the 8, the 18th among this embodiment, the film carrier tape manufactured using of single face wiring is wherein made substrate with polyimide film, liquid crystal polymer film, and what the metal of metal line used is copper.Electronic unit 5a is installed on interarea 8a, the 18a of the flexible base plate 8,18 that is formed with metal line.Electronic unit 5a comprises the driver IC 501 that drives solid- state image pickup 2,3, chip-resistance 502, chip capacitor 503, chip transistor 504 etc., and these components and parts constitute drive circuit, the output/input circuit of solid-state image pickups 2,3.This electronic unit 5a utilizes scolding tin etc. to be connected electrically on the metal line of flexible base plate 8,18.
First flexible base plate 8 is arranged to along extending with the face of the opposite side of sensitive surface of first solid-state image pickup 2, and first flexible base plate 8 bends towards sensitive surface one side in the side end face of first solid-state image pickup 2.Shown in Fig. 2 (b), the 15c of splicing ear portion is connected on the element terminal 9 that is present near first solid-state image pickup 2 the above-mentioned side end face by projection, electronic unit 5a is installed on first flexible base plate 8, is arranged to back one side with the side end face of the opposite side in side end face of first solid-state image pickup 2 that has element terminal 9.
Be folded to the element terminal 9 of first solid-state image pickup 2 in first flexible base plate 8 and crooked bend 15a and the 15c of splicing ear portion is that the film of substrate is removed the only part of remaining metal line.Therefore, bending easily keeps case of bending easily.Can also make radius of curvature smaller, make the shape miniaturization of device for solid photography 1.And, around the coupling part of element terminal 9 and the 15c of splicing ear portion and be provided with around the bend 15a and strengthen resin 15b and protect coupling part and sweep.So, connection reliability improves, and can fix under the state with 8 bendings of first flexible base plate.Can utilize this reinforcement resin of work 15b such as heat-curing resin of epoxy resin series.
Shown in Fig. 2 (c), an end of second flexible base plate 18 is installed in the side end of second solid-state image pickup 3, at bend 16a by bending to sensitive surface one side, the element terminal 9 of second solid-state image pickup 3 and the 16c of splicing ear portion utilize projection to be connected and link together.First flexible base plate 8 is connected with first solid-state image pickup 2 by about 180 degree of bending, and second flexible base plate 18 is connected with second solid-state image pickup 3 by about 80 degree of bending.Except this angle of bend difference, the structure of the coupling part of first and second flexible base plate 8,18 is identical.
First and second flexible base plate 8,18 both sides are that the back side (face of an opposite side with the sensitive surface) side along second solid-state image pickup 3 is extended and mutually in opposite directions, face in opposite directions becomes interarea 8a, the 18a that has metal line mutually, and electronic unit 5a is installed in the there.The width that first and second flexible base plate 8,18 extends along the back side one side of second solid-state image pickup 3 and the width at second solid-state image pickup, 3 back sides are about equally.Therefore, if see second solid-state image pickup 3 from sensitive surface one side, the electronic unit 5a that is installed is buried in the behind of second solid-state image pickup 3, and it is very little that device for solid photography 1 just becomes.
Promptly shown in Figure 3 as expanded view, be formed on the external connecting 12 of first flexible base plate 8, be formed on after a part of bending of flexible base plate and in the zone 4 that forms.In other words, be folded, and the face that becomes a side opposite with interarea 8a overlaps mutually opposite to each other in the part of first folding part, 81 flexible base plates.So, the part of metal line (not shown) just is positioned at the back side one side of the face that electronic unit 5a is installed.In the metal line formation that is positioned at this back side one side external connecting 12 is arranged.External connecting 12 is electrically connected by the metal line (not shown) with the terminal of electronic unit 5a.After like this flexible base plate being folded up, just can on the two sides, arrange metal line, realize small-sized two sides wiring with cheap single face circuit board.
First flexible base plate 8 owing to the crooked zone 4 that forms, along further extending further from the direction at the back side of second solid-state image pickup 3 than the part that electronic unit 5a has been installed.What carry out in these two places of the first bending part 10a, the second bending part 10b is that relative interarea 8a becomes the same bending in mountain peak, than the part of the second dogleg section 10b more close bearing of trend promptly first join domain 13 be disposed in the back side one side of installed surface of the electronic unit 5a of second flexible base plate 18, be used for coupling together with second flexible base plate 18.At this moment, above the interarea 8a of first join domain 13 becomes in Fig. 1.First join domain 13 be provided with a plurality of through holes 23,23 ..., interarea 8a through hole 23,23 ... the peripheral part be formed with ring electrode 22,22 ...Remark additionally, though omitted diagram, ring electrode 22,22 ... be connected on external connecting 12, the electronic unit 5a etc. by the metal line that is formed on the interarea 8a.So,, reduce, make equipment miniaturization, thereby also reduce cost so external connection line 11 only is connected number, the connection place that just can make connecting line on first flexible base plate 8 because first and second flexible base plate 8,18 is connected electrically in together.
Secondly, with reference to figure 4, the structure of the coupling part of two flexible base plates 8,18 is described.
Second flexible base plate 18, in order to be connected with first flexible base plate 8, by bending, a part and face (from the face) 18b of an opposite side with interarea 8a are in opposite directions and overlapping at second folded part 82.In the zone that is folded promptly second join domain 19 form and be arranged with a plurality of solder ball (projected electrode) 14,14 ...Solder ball (projected electrode) 14,14 ... be electrically connected by the metal line (not shown) on the interarea 18a and second solid-state image pickup 3, the electronic unit 5a that is installed in second flexible base plate 18.
First join domain 13 of first flexible base plate 8 from overlap be formed with this solder ball 14,14 ... the interarea 18a of second join domain 19, solder ball 14,14 ... top some inserted through hole 23,23 ... in.In other words, solder ball 14,14 ... with through hole 23,23 ... mutual plane is arranged, is man-to-man relation.At this moment, ring electrode 22,22 ... be present in and with solder ball 14,14 ... the face of the opposite side of face in opposite directions.By carrying out the scolding tin Reflow Soldering, solder ball 14,14 ... the fusion and be full of through hole 23,23 ..., further with on every side ring electrode 22,22 ... engage and be electrically connected.Because by the scolding tin Reflow Soldering two flexible base plates 8,18 have been connected with each other like this, connect so become firmly and reliably.And, can be at an easy rate with solder ball 14,14 ... the fusion and be full of through hole 23,23 ... aligned in position; Because connecting operation is common scolding tin Reflow Soldering, so get up to be easy to.
The manufacture method of-device for solid photography-
The manufacturing process of the device for solid photography 1 of this embodiment is such, first from preparing first flexible base plate 8 shown in Figure 3 and second flexible base plate 18 shown in Fig. 4 (c).These flexible base plates 8,18 form metal line and make by the film carrier tape manufactured using that posts Copper Foil at single face being carried out etching, further second join domain 19 of second flexible base plate 18 form in addition solder ball 14,14 ...
Secondly, a plurality of electronic unit 5a are installed on first flexible base plate 8, also a plurality of electronic unit 5a are installed on second flexible base plate 18.
Afterwards, the 15c of splicing ear portion is welded on the element terminal 9 first flexible base plate 8 and first solid-state image pickup 2 are coupled together., utilize syringe etc. around 15c of splicing ear portion and bend 15a, to form and strengthen resin 15b 8 bendings of first flexible base plate at bend 15a.Remark additionally, transparency protected parts 17,17 are fitted on the sensitive surface of solid- state image pickup 2,3 in advance.
The 16c of splicing ear portion is welded on the element terminal 9 second flexible base plate 18 and second solid-state image pickup 3 are coupled together., utilize syringe etc. around 16c of splicing ear portion and bend 16a, to form and strengthen resin 15b 18 bendings of second flexible base plate at bend 16a.
Afterwards, after first folding part 81 folds first flexible base plate 8, substrate back is fit together mutually; After second folding part 82 folds second flexible base plate 18, substrate back is fit together mutually.
Secondly, make first and second solid- state image pickup 2,3 adjacent, the state that adjacent back is reached is that mutual sensitive surface quadrature and side end face is in contact with one another, and fixes with fixed part again.
Afterwards, at the first bending part 10a, the second bending part 10b, two places with 8 bendings of first flexible base plate, allow first join domain 13 and second join domain 19 in opposite directions, with solder ball 14,14 ... the fusion and be full of through hole 23,23 ... aligned in position, make two join domains 13,19 pushing the other side mutually, and its scolding tin is refluxed again, flexible base plate 8,18 is connected with each other.
Afterwards, speculum 6 is arranged into the place ahead of the sensitive surface of first solid-state image pickup 2, external connection line 11 is connected on the external connecting 12 of first flexible base plate 8.
So, just made device for solid photography 1.
-camera unit-
Fig. 5 is with analysing and observe the cylindrical case 21a of demonstration, the concept map of glass cover 21b, the structure of resulting camera unit (Optical devices unit) 100 after it shows in the cylindrical case 21a that described device for solid photography 1 insertion is square.
In the device for solid photography 1 of this embodiment, comprise that the width of the back side one side that is extended to second solid-state image pickup 3 by dogleg section of flexible base plate 8,18 roughly equates with the width at the back side of second solid-state image pickup 3.Therefore, if see second solid-state image pickup 3 from sensitive surface one side, the electronic unit 5a that is then installed is hidden in the behind of second solid-state image pickup 3, and device for solid photography 1 is very little, and the volume of camera unit 100 integral body also diminishes simultaneously.The area of glass cover 21b is bigger a little than the sensitive surface of second solid-state image pickup 3.Therefore, when device for solid photography 1 is inserted cylindrical case 21a, can set the gap between cylindrical case 21a and the device for solid photography 1 very little, device for solid photography 1 just can not dangle in camera unit 100 inside.The result is to realize small-sized and high-precision camera.
In this embodiment, because with two solid-state image pickups, 2,3 adjacent layouts, make the optical axis of first solid-state image pickup 2 parallel with the optical axis of second solid-state image pickup 3 by speculum 6, simultaneously by flexible base plate 8 bendings are coupled together two flexible base plates 8,18 that are connected solid- state image pickup 2,3, so can come shared signal input, power supply input by two solid- state image pickups 2,3 and drive circuit thereof, thereby the components number of wiring etc. is reduced from the outside.Therefore, can make device for solid photography 1 miniaturization, thereby suppress manufacturing cost.And, only with the substrate bending, allow the face of join domain be in contact with one another and carry out the scolding tin Reflow Soldering again, can realize the connection of two flexible base plates 8,18.Optical axis adjustment to solid- state image pickup 2,3 does not have any influence, so manufacturing time is shortened, reduces cost.Besides, because two flexible base plates 8,18 have pliability, can be crooked under the effect of power, so flexible base plate 8,18 is inserted in the cylindrical case 21a than being easier to.
(second embodiment)
The device for solid photography of second embodiment, be with the difference of the device for solid photography 1 of first embodiment: the structure of the coupling part of two flexible base plates is different.Because solid-state image pickup is identical with first embodiment with the syndeton of flexible base plate, the mounting structure of electronic unit 5a etc., so followingly only the part different with first embodiment described.
Fig. 6 (a) is the schematic isometric of the device for solid photography 101 of this embodiment, and the interarea 108a of first join domain 113 of first flexible base plate 108 is towards second join domain 119 of second flexible base plate 118.In other words, the interarea 108a of first join domain 113 of this embodiment towards direction opposite with direction among first embodiment.
Fig. 6 (b) is the expanded view of first flexible base plate 108 of this embodiment.This embodiment is different with first embodiment, substrate from the part linear strip of solid-state image pickup 2 15c of connection terminals portion extend to first join domain 113, crooked back and the zone 104 that forms then first bending part 181 are present in the both sides in the zone that electronic unit 5a is installed.Carried out for interarea 108a, becoming the same bending in mountain valley towards the substrate portion that first join domain 113 extends in these two places of the first bending part 110a, the second bending part 110b, on the interarea 108a of first join domain 113, be provided with a plurality of solder ball 114,114 ...These solder ball 114,114 ... utilize the metal line (not shown) to be connected on electronic unit 5a, the external connecting 12 etc.
On the other hand, shown in Fig. 7 (a), Fig. 7 (b) and Fig. 7 (c), in order to be connected with first flexible base plate 108, by bending, face (from the face) 118b of the opposite side of the part of second flexible base plate 118 transference interarea 118a is also overlapping in opposite directions in second folding part 182 for second flexible base plate 118.In the fold domain promptly second join domain 119 be formed with a plurality of through holes 123,123 ..., interarea 118a through hole 123,123 ... peripheral edge portion be formed with ring electrode 122,122 ..., these all are the places different with first embodiment.
In other words, among this embodiment, the zone and first embodiment that are formed with solder ball, through hole, ring electrode are contraries.Therefore, it is identical with first embodiment to connect operation, and effect is also identical.
(the 3rd embodiment)
Device for solid photography among the 3rd embodiment, be with the difference of device for solid photography 1 among first embodiment, the position of two solid-state image pickups is different and be to have replaced speculum with prism, so, below the place different with first embodiment described.
As Fig. 8 (a), Fig. 8 (b); the device for solid photography 201 of this embodiment is such; a gluing of first prism 29 by gluing on the transparency protected parts 17 of first solid-state image pickup 2, a gluing of second prism 28 by gluing on the transparency protected parts 17 of second solid-state image pickup 3.Transparency protected parts 17,17 and prism 29,28 are by transparent bonding agent 31,31 gluings together.A face of first prism 29 overlaps with a face of second prism 28 and is fixed.
It is trapezoidal column that two prisms 29,28 are section, and the face that constitutes trapezoidal hypotenuse overlaps.Two solid- state image pickups 2,3 are across two prisms, 29,28 adjacent layouts and be fixed.Two angles that sensitive surface was are greatly about 75 degree.Distance between two solid- state image pickups 2,3 is set shortlyer than the length on the longest limit of the sensitive surface of solid- state image pickup 2,3.
The incident light 30 that incides the device for solid photography 201 of this embodiment incides second solid-state image pickup 3 through the light that the light of two prisms 29,28 back, first wavelength incides first solid-state image pickup, 2, the second wavelength.In other words, by the angle of two prisms, the reflection characteristic of each face are set at the angle of defined, characteristic, incident light 30 just incides first prism 29, the light reflection of first wavelength on the face that two prisms 29,28 overlap, the light transmission of second wavelength.Here, first solid-state image pickup 2 is CCD of the light of optionally perception first wavelength, and second solid-state image pickup 3 is CCD of the light of optionally perception second wavelength.The light 30b optical axis separately that incides the light 30a of first solid-state image pickup 2 like this and incide second solid-state image pickup 3, originally be the same optical axis of incident light 30, the optical axis of incident light 30 has been changed direction by two prisms 29,28 and respectively towards different directions.
In this embodiment, because solid- state image pickup 2,3 is fixed by prism 29,28, so except the effect that can receive first embodiment, can also receive the effect that is easy to the optical axis alignment of two solid- state image pickups 2,3.
Remark additionally, the section shape of prism is not limited to trapezoidal, and triangle also is fine.And, if angulation just can make device for solid photography 201 miniaturizations between the sensitive surface below 110 degree more than 70 degree, be very desirable.
(the 4th embodiment)
The optical device module of the 4th embodiment is installed two light-emitting components again and is constituted in the device for solid photography 201 of the 3rd embodiment.Because it is all identical in addition, so following only to describing with the 3rd place that embodiment is different with the 3rd embodiment.
Shown in Fig. 9 (a), Fig. 9 (b), the optical device module 301 that this embodiment is related is that to install in the side of the prism of the device for solid photography 201 of the 3rd embodiment be the light-emitting diode 33 of light-emitting component and constituting.The optical axis of light-emitting diode 33 is conditioned parallelly with the optical axis of the incident light 30 that incides prism 29.Remark additionally, the side that the prism of light-emitting diode 33 is installed is the face with the plane of incidence approximate vertical of the light of prism 29, can not arrive the sensitive surface of solid- state image pickup 2,3 from the light of this face incident.
Utilize clamp 32 that light-emitting diode 33 is installed in prism side.Electric power is luminous for coming by power line 34 from the outside.Remark additionally, another light-emitting diode is installed in another side of prism 28,29, is hidden in the drawings and cannot see.
Because the optical device module of this embodiment is light source, camera can be made of one and very miniaturization, thus can be deep enough be buried disaster-stricken scene in rubble, building, engraving as light such as interior according to less than place, very narrow place inside is observed.
(the 5th embodiment)
The optical device module of the 5th embodiment is with combine back and obtaining of two solid-state image pickups and laser diode.Remark additionally, because a part of structure is the same with second embodiment, the 3rd embodiment, so omission is to the explanation of same section.
Shown in Figure 10 (a), Figure 10 (b), the optical device module 401 of this embodiment obtains after three prisms 28,29,39 are combined, across these prisms 28,29,39 with two solid- state image pickups 2,3 and laser diode 38 adjacent settings and fix.First solid-state image pickup 2 and first flexible base plate 108 described at the downside of figure are the same with second embodiment; Second solid-state image pickup 3 that the upside of figure is described and second flexible base plate 218 are except the part that flexible base plate is connected with each other, and be all the same with second embodiment.On first solid-state image pickup 2, second prism 28 is connected on second solid-state image pickup 3 first prism 29 by gluing, and these 2 the same with the 3rd embodiment.
In this embodiment, be connected electrically on the luminous laser diode of face 38 further being provided with the 3rd flexible base plate 27, the three flexible base plates 27 on second flexible base plate 218, be equipped with simultaneously in order to drive the electronic unit 5a of this laser diode 38.The 3rd flexible base plate 27 also is the single face circuit board that is made of film carrier tape manufactured using, is formed with the metal line (not shown) above in the drawings.A top side that is formed with this metal line is equipped with electronic unit 5a.Laser diode 38 is to utilize from the terminal (not shown) of laser diode 38 to carry out with the leading part (not shown) of giving prominence to from the end of the 3rd flexible base plate 27 with being electrically connected of the 3rd flexible base plate 27.Remark additionally, it is also harmless that the protection resin is set in this coupling part.
Three prisms 28,29,39 are respectively that section shape is trapezoidal column prism; be fitted with the prism 39 and second prism 28 that is fixed on second solid-state image pickup 3 by transparency protected parts 17 of the light-emitting area of laser diode 38, its face that constitutes trapezoidal hypotenuse overlaps.On the other hand, the face on the trapezoidal base of the formation of the face on the trapezoidal base of the formation of first prism 29 and prism 39 overlaps.Under such structure, the same with the 3rd embodiment, the incident light that incides first prism 29 is divided into two bundles and because refraction has changed the direction of optical axis, and the light 30a of first wavelength incides in first solid-state image pickup 2, the light 30c of second wavelength incides in second solid-state image pickup 3.On the other hand, the light 40a that penetrates from laser diode 38 goes out from optical device module 401 in the coincidence face reflection of second and third prism 28,39 and as penetrating light 40b.This optical axis that penetrates light 40b is parallel with the optical axis to the incident light 30 of first prism 29.
Secondly, the structure to the coupling part of three flexible base plates 108,218,27 describes.
Shown in Figure 11 (a) and Figure 11 (b), according to order from top to bottom, nethermost second flexible base plate 218 in three flexible base plates, middle the 3rd flexible base plate 27 and uppermost first flexible base plate 108 are overlapping and interconnect.The difference of second flexible base plate 18 among second flexible base plate 218 and first embodiment is, what be formed on second join domain 219 is not solder ball but projection (Cu-Ni-Au post) 35,35 ..., other place is all the same.And first flexible base plate 108 is identical with second embodiment.
On the 3rd join domain 227 that first, second join domain 113,219 of the 3rd flexible base plate 27 connects, be provided with a plurality of through holes 223,223 ..., interarea (above) through hole 223,223 ... the peripheral part be formed with ring electrode 222,222 ...Remark additionally, though omitted diagram, ring electrode 222,222 ... the metal line that utilization is formed on the interarea is connected with electronic unit 5a, laser diode 38 on being installed in the 3rd flexible base plate 27.
The first, the 3rd, second join domain 113,227,219 is superimposed, solder ball 114,114 ... with projection 35,35 ... enter a plurality of through holes 223,223 ... in.Afterwards, utilize welding to reflux again, solder ball 114,114 ..., ring electrode 222,222 ... and projection 35,35 ... be electrically connected.
At this moment, other conductive material can also be inserted in the through hole 223,223, with solder ball 114,114 ..., ring electrode 222,222 ... and projection 35,35 ... be electrically connected.
In this embodiment, the rayed that laser diode 38 is sent receives the light of returning at solid- state image pickup 2,3 to the object that is positioned at optical device module 401 the place aheads, so just can measure the distance from optical device module 401 to objects in front.And, can also use laser to make light source.
This embodiment also is the same with first embodiment, second embodiment, a plurality of optical elements and its peripheral circuit can be combined to do very for a short time, and, can be easy to and very reliably flexible base plate is connected with each other.Therefore, can make such compact optical apparatus module at an easy rate.
(the 6th embodiment)
The optical device module of the 6th embodiment, laser diode 38 backs of replacing with led chip in the optical device module 401 of the 5th embodiment obtain, because other place is all the same with the 5th embodiment in addition, so following to describing with the 5th part that embodiment is different.
Shown in Figure 12 (a), Figure 12 (b), the same with the optical device module 401 of the 5th embodiment, the optical device module 501 of this embodiment comprises two solid- state image pickups 2,3, is provided with led chip 41 in the place that is provided with laser diode 38 of the 5th embodiment and replaces laser diode as light-emitting component.In this embodiment, the same with the 5th embodiment, two photo detectors and a light-emitting component are done very for a short time, and led chip 41 is used as light source usefulness, can receive and the 5th the same effect of embodiment.
(the 7th embodiment)
Figure 13 is the phantom of the 7th camera unit that embodiment is related (optical device module) 600.This camera unit 600 inserts the 5th optical device module that embodiment is related 401 in the square cylindrical case 21a and obtains.In the drawings, show cylindrical case 21a, glass cover 21b with section.The camera unit 100 related with first embodiment is the same, when optical device module 401 is inserted cylindrical case 21a, can set the gap between cylindrical case 21a and the optical device module 401 very little, optical device module 401 just can not rock in camera unit 600 inside.
Because the cylindrical case 21a of the camera unit of this embodiment 600, glass cover 21b are the same with cylindrical case 21a, the glass cover 21b of first embodiment,, explanation do not carry so omitting.
The camera unit 600 of this embodiment, be when optical device module 401 is inserted cylindrical case 21a, add together granular thermal component 80,80 ... make.Space beyond the space in the occupied cylindrical case 21a of optical device module 401 almost completely by thermal component 80,80 ... occupy, the heat that produces from solid- state image pickup 2,3, laser diode 38 and electronic unit 5a conveys to cylindrical case 21a soon and heat is shed, and is unlikely to too high with the temperature that guarantees optical device module 401.Therefore, in this embodiment, the reliability of camera unit 600 improves.At least thermal component 80,80 ... the surface have electric insulating quality and prevent optical device module 401 short circuits.With the surface be insulated manufactured aluminium, copper alloy etc. do thermal component 80,80 ...Their pyroconductivity is more than 100 times of pyroconductivity of air under the normal temperature.And, thermal component 80,80 ... shape can be graininess, also can be the wash the dishes aggregate of the same metal of brush of metal.
(other embodiment)
To embodiment described herein is example of the present invention, and the present invention is not limited thereto.For example, except utilizing above-mentioned CCD to do to utilize electrostatic induction transistor npn npn imaging apparatus (SIT), electric charge modulation type imaging apparatus (CMD) etc. to make solid-state image pickup the solid-state image pickup.And, except solid-state image pickup, can also make optical element with laser, LED etc.In other words, a plurality of optical elements sets are used altogether also harmless.
With the characteristic of each embodiment combine use also harmless.For example, in the 3rd embodiment, can adopt among second embodiment with the interconnective syndeton of flexible base plate.
The position of external connecting 12 is not limited to reverse side one side of the electronic unit installation portion of first flexible base plate, external connecting 12 can be arranged on second and third flexible base plate, external connecting 12 can also be arranged between for example first bending part and second bending part of first flexible base plate.
Flexible base plate is not limited to the film carrier tape manufactured using of single face wiring, double-sided wiring, can also use single face or double-sided wiring flexible base plate beyond the film carrier tape manufactured using, 3 laminatings are incorporated into together and the flexible base plate that constitutes etc.
When the flexible base plate more than two or three is interconnected, the way that connects except adopting flexible base plate of only bending, can also adopt the flexible base plate more than two or three bending and the way that connects respectively.
In the 5th to the 7th embodiment, as long as the shape of selected three prisms and configuring condition thereof can satisfy following requirement, these requirements are: the light that incides optical device module impinges perpendicularly on the sensitive surface of each solid-state image pickup in fact, and is parallel with the optical axis of the light that incides optical device module (inciding the light of solid-state image pickup) from the light that optical device module penetrates.
In the 5th to the 7th embodiment, can replace laser diode 38, led chip 41 with the 3rd solid-state image pickup.In this case, preferably, three solid-state image pickups have the characteristic of a kind of color in the three primary colors of perceived light respectively.After doing like this, just can realize colored camera unit.And, except three solid-state image pickups, can also be installed to the 3rd, the 4th light-emitting diode that embodiment is such on the prism.
In sum, optical device module involved in the present invention can make a plurality of optical elements become the shape of miniaturization on the whole, so optical device module of using as small-sized camera unit etc. of great use.
Claims (17)
1. optical device module, it comprises: a plurality of optical elements, the flexible base plate that is connected with described optical element, the speculum or the prism of direction that is installed in the electronic unit on the described flexible base plate and changes the optical axis of at least one described optical element is characterized in that:
Described flexible base plate has a plurality of, and simultaneously each this flexible base plate connects with different described optical element respectively;
A plurality of described optical elements are adjacent each other;
The optical axis of at least one described optical element has been changed direction by described speculum or prism and has become parallel with other the optical axis of described optical element;
At least one flexible base plate in the described flexible base plate is electrically connected with other described flexible base plate by bending.
2. optical device module according to claim 1 is characterized in that:
Described a plurality of optical element comprises first solid-state image pickup and second solid-state image pickup;
Different described flexible base plates is connected with two described solid-state image pickups respectively;
First prism is fixed on the sensitive surface of described first solid-state image pickup;
Second prism is fixed on the sensitive surface of described second solid-state image pickup;
Described first and second prism is fixed with each other.
3. optical device module according to claim 2 is characterized in that:
Also comprise light-emitting component, the optical axis of this light when the outside of the light directive optical device module that sends from this light-emitting component, the optical axis of this light is parallel when inciding one of at least prism described first and second prism from the outside of optical device module with light that the optical axis that is parallel to described first and second solid-state image pickup is injected this first and second solid-state image pickup.
4. optical device module according to claim 2 is characterized in that:
Described a plurality of optical element also comprises the 3rd solid-state image pickup;
Another different described flexible base plate is connected with described the 3rd solid-state image pickup;
Prism is fixed on the sensitive surface of described the 3rd solid-state image pickup;
Described prism is fixed at least one prism in described first prism and second prism.
5. optical device module according to claim 4 is characterized in that:
Also comprise light-emitting component, the optical axis of this light when the outside of the light directive optical device module that sends from this light-emitting component, the optical axis of this light is parallel when inciding at least one prism described first, second and third prism from the outside of optical device module with light that the optical axis that is parallel to described first, second and third solid-state image pickup is injected this first, second and third solid-state image pickup.
6. optical device module according to claim 2 is characterized in that:
Between the sensitive surface of described solid-state image pickup and described prism, be provided with transparency protected parts.
7. optical device module according to claim 1 is characterized in that:
Be provided with the reinforcement resin in the coupling part of described optical element and described flexible base plate.
8. optical device module according to claim 1 is characterized in that:
Described flexible base plate is made of film carrier tape manufactured using, and film is removed in the coupling part of described optical element and described flexible base plate.
9. optical device module according to claim 1 is characterized in that:
Have the projected electrode that utilizes scolding tin to form at least one flexible base plate in a plurality of described flexible base plate that is electrically connected mutually, have the through hole of inserting this projected electrode on another flexible base plate.
10. optical device module according to claim 9 is characterized in that:
Described another flexible base plate is by bending and some is overlapping, and described through hole is formed on the overlapping region.
11. optical device module according to claim 9 is characterized in that:
Described another flexible base plate is bent and some is overlapping, and described projected electrode is formed on the overlapping region.
12. optical device module according to claim 9 is characterized in that:
Be arranged on but another described flexible base plate on electrode be electrically connected with described projected electrode.
13. optical device module according to claim 9 is characterized in that:
Described flexible base plate is the single face circuit board that only is formed with wiring on a face.
14. optical device module according to claim 13 is characterized in that:
At least one flexible base plate in the described flexible base plate is bent between the face that is not formed with described wiring and the face that some is overlapping;
The external connecting that is connected with the outside be formed on described flexible base plate by the zone of bending.
15. an Optical devices unit is characterized in that:
Comprise: described optical device module of claim 1 and the shell of taking in described optical device module.
16. Optical devices according to claim 15 unit is characterized in that:
In described shell, take in surperficial at least thermal component with electrical insulating property.
17. the manufacture method of an optical device module is characterized in that:
Comprise following each operation:
A plurality of electronic units are installed in operation on first flexible base plate;
First solid-state image pickup is connected to operation on described first flexible base plate;
A plurality of electronic units are installed to operation on second flexible base plate;
Second solid-state image pickup is connected to operation on described second flexible base plate;
Described first and second solid-state image pickup is the adjacent and operation of establishing;
With at least one the flexible base plate bending in described first and second flexible base plate with these two operations that flexible base plate is connected with each other; And
Change on the layout described first solid-state image pickup optical axis direction and make the direction of optical axis of described first solid-state image pickup speculum parallel or the operation of prism with the optical axis of described second solid-state image pickup.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006312543A JP4714665B2 (en) | 2006-11-20 | 2006-11-20 | Optical device module and manufacturing method thereof |
| JP2006-312543 | 2006-11-20 | ||
| JP2006312543 | 2006-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101188675A true CN101188675A (en) | 2008-05-28 |
| CN101188675B CN101188675B (en) | 2013-05-01 |
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| CN2007101672171A Expired - Fee Related CN101188675B (en) | 2006-11-20 | 2007-11-01 | Optical device module and method for fabricating the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7817204B2 (en) |
| JP (1) | JP4714665B2 (en) |
| CN (1) | CN101188675B (en) |
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|---|---|---|---|---|
| CN102809662A (en) * | 2011-05-31 | 2012-12-05 | 精工爱普生株式会社 | Module and electronic apparatus |
| CN103026699A (en) * | 2011-07-26 | 2013-04-03 | 松下电器产业株式会社 | Imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080117324A1 (en) | 2008-05-22 |
| US7817204B2 (en) | 2010-10-19 |
| CN101188675B (en) | 2013-05-01 |
| JP2008131228A (en) | 2008-06-05 |
| JP4714665B2 (en) | 2011-06-29 |
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