CN101188206A - Substrate carrying in/out apparatus, substrate carrying method and device thereof - Google Patents

Abstract

It is arranged that boards can be carried in and out of optional shelves in a board cassette. When it is desired to carry out a board (1G) stored in each shelf (1R) formed as a shelf plate by use of a plurality of wires (4) attached under tension to a cassette main body (1) constituting a board cassette (1C), this is achieved by moving board lifting arms (14) constituting a pair of board lifting units (1U1) onto a shelf (1R') immediately below the shelf (1R) having the board (1G) stored therein, actuating a pneumatic floating unit (21) attached to the upper surface of each board lifting arm (14), and spouting pressure air to extract the board (1G) in its floating state.

Description

Substrate carrying in/out apparatus, board carrying method and device thereof

The application be that November 04, application number in 2004 are 200480032167.0 the applying date, denomination of invention divides an application for the Chinese patent application of " substrate carrying in/out apparatus, board carrying method and device ".

Technical field

The present invention relates to be used to move into the device of taking out of the substrate of on the regulation frame of substrate box, taking in.

In addition, the present invention relates on substrate, forming in the semiconductor-fabricating device of semiconductor element through a plurality of operations successively, carry the method and the device of described substrate for the processing of carrying out each operation along the processing unit group of a plurality of processing unit formations that dispose by process sequence.

The application advocates priority 2004-033041 number to Japan's patent application 2003-382207 number of Japan's patent application application on November 12nd, 2003-376429 number 1 of application on November 6th, 2003 and Japan's patent application of application on February 10th, 2004, quotes the content of these applications at this.

Background technology

Take in the substrate box of employed substrates (glass substrate) such as liquid crystal indicator and have various substrates (for example with reference to patent documentation 1) being used for multistage.This base plan is seen as rectangular lamellar, and its size is 500mm * 600mm, follows the development of technology in recent years, and the substrate of 2000mm * 1800mm is also arranged.And, disclose various technology (for example with reference to patent documentation 2) as being used for that described substrate is moved into the technology of taking out of substrate box.

As shown in figure 11, at the inboard face of existing substrate box 1C ', the support unit 51 that is used for supporting substrates 1G both ends is outstanding with predetermined distance on short transverse, is formed for supporting the frame 1R of described substrate 1G with crossing over multistage.Each the substrate 1G that is incorporated in substrate box 1C ' has only support unit 51 supportings of their both ends by correspondence.In this case, deflection appears in the central portion of each substrate 1G, therefore move into have when taking out of with under substrate 1G disturb may.In addition, take out of each substrate 1G, must make the substrate of substrate ejector 1B (with reference to Fig. 5) draw arm 52 and also can enter in order to move into.For preventing these unfavorable conditions, must increase the height (frame, spacing 1H) of each frame 1R.Its result reduces the sheet number of taking in of the substrate 1G of a substrate box 1C '.

For preventing above-mentioned unfavorable condition, known have as shown in figure 12, along substrate box 1C " left and right directions draw close plating silk 53 and form the technology of each frame 1R thus.At this substrate box 1C " situation under, only carry out the band roller framework 54 of lifting and promote substrate 1G, and move in this state and take out of this substrate 1G by connecting its bottom surface sections.But, when taking out of substrate 1G, must begin to take out of successively the substrate 1G of epimere from the substrate 1G on the frame 1R that is accommodated in hypomere.In addition, when taking in substrate 1G, need begin to be received into successively in the frame 1R of hypomere from the frame 1R of epimere.Therefore, take out of the substrate 1G on the frame 1R that is accommodated in any section or substrate 1G to be received on the frame 1R of any section be difficult.

In addition, the semiconductor element that forms on such substrate is being under the situation of an operation group with continuous different a plurality of operations, consists of multilayer and is formed on the substrate via same or approximate a plurality of operations.

For example, in substrate W shown in Figure 26, after utilizing cleaning device A that substrate W surface is cleaned, utilize CVD device B to form oxide-film 151 on its surface.Then, utilize electro-optical device (Off オ ト device) C on described oxide-film 151, to apply emulsion 152, and expose and develop according to exposing patterns.Then, utilize Etaching device D that the part beyond the exposing patterns is melted, and then remove emulsion 152.Thus, form the ground floor semiconductor element on the surface of substrate W.Also some substrate W strides multilayer and forms semiconductor element on its surface, and in addition, the forming process of each layer also has and different situation shown in Figure 26.

Therefore, as shown in figure 27, in a plurality of operation groups of each layer that forms semiconductor element, to handle a plurality of processing unit A～D of same or approximate operation with state configuration arranged side by side, perhaps will dispose relatively with the device of state configuration arranged side by side, to be configured in a place to the processing unit group concentrated area that is called as " segmentation (ベ イ) " that each layer carries out same or approximate processing, a plurality of " segmentations " corresponding with the process number of each layer will be arranged on different place (for example with reference to patent documentation 3).

And the carrying of substrate is carried out under the state that multi-piece substrate is accommodated in the case, and in whole operations, same processing (batch processing) is carried out in the multi-piece substrate concentrated area that is accommodated in the case.The special-purpose carrier 153 that the mobile utilization of the substrate in batch between each segmentation (being meant the multi-piece substrate that is accommodated in the case) connects between each segmentation carries out.For the ground of multilayer on substrate forms semiconductor element, substrate in batch is that unit will be back and forth between each segmentation of the operation of front and back with every layer.In Figure 27, label 154 is the windrow devices that are used for interim placing box.

Like this, above-mentioned " segmented mode ", be carried out to batch processing for multi-piece substrate is concentrated in each operation, begin to become and quite grow (with reference to Figure 22) to the processing of the whole operations of end and the time that comprises whole stand-by period (the making time T 12 of goods) that becomes in the needed manufacturing line of finished product (goods) from substrate being dropped into manufacturing line.Its result, be stranded in the manufacturing line owing in manufacturing line, there are many semi-finished product (make midway unfinished work) to be in inventory status, therefore as mainly elongated to the delivery cycle (delivery date) that referable is finished during the product from counting delivery after ordering.Therefore, be unsuitable for the manufacturing of short goods at delivery date.In addition, owing to goods cause and can not calculate as goods in system time T 12 length, the quantity of the unfinished work that is detained as the stock in manufacturing line (at product inventory) is many, so consider turnover rate (rate of recovery) variation that makes capital invested from the operation aspect.And in recent years, because substrate becomes big and becomes expensive with this, therefore above-mentioned problem becomes more obvious.In addition, " goods are in the system time " reaches " at product inventory " and is known as " TAT (Turn Around Time) ", " WIP (Work-in-process) " respectively, and the former abbreviation " TAT " uses in the following description.

Patent documentation 1:(Japan) spy opens flat 8-198405 communique

Patent documentation 2:(Japan) spy opens flat 11-227943 communique

Patent documentation 3:(Japan) spy opens the 2002-26106 communique

Summary of the invention

The present invention proposes in view of above-mentioned unfavorable condition, and its problem is to move on the frame arbitrarily of substrate box takes out of substrate.

In addition, problem of the present invention is that in semiconductor-fabricating device, the goods that shorten substrate are at system time (TAT).

For solving described problem, the invention is characterized in, by constituting: substrate box as the lower part, its inside at box main body is formed with a plurality of of multistage supporting substrates, the particular side of described box main body forms moving into of substrate and takes out of opening, and described is made of a plurality of Zhi Chengcai that connect box main body with predetermined distance; And substrate elevating unit, it makes substrate elevating plate with substrate lifting device pass in and out respectively in the described substrate box from the side of described substrate box, and under described substrate elevating plate enters into state in the substrate box, with directly over substrate from described Zhi Chengcai, lift a little, wherein, described substrate box and described substrate elevating unit relatively carry out lifting.

In order to take out target base plate, after making substrate box and substrate elevating unit relatively carry out lifting, the substrate elevating plate that makes the substrate elevating unit enters in the substrate box respectively from the side of substrate box.Under this state, when making the substrate lifting device work of each substrate elevating unit, the substrate directly over making is lifted (rising) a little with respect to Zhi Chengcai.Under above-mentioned state, utilize suitable ejector that substrate is drawn to the outside from substrate box.

When substrate box is moved into substrate, as long as carry out and above-mentioned opposite operation.That is, when moving into substrate, carry out under the state of the substrate lifting device work that has on the substrate elevating plate in inserting substrate box.Owing on this substrate box, have the Zhi Chengcai that connects substrate accommodation container, so the deflection of substrate is little, and increase on the basis of taking in the sheet number reducing the mutual interval of substrate, owing to can make substrate box and the lifting relatively of substrate elevating unit, can be supported on taking out of of target base plate on the specific frame or moving into to the substrate of target frame, therefore, can carry out relatively the moving into, take out of of substrate of frame arbitrarily.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, makes each substrate elevating plate with described substrate lifting device from taking out of two adjacent opposite flanks of opening and pass in and out respectively in the described substrate box with described moving into.In the present invention, since have a pair of substrate elevating unit, the length of the substrate elevating plate of single armed shape can be shortened with lowering or hoisting gear, owing to can reduce its deflection, therefore can reduce the frame spacing of substrate box and increase the main frame number, thus increase substrate take in the sheet number.

In addition, the present invention is a prerequisite with described invention, it is characterized in that described substrate lifting device is by the substrate elevating plate that is formed with countless air ejiction openings and be used to make pressure air to constitute from the pressure air source of each air ejiction opening ejection, it makes substrate float with respect to Zhi Chengcai.In the present invention, take out of substrate owing to can move into respect to Zhi Chengcai non-contactly, so do not have the worry of wounded substrate.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, described substrate lifting device by the substrate elevating plate that is formed with countless air ejiction openings, be used to make pressure air to constitute from the pressure air source of each air ejiction opening ejection and the substrate floating servicing unit that the substrate elevating plate is floated a little, it utilizes pressure air and substrate floating servicing unit that substrate is floated with respect to Zhi Chengcai.In the present invention, substrate utilizes pressure air and substrate floating servicing unit both floats from Zhi Chengcai reliably.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, described substrate lifting device is the top a plurality of backing rolls that are installed on the substrate elevating plate, and the substrate elevating plate rises a little and described substrate is lifted from Zhi Chengcai.In the present invention, utilize the so simple mechanical structure of a plurality of backing rolls is installed on the substrate elevating plate, lift substrate with respect to Zhi Chengcai.

In addition, the invention is characterized in, by constituting: substrate box as the lower part, its inside at box main body is formed with a plurality of of multistage supporting substrates, the particular side of described box main body forms moving into of substrate and takes out of opening, and described is made of a plurality of Zhi Chengcai that connect box main body with predetermined distance; And substrate elevating unit, it makes substrate elevating plate with substrate lifting device pass in and out respectively in the described substrate box from the side of described substrate box, and under described substrate elevating plate enters into state in the substrate box, with directly over substrate from described Zhi Chengcai, lift a little, wherein, described substrate elevating unit, the a plurality of substrate elevating plates corresponding with the frame number of substrate box are supported on the lifter plate support unit, each substrate elevating plate have with directly over the substrate lifting device that lifts a little from the described Zhi Chengcai of substrate, the action of the substrate lifting device of each substrate elevating plate can be switched individually.

It is under the substrate elevating plate that makes the substrate elevating unit enters state in the substrate box that the moving into of the relative substrate box of substrate taken out of, and the substrate lifting device work corresponding with the target frame is carried out.Under situation of the present invention,,, make the structure of substrate elevating unit become simple so do not need to be used for the device of described lifting owing to needn't make the relative lifting of substrate box with the substrate elevating unit.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, described substrate lifting device is that the ejiction opening that sprays pressure air from each substrate lifting device can switch individually from the structure of countless air ejiction opening ejection pressure airs.It is under the substrate elevating plate that makes the substrate elevating unit enters state in the substrate box that the moving into of the relative substrate box of substrate taken out of, and only carries out from the substrate elevating plate ejection pressure air corresponding with the target frame.Therefore, by the substrate elevating plate of selection pressure air ejection, move on can any frame in a plurality of of substrate box and take out of the substrate of taking in.

In addition, the invention provides a kind of method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that, described substrate is after temporarily being placed on the first interim mounting table that is disposed between described each processing unit, utilize the substrate delivery/reception device that disposes accordingly with each processing unit to take out, and the processing unit carrying of operation backward of each sheet ground.

According to the present invention, realize and the roughly the same action effect of invention described later.

In addition, the invention provides a kind of method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that, the carrying path of described substrate has: in order to carry out the processing of each operation successively for described substrate, and via the first interim mounting table operation side regular carrying road of carrying successively backward that is disposed between described each processing unit; And for the substrate of handling is midway carried out attached processing, and the branch road of reciprocal carrying substrate is carried the road between the described first interim mounting table or the second interim mounting table different with the described first interim mounting table and attached processing unit.

According to the present invention, realize and the roughly the same action effect of invention described later.

In addition, the invention provides a kind of method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that, utilization is disposed at the substrate delivery/reception device between each processing unit and the conveyer, to give each processing unit by the substrate delivery/reception of each sheet ground carrying of described conveyer, and utilize described substrate delivery/reception device to give conveyer and the processing unit of operation carrying backward by the substrate delivery/reception that each processing unit is handled.

According to the present invention, realize and the roughly the same action effect of invention described later.

In addition, the invention provides a kind of device, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, carry the device of described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that having: be disposed at a plurality of first interim mounting table between each processing unit of taking on the front and back operation for the substrate in the temporary transient placement carrying; And after the substrate of the first interim mounting table taking-up of operation side is in the past handled with this processing unit, be used for a plurality of substrate delivery/reception devices to other first interim mounting table carrying substrate of the back operation side adjacent with the described first interim mounting table, wherein, will handle midway each sheet ground of substrate operation side carrying backward successively via the described first interim mounting table.

The processing unit of the past operation is the processing unit carrying substrate of operation backward, owing to be disposed at the temporary transient substrate of placing on the interim mounting table of first between each processing unit, and utilize the substrate delivery/reception device that substrate is carried operation backward successively via the described first interim mounting table, even so productive temp time (needed time of the processing of processed continuously each substrate in this processing unit of each processing unit, or processed continuously substrate relatively this processing unit making time at interval or at interval from the efflux time of this processing unit) how much have a deviation, each substrate delivery/reception device can be not and the action of the substrate delivery/reception device of the operation of front and back (not linking) synchronously yet, and carry out the handing-over (carrying) of substrate independently.

Though directly handing-over is handled midway and (is meant the processing that finishes the specific operation in whole operations between each substrate delivery/reception device of front and back, the state of the processing of remaining residue operation) substrate, there is the baroque problem that makes substrate damage or make the substrate delivery/reception device, but owing to the board carrying in will handling via the first interim mounting table arrives the back operation, so above-mentioned each problem is eliminated.

Owing to being flows through substrate along each the sheet ground of processing unit group by the process sequence configuration to carry out the mode that multiple operation is handled, so goods shortened in the system time.Therefore, because with after same processing is carried out in the multi-piece substrate concentrated area, " segmented mode " that ensuing operation is carried out in same concentrated area compared, described goods obviously shortened in the system time, and the quantity of the substrate that becomes in manufacturing line at goods (unfinished work) and be detained also significantly reduces, therefore, the delivery cycle (delivery date) shortens, and can tackle short delivery delivery date or immediate delivery phase.Its result, at the method for making semiconductor that above-mentioned board carrying method has feature, from the operation aspect, the recovery of investment (turnover) becomes soon, thereby has improved turnover of capital (rate of recovery).

In addition, the present invention is a prerequisite with described invention, it is characterized in that, the described first interim mounting table can be placed multi-piece substrate temporarily.In the present invention, when the processing unit situation about temporarily breaking down of back operation etc., can not make the processing substrate midway of the processing of the processing unit of operation before finishing be stranded in the processing unit or in the connection device, and can take out and the concentrated area be placed temporarily from these each devices.

The present invention is a prerequisite with described invention, it is characterized in that, the described first interim mounting table is the multistage container structure, moves in the mode of first-in first-out and takes out of.In the present invention, even on the first interim mounting table, multi-piece substrate is set temporarily, therefore also can move into and take out of, can prevent owing to compare the generation of the reduction etc. of the only specific substrate quality of item that long-time delay produces in manufacturing line with other substrate in the first-in first-out mode.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, has: the second interim mounting table, itself and the described first interim mounting table differently are configured on the desired position on regular carrying road of substrate, and are attached processing unit special use; And substrate branch road carrier, its substrate branch road that is used for taking out from the described second interim mounting table is transported to attached processing unit.

The processing substrate midway that carries out attached processing after utilizing the substrate delivery/reception device to be placed on the second interim mounting table temporarily, given substrate branch road carrier and be moved to attached processing unit by handing-over via the branch road path, after processing, utilize described substrate branch road carrier to be transported to be disposed at and to carry out the locational second interim mounting table that subsequent processing handles and placed temporarily.Then, attached substrate of handling and common substrate similarly are handled upside down by untreated each process sequence via regular carrying road.Because the productive temp time of each operation is set to constant, so when extracting and when finishing attached processing and turning back to regular carrying road by above-mentioned extraction, by the operation with extraction is benchmark, till the processing that finishes regulation sheet number, change the productive temp time (when extracting in the operation before and after it, the productive temp time of back operation is shortened, returning when original, productive temp time of preceding operation is shortened), make after this to become the original productive temp time and handle swimmingly.

Wherein, in failure and other reasons owing to the particular procedure device, and have under the situation of other substrate being disposed on locational first or second the arbitrary interim mounting table that extracts, behind the substrate that has extracted attached processing usefulness, by other substrate operation carrying (flows direction) backward that will be through with the substrate same treatment of described extraction, under constant state of the productive temp time of keeping back operation, carry out the processing of substrate.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, the carrying that temporarily is positioned over the substrate on the described second interim mounting table utilizes the carrying of the second interim mounting table self to carry out.Often the substrate of the second interim mounting table to move into mouthful and take out of the identical design of mouth more, yet, owing to the second interim mounting table is configured between regular carrying road and the branch road carrying road, so by the carrying second interim mounting table self, and will not move into mouthful (taking out of mouth) two places are not set.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, by the processing unit group that a plurality of processing unit constitute, is cut apart by two and configuration relatively along regular carrying road, is constituted branch road carrying road between two each processing unit group of cutting apart.Because the processing unit group both sides correspondence of branch road carrying Lu Yuqi both sides, so with regular carrying road is that the situation of straight line is compared, its length becomes half, makes to utilize substrate branch road carrier needed time of carrying substrate between the attached processing unit and the second interim mounting table to shorten.

In addition, the invention provides a kind of device, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, carry the device of described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that, have: conveyer, it is used for each sheet ground carrying substrate along the orientation configuration of each processing unit; And the substrate delivery/reception device, it is configured between described conveyer and each processing unit, is used for carrying out between the two the handing-over of substrate, wherein, will be utilized the processing unit carrying of operation backward of described conveyer by the substrate that described each processing unit is handled.

Owing to being flows each ground of substrate along the processing unit group by process configurations to carry out the mode that multiple operation is handled, so goods were shortened in the system time.Therefore, with after same processing is carried out in the multi-piece substrate concentrated area, similarly concentrate " segmented mode " that carry out next processing to compare, described goods obviously shortened in the system time (TAT), and, the quantity of the substrate that becomes in manufacturing line at goods (unfinished work) and be detained is also significantly reduced, therefore shortened the delivery cycle (delivery date), thereby can tackle short delivery delivery date or immediate delivery phase.Its result, the method for making semiconductor that on above-mentioned board carrying method, has feature, from the operation aspect, the recovery of investment (turnover) accelerates, thereby has improved turnover of capital (rate of recovery).

In addition, the present invention is a prerequisite with described invention, it is characterized in that, described substrate is carried under the state that is accommodated on the pallet.Though when substrate is carried under directly by the state of mounting on conveyer, have substrate with contact-making surface conveyer contaminated or damage may, in the present invention because substrate is housed inside on the pallet, so can not produce such worry.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, disposes the substrate storage device that is used for temporarily taking care of the substrate that processing that described processing unit carries out finishes in the positive downstream of the processing unit of conveyer.Even because the fault of processing unit of back operation or mainteinance repair etc. can not be with board carrying operations backward, also can temporarily take care of on the substrate storage device, thereby the substrate that the processing of operation finishes before making can be with constant state (for example remaining the state that is contained in the processing unit) delay always by the substrate that will handle midway (processing that refers to the operation of this upstream side finishes).

In addition, the present invention is a prerequisite with described invention, it is characterized in that, described conveyer is an annular conveyer, be used for each the processing unit assembly that forms semiconductor element on the substrate place annular conveyer around.In the present invention, conveyer is an annular conveyer, and each processing unit assembly places around it.Therefore, even, also can reduce the whole area that is provided with forming under the situation of semiconductor element and a plurality of processing unit of necessary configuration in order to stride multilayer on the substrate.

In addition, the present invention is a prerequisite with described invention, it is characterized in that, for the substrate of handling is midway carried out attached processing, manages the branch road Handling device that can carry described substrate between the device throughout and dispose.Therefore,, or break down and substitute when handling with other processing unit at arbitrary processing unit in the extraction inspection of handling substrate midway, can be with board carrying to described other processing unit, thus improved the treatment effeciency of substrate.

The invention is characterized in, by constituting: substrate box as the lower part, its inside at box main body is formed with a plurality of of multistage supporting substrates, and the particular side of described box main body becomes moving into of substrate and takes out of opening, and described is made of a plurality of Zhi Chengcai that connect box main body with predetermined distance; And substrate elevating unit, it makes substrate elevating plate with substrate lifting device pass in and out respectively in the described substrate box from the side of described substrate box, and under described substrate elevating plate enters into state in the substrate box, with directly over substrate from described Zhi Chengcai, lift a little, wherein, described substrate box and described substrate elevating unit relatively carry out lifting.Therefore, can take out of the substrate on any frame that is accommodated in substrate box with not damaging, and substrate can be moved in any frame of substrate box.

In addition, the invention provides a kind of method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that, described substrate is after temporarily being placed on the first interim mounting table that is disposed between described each processing unit, utilize the substrate delivery/reception device that disposes accordingly with each processing unit to take out, and the processing unit carrying of operation backward of each sheet ground.Therefore, though therefore the productive temp time of each processing unit how much have deviation, each substrate delivery/reception device can be not and the action of the substrate delivery/reception device of the operation of front and back (not linking) synchronously yet, and carry out the handing-over (carrying) of substrate independently.In addition, owing to being flows through substrate along each the sheet ground of processing unit group by the process sequence configuration to carry out the mode that multiple operation is handled, so goods shortened in the system time, and, the quantity of the substrate that becomes in manufacturing line at goods (unfinished work) and be detained also significantly reduces, therefore, the delivery cycle (delivery date) shortens, and can tackle short delivery delivery date or immediate delivery phase.

In addition, the invention provides a kind of method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that, utilization is disposed at the substrate delivery/reception device between each processing unit and the conveyer, to give each processing unit by the substrate delivery/reception of each sheet ground carrying of described conveyer, and utilize described substrate delivery/reception device to give conveyer and the processing unit of operation carrying backward by the substrate delivery/reception that each processing unit is handled.Promptly, owing to being flows through substrate along each the sheet ground of processing unit group by the process sequence configuration to carry out the mode that multiple operation is handled, so goods shortened in the system time (TAT), and, the quantity of the substrate that becomes in manufacturing line at goods (unfinished work) and be detained also significantly reduces, therefore, the delivery cycle (delivery date) shortens, and can tackle short delivery delivery date or immediate delivery phase.

Description of drawings

Fig. 1 is the overall perspective view of the substrate carrying in/out apparatus 1A1 of first embodiment of the invention;

Fig. 2 is the stereogram of substrate box 1C;

Fig. 3 is the front elevation of the substrate carrying in/out apparatus 1A1 of first embodiment;

Fig. 4 is the plane graph that each substrate elevating arm 14 of a pair of substrate elevating unit 1U1 enters into the state in the substrate box 1C;

Fig. 5 is the plane graph of substrate ejector 1B;

Fig. 6 is the side cut away view of substrate ejector 1B;

Fig. 7 is the figure that expression makes the state that substrate 1G floats;

Fig. 8 is the state of substrate 1G is lifted in expression by each backing roll 33 figure;

Fig. 9 is the front elevation of the substrate carrying in/out apparatus 1A2 of second embodiment;

Figure 10 is the front elevation of the substrate carrying in/out apparatus 1A3 of the 3rd embodiment;

Figure 11 is the figure that expression is accommodated in the state of the substrate 1G deflection in the existing substrate box 1C ';

Figure 12 is that expression will be accommodated in existing substrate box 1C " in substrate 1G utilize the figure of the state that band roller frame 54 takes out of;

Figure 13 is the overall plan view of the semiconductor-fabricating device U of the 4th embodiment;

Figure 14 is the front elevation of the semiconductor-fabricating device U of the 4th embodiment;

Figure 15 is the plane graph of the flow direction of substrate W on the regular carrying road of first group of processing unit A～D of expression;

Figure 16 is the plane graph of the first cleaning device A11 and CVD device B1;

The front cross-sectional view of Figure 17 state that to be expression substrate W taken out of from main substrate case 101;

Figure 18 is the plane graph of the flow direction of substrate W on the branch road carrying road of first group of processing unit A～D of expression;

Figure 19 is accommodated in the state of the first cleaning device A11 is moved in carrying with the substrate W in the substrate box 104 Action Specification figure;

Figure 20 will be accommodated in the Action Specification figure of the state in the main substrate case 101 from the substrate W of first cleaning device A11 discharge;

Figure 21 moves into the Action Specification figure of the state of CVD device B1 with being accommodated in substrate W in the main substrate case 101;

Figure 22 is the mode time figure of the flow direction of the substrate W of expression will handle midway substrate W and utilize monolithic processing and batch processing normally to handle the time;

Figure 23 represents that monolithic of the present invention is relatively handled and the figure of the relation of the processing sheet number of the substrate W of the time of batch processing;

Figure 24 is the mode time figure of the flow direction of the substrate W of expression when extract handling midway substrate W;

Figure 25 is the mode time figure of the flow direction of the substrate W when being illustrated in specific processing unit and breaking down;

Figure 26 is illustrated in the figure that substrate W goes up the operation that forms semiconductor element;

Figure 27 is the overall plan view of the semiconductor-fabricating device U of existing segmented mode;

Figure 28 is the overall plan view of the semiconductor-fabricating device U1 of the 5th embodiment;

Figure 29 is the stereogram of pallet P;

Figure 30 takes out of the plane graph that position Ra disposes the state of pallet P at the substrate of relative cleaning device A;

Figure 31 is the amplification view of substrate delivery/reception device Ga;

Figure 32 is the side plan view of annular conveyer K;

Figure 33 is the front cross-sectional view of annular conveyer K;

Figure 34 is the mode time figure of the flow direction of the substrate W of expression will handle midway substrate W and utilize monolithic processing and batch processing normally to handle the time;

Figure 35 represents that monolithic of the present invention is relatively handled and the figure of the relation of the processing sheet number of the substrate W of the time of batch processing;

Figure 36 is the mode time figure of the flow direction of the substrate W when being illustrated in specific processing unit and breaking down;

Figure 37 is the overall plan view of the semiconductor-fabricating device U2 of the 6th embodiment.

Reference numeral

1A1～1A3 substrate carrying in/out apparatus;

The 1C substrate box;

1Fa, 1Fb side;

The 1G substrate;

1H frame spacing (predetermined distance);

1K moves into and takes out of opening;

1R ', 1R frame;

1U1～1U3 substrate elevating unit;

The 1V pressure air source;

1 box main body;

4 wires (Zhi Chengcai);

6 movable frames (lifter plate support unit);

34,35 substrate elevating arms (substrate elevating plate);

21 air float unit (substrate lifting device);

21a air ejiction opening;

33 backing rolls (substrate lifting device);

101 main substrate casees (the first interim mounting table);

102 check with substrate box (the second interim mounting table);

103 branch road carriers (substrate branch road carrier);

A cleaning device (processing unit);

BCVD device (processing unit);

C electro-optical device (processing unit);

D Etaching device (processing unit);

E testing fixture (processing unit);

Ea, Eb substrate delivery/reception device;

Ga, Gb substrate delivery/reception device;

The K annular conveyer;

The temporary transient storage appts of L;

L1 substrate delivery/reception row (regular carrying road);

The interim mounting table row of L2 substrate (regular carrying road);

L3 branch road carrying row (branch road carrying road);

Ma, Mb testing fixture (attached processing unit);

The P pallet;

The S substrate transfer apparatus;

The U semiconductor-fabricating device;

U1, U2 semiconductor-fabricating device;

V branch road Handling device;

The W substrate.

Embodiment

Below, enumerate most preferred embodiment of the present invention, further describe the present invention.

First embodiment.

At first, based on first～the 3rd embodiment substrate carrying in/out apparatus of the present invention is described.

Fig. 1 is the overall perspective view of the substrate carrying in/out apparatus 1A1 of first embodiment of the invention, Fig. 2 is the stereogram of substrate box 1C, Fig. 3 is the front elevation of the substrate carrying in/out apparatus 1A1 of first embodiment, Fig. 4 is the plane graph that each substrate elevating arm 14 of a pair of substrate elevating unit 1U1 enters the state in the substrate box 1C, Fig. 5 is the plane graph of substrate ejector 1B, and Fig. 6 is the side cut away view of substrate ejector 1B.

As Fig. 1 and shown in Figure 3, the substrate carrying in/out apparatus 1A1 of first embodiment is made of each substrate elevating unit 1U1 of a pair of side 1Fa, the 1Fb configuration of particular side (move into and the take out of opening 1K) adjacency of the substrate 1G of substrate box 1C and relative and this substrate box 1C.On each substrate elevating unit 1U1, be equipped with and be used for the pressure air source 1V of supply pressure air respectively.And, as shown in Figure 4, take out of opening 1K with moving into of each substrate 1G of described substrate box 1C and relatively dispose substrate ejector 1B.

At first, substrate box 1C is described.As shown in Figure 2, the box main body 1 that constitutes the cuboid frame shape of this substrate box 1C is made of the composite material of resin or metal and resin.And, side 1Fa, the 1Fb about it and the back side with predetermined distance be equipped with a plurality of (in the situation of present embodiment about side 1Fa, 1Fb on respectively be equipped with four, be equipped with two overleaf) stringer board 2, and, with predetermined distance a plurality of (being three in the situation of present embodiment) transverse slat 3 is installed below thereon.In addition, the positive leading flank of box main body 1 is taken out of opening 1K in order to move into to take out of substrate 1G and formed to move into by opening.Substrate 1G utilizes substrate ejector 1B to take out of opening 1K and taken out of substrate box 1C by being moved into via described moving into.Substrate 1G is moved into the direction note of taking out of move into and take out of direction 1P, will remember and make left and right directions 1Q with the described horizontal direction (Width of substrate box 1C) of taking out of direction 1P quadrature of moving into.

As shown in Figure 2, each stringer board 2 that is installed on described substrate box 1C left and right side 1Fa, the 1Fb is installed relative to one another.And, as shown in Figure 3, on the position of the sustained height of a pair of stringer board 2, each corbel that is used for supporting substrates 1G is installed along the Width (left and right directions 1Q) of substrate box 1C.In the situation of the substrate box 1C of present embodiment, described Zhi Chengcai connects box main body 1 and is giving the wire 4 that draws extension under the state of tension force.Thus, at each wire 4 of short transverse each other, be that frame plate is taken in substrate 1G respectively, thereby be formed for the frame 1R of multistage supporting with this wire 4.

Secondly, unit 1U1 describes to a pair of substrate elevating.As shown in Figures 3 and 4, a pair of substrate elevating unit 1U1 is to clip substrate box 1C and the mode roughly symmetrically configuration relative with its each side 1Fa, 1Fb.Because the structure of each substrate elevating unit 1U1 is identical, so describe in the structure of the substrate elevating unit 1U1 in this left side of only front being seen.On the plane is seen as the base 5 of rectangular flat shape, can dispose movable frame 6 along left and right directions 1Q with advancing and retreat.That is, on base 5, be equipped with pair of guide rails 7 along left and right directions 1Q in the end of positive front side and depth side.And, in the bottom surface sections of described movable frame 6 four guide body 8 that are loaded on the described pair of guide rails 7 are installed.And, between the pair of guide rails 7 of base 5, be provided with ball-screw mounting groove 9 along left and right directions 1Q, in this ball-screw mounting groove 9, dispose ball-screw 11.This ball-screw 11 is twisted and is combined on the nut body (not shown) of the bottom surface sections that is installed on movable frame 6.In addition, the one end is connected with the motor 13 that moves horizontally on being installed on carriage 12.Make this motor reel when prescribed direction is rotated when making this move horizontally motor 13 work, described movable frame 6 is guided by pair of guide rails 7 and advances and retreat with ormal weight along left and right directions 1Q.

Described movable frame 6 is the flat boards with form wideer than the upper end than the rear side of the narrow slightly width of base 5 and its bottom, installs to erect state with respect to base 5.Front face (part relative with side 1Fa, the 1Fb of substrate box 1C) in this movable frame 6 can dispose the side up and down and see roughly L shaped substrate elevating arm 14.That is, the front face in movable frame 6 is equipped with pair of guide rails 15 at the both ends of its depth direction (move into and take out of direction 1P) along short transverse in the same manner with described base 5.And, four guide body 16 that are loaded on the described pair of guide rails 15 are installed in the back side of described substrate elevating arm 14 one.In addition, between the pair of guide rails 15 of movable frame 6, dispose ball-screw 17 along short transverse.This ball-screw 17 is twisted and is combined on the nut body of being located on the movable frame 6 (not shown).In addition, the one end is connected with the elevating motor 19 that is provided with on the motor mounting plate 18 that is installed on movable frame 6 upper ends.Make this motor reel when prescribed direction is rotated when making these elevating motor 19 work, described substrate elevating arm 14 is guided by pair of guide rails 15, carries out lifting along short transverse with ormal weight.

Described substrate elevating arm 14 planes are seen and are separated into trident, so that avoid to enter into inside, on the part relative, be respectively equipped with the 14a of portion with described each stringer board 2 with the interference of each stringer board 2 that constitutes this substrate box 1C from each side 1Fa, 1Fb of substrate box 1C.And, air is installed on substrate elevating arm 14 floats unit 21.Certainly, to float the aggregate thickness of unit 21 littler than the frame spacing 1H of substrate box 1C for substrate elevating arm 14 and air.This air floats unit 21 and has following function, that is, make the pressure air supplied with from pressure air source 1V from a plurality of air ejiction opening 21a ejections of provided thereon, thereby the substrate 1G directly over being disposed at is floated from each wire 4.

Above-mentioned result is, the chord position that substrate elevating arm 14 is configured to regulation by making elevating motor 19 work put (with take in the frame 1R that moves into the substrate 1G that takes out of under the corresponding position of frame 1R '), and under this state, make to move horizontally motor 13 work and make movable frame 6 move (advancing), described substrate elevating arm 14 is entered on the frame 1R ' under described along left and right directions 1Q.In Fig. 2, represent to enter into each substrate elevating arm 14 of the state on the frame 1R ' under the substrate box 1C by double dot dash line.

Secondly, 1B describes to the substrate ejector.This substrate ejector 1B is with respect to substrate box 1C lifting relatively, and it has takes out of substrate 1G that is incorporated in this substrate box 1C and the function of this substrate 1G being moved into substrate box 1C.As Fig. 5 and shown in Figure 6, on the substrate-placing platform 22 that can be provided with relatively up and down, a plurality of guide reels 23 are installed along left and right directions 1Q with respect to substrate box 1C.These guide reels 23 are used to support moves into the substrate 1G that takes out of.And, on described substrate-placing platform 22, take out of direction 1P in the substantial middle portion of left and right directions 1Q along moving into of substrate 1G and be equipped with guide rail 24.The plane is installed on the guide body 25 that is loaded on this guide rail 24 sees that roughly the substrate of T shape is drawn arm 26.In addition, the substantial middle portion at the left and right directions 1Q of described substrate-placing platform 22 takes out of direction 1P along moving into of substrate 1G and is provided with ball-screw mounting groove 27, disposes ball-screw 28 in this ball-screw mounting groove 27.This ball-screw 28 is twisted to be combined in and is installed on substrate and draws on the nut body 29 of arm 26 rearward end.In addition, its end is connected with the motor 32 of drawing on being installed on carriage 31.Make this motor reel when prescribed direction is rotated when making this draw motor 32 work, described substrate is drawn arm 26 and is guided by guide rail 24, takes out of direction 1P along moving into of substrate 1G and advances and retreat with ormal weight.In addition, on drawing the leading section of arm 26, described substrate is provided with each the suction tray 26a that is used for below the vacuum suction substrate 1G end.These suction trays 26a is connected with vacuum absorption device (not shown).

About the effect of substrate carrying in/out apparatus 1A1 of the present invention, the situation of taking out of the specific substrate 1G on the frame 1R that is incorporated in substrate box 1C is described.As shown in Figure 3, when elevating motor 19 action that makes each substrate elevating unit 1U1, utilize the effect of ball-screw 17 that each substrate elevating arm 14 is guided by pair of guide rails 15 and carry out lifting.Thus, make described substrate elevating arm 14 be configured in and be accommodated on the roughly the same height of frame 1R ' under the particular substrate 1G on the frame 1R of substrate box 1C.Under this state, as shown in Figure 4, when make each substrate elevating unit 1U1 move horizontally motor 13 work the time, utilize the effect of ball-screw 11 that each movable frame 6 is advanced along left and right directions 1Q.Thus, the substrate elevating arm 14 of each substrate elevating unit 1U1 directly enters on the frame 1R ' under the frame 1R of substrate box 1C.On described substrate elevating arm 14, be respectively equipped with the 14a of portion owing to producing on the part of disturbing, so this substrate elevating arm 14 can not produce interference with each stringer board 2 at each stringer board 2 with formation substrate box 1C.In addition, be accommodated in each the substrate 1G in the substrate box 1C owing to utilize 4 supportings of four wires, thus can deflection, thus can not contact with substrate elevating arm 14.

As shown in Figure 7, the pressure air of supplying with from the pressure air source 1V of each substrate elevating unit 1U1 a plurality of air ejiction opening 21a ejections of floating unit 21 from air.Thus, specific substrate 1G is floated a little from each wire 4.

Secondly, with reference to Fig. 5 and Fig. 6, the effect (effect of substrate ejector 1B) when taking out of the particular substrate 1G that floats describes.The substrate of substrate ejector 1B is drawn arm 26 and is configured on the height corresponding with frame 1R ' under the specific substrate 1G (with reference to Fig. 6) by making substrate box 1C and substrate-placing platform 22 lifting relatively in advance.Make drawing motor 32 work of substrate ejector 1B and make ball-screw 28, take out of direction 1P along moving into of substrate 1G and advance thereby make substrate draw arm 26 to the prescribed direction rotation.Thus, the leading section that substrate is drawn arm 26 is taken out of the part that opening 1K enters into the positive front side of frame 1R ' under the frame 1R that takes in particular substrate 1G via moving into of substrate box 1C, and be configured in this substrate 1G leading section under.Under this state, when making vacuum absorption device work, the following of substrate 1G leading section drawn on the vaccum-suction attachement pad 26a of arm 26 at substrate by vacuum suction.Make motor 32 work of drawing of substrate ejector 1B once more, when making its motor reel, make substrate draw arm 26 and retreat to opposite spin.Follow this, the specific substrate 1G that is incorporated on the frame 1R of substrate box 1C is drawn with the state (with wire 4 non-contacting states) that floats from wire 4, and is supported on each guide reel 23 that is installed on the substrate-placing platform 22.Therefore, needn't worry owing to 4 frictions of particular substrate 1G in the process of taking out of and wire make this substrate 1G damage or produce foreign matter.

When described substrate 1G is moved into substrate box 1C, performance and above-mentioned opposite effect.At this moment, also make the substrate elevating arm 14 of each substrate elevating unit 1U1 enter into the part of the frame 1R ' under the frame 1R that moves into substrate 1G in advance, and float a plurality of ejiction opening 21a ejection pressure airs of unit 21 from air.Therefore, the substrate 1G that is moved into substrate box 1C enters with float state, thereby can not produce friction with each wire 4.

The height and position of the substrate elevating arm 14 of each substrate elevating unit 1U1 can freely be set by making elevating motor 9 work.In addition, because substrate box 1C and substrate ejector 1B lifting relatively also can be set freely so the substrate of substrate ejector 1B is drawn the height and position of arm 26.This means, can take out of the substrate 1G on any frame 1R that is accommodated in substrate box 1C and substrate 1G can be moved on any frame 1R of substrate box 1C.In addition, in the substrate carrying in/out apparatus 1A1 of present embodiment, owing to be provided with a pair of substrate carrying in/out apparatus 1A1 with respect to a substrate box 1C, so each substrate elevating arm 14 is entered from two sides 1Fa, the 1Fb of described substrate box 1C.Thus, can shorten the length of each substrate elevating arm 14,, also can reduce their deflection under the single armed state even they are installed.Consequently, can reduce the frame spacing 1H of substrate box 1C, and can increase a substrate box 1C substrate 1G take in the sheet number.

The above embodiments are modes of utilizing pressure air that substrate 1G is floated.But, as shown in Figure 8, also can be that rotation is installed a plurality of backing rolls 33 freely and lifted the mode of substrate 1G by each backing roll 33 on substrate elevating arm 14.At this moment, behind the frame 1R ' under the substrate elevating arm 14 that makes each substrate carrying in/out apparatus 1A1 enters substrate box 1C, elevating motor 19 is moved a little and described substrate elevating arm 14 is risen a little.

The substrate elevating unit 1U1 that constitutes above-mentioned substrate carrying in/out apparatus 1A1 is a mode that substrate elevating arm 14 liftably is provided with respect to substrate box 1C.If but can make the relative lifting of substrate elevating arm 14 also passable with substrate box 1C.Therefore, for example also can be described substrate elevating arm 14 to be fixed along short transverse with respect to movable frame 6, and the mode that the mode of substrate box 1C liftably is set or both are provided with together up and down.

In the above-described embodiment, make the means of substrate 1G lifting only be pressure air.But owing to make the floatation volume of substrate 1G minimum (about 0.1mm) by pressure air, thus also can be provided for servicing unit (not shown) that substrate 1G is floated, and itself and pressure air are used simultaneously.Thus, described substrate 1G is floated.This substrate floating servicing unit for example supposes to have the device of air pressures such as electromagnetic forces such as utilizing solenoid or cylinder.

Second embodiment.

The substrate carrying in/out apparatus 1A1 of the first above-mentioned embodiment is the mode that disposes a pair of substrate elevating unit 1U1 with respect to a substrate box 1C, is to make substrate elevating arm 14 from the two sides 1Fa of this substrate box 1C, the mode that 1Fb enters respectively.But, as shown in Figure 9, also can be by a substrate box 1C and the substrate carrying in/out apparatus 1A2 that substrate elevating unit 1U2 constitutes.In the substrate carrying in/out apparatus 1A2 of this second embodiment, substrate elevating unit 1U2 has the advantage that constitutes by.In addition, substrate carrying in/out apparatus 1A2 shown in Figure 9 is a kind of mode that the substrate elevating arm 34 of substrate elevating unit 1U2 enters from the side 1Fa of the side of substrate box 1C.But, also can be the mode that described lifting arm 34 enters from the side 1Fb of the opposite side of substrate box 1C, the front of substrate box 1C (move into and take out of opening 1K) or the back side.

The 3rd embodiment.

In addition, the substrate elevating unit 1U3 shown in figure 0 also can be provided with on movable frame 6 and each corresponding substrate elevating arm 35 of quantity except the frame 1R of the frame 1R of the epimere of substrate box 1C regularly.In a pair of substrate elevating unit 1U3 of the substrate carrying in/out apparatus 1A3 that constitutes the 3rd embodiment, on each substrate elevating arm 35, each air is installed and floats unit 21, they are formed with air pipe arrangement road in the mode of working independently of one another.In addition, each substrate elevating arm 35 is installed on the movable frame 6 with the single armed state.And, utilize not shown switching device shifter to switch air pipe arrangement road, so that only float unit 21 ejection pressure airs from the air corresponding with specific substrate 1G.So, among each substrate 1G of multistage supporting, have only specific substrate 1G to float, this substrate 1G is taken out of by substrate ejector 1B.In addition, when moving into substrate 1G, only float corresponding 21 ejection pressure airs from the air corresponding with the frame 1R that moves into this substrate 1G.Under the situation of this embodiment, do not need to be used to make the lowering or hoisting gear of substrate elevating arm 35 or the relative lifting of substrate box 1C, therefore have its structure simple advantage that becomes.

In each above-mentioned embodiment, the Zhi Chengcai of supporting substrates 1G is each wire 4 that connects box main body 1 and install with the state of giving tension force.Thus, has the advantage that under the identical state of the width that makes each frame 1R, can reduce frame spacing 1H.And, also can be the Zhi Chengcai beyond the wire 4, for example thin bar.

The 4th embodiment.

Secondly, based on the 4th～the 6th embodiment board carrying method of the present invention and device thereof are described.

Figure 13 is the overall plan view of semiconductor-fabricating device U, Figure 14 is the front elevation of this device, Figure 15 is the plane graph of the flow direction of substrate W on the regular carrying road of first group of processing unit A～D of expression, Figure 16 is the plane graph of the first cleaning device A11 and CVD device B1, the front cross-sectional view of Figure 17 state that to be expression take out of substrate W from main substrate case 101, Figure 18 is the plane graph of the flow direction of substrate W on the branch road carrying road of first group of processing unit A～D of expression.

At first, the overall structure to semiconductor-fabricating device U describes.As shown in figure 13, this semiconductor-fabricating device U is used for striding the device that five layers of ground form semiconductor element on substrate W, formation ground floor forming process P1 considers the design efficiency of clean room and is divided into two groups of settings to each processing unit A～D of five operation groups of layer 5 forming process P5.That is, be divided into first and second two groups accordingly by each the processing unit A～D of process sequence configuration and the width of clean room, in addition, the processing unit A～D of each group is with the state configuration of relative mode with two column splits.In described ground floor forming process P1, by the treatment process order the first cleaning device A11, CVD device B1, the second cleaning device A12, electro-optical device C1, Etaching device D1 are configured in roughly a straight line along device orientation Q on.Equally, in second layer forming process P2, by the treatment process arranged in order first cleaning device A21, a CVD device B21, the 2nd CVD device B22, the second cleaning device A22, electro-optical device C2, Etaching device D2.In three-layer forming operation P3, the first cleaning device A31, CVD device B3, the second cleaning device A32, electro-optical device C3, Etaching device D3 are striden across first and second each configuration set by the treatment process order.In the 4th layer of forming process P4, by treatment process arranged in order cleaning device A4, CVD device B4, electro-optical device C4, Etaching device D4.In layer 5 forming process P5, by treatment process arranged in order cleaning device A5, CVD device B5, electro-optical device C5, Etaching device D5.Between each relative processing unit group, be provided with two substrate delivery/reception row L1, two the interim mounting table row of substrate L2, branch road carrying row L3 along device orientation Q.And, dispose each testing fixture Ma, Mb at the terminal part of each group as one of attached processing unit example.

That is, each substrate delivery/reception row L1 is set, disposes substrate delivery/reception device Ea, the Eb corresponding with each processing unit A～D near each relative processing unit A～D.Be provided with the interim mounting table row of each substrate L2 in the inboard of described substrate delivery/reception row L1, manage device A～D throughout and be respectively equipped with main substrate case 101 (the first interim mounting table) with stationary state each other.This main substrate case 101 is in order to handle that midway substrate W joins to the processing unit A～D of subsequent processing and the device that is used for temporarily taking in this substrate W.Therefore, but multistage take in multi-piece substrate W, and, can utilize the mode (aftermentioned) of first-in first-out to carry out arbitrarily moving into of substrate W and take out of.Wherein, so-called " handling midway " is meant processing and the remaining state that the processing of residue operation is arranged till the certain working procedure that finishes among whole operations.

In addition, at the interim mounting table row of described each substrate L2, with the corresponding part of particular procedure device A～D, in order to handle the extraction inspection of substrate W midway, and be provided with the inspection that is used to take in this substrate W with substrate box 102 (the second interim mounting table).This inspection utilizes the branch road carrier 103 of being located at branch road carrying row L2 to be transported to testing fixture Ma, the Mb last (aftermentioned) of first and second each group with substrate box 102.In addition, the carrying of substrate W that is provided with the substrate W that is used to take in operation carrying in the past and is transported to subsequent processing at the top portion of the interim mounting table row of described substrate L2 and terminal part is with substrate box 104.In addition, in Figure 13,, each is checked with substrate box 102 draw diagonal, in addition each carrying is drawn and described main substrate case 101 rightabout oblique lines with substrate box 104, they are distinguished by each main substrate case 101 is drawn oblique line.

And, between the interim mounting table L2 of two substrates of relatively configuration, be provided with branch road carrying row L3, and dispose the branch road carrier 103 that can walk freely along device orientation Q.By being loaded into each substrate delivery/reception device Ea, Eb of two above-mentioned substrate delivery/reception row L1; Be located at each substrate box 101,102,104 that each substrate is provided with platform row LW temporarily; And the branch road carrier 103 of being located at branch road carrying row L3 forms substrate transfer apparatus S.In addition, in Figure 13, Ma is the testing fixture of first group substrate W, and Mb is the testing fixture of second group substrate W.In addition, Mc is the testing fixture of the substrate W after final operation (layer 5 forming process P5) finishes.At this, express a plurality of inspections that are provided with accordingly with testing fixture Ma, Mb and carry the substrate W that manages device A～D operation extraction midway throughout, and the state of testing fixture Ma, Mb is given in handing-over with substrate box 102.

In addition, as Figure 13 and shown in Figure 14, each processing unit A～D of first group and each processing unit A～D of second group see that by the plane edge is connected with the track carrier 105 that the direction of the device orientation Q quadrature of each processing unit A～D is provided with.This track carrier 105 has the function of carrying with the handing-over of substrate box 104 between the top portion of the interim mounting table row of each substrate L2 and terminal part.Utilize first group of processing unit A～D to carry out under the state of substrate W in being incorporated in carrying substrate case 104 of predetermined processing handing-over and give track carrier 105.Then, be moved to second group of processing unit A～D place, and by the top portion of mounting to the interim mounting table row of substrate L2.

The semiconductor-fabricating device U of present embodiment is to make each sheet ground of substrate W flow through manufacturing line and to its mode of handling (monolithic processing) (relative therewith, existing segmented mode is the mode (batch processing) that multi-piece substrate W is focused on).That is, as shown in figure 15, a plate base W utilizes substrate transfer apparatus S to manage throughout between device A～D and carries.The substrate W that is handled by specific processing unit A～D is taken out of from this processing unit A～D by substrate delivery/reception device Ea, the Eb that disposes accordingly with this processing unit A～D, and is received in the main substrate case 101 temporary transient the setting.Temporarily be placed on the substrate W of described main substrate case 101, substrate delivery/reception device Ea, Eb that the processing unit A～D of utilization and subsequent processing disposes accordingly are transported to this processing unit A～D place.By carrying out this effect repeatedly, described substrate W is carried out predetermined process.Each arrow among Figure 15 is represented the flow direction (portable cord) of processing that a plate base W is carried out.In addition, in the present embodiment, the carrying path note of above-mentioned substrate W is done " regular carrying road ".

Regular carrying road among the above-mentioned substrate transfer apparatus S is described in detail.At this, because the effect (the handing-over effect of the substrate W between each processing unit A～D and the substrate delivery/reception device E) of the substrate transfer apparatus S between each the processing unit A～D among each layer forming process P1～P5 of first～the 5th is all roughly the same in operation arbitrarily, so in the present embodiment, the handing-over effect to the substrate W among the ground floor forming process P1 describes.As shown in figure 16, on the substrate delivery/reception row L1 of the substrate transfer apparatus S of present embodiment, dispose among two kinds of substrate delivery/reception device Ea, Eb any accordingly with each processing unit A～D.At this, use substrate delivery/reception device Ea, Eb arbitrarily with respect to each processing unit A～D, perhaps determine according to this processing unit A～D.That is, as cleaning device A and electro-optical device C, under common environment during treatment substrate W, use substrate delivery/reception device Ea, as CVD device B and Etaching device D, under vacuum environment during treatment substrate W, close owing to need that moving into of they taken out of opening in handling, so use substrate delivery/reception device Eb.Therefore, in ground floor forming process P1, substrate delivery/reception device Ea and first and second each cleaning device A11, A12 and electro-optical device C1 are provided with accordingly, and same, substrate delivery/reception device Eb and CVD device B1 and Etaching device D1 are provided with (with reference to Figure 15) accordingly.

As Figure 14 and shown in Figure 16, each substrate delivery/reception device Ea, Eb are layed in pair of guide rails 11 guiding on the floor, and can walk freely along device orientation Q.And their base 106a, 106b are rotatable in horizontal plane, and lifting freely.And, be used to adsorb and move into the vacuum absorption device 107 of taking out of substrate W and be used to support a plurality of backing rolls 108 of moving into the substrate W that takes out of constituting to be provided with on the base 106a of described substrate delivery/reception device Ea.Described vacuum absorption device 107 is for example advanced and retreat by making ball-screw drive rotation.In addition, on the base 106b that constitutes substrate delivery/reception device Eb, be provided with in couples and be used to lift and move into the supporting arm 109 of taking out of substrate W.

As Figure 15 and shown in Figure 16, the substrate delivery/reception device Ea that is provided with accordingly with the first cleaning device A11 has following function, take out of (drawing) and be accommodated in the substrate W that carries with in the substrate box 104, it is moved into the first cleaning device A11, and, the substrate W of the clean that is through with is taken out of from the first cleaning device A11, it is accommodated in the main substrate case of being located between the first cleaning device A11 and the CVD device B1 101.And, the substrate delivery/reception device Eb that disposes accordingly with CVD device B1 has following function, take out of the substrate W that is accommodated in the described main substrate case 101, it is moved into CVD device B, and, the substrate W that is through with in the processing of described CVD device B1 is taken out of from this CVD device B1, and it is received in the main substrate case of being located between the CVD device B1 and the second cleaning device A12 101.Therefore, each domain of walk Ra, Rb of substrate delivery/reception device Ea and substrate delivery/reception device Eb repeat in the part of main substrate case 101.

Like this, the substrate W that is accommodated in the main substrate case 101 is taken out of by substrate delivery/reception device Ea, Eb arbitrarily, and is moved in each processing unit A～D.In addition, the substrate W of the processing undertaken by each processing unit A～D of being through with is taken out of by substrate delivery/reception device Ea, Eb arbitrarily, and is received in the main substrate case 101 of back operation side.Below, by carrying out above-mentioned operation repeatedly, the processing that enforcement is undertaken by each processing unit A～D to substrate W.Therefore, be incorporated in the sheet number of the substrate W in the described main substrate case 101, (in other words, the situation that each processing unit A～D is successfully worked) is a slice under normal conditions.

Main substrate case 101 is described.As shown in figure 17, the main substrate case 101 of present embodiment is a cuboid frame shape, takes out of substrate W in order to move into, and its face relative with substrate delivery/reception device Ea, Eb is by opening.And (device orientation Q) is equipped with many wire 112 with the state of giving tension force along its Width.These wires 112 are installed with predetermined distance in short transverse, at each section substrate depositing rack 113 that to be formed with described wire 112 be frame plate.Thus, can in a main substrate case 101, take in multi-piece substrate W multistage.And this main substrate case 101 is first-in first-out mode (First-in First-out).That is, by making lifting arm 114 turnover main substrate casees 101 from its side, the substrate W that is accommodated on the substrate depositing rack 113 of any section can be broken away from a little from each wire 112.Therefore, can carry out arbitrarily moving into of substrate W takes out of.Its result, (fault of each processing unit A～D etc.) and in described main substrate case 101, taken in substrate W even for a certain reason more than or equal to two, also can take out the substrate W that FEFO is handled earlier, thereby can prevent because processing substrate W midway is placed the reduction of the quality of item that produces etc. for a long time.Like this, main substrate case 101 of the present invention not only has the function of the substrate W that handing-over temporarily is set temporarily, also has following function, manage throughout under the situation that device A～D breaks down, make the substrate W that is stranded in the operation of this upstream side break away from the flow process of manufacturing line, temporarily take in, promptly have the pooling feature of manufacturing line.

Relative therewith, check that be the example of formula according to the order of sequence with substrate box 102 and carrying with substrate box 104.As shown in figure 14, identical with above-mentioned main substrate case 101, be provided with substrate depositing rack 113 with utilizing each wire 112 multistage, and, under each substrate box 102,104, be provided with liftable band roller frame 115.Under moving into the situation that is accommodated in the substrate W in these substrate boxes 102,104, described band roller frame 115 is risen, and make the substrate W on the substrate depositing rack 113 that is accommodated in hypomere break away from wire 112.Under this state, the vacuum absorption device 107 of utilization formation substrate delivery/reception device Ea, Eb or supporting arm 109 are moved into and are taken out of described substrate W.In the situation of the substrate box 102,104 of this structure, the simple advantage that becomes of the structure with device (band roller frame 115) that substrate W is risen.In addition, this is checked with substrate box 102 and also can in this case, can carry out the arbitrary access of the inspection operation of substrate W for the substrate box of the mode (first-in first-out) identical with main substrate case 101.

Secondly, the branch road carrying road to substrate transfer apparatus S describes.In semiconductor-fabricating device U,, have from the operation of regulation and extract the situation of handling substrate W midway for carrying out the extraction inspection of substrate W.The substrate W that described branch road carrying road is used for extracting is transported to testing fixture Ma, the Mb place of each group.For example, in the ground floor forming process P1 of present embodiment, as shown in figure 18, the inspection that is respectively equipped with the substrate W that is used to take in extraction in the part of the interim mounting table row of the substrate L2 corresponding with electro-optical device C1 and Etaching device D1 of ground floor forming process P1 is with substrate box 102.This means that in the ground floor forming process P1 of present embodiment, the substrate W of the processing that the electro-optical device C1 that is through with is carried out or the substrate W of the processing that the Etaching device D1 that is through with carries out extract inspection.

As shown in figure 14, constituting on the branch road carrying row L3 on branch road carrying road, Q is equipped with pair of guide rails 116 along the device orientation, disposes branch road carrier 103 on this guide rail 116.This branch road carrier 103 can be walked freely by described guide rail 116 guiding.In addition, be provided with case connection device 117 on this branch road carrier 103, it has the inspection substrate box 102 that the substrate W of extraction is taken in acceptance, and gives the function of testing fixture Ma, Mb with its handing-over, and has the function of carrying out its adverse effect.

Each arrow of Figure 18 is represented the flow direction (portable cord) handled for the substrate W that extracts.As shown in figure 18, extract the substrate W of inspection by substrate delivery/reception device Ea, Eb are received into inspection with in the substrate box 102 arbitrarily.Take in the inspection of this substrate W and given branch road carrier 103 by handing-over with substrate box 102 former states ground.Then, utilize described branch road carrier 103 to be transported to the approximated position of the testing fixture Ma of the interim mounting table row of substrate L2, and by mounting on the described approximated position part of the interim mounting table row of substrate L2.This substrate W moves into testing fixture Ma by the substrate delivery/reception device Ea that disposes accordingly with testing fixture Ma.The substrate W of the inspection that the described testing fixture Ma that is through with carries out is received to and checks with in the substrate box 102, and subsequent processing position that utilizes branch road carrier 103 to be transported to once more to extract operation and mounting are to the interim mounting table row of substrate L2.

Secondly, the effect to substrate transfer apparatus S describes.Only the handing-over effect from the first cleaning device A11 to the substrate W CVD device B1 is described at this.As shown in figure 19, the substrate delivery/reception device Ea of corresponding first cleaning device A11 configuration is moved, with itself and carrying substrate box 104 relative configurations.Be accommodated in described carrying and taken out of also mounting to the base 106a of substrate delivery/reception device Ea from carrying with substrate box 104 by the vacuum absorption device of being located on the substrate delivery/reception device Ea 107 with the substrate W in the substrate box 104.Then, make described base 106a Rotate 180 ° in horizontal plane.Under this state, make substrate delivery/reception device Ea downstream side (back operation side) move, with the first cleaning device A11 move into opening 118 relative configurations.Substrate W is moved in this device A11 via the opening 118 of moving into of the first cleaning device A11 by being located at the effect of the vacuum absorption device 107 on the substrate delivery/reception device Ea, carries out clean, and takes out of opening 119 from this and take out of.

As shown in figure 20, when carrying out the clean of substrate W, substrate delivery/reception device Ea is along device orientation Q operation side shifting backward, with the first cleaning device A11 take out of opening 118 relative configurations.Utilize and above-mentioned effect much at one, the substrate W that takes out of from the first cleaning device A11 once more by handing-over to substrate delivery/reception device Ea, and former state be moved to the position relative with main substrate case 101.And described substrate W is incorporated in the main substrate case 101.Described substrate delivery/reception device Ea is moved to and carries with the relative position of substrate box 104, and repeats above-mentioned effect.

Then, as shown in figure 21, when being accommodated in substrate W in the main substrate case 101 and substrate delivery/reception device Ea is retreated, the substrate delivery/reception device Eb of corresponding CVD device B1 configuration is moved, with described main substrate case 101 relative configurations.Utilization is located at the effect of the supporting arm 109 on the substrate delivery/reception device Eb and is taken out of substrate W from main substrate case 101.This substrate W is moved operation side backward in mounting under the state on the described substrate delivery/reception device Eb, so in horizontal plane by with predetermined angular rotation, and with CVD device B1 move into opening 121 relative configurations.Then, moved in the CVD device B1.

The substrate W of the processing among the described CVD device B1 of being through with is received in the main substrate case 101 of subsequent processing by substrate delivery/reception device Eb.Afterwards, the second cleaning device A12, electro-optical device C1, Etaching device D1 carry out effect much at one.And, as shown in figure 15, in first group of processing unit A～D, the substrate W that takes out of from the CVD device B3 that is disposed at downstream part utilizes substrate delivery/reception device Eb to be received into carrying with in the substrate box 104, and, utilize described track carrier 105 to be transported to second group of processing unit A～D place utilizing the temporary transient mounting of branch road carrier behind the approximated position of the track carrier 105 of the interim mounting table row of substrate L2.And then, in second group of processing unit A～D, carry out effect much at one.

Next, the processing time of the substrate W on the above-mentioned regular carrying road of explanation of comparing with existing segmented mode.Figure 22 is the mode time figure of the flow direction of the substrate W of expression will handle midway substrate W and utilize monolithic processing and batch processing normally to handle the time.In addition, in Figure 22～Figure 24, owing to be the mode time figure that is used to understand the normal flow direction of substrate W, so less than not corresponding with the treatment process of described embodiment and reduced its operation quantity.Below, when expression one plate base W, additional " 1 "～" n " label.In addition, the processing time of each processing unit (productive temp time) is set at roughly the same.

In monolithic of the present invention is handled, (W1～Wn) is setting after the productive temp time (T1) drops into the processing unit of operation (I) and handle, and dropped into the processing unit of operation (II) and handles via main substrate case 101 (the first interim mounting table) for each substrate.And then the substrate W that takes out from the processing unit of operation (II) drops into the processing unit of operations (III) via other main substrate case 101 and handles.Like this, not for check to handle that midway substrate W extracts or the situation of the normal process that specific processing unit does not break down under, each substrate (W1～Wn) only temporarily be positioned in each main substrate case 101, and be not incorporated in the described main substrate case 101, and flow to lower procedure successively, in each operation, handle with the roughly the same setting productive temp time (T1).

Describe particularly above.Under situation of the present invention, as shown in figure 22, when the first plate base W is dropped into operation (I), utilize the processing unit of this operation (I) that substrate W1 is carried out predetermined process.When this processing finished, this substrate W1 dropped into the processing unit of operation (II) via main substrate case 101 (the first interim mounting table).Follow this, the second plate base W is dropped into the processing unit of operation (I).Like this, in the present invention, (monolithic processing) handled by input each operation (I), (II), (III) in each sheet ground of substrate W1～W3.Relative therewith, in existing segmented mode, handle owing to be that unit is concentrated with each operation, so the processing time of each operation is elongated with multi-piece substrate W.But in situation of the present invention, the TAT of each substrate W1～W3 (T2) compares with the TAT (T12) of the situation of segmented mode, and compole is short at that time.In addition, the productive temp time T 1 of each substrate W1～W3 of the present invention is also short than the productive temp time T 11 of segmented mode.

In addition, graphical presentation shown in Figure 23 monolithic of the present invention is relatively handled and the relation of the processing sheet number of the substrate W of time of batch processing.In the figure, the situation that solid line 122 expressions monolithic of the present invention is handled, the situation of the existing segmented mode of double dot dash line 123 expressions.This figure is from substrate W being dropped into behind the manufacturing line to the total processing time that is removed needed every plate base W1 as the product of finishing, and it is identical being assumed to be in monolithic processing and batch processing.In existing segmented mode, because for example 20 plate base W focus on, so, then can not obtain as the substrate W that finishes product if through this TAT (T12).But, in situation of the present invention, owing to be the mode that each sheet ground is handled, so if the TAT (T12) of process a slice then produces a plate base W.

Above-mentioned result is, the quantity that becomes the substrate W (at product inventory) that is detained at goods (unfinished work) in manufacturing line also reduces, as long as few running fund can reclaim at short notice with respect to investment, therefore, the managerial advantage that has the good grade of turnover of capital.In addition, owing to, the keeping space of the substrate W in the manufacturing line is reduced, therefore has the low advantage of construction cost of clean room by reducing at goods in the storehouse.Particularly in nearly a period of time, because increasing the unit price of every plate base W1, the size of substrate W also increases, thus make the shortening of above-mentioned TAT or in the product inventory minimizing, thus big benefit produced.In addition, the delivery cycle (delivery date) shortens, thereby can tackle short delivery delivery date or immediate delivery phase.

Secondly, describe extracting the situation of handling substrate W midway.Figure 24 is used to understand extract and the mode time figure of the flow direction of the substrate W when checking the substrate W that handles midway.The setting productive temp time of each operation (I), (II), (III) all is T1, begins to finish operation (I) to the 4th plate base W4 from input and is extracted afterwards, through behind the review time T3, substrate W (n-m-4) is added subsequent processing (II).Like this, when substrate W (n-4) is added operation (II), the input productive temp time (T1+ α) at interval of the operation (I) of multi-disc (in the illustrated example being two) substrate W (n-m-3) after the conduct and W (n-m-2) is bigger than described setting productive temp time T 1 relatively, substrate W (n-m-1) afterwards and W (n-m) drop into the processing unit of operation (I) with original productive temp time T 1, then, in whole operations, to set productive temp time T 1 treatment substrate W swimmingly.Like this, when the making time (productive temp time) the operation (I) of the plurality of substrates of substrate W4 after operation (II) adds that the extraction that is through with is checked is longer than the setting productive temp time, afterwards, in whole operations, handle with the common productive temp time.

On the other hand, when extracting substrate W4 after the processing of operation (I) that be through with, because the processing unit of the operation after taking on (II), (III) does not drop into substrate, (productive temp time) is common twice so the substrate of operation (II), (III) is discharged at interval, and production efficiency reduces.Therefore, in the present invention, near main substrate case 101 processing unit that is being disposed at operation (II) (the first interim mounting table) or inspection are gone up with substrate box 102 (the second interim mounting table) and are finished operation (I), and under the situation of temporarily taking in the substrate that does not flow to manufacturing line, (when temporarily take in aftermentioned), when this substrate W (n-m+1) is dropped into the processing unit of operation (II), even check and extract substrate W4 from regular carrying road in order to extract, can make the productive temp time of back operation become setting productive temp time T 1 afterwards, thereby production efficiency can not reduce yet.

Secondly, the situation that specific processing unit is broken down describes.Figure 25 is the mode time figure of the flow direction of the substrate W when being used to understand specific processing unit and temporarily breaking down.In operation (II), under the situation that the processing unit of operation (II) after the processing of the substrate W3 that is through with breaks down, also can be after breaking down, several pieces (four) substrate W4～W7 are carried out the processing of operation (I) to set productive temp T1, next, several pieces (three) substrate W8～W10 are owing to the processing unit of operation (II) stops to handle adjustment, therefore to handle than setting the 1 long productive temp time (T1+ β) of productive temp time T.These plate bases W4～W10, even because after follow-up substrate (for example substrate W5 of relative substrate W4) finishes the processing of operation (I), can not be dropped in the operation (II), therefore, moved into and be received into successively in the main substrate case 101 between operation (I) and the operation (II).

After the processing that finishes operation (II) from the 3rd substrate W3 is through dwell time T4, when opening the processing unit of operation (II) once more, the before substrate of moving into of multi-piece substrate W4～W10 that is incorporated in the main substrate case 101 begins to be taken out of successively, and drops into the processing unit of operation (II) to set productive temp time T 1.And, comprise finally to drop into the later substrate of next substrate W12 of the substrate W11 of operation (I) than setting the 1 big productive temp time (T1+ β) of productive temp time T, dropped into operation (I) to set productive temp time T 1 successively, thereby all handled continuously swimmingly in the operation.

In the substrate transfer apparatus S of present embodiment, branch road carrying row L3 is corresponding with each processing unit A of cutting apart configuration in its both sides～D group both sides.Therefore, the travel distance of branch road carrier 103 can be shortened, the handling time of the substrate W that branch road carrier 103 carries out can be shortened.

In the substrate transfer apparatus S of the above embodiments, main substrate case 101 is located at the interim mounting table row of substrate L2 place with stationary state.Therefore, in the present embodiment, differently be provided with main substrate case 101 and check, the substrate W that extracts is accommodated in described inspection with mutually in 102, and utilize branch road carrier 103 should check to be transported to testing fixture Ma, Mb place with substrate box 102 integral body with substrate box 102.Its result, described inspection is moved into mouthful or is taken out of mouthful just one and get final product with the substrate W's of substrate box 102, so has its advantage of simple structure.

In the substrate transfer apparatus S of present embodiment, if the substrate W that will extract for inspection is accommodated in to check with in the substrate box 102, but it is accommodated in the main substrate case 101, then be difficult to this substrate W is joined to branch road carrier 103.But, under the situation that for example described substrate box 101 rotatably is provided with in horizontal plane, also can the substrate W that check be joined to branch road carrier 103 from described substrate box 101.Thus, do not need to check with substrate box 102 to have the advantage of simple structure of substrate transfer apparatus S.

In addition, though present embodiment be the substrate W that extracts be incorporated in check with the state in the substrate box 102 under, be that unit joins mode to branch road carrier 103 with each this detection with substrate box 102.But, also can be it not to be accommodated in to check, and join mode to branch road carrier 103 with substrate W monomer with in the substrate box 102.Thus, has the advantage that does not need to check with substrate box 102.

The substrate transfer apparatus S of present embodiment is a mode of utilizing substrate delivery/reception device Ea, Eb arbitrarily to carry out the handing-over of substrate W via main substrate case 101 (the first interim mounting table).But substrate delivery/reception device Ea, Eb also can be the modes of substrate W of directly joining.In this case, the needed time of handing-over of substrate is significantly shortened, thereby can further shorten TAT.

In the present embodiment, as the attached processing that the substrate W that handles is midway carried out, the situation about checking that extracts has been described.But,, also can be the processing of extracting beyond checking as attached processing.

For example, press the situation of design formation etc. at pattern Processing, the also oriented repair apparatus that is used for the bodging part carries out the example of branch road carrying etc.

In first and second each two the interim mounting table row of substrate L2 that organize of present embodiment, use as the keeping space that is used to store the substrate box of taking in processing substrate W midway in the part space in addition that main substrate case 101 can be installed.Thus, when specific processing unit A～D breaks down or manufacturing line integral body safeguarded, can temporarily unload and take in more substrate W from manufacturing line.That is the effect that, has " pooling feature of the manufacturing line " increase that makes the interim mounting table row of substrate L2.

The 5th embodiment.

Secondly, the 5th embodiment is described.In addition, in the present embodiment, to the inscape additional identical symbol common with the inscape of above-mentioned the 4th embodiment.

Figure 28 is the overall plan view of the semiconductor-fabricating device U1 of first embodiment, Figure 29 is the stereogram of pallet P, Figure 30 takes out of the plane graph that position Ra disposes the state of pallet P at the substrate of relative cleaning device A, Figure 31 is the amplification view of substrate delivery/reception device Ga, Figure 32 is the side plan view of annular conveyer K, and Figure 33 is the front cross-sectional view of annular conveyer K.

At first, the overall structure to semiconductor-fabricating device U1 describes.As shown in figure 28, this semiconductor-fabricating device U1, by see on the plane bight be slow toroidal annular conveyer K around constitute by each processing unit (cleaning device A, CVD device B, electro-optical device C, Etaching device D, testing fixture E) of the treatment process arranged in order of substrate W and the substrate storage storehouse F that is used for the substrate W of keeping before and after handling.And, between annular conveyer K and each processing unit A～E and substrate storage storehouse F, dispose substrate delivery/reception device Ga, the Gb of the handing-over that is used for carrying out substrate W between the two.In addition, on the position corresponding, annular conveyer K inboard, dispose the temporary transient storage appts L of substrate W with each processing unit A～E.Utilize above-mentioned annular conveyer K and each substrate delivery/reception device Ga, Gb to constitute base plate transfer device S.

In the substrate transfer apparatus S of present embodiment, substrate W utilizes annular conveyer K to carry with the state that each sheet ground is incorporated on the pallet P.This pallet P utilizes the effect of annular conveyer K to carry (advancing), and stops in the position corresponding with each processing unit A～E.And, utilize substrate delivery/reception device Ga, the Gb of corresponding configuration that substrate W is taken out of from pallet P, and move into each processing unit A～E with them.The substrate W of the processing among each processing unit A～E of being through with is taken out of from each processing unit A～E by substrate delivery/reception device Ga, Gb once more, and is moved into the pallet P (not taking in the pallet P of substrate W) of the sky of waiting on annular conveyer K, and side carrying downstream.Below, will take out of the position note work " substrate is taken out of position Ra " of substrate W from pallet P, will move into the position note of substrate W to the pallet P of sky and do " substrate is moved into position Rb ".Manage throughout among device A～E, by in turn carrying out above-mentioned operation, described substrate W is carried out predetermined process, and it is accommodated in the F of substrate storage storehouse.Among Figure 28, represent that by arrow the processing of substrate W flows to (portable cord).

At first, pallet P is described.As shown in figure 29, the pallet P of present embodiment is made of the composite material of resin or resin and metal.The tray main body 201 that constitutes this pallet P is for only taking in the cuboid frame shape of a plate base W, for described substrate W is moved into take out of and one side (with substrate delivery/reception device Ga, face that Gb is relative) formed to move into by opening and take out of opening 201a.Both sides at described tray main body 201 reach each face up and down, around will being located at predetermined distance by three reinforcement plates that stringer board 202 and transverse slat 203 constitute.Equally, the substantial middle portion at each face up and down of tray main body 201 and the back side is provided with other reinforcement plate of and described each reinforcement plate quadrature that constitute by stringer board 204 and transverse slat 205.And, being located on each stringer board 202 equal height position each other of two sides, each support wire 206 is installed with the state of giving tension force.The substrate W that is moved into pallet P is by each support wire 206 supporting.In addition, the arrow among Figure 29 represents that moving into of substrate W take out of direction Q.

K describes to annular conveyer.As shown in figure 30, the annular conveyer K of present embodiment is a dynamical type roller conveyer.That is, respectively install between the frame 207,208 rotation a plurality of board carrying rollers 209 that are arranged in parallel with predetermined distance are installed freely inside and outside.The interval of respectively installing frame 207,208 inside and outside described is wideer slightly than the length of the depth direction (length direction) of pallet P, and each pallet P takes out of opening 201a with the state configuration relative with the device frame 208 of the outside (outer circumferential side) with moving into of they.One end of each board carrying roller 209 is outstanding from the device frame 207 of inboard (interior all sides), and sprocket wheel 211 is installed respectively.Volume hangs with chain 212 on each sprocket wheel 211.Therefore, when driving rotating sprocket 211, make whole sprocket wheels 211 drive rotation by chain 212 when making drive motor M work.Its result, each board carrying roller 209 rotates to same direction, the pallet P of carrying (advancing) mounting on them.In the device frame 208 in the described outside, take out of position Ra with substrate and substrate is moved into the corresponding part of position Rb, to take out of substrate W and be provided with each notch 208a, 208b by otch respectively in order to move into.

Secondly, H describes to substrate lifting device.In addition, substrate lifting device H that the following describes and pallet arresting stop J and each processing unit A～E are provided with accordingly, and, their structure is all identical, therefore, substrate lifting device H and the pallet arresting stop J that only substrate that is disposed at relative cleaning device A is taken out of position Ra here describes.This substrate lifting device H, as Figure 31～shown in Figure 33, taking out of when being accommodated in pallet P upper substrate W or when the pallet P of sky moves into substrate W, move into the state that lifts this substrate W from support wire 206 and to take out of, its substrate that is disposed at annular conveyer K take out of position Ra and substrate move into position Rb under.And four substrate elevating arms 213 that can enter each board carrying roller 209 gap are each other liftably installed.At each supporting substrates W above the substrate elevating arm 213, and the backing roll 214 that is used for moving into channeling conduct when taking out of this substrate W is installed.The fulcrum shaft that each backing roll 214 is taken out of the horizontal direction setting of direction Q (with reference to Figure 31) quadrature with edge and moving into of substrate W is that the center rotates freely.

Be disposed at substrate when taking out of Ra place, position at the pallet P that will take in substrate W, each substrate elevating arm 213 rises.Then, give prominence to, and enter in the pallet P, lift the substrate W that is supported on each support wire 206 from the bottom surface sections of tray main body 201 from each board carrying roller 209 gap each other.Thus, the substrate W that is accommodated on the pallet P breaks away from each support wire 206, and can utilize substrate delivery/reception device Ga, Gb to take out of.In addition, be disposed at substrate when moving on the Rb of position at empty pallet P, each substrate elevating arm 213 rises.Therefore, the substrate W that is moved into by substrate delivery/reception device Ga, Gb is supported on each backing roll 214 of substrate lifting device H, can not occur producing the possibility of disturbing with each support wire 206 of pallet P.And when moving into described substrate W integral body in the pallet P, each substrate elevating arm 213 descends.Thus, substrate W is supported on each support wire 206.

Secondly, J describes to the pallet arresting stop.As shown in figure 33, in the positive downstream of described substrate lifting device H, be provided with the pallet P that is used to make by annular conveyer K carrying and stop at the pallet arresting stop J that substrate is taken out of position Ra.This pallet arresting stop J is by making liftably the keep plate of installing 215 outstanding from board carrying roller 209 gap each other, and the structure that the carriage P of carrying is stopped.This pallet arresting stop J is by being installed on proximity switch (not shown) work of the assigned position that respectively installs frame 207,208 inside and outside the annular conveyer K.Thus, the pallet P substrate that is disposed at annular conveyer K under the state of location is taken out of position Ra.

Secondly, substrate delivery/reception device Ga, Gb are described.As shown in figure 28, manage throughout and dispose substrate delivery/reception device Ga, Gb between device A～E and the annular conveyer K respectively.This substrate delivery/reception device Ga, Gb, to be joined to each processing unit A～E by the substrate W in the pallet P of annular conveyer K carrying, the substrate W after will being handled by each processing unit A～E utilizes described substrate delivery/reception device Ga, Gb to join and carries the processing unit A～E of operation backward to annular conveyer K.In the semiconductor-fabricating device U1 of present embodiment, corresponding each processing unit A～E is provided with any among two kinds of substrate delivery/reception device Ga, Gb.At this, using arbitrarily with respect to each processing unit A～E, substrate delivery/reception device Ga, Gb determine according to the structure of this processing unit A～E.Promptly, as cleaning device A and electro-optical device C and testing fixture E, under common environment during treatment substrate W, use is provided with the substrate delivery/reception device Ga of vacuum absorption device 216a at the leading section of drawing arm 216, as CVD device B and Etaching device D, under vacuum environment during treatment substrate W, take out of opening and close owing to need in handling these are moved into, so use is provided with the substrate delivery/reception device Gb of a pair of handing-over arm 217 (with reference to Figure 28).

As Figure 30～shown in Figure 32, each substrate delivery/reception device Ga, Gb are layed in pair of guide rails 218 guiding on the floor, can walk freely along the carrying direction of pallet P.In addition, these bases 219 are rotatable in horizontal plane.Be used to adsorb and move into and take out of drawing arm 216 and being used to guide a plurality of guide reels 221 of moving into the substrate W that takes out of of substrate W constituting to be provided with on the base 219 of described substrate delivery/reception device Ga.For example, make described arm 216 advance and retreat of drawing by make ball-screw 223 drive rotation by drive motor 222.

Like this, be incorporated in pallet P and the substrate W that is handled upside down takes out of position Ra at substrate and utilizes arbitrarily that substrate delivery/reception device Ga, Gb take out of, and move into each processing unit A～E.In addition, the substrate W that has implemented the processing that each processing unit A～E carries out is taken out of by substrate delivery/reception device Ga, Gb arbitrarily, and moves into the pallet P that moves into the sky of position Rb place waiting at the substrate of annular conveyer K.Then, be transported to the substrate corresponding and take out of position Ra with the processing unit A～E of back operation.Carry out above-mentioned operation among device A～E repeatedly by managing throughout, the substrate W that device A～E carries out predetermined process is managed in carrying throughout.

Secondly, the temporary transient storage appts L to substrate W describes.As Figure 28 and shown in Figure 30, in the inboard of annular conveyer K, with except the corresponding position of each processing unit A～D of testing fixture E on be provided with the temporary transient storage appts L of substrate W.This temporary transient storage appts L is for example for the substrate W that handles midway, because the fault of the processing unit A～E of operation or Maintenance and Repair thereafter and described substrate W can not be carried downstream side the time, the pallet P of this substrate W is taken in temporary transient keeping.This temporary transient storage appts L takes in the tray rack portion 224 of multi-disc pallet P and accepts the pallet P on the annular conveyer K and be used for that pallet P is moved into the pallet carry-in/carry-away device 225 of taking out of described tray rack portion 224 and constitute by being used for multistage.Described pallet carry-in/carry-away device 225 is rotation freely in horizontal plane, with annular conveyer K in the face of configuration, can move into take out of pallet P and with tray rack portion 224 in the face of configuration and can move into and take out of pallet P.Therefore, the part of device frame 207 of inboard of moving into position Rb at the substrate of annular conveyer K is in order to carry out that moving into of pallet P taken out of and cut, thereby forms notch 207a.Among Figure 30, represent that with dashdotted arrow processing from the pallet P that takes out of to tray rack portion 224 that move into flows to (portable cord).In addition, in the semiconductor-fabricating device U1 of present embodiment since the W of the frame portion former state of the inspection that testing fixture E carries out that is through be incorporated in the F of substrate storage storehouse, therefore, the temporary transient storage appts L (with reference to Figure 28) of relative testing fixture E needn't be set.

Secondly, the effect to substrate transfer apparatus S describes.At this, where to manage device A～E all roughly the same because the effect (the handing-over effect of the substrate W between the pallet P on the annular conveyer K and each processing unit A～E) of the substrate transfer apparatus S of each processing unit A～E is in office, so in the present embodiment, only the handing-over effect to the substrate W of cleaning device A describes.As shown in figure 28, in the past the device of the operation substrate W that utilizes board carrying car (not shown) etc. to move into substrate storage storehouse F only takes out of a slice by substrate delivery/reception device Ga, and it is received in the pallet P of the sky of waiting on annular conveyer K.Among Figure 28, represent to take in the pallet P of substrate W, represent empty pallet P with double dot dash line with solid line.Under this state, make drive motor M work and drive each board carrying roller 209 of rotation, pallet P is carried side downstream.Utilize proximity switch (not shown) to act on and make pallet arresting stop J work and keep plate 205 is risen, thereby make its upper end outstanding from each board carrying roller 209 gap each other.Thus, pallet P is positioned and stops at substrate corresponding with cleaning device A among the annular conveyer K and takes out of position Ra.

As Figure 31～shown in Figure 33, when pallet P stopped at the substrate plate and goes out position Ra, substrate lifting device H work was risen each lifting arm 214.Thus, the substrate W that is accommodated in pallet P is picked up and breaks away from each support wire 206.The arm 216 of drawing that constitutes substrate delivery/reception device Ga is advanced, with its leading section be disposed at substrate W leading section under.Make vacuum absorption device 216a work and will draw arm 216 and substrate W absorption, and former state it is retreated.The substrate W that draws from pallet P is supported on each guide reel 211 that constitutes substrate delivery/reception device Ga, and is configured in above the base 219.Then, make 219 rotations of described base, with its with cleaning device A move into opening 226 relative configurations.And the described arm 216 of drawing is advanced, substrate W is moved into cleaning device A via moving into opening 226.

As shown in figure 30, utilizing cleaning device A that described substrate W is carried out in the process of clean, substrate delivery/reception device Ga is guided by pair of guide rails 218 and moves, with cleaning device A take out of opening 227 relative configurations.In addition, the keep plate 215 of pallet arresting stop J is descended, and make drive motor M work that described pallet P is carried side downstream, and make it stop at substrate to move into position Rb.

Be through with cleaning device A processing substrate W via cleaning device A take out of opening 227 handing-over to substrate delivery/reception device Ga, and move at the substrate of annular conveyer K and move into the empty pallet P that position Rb waits for.The effect of substrate delivery/reception device Ga of this moment is an operation opposite when taking out of the substrate W that is accommodated in pallet P.Afterwards, in CVD device B, electro-optical device C, Etaching device D, testing fixture E, carry out same effect carrying substrate, thereby a plate base W is carried out predetermined process (monolithic processing) successively and it is accommodated in the F of substrate storage storehouse.

Secondly, the situation of the batch processing of carrying out with existing segmented mode is compared, and the processing time of the substrate W of above-mentioned substrate transfer apparatus S is described.Figure 34 is the mode time figure of the flow direction of the substrate W of expression will handle midway substrate W and utilize monolithic processing and batch processing normally to handle the time.In addition, therefore not corresponding because Figure 34 and Figure 36 are the time diagram that is used to understand the normal flow direction of substrate W with the treatment process of described embodiment, and reduced its operation quantity.Below, when expression one plate base W, additional label " 1 "～" n ".In addition, the processing time of each processing unit (productive temp time) is set at roughly the same.

In monolithic of the present invention is handled, each substrate (W1～Wn) with the processing unit of setting productive temp time T 1 and being dropped into operation (I) in and handle after, dropped in the processing unit of operation (II) and handled.In addition, the substrate W that takes out from the processing unit of operation (II) is dropped in the processing unit of operation (III) and is handled.Like this, (in other words, manage throughout under the situation about not breaking down in the device) under the situation of substrate W proper flow, (W1～Wn) flow to lower procedure successively in each operation, handles with the roughly the same setting productive temp time each substrate.

Specify above situation.Under situation of the present invention, as shown in figure 34, when the first plate base W1 is dropped into operation (I), utilize the processing unit of this operation (I) that substrate W1 is carried out predetermined process.When this processing finished, this substrate W1 was carried by annular conveyer K and the processing unit of quilt input operation (II).Follow this, the second plate base W2 is dropped in the processing unit of operation (I).Like this, in the present invention, substrate W1～W3 each sheet ground is separately dropped into each operation (I), (II) and is handled (monolithic processing) in (III).Relative therewith, in existing segmented mode, because multi-piece substrate W is focused in each operation, so the processing time of each operation is elongated.But under situation of the present invention, the TAT of each substrate W1～W3 (T2) compares extremely short with the TAT (T12) of the situation of segmented mode.In addition, the productive temp time T 1 of each substrate W1～W3 of the present invention is also short than the productive temp time T 11 of segmented mode.

In addition, graphical presentation shown in Figure 35 monolithic of the present invention is relatively handled and the relation of the processing sheet number of the substrate W of time of batch processing.In the figure, the situation that solid line 228 expressions monolithic of the present invention is handled, the situation of the existing segmented mode of double dot dash line 229 expressions.But this figure begins to as the total processing time of finishing the needed every plate base W of product taking-up from substrate W being dropped into manufacturing line, is assumed to be identical situation in monolithic processing and batch processing.In existing segmented mode, because for example 20 plate base W focus on, so, then can not obtain as the substrate W that finishes product if without its TAT (T12).But, in situation of the present invention, owing to be the mode that each sheet is handled, so if the TAT (T12) of process a slice amount then produces a plate base W.

Above-mentioned result, quantity as the substrate W (at product inventory) that is detained at goods (unfinished work) is reduced, thereby get final product with few circulating fund,, therefore have the managerial advantage of the good grade of turnover of capital owing to the recovery of finishing at short notice investment.In addition,, the keeping space of the substrate W in the manufacturing line is reduced, therefore have the low advantage of construction cost of clean room owing to minimizing at product inventory.Particularly in recent years, because the size of substrate W increases, the unit price of every plate base W is also high, so the minimizing that the shortening of above-mentioned TAT reaches at product inventory can produce big benefit.In addition, because the delivery cycle (delivery date) shortens, therefore can tackle short delivery delivery date or immediate delivery phase.

Secondly, the situation that the particular procedure device is broken down describes.Figure 36 is the mode time figure of the flow direction of the substrate W when being used to understand specific processing unit and temporarily breaking down.Be in operation (II), after the processing that finishes substrate W3, the situation that the processing unit of operation (II) breaks down, after breaking down, several pieces (4) substrate W4～W7 also can carry out the processing of operation (I) to set productive temp time T 1, afterwards several pieces (3) substrate W8～W10, owing to by the processing unit of operation (II) stop to handle adjustment, and to handle than setting the 1 long productive temp time (T1+ β) of productive temp time T.These multi-piece substrates W4～W10, even, therefore moved into successively and be accommodated in the temporary transient storage appts L between operation (I) and the operation (II) owing to after the processing of follow-up substrate (for example substrate W4 the is substrate W5 relatively) operation that is through with (I), can not drop into operation (II).

When after the processing that finishes operation (II) since the 3rd plate base W3 is through dwell time T4, opening the processing unit of operation (II) once more, multi-piece substrate W4～the W10 that is accommodated in the temporary transient storage appts L is taken out of successively by the substrate of moving into earlier, and drops into the processing unit of operation (II) to set productive temp time T 1.And, comprise finally to drop into the later substrate of next substrate W12 of the substrate W11 of operation (I) than setting the 1 big productive temp time (T1+ β) of productive temp time T, dropped into operation (I) to set productive temp time T 1 successively, thereby all handled continuously swimmingly in the operation.

The 6th embodiment.

The semiconductor-fabricating device U1 of the 5th embodiment shown in Figure 28 is the situation that is used for only forming the layer of semiconductor element on substrate W.But this semiconductor-fabricating device U1 also can stride multilayer ground and form semiconductor element on substrate W.For example, the semiconductor-fabricating device U2 of the 6th embodiment shown in Figure 37 is to stride three layers of situation that forms semiconductor element on substrate.Under the situation of this embodiment, around annular conveyer K, being used in the processing unit A～E that forms first～the 3rd each layer becomes group, by its process sequence configuration.That is, utilize first processing unit group A1～E1 on substrate W, to carry out the shaping of ground floor, utilize second processing unit group A2～E2 on substrate W, to carry out the shaping of the second layer, utilize the 3rd processing unit group A3～E3 on substrate W, to carry out the 3rd layer shaping.In addition, in the part of final operation, be adjacent to be provided with the testing fixture E3 of the 3rd processing unit group A3～E3 and extract testing fixture 231.And, in the semiconductor-fabricating device U2 of this embodiment, dispose branch road Handling device V in the inboard of annular conveyer K.This branch road Handling device V has branch road carrying road 232 of laying along the length direction of semiconductor-fabricating device U2 and the branch road carrier 233 that can reciprocatingly install on described branch road carrying road 232 in the inboard of annular conveyer K.

Utilize described branch road carrier 233, substrate W can be carried to other processing unit A～E from arbitrary processing unit A～E.Under the situation of semiconductor-fabricating device U2 shown in Figure 37, extract the substrate W of the processing among the Etaching device D1 of the first processing unit group that is through with, utilize 233 carryings of branch road carrier to extracting testing fixture 231.The substrate W of inspection of described extraction testing fixture 231 of being through with utilizes branch road carrier 233 by the cleaning device A2 of the carrying path carrying different with annular conveyer K to the second processing unit group, the processing after carrying out once more.In addition, utilize described branch road carrier 233, when arbitrary processing unit A～E breaks down, replace handling by other processing unit, therefore also can be with substrate W carrying to described other processing unit.Under the situation of this semiconductor-fabricating device U2, can implement the attached processing (for example extracting inspection etc.) of regulation to processing substrate W midway, have the advantage of the treatment effeciency raising that makes substrate W.This branch road carrier 233 can be the mode of carrying substrate W under the state in being accommodated in pallet P, perhaps, also can be the mode of only carrying the substrate W that takes out from described pallet P.In addition, though the branch road Handling device V among the semiconductor-fabricating device U2 of the above embodiments is a branch road carrier 233, for example also can be robot.

Like this, be under the situation of annular conveyer K at conveyer, owing to can around it, dispose each processing unit A～E, thus the whole area that is provided with is diminished, thus the construction cost of clean room can be reduced.

In the above embodiments 5, embodiment 6, substrate W is to be incorporated in the state carrying among the pallet P.If with the state carrying of direct mounting on each board carrying roller 209, then the contact-making surface of substrate W and board carrying roller 209 may pollute or damage with described substrate W.But, in the present embodiment, owing to substrate W is incorporated on the pallet P, so above-mentioned unfavorable condition can not take place.

In semiconductor-fabricating device U1, the U2 of embodiment 5, embodiment 6, around annular conveyer K, dispose each processing unit A～E.Therefore, can reduce the floor space of the clean room that each semiconductor-fabricating device U1, U2 are set.But this conveyer can not be annular shape, for example also can be rectilinear form.In addition, the annular conveyer K of each embodiment is a dynamical type roller conveyer.But, also can be the conveyer of alternate manner, for example also can be utilize the aerial crane transportation tray P that hangs down from the transmission rail that is layed in ceiling mode conveyer or will be used for the conveyer of transportation tray P longitudinally and be used for equally along the conveyer combination of sideways transfer and the device of looping structure.

The preferred embodiment of the invention more than has been described, but has the invention is not restricted to these embodiment.Without departing from the spirit and scope of the present invention, can carry out structure additional, omit, displacement, and other change.The present invention is not limited by described explanation, and the scope of the technical scheme of only being added limits.

Utilize possibility on the industry.

The present invention is suitable for making at substrate through multiple working procedure successively the semiconductor manufacturing of semiconductor element Operation.

Claims (14)

1. board carrying method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that

Described substrate utilizes the substrate delivery/reception device that disposes accordingly with each processing unit to take out after temporarily being placed on the first interim mounting table that is disposed between described each processing unit, and the processing unit carrying of operation backward of each sheet ground.

2. board carrying method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that

The carrying path of described substrate has: in order to carry out the processing of each operation successively for described substrate, and via the first interim mounting table operation side regular carrying road of carrying successively backward that is disposed between described each processing unit; And

For the substrate of handling is midway carried out attached processing, and the branch road of reciprocal carrying substrate is carried the road between the described first interim mounting table or the second interim mounting table different with the described first interim mounting table and attached processing unit.

3. board carrying method, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, the method of carrying described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that

Utilization is disposed at the substrate delivery/reception device between each processing unit and the conveyer, to give each processing unit by the substrate delivery/reception of each sheet ground carrying of described conveyer, and utilize described substrate delivery/reception device to give conveyer and the processing unit of operation carrying backward by the substrate delivery/reception that each processing unit is handled.

4. substrate transfer apparatus, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, carry the device of described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that having:

For temporary transient place the substrate in the carrying and be disposed at take on before and after a plurality of first interim mounting table between each processing unit of operation; And

After substrate that the in the past first interim mounting table of operation side takes out is with this processing unit processing, be used for a plurality of substrate delivery/reception devices of board carrying to other first interim mounting table of the back operation side adjacent with the described first interim mounting table,

Wherein, will handle midway each sheet ground of substrate operation side carrying backward successively via the described first interim mounting table.

5. substrate transfer apparatus as claimed in claim 4 is characterized in that, the described first interim mounting table can be placed multi-piece substrate temporarily.

6. substrate transfer apparatus as claimed in claim 4 is characterized in that, the described first interim mounting table is the multistage container structure, and moves in the mode of first-in first-out and to take out of.

7. substrate transfer apparatus as claimed in claim 4 is characterized in that having: the second interim mounting table, itself and the described first interim mounting table are configured on the desired position on regular carrying road of substrate dividually, and are attached processing unit special use; And substrate branch road carrier, its substrate branch road that is used for taking out from the described second interim mounting table is transported to attached processing unit.

8. substrate transfer apparatus as claimed in claim 7 is characterized in that, is positioned over the carrying of the substrate on the described second interim mounting table temporarily, is undertaken by carrying the second interim mounting table itself.

9. substrate transfer apparatus as claimed in claim 4 is characterized in that, by the processing unit group that a plurality of processing unit constitute, is cut apart by two and configuration relatively along regular carrying road, is become branch road carrying road between two each processing unit group of cutting apart.

10. substrate transfer apparatus, be on substrate, to form in the semiconductor-fabricating device of semiconductor element via multiple working procedure successively, carry the device of described substrate along the processing unit group that constitutes by a plurality of processing unit by the process sequence configuration for the processing of carrying out each operation, it is characterized in that having:

Conveyer, it is used for each sheet ground carrying substrate along the orientation configuration of each processing unit; And

The substrate delivery/reception device, it is configured between described conveyer and each processing unit, is used for carrying out between the two the handing-over of substrate,

Wherein, utilize board carrying that described conveyer will be handled by described each processing unit to the processing unit of back operation.

11. substrate transfer apparatus as claimed in claim 10 is characterized in that, described substrate is carried with the state that is housed inside on the pallet.

12. substrate transfer apparatus as claimed in claim 10 is characterized in that, disposes the substrate storage device that is used for temporarily taking care of the substrate that processing that described processing unit carries out finishes in the positive downstream of the processing unit of conveyer.

13. substrate transfer apparatus as claimed in claim 10 is characterized in that, described conveyer is an annular conveyer, be used for each the processing unit assembly that forms semiconductor element on the substrate place annular conveyer around.

14. substrate transfer apparatus as claimed in claim 10 is characterized in that, for the substrate of handling is midway carried out attached processing, disposes and manages the branch road Handling device that can carry described substrate between the device throughout.

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