CN101187045A - 在电镀时对引线框架宽度方向的定位方法 - Google Patents
在电镀时对引线框架宽度方向的定位方法 Download PDFInfo
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- CN101187045A CN101187045A CNA2007100766504A CN200710076650A CN101187045A CN 101187045 A CN101187045 A CN 101187045A CN A2007100766504 A CNA2007100766504 A CN A2007100766504A CN 200710076650 A CN200710076650 A CN 200710076650A CN 101187045 A CN101187045 A CN 101187045A
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CN200710076650A CN101187045B (zh) | 2007-08-29 | 2007-08-29 | 在电镀时对引线框架宽度方向的定位方法 |
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CN200710076650A CN101187045B (zh) | 2007-08-29 | 2007-08-29 | 在电镀时对引线框架宽度方向的定位方法 |
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CN101187045A true CN101187045A (zh) | 2008-05-28 |
CN101187045B CN101187045B (zh) | 2010-05-26 |
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CN200710076650A Expired - Fee Related CN101187045B (zh) | 2007-08-29 | 2007-08-29 | 在电镀时对引线框架宽度方向的定位方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102011160A (zh) * | 2010-12-08 | 2011-04-13 | 番禺得意精密电子工业有限公司 | 抽线式端子的电镀方法 |
CN102080243B (zh) * | 2009-11-30 | 2012-05-23 | 曲悦峰 | 可调条镀模具 |
CN103590091A (zh) * | 2013-11-21 | 2014-02-19 | 沈阳仪表科学研究院有限公司 | 多层超薄金刚石刀片的加工方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2444962Y (zh) * | 2000-06-28 | 2001-08-29 | 苏兆辉 | 集成电路引线框选镀生产线定位装置 |
JP2006169578A (ja) * | 2004-12-15 | 2006-06-29 | Matsushita Electric Ind Co Ltd | 部分めっき装置 |
US7744732B2 (en) * | 2005-04-06 | 2010-06-29 | Leviton Manufacturing Company, Inc. | Continuous plating system and method with mask registration |
-
2007
- 2007-08-29 CN CN200710076650A patent/CN101187045B/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102080243B (zh) * | 2009-11-30 | 2012-05-23 | 曲悦峰 | 可调条镀模具 |
CN102011160A (zh) * | 2010-12-08 | 2011-04-13 | 番禺得意精密电子工业有限公司 | 抽线式端子的电镀方法 |
CN102011160B (zh) * | 2010-12-08 | 2012-09-19 | 番禺得意精密电子工业有限公司 | 抽线式端子的电镀方法 |
CN103590091A (zh) * | 2013-11-21 | 2014-02-19 | 沈阳仪表科学研究院有限公司 | 多层超薄金刚石刀片的加工方法 |
CN103590091B (zh) * | 2013-11-21 | 2016-07-20 | 沈阳仪表科学研究院有限公司 | 多层超薄金刚石刀片的加工方法 |
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CN101187045B (zh) | 2010-05-26 |
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Addressee: Shenzhen Changlong Dianjin Technology Co. Ltd. patent responsible person Document name: Notification that Application Deemed not to be Proposed |
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Owner name: SHENZHEN LONG DRAGON SPOT GOLD TECHNOLOGY LTD. Free format text: FORMER OWNER: QU YUEFENG Effective date: 20140903 |
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Effective date of registration: 20140903 Address after: 5, 1 floor C District, 518000 Housing Science and Technology Park, Longhua street, Shenzhen, Guangdong, Baoan District, China Patentee after: Shenzhen Hong Kong Long Dragon Co., LTD. Address before: 518000 Guangdong city of Shenzhen province Futian District Jintian road central business building A0916 Patentee before: Qu Yuefeng |
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