CN101180692A - Digital signal processing board - Google Patents
Digital signal processing board Download PDFInfo
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- CN101180692A CN101180692A CNA2006800173292A CN200680017329A CN101180692A CN 101180692 A CN101180692 A CN 101180692A CN A2006800173292 A CNA2006800173292 A CN A2006800173292A CN 200680017329 A CN200680017329 A CN 200680017329A CN 101180692 A CN101180692 A CN 101180692A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/28—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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Abstract
A digital signal processor is provided with a component for processing a digital signal, a power supply line for supplying the component with power, and a decoupling capacitor connected between the power supply line and a grounding wire. The decoupling capacitor has an equivalent series resistance higher than 0 but not more than 25mOmega at 100kHz, and an equivalent series inductance higher than 0 but not more than 800pH at 500MHz. The digital signal processor does not generate much digital noise and can be made small and thin.
Description
Technical field
The present invention relates to a kind of digital signal processing appts that digital signal is handled.
Background technology
In recent years, the rapid digitlization of electronic equipment such as sound equipment, image class household appliances.This class of electronic devices is based on Digital Signal Processing, and utilizes this technology that a large amount of signals are carried out high speed processing, and described Digital Signal Processing becomes digital signal or analog signal conversion the digital signal of regulations such as MPEG2 and compresses processing.
Figure 13 is the circuit diagram of existing digital signal processing appts 5001.Described signal handling equipment 5001 possesses large scale integrated circuit (LSI) 25, power supply terminal 26, power line 27, decoupling capacitor 28, DC/DC transducer 29, smmothing capacitor 30 and 31 and remove a plurality of capacitors 32 that noise is used.Power supply terminal 26 is connected with DC power supply 26A, and power line 27 connects power supply terminal 26 and LSI25.Decoupling capacitor 28 is solid electrolytic capacitors, is connected between power line 27 and the ground connection 5001A.DC/DC transducer 29 is connected with power line 27, and outputs to power line 27 after the voltage transitions with DC power supply 26A.Smmothing capacitor 30 is connected between the input 29A and ground connection 5001A of DC/DC transducer 29, and smmothing capacitor 31 is connected between the output 29B and ground connection 5001A of DC/DC transducer 29.
Follow the high speed operation of electronic equipment, LSI25 also moves with high frequency.LSI25 turns round with high frequency, and the electric power that it consumed increases.Therefore, for the power consumption that suppresses LSI25 makes the heat that produces reach minimum, under the more situation voltage that reduces DC power supply 26A, so that under low-voltage, drive LSI25.
Be subjected to the influence of the fluctuation of load easily with the LSI25 of low voltage drive.Therefore, when the electric power consumption of LSI25 increases fast because of the fluctuation of load, can be from decoupling capacitor 28 supplying electric current to LSI25, thus can stably keep the voltage that supplies to LSI25.
The value of the equivalent series resistance (ESR) of decoupling capacitor 28 is made as R, and the value of equivalent series inductance (ESL) is made as L, and the electric current of supplying with to LSI25 from decoupling capacitor 28 is made as i, and then decoupling capacitor 28 produces by the voltage drop V shown in the following formula.
V＝R×i+L×di/dt。
That is, after ESR and ESL change greatly, can't fully guarantee to be applied to the voltage of LSI25.
Figure 14 represents the digital noise of digital signal processing appts 5001.Because so a large amount of signals of digital signal processing appts 5001 compressions as shown in figure 14, can produce digital noise to carry out high speed processing.Especially when being used for Digital Television, this digital noise obviously shows as the image instability.In order to reduce this digital noise, a large amount of removal noises is connected between LSI25 and the ground connection 5001A with capacitor 32.Capacitor 32 uses multi-layer ceramic capacitor usually.The quantity of the capacitor 32 that is connected with each LSI25 is more than 30, and described a large amount of capacitor 32 must be installed near the LSI25.Therefore, must make the substrate multiple stratification and the maximization of the circuit that digital signal processing appts has been installed, thereby cost must increase.
In addition, still imperfect tense can't assess, therefore must set capacitor 32 by tentative calculation (cut and try) to digital noise at digital signal processing appts 5001.Like this with the unpredictable time that is used to handle digital noise, thereby prolong its construction cycle, and cost is increased.
The ESR and the ESL that are used as the solid electrolytic capacitor of decoupling capacitor 28 can't fully guarantee therefore must make the ESR of solid electrolytic capacitor and ESL littler in order to drive the required voltage of LSI25.
Summary of the invention
A kind of digital signal processing appts comprises parts that digital signal is handled, to the power line of parts supply capability be connected decoupling capacitor between described power line and the ground connection.Decoupling capacitor have when 100kHz greater than 0 and during at the equivalent series resistance below the 25m Ω with at 500MHz greater than 0 and equivalent series inductance below 800pH.
This digital signal processing appts can not produce a large amount of digital noises, and can form little and thin size.
Description of drawings
Fig. 1 is the circuit diagram of the digital signal processing appts of first embodiment of the invention.
Fig. 2 represents the digital noise of the digital signal processing appts of first execution mode.
Fig. 3 A is the cross sectional plan view of the solid electrolytic capacitor that uses in the digital signal processing appts of first execution mode.
Fig. 3 B is the cross-section front view of the solid electrolytic capacitor shown in Fig. 3 A along line 3B-3B intercepting.
Fig. 3 C is the section upward view of the solid electrolytic capacitor shown in Fig. 3 A.
Fig. 3 D is the cross sectional side view of the solid electrolytic capacitor shown in Fig. 3 A.
Fig. 4 is the partial cut-away perspective view of capacitor element of the solid electrolytic capacitor of first execution mode.
Fig. 5 is the pectination anode terminal of solid electrolytic capacitor of first execution mode and the perspective view of pectination cathode terminal.
Fig. 6 A is pectination anode terminal shown in Figure 5 and the pectination cathode terminal profile along line 6A-6A intercepting.
Fig. 6 B is pectination anode terminal shown in Figure 5 and the pectination cathode terminal profile along line 6B-6B intercepting.
Fig. 6 C is pectination anode terminal shown in Figure 5 and the pectination cathode terminal profile along line 6C-6C intercepting.
Fig. 7 represents the characteristic of the solid electrolytic capacitor of first execution mode.
Fig. 8 represents the characteristic of the solid electrolytic capacitor of first execution mode.
Fig. 9 is the circuit diagram of the digital signal processing appts of second embodiment of the invention.
Figure 10 A is the profile of the digital signal processing appts of second execution mode.
Figure 10 B is the profile of the digital signal processing appts of second execution mode.
Figure 11 represents the digital noise characteristic of the digital signal processing appts of second execution mode.
Figure 12 is the profile of the digital signal processing appts of comparative example.
Figure 13 is the circuit diagram of existing digital signal processing appts.
Figure 14 represents the digital noise characteristic of existing digital signal processing appts.
Reference numeral
1 capacitor element (first capacitor element, second capacitor element)
4 anode portion (first anode portion, second plate portion)
6 solid electrolyte layers (first solid electrolyte layer, second solid electrolyte layer)
8 pectination anode frames
9 pectination negative electrode frames
10 pectination anode terminals
10A planar portions (first planar portions)
10B shielding part (first shielding part)
10E connecting portion (first connecting portion)
The 10F connecting portion
The 10G planar portions
10H placed side (first placed side)
10M installed surface (first installed surface)
11 pectination cathode terminals
11A planar portions (second planar portions)
11B shielding part (secondary shielding portion)
11F connecting portion (second connecting portion)
The 11G connecting portion
The 11H planar portions
11J installed surface (second installed surface)
11N placed side (second placed side)
12 potting resins
13 conduction silver paste
16 parts
The 16A power end
17 power supply terminals
18 power input lines
19 decoupling capacitors
20 DC/DC transducers
21 smmothing capacitors (first smmothing capacitor)
22 smmothing capacitors (second smmothing capacitor)
23 remove the noise capacitor
107 negative pole parts (first negative pole part, second negative pole part)
201 solid electrolytic capacitors
516 parts
The 516A power end
The 516C earth terminal
517 power supply terminals
The 518A power line
The 518B power line
519 decoupling capacitors
520 DC/DC transducers
The 520A input
The 520B output
The 520C earth terminal
521 smmothing capacitors (first smmothing capacitor)
522 smmothing capacitors (second smmothing capacitor)
523 remove the noise capacitor
601 multilager base plates (substrate)
602 conductive layers
603 conductive layers (first conductive layer)
604 conductive layers (second conductive layer)
The D1 insulating barrier
The D2 insulating barrier
The D3 insulating barrier
The D4 insulating barrier
Embodiment
(first execution mode)
Fig. 1 is the circuit diagram of the digital signal processing appts 1001 of first embodiment of the invention.Digital signal processing appts 1001 comprise parts 16, power supply terminal 17, power line 18, decoupling capacitor 19, DC/DC transducer 20, smmothing capacitor 21 and 22 and a plurality of removal noise with capacitor 23.Parts 16 are the large scale integrated circuits (LSI) with power end 16A, utilize the electric power processing digital signal that supplies to power end 16A, and export from signal end 16B.Power supply terminal 17 is connected with DC power supply 17A.Power line 18 connects the power end 16A of power supply terminal 17 and parts 16.Decoupling capacitor 19 is the solid electrolytic capacitors that are connected between power line 18 and the ground connection 1001A.The direct voltage of DC power supply 17A output supplies to the input 20A of DC/DC transducer 20, DC/DC transducer 20 with this voltage transitions after, from output 20B to power line 18 output dc voltages.Smmothing capacitor 21 is connected between the input 20A and ground connection 1001A of DC/DC transducer 20, and smmothing capacitor 22 is connected between the output 20B and ground connection 1001A of DC/DC transducer 20.Capacitor 23 is connected between the power end 16A and ground connection 1001A of parts 16, and normally used be multi-layer ceramic capacitor.
As the solid electrolytic capacitor of decoupling capacitor 19 and smmothing capacitor 22 is with the surface installing type solid electrolytic capacitor of conducting polymer as solid electrolyte, have when 100kHz greater than 0 and during at the equivalent series resistance below the 25m Ω with at 500MHz greater than 0 and equivalent series inductance (ESL) below 800pH.
Utilization has so little ESR and the capacitor 19 and 22 of ESL, can fully guarantee in order to the required voltage of driver part 16.Parts 16 and clock signal synchronous operation.Described clock signal produces the high frequency radiation noise.DC/DC transducer 20 has switch element.This switch element produces switching noise.This high frequency radiation noise and this switching noise flow to ground connection 1001A by capacitor 19,22, thereby can reduce the high frequency radiation noise and the switching noise of transmission on the power line 18 greatly.
Fig. 2 represents the digital noise of the digital signal processing appts 1001 of first execution mode.Digital noise in the digital signal processing appts 1001 is cut to the digital noise that is lower than existing digital signal processing appts 5001 shown in Figure 14.In addition, the quantity of capacitor 23 shown in Figure 1 can be reduced to removal noise shown in Figure 13 with about 1/2～1/3 of the quantity of capacitor 32.
The digital signal processing appts 1001 of first execution mode will have the solid electrolytic capacitor of less ESR and ESL as decoupling capacitor 19 and smmothing capacitor 22, can reduce digital noise greatly thus.Digital signal processing appts 1001 can reduce to remove the quantity of noise with capacitor 23, thereby can form little and thin size, and low price.
In first execution mode, smmothing capacitor 21 also can use the solid electrolytic capacitor identical with decoupling capacitor 19 and smmothing capacitor 22.
Fig. 3 A is the cross sectional plan view of the solid electrolytic capacitor 201 of use in decoupling capacitor 19 and the smmothing capacitor 22.Fig. 3 B is the cross-section front view of the solid electrolytic capacitor 201 shown in Fig. 3 A along line 3B-3B intercepting.Fig. 3 C and Fig. 3 D are respectively the section upward view and the cross sectional side views of the solid electrolytic capacitor 201 shown in Fig. 3 A.Fig. 4 is the broken section perspective view of the capacitor element 1 of solid electrolytic capacitor 201.
Lamination a plurality of (in first execution mode being 5) capacitor element 1 is placed on anode portion 4 on the pectination anode frame 8.The guide portion 8A at pectination anode frame 8 two ends is crooked and encase anode portion 4, and anode portion 4 and junction surface 8B are bonded into one by laser welding.
The a plurality of capacitor elements 1 of lamination are placed on negative pole part 107 on the pectination negative electrode frame 9 by electroconductive binder.It is fixing to utilize the guide portion 9B of the guide portion 9A at two ends of pectination negative electrode frame 9 and terminal that capacitor element 1 is positioned, and is bonded into one.Form capacitor element unit 1A through incorporate a plurality of capacitor elements 1, pectination anode frame 8 and pectination negative electrode frame 9.
Fig. 5 is the pectination anode terminal 10 of use in the solid electrolytic capacitor 201 and the major part perspective view of pectination cathode terminal 11.Fig. 6 A, Fig. 6 B and Fig. 6 C are respectively pectination anode terminal 10 shown in Figure 5 and pectination cathode terminal 11 profiles along line 6A-6A, line 6B-6B and line 6C-6C.In the solid electrode capacitor 201, pectination anode terminal 10 is positioned at from pectination cathode terminal 11 on the direction of 201A.Pectination anode terminal 10 comprises placed side 10H, connecting portion 10E and planar portions 10A.Be placed with capacitor element unit 1A on the 10H of placed side.Connecting portion 10E extends to the 10K direction from the two ends of direction 201B placed side 10H, that intersect with direction 201A, and described 10K direction is meant the outside direction of facing from placed side 10H of direction 10J.Planar portions 10A extends from connecting portion 10E in the mode of faces direction 10J.That is, planar portions 10A forms stair-stepping difference in height via connecting portion 10E.Connecting portion 10F extends to the 10L direction from the end opposite with direction 201A of placed side 10H, and described 10L direction is meant the outside direction from direction 10J.Shielding part 10B extends to pectination cathode terminal 11 from connecting portion 10F.Shielding part 10B has planar portions 10G, and described planar portions 10G faces identical direction 10J with placed side 10H.That is, shielding part 10B forms stair-stepping difference in height via connecting portion 10F.The pectination anode frame 8 of capacitor element unit 1A is placed on the planar portions 10A, and engages by laser welding at junction surface 10C place.Jut 10D is from potting resin 12 projections.Jut 10D is bent upwards along the side of potting resin 12.Placed side 10H, connecting portion 10E, 10F, planar portions 10A, shielding part 10B and jut 10D are by metallic plate of punching press and make it crooked and form as one.
The lower surface 11J of pectination cathode terminal 11 is used as installed surface when solid electrolytic capacitor 201 is installed.The shape of the negative pole part 107 of the shape of lower surface 11J and capacitor element 1 is roughly the same, thereby as much as possible near pectination anode terminal 10.Be provided with the connecting portion 11F that extends to the oblique upper of direction 201B from pectination cathode terminal 11.Form stair-stepping difference in height via connecting portion 11F with the plane planar portions 11A that pectination negative electrode frame 9 engages.Connecting portion 11G to pectination anode terminal 10 towards direction 201A, extend obliquely upward from lower surface 11J as installed surface.Shielding part 11B forms stair-stepping difference in height via connecting portion 11G.Shielding part 11B has planar portions 11H.Pectination cathode terminal 11 is by metallic plate of punching press and make it crooked and form as one.Be placed with the pectination negative electrode frame 9 of capacitor element unit 1A on the planar portions 11A, and engage by laser welding at junction surface 11C place.Jut 11D, the 11E of pectination cathode terminal 11 be from potting resin 12 projections, and be bent upwards along the side of potting resin 12.Pectination cathode terminal 11 has placed side 11N, is placed with capacitor element unit 1A on the described placed side 11N.
Potting resin 12 is made up of insulating resins such as epoxy resin, and so that the mode that the lower surface 11J of the lower surface 10M of pectination anode terminal 10 and pectination cathode terminal 11 exposes is come covering capacitor cell 1A.
That is, pectination anode terminal 10 has and is positioned at as the opposition side of the lower surface 10M of installed surface and is placed with the placed side 10H of capacitor element unit 1A.Pectination cathode terminal 11 has and is positioned at as the opposition side of the lower surface 11J of installed surface and is placed with the placed side 11N of capacitor element unit 1A.Shielding part 10B has connecting portion 10F, described connecting portion 10F extends and forms to direction 10L from the lower surface 10M of pectination anode terminal 10, described direction 10L is not only towards pectination cathode terminal 11 but also towards capacitor element unit 1A, described shielding part 10B also has planar portions 10G, and described planar portions 10G extends to the direction 201C opposite with direction 201A from connecting portion 10F.Shielding part 10B is covered by potting resin 12.Shielding part 11B has connecting portion 11G, described connecting portion 11G extends to direction 11P from lower surface 11J, described direction 11P is not only towards pectination anode terminal 10 but also towards capacitor element unit 1A, described shielding part 11B also has planar portions 11H, and described planar portions 11H extends to direction 201A from connecting portion 11G.Shielding part 11B is covered by potting resin 12.
Capacitor element unit 1A engages with the planar portions 11A of pectination cathode terminal 11.The conductive paste 13 that contains silver is located at the pectination negative electrode frame 9 of capacitor element unit 1A and the space part between the pectination cathode terminal 11, can reduce the resistance that is connected between pectination negative electrode frame 9 and the pectination cathode terminal 11, thus the raising connection reliability.
A plurality of pectination anode terminals 10 and a plurality of pectination cathode terminal 11 are arranged on the ring-type base material of being made up of copper alloy continuously with predetermined distance.Under this state, capacitor element unit 1A is mounted engagement in respectively on a plurality of pectination anode terminals 10 and a plurality of pectination cathode terminal 11, cover respectively with potting resin 12 again and be integral.After this, separate with base material and obtain single solid electrolytic capacitor 201.
The shielding part 10B that forms by connecting portion 10E, planar portions 10A, connecting portion 10F and the planar portions 10G of pectination anode terminal 10, and the shielding part 11B that forms by connecting portion 11F, planar portions 11A, connecting portion 11G and the planar portions 11H of pectination cathode terminal 11, cover and do not expose by potting resin 12. Planar portions 10G, 11H form stepped via connecting portion 10F, 11G, therefore be difficult to and pectination terminal 10,11 as the interface between lower surface 10M, the 11J of installed surface on form R.So, can prevent that potting resin 12 from flowing into lower surface 10M, the 11J as installed surface of pectination terminal 10 and 11.
In the solid electrolytic capacitor 201 of first execution mode, utilize the pectination anode terminal 10 of substantially planar and anode portion 4 that pectination cathode terminal 11 can make capacitor element 1 and negative pole part 107 to stretch out short as far as possible distance to the outside.And the lower surface 11J that makes pectination cathode terminal 11 is as much as possible near the lower surface 10M of pectination anode terminal 10, and makes the path between pectination anode terminal 10 and the pectination cathode terminal 11 the shortest, and capacitor 201 has little ESR and little ESL thus.Particularly the ESL of capacitor 201 reduces to 500pH, be existing capacitor ESL 1500pH 1/3.
Pectination anode frame 8 and pectination negative electrode frame 9 engage with planar portions 10A, 11A by laser welding respectively, and described planar portions 10A, 11A are separately positioned on pectination anode terminal 10 and the pectination cathode terminal 11, and come the 10A of overlay planes portion, 11A by potting resin 12.This structure makes the weld mark on planar portions 10A, the 11A be covered by potting resin 12 and becomes attractive in appearance, can prevent to produce the loosening of fault owing to weld mark when capacitor 201 is installed, thereby can improve reliability.
Shielding part 10B extends to the oblique upper of pectination cathode terminal 11 from the end face of pectination anode terminal 10, and shielding part 11B extends to the oblique upper of pectination anode terminal 10 from the end face of pectination cathode terminal 11.Shielding part 10B, 11B are covered by potting resin 12.Shielding part 10B, 11B prevent that the moisture that is contained from arriving capacitor element 1 and producing harmful effect from the oxygen that potting resin 12 is invaded, thereby the reliability of capacitor 201 is improved.
In addition, in first execution mode, the anode bodies of capacitor element 12 is formed by aluminium foil, but is not limited to aluminium foil, also can being combined to form by tantalum paper tinsel or niobium paper tinsel or sintered body and these materials.
The characteristic of solid electrolytic capacitor 201 below is described.
Preparation has the sample of the solid electrolytic capacitor 201 of various equivalent series impedances (ESR), measures the initial characteristic of tangent, equivalent series inductance (ESL) and the leakage current of electrostatic capacitance, loss angle (loss angle), and it the results are shown among Fig. 7.Solid electrolytic capacitor 201 is applied 10V voltage, measure the value of leakage current after two minutes.Solid electrolytic capacitor 201 has the rated voltage of 6.3V and the electrostatic capacitance of 47 μ F.The quantity of capacitor 23 of sample that further demonstrates use capacitor 201 shown in Figure 1 among Fig. 7 is with respect to the economy of the quantity of capacitor 23 in the existing digital signal processing appts 5001 shown in Figure 13.
As shown in Figure 7, by making ESR below 25m Ω, can reduce the quantity of the capacitor 23 that is used to remove digital noise effectively.
The sample that has the solid electrolytic capacitor 201 of various distance L between preparation pectination anode terminal 10 and the pectination cathode terminal 11, measure the initial characteristic of electrostatic capacitance, loss tangent of an angle, equivalent series resistance (ESR), equivalent series inductance (ESL) and leakage current, its result as shown in Figure 8.Described distance L is greater than 0.
As shown in Figure 8, the distance L between pectination anode terminal 10 and the pectination cathode terminal 11 more in short-term, the value of ESL diminishes, particularly when distance L greater than 0 and when 2mm is following, therefore the value of ESL can reduce the quantity of capacitor 23 effectively below 800pH.
As mentioned above, decoupling capacitor 19 and smmothing capacitor 22 use the solid electrolytic capacitor 201 of present embodiment, can reduce the digital noise that digital signal processing appts 1001 produces thus greatly.Therefore, can reduce the quantity of the capacitor 23 that is used to reduce digital noise, make digital signal processing appts 1001 little and thin, and low price.
(second execution mode)
Fig. 9 is the circuit diagram of the digital signal processing appts 1002 of second embodiment of the invention.Digital signal processing appts 1002 comprises parts 516, power supply terminal 517, power line 518A, 518B, decoupling capacitor 519, DC/DC transducer 520, smmothing capacitor 521,522 and a plurality of removal noise capacitor 523.Parts 516 are the large scale integrated circuits (LSI) with power end 516A, utilize the electric power supply to power end 516A to come processing digital signal, and the signal after handling from signal end 516B output.Power supply terminal 517 is connected with DC power supply 517A.Power line 518B connects the input 520A of power supply terminal 517 and DC/DC transducer 520.Power line 518A connects the output 520B of DC/DC transducer 520 and the power end 516A of parts 516.Decoupling capacitor 519 is the solid electrolytic capacitors that are connected between power line 518A and the ground connection 1002A.The direct voltage of DC power supply 17A output supplies to the input 520A of DC/DC transducer 520 via power line 518B, DC/DC transducer 520 with described voltage transitions and from output 520B to power line 518A output dc voltage.Smmothing capacitor 521 is connected between the input 520A and ground connection 1002A of DC/DC transducer 520, and smmothing capacitor 522 is connected between the output 520B and ground connection 1002A of DC/DC transducer 520.The earth terminal 516C of parts 516 is connected with ground connection 1002A.Capacitor 523 uses multi-layer ceramic capacitor usually.The earth terminal 520C of DC/DC capacitor 520 is connected with ground connection 1002A.Capacitor 523 is connected between the power end 516A and ground connection 1002A of parts 516, and uses multi-layer ceramic capacitor usually.
Figure 10 A and Figure 10 B are the profiles of digital signal processing appts 1002.Digital signal processing appts 1002 comprises circuit shown in Figure 9, and the multilager base plate 601 of parts 516, DC/DC transducer 520 and capacitor 519,521,522 and 523 promptly is installed.Multilager base plate 601 comprises a layer S3, be located at insulating barrier D5 on layer S3, be located at layer G2 on the insulating barrier D5, be located at insulating barrier D4 on layer G2, be located at layer Vcc on the insulating barrier D4, be located at insulating barrier D3 on layer Vcc, be located at layer S2 on the insulating barrier D3, be located at insulating barrier D2 on layer S2, be located at layer G1 on the insulating barrier D2, be located at the insulating barrier D1 on layer G1 and be located at layer S1 on the insulating barrier D1.
Among Figure 10 A, power line 518A shown in Figure 9 is corresponding with conductive layer 602 on being located at layer Vcc.Ground connection 1002A is corresponding with conductive layer 603 and the conductive layer 604 that is located on layer G2 on being located at layer G1.On layer S1～S3, G1, G2 and the Vcc, the protective layer 601A that is provided with described conductive layer and is used to make these conductive layers to insulate.Decoupling capacitor 519 is connected between the conductive layer 602 and conductive layer 603 as power line 518A.The power end 516A of parts 516 is connected with conductive layer 602.The earth terminal 516C of parts 516 and decoupling capacitor 519 similarly be located at layer G1 on conductive layer 603 be connected, and not be located at layer G2 on conductive layer 604 be connected.The earth terminal 516C of parts 516 similarly is connected with conductive layer 603 with decoupling capacitor 519, earth terminal 516C can be connected with the shortest distance with decoupling capacitor 519 thus, thereby can reduces the impedance that produces in the ground connection 1002A.
Among Figure 10 B, power line 518B shown in Figure 9 is corresponding with conductive layer 605 on being located at layer Vcc.Ground connection 1002A is corresponding with conductor layer 603 and the conductor layer 604 that is located on layer G2 on being located at layer G1.Smmothing capacitor 521 is connected between the conductive layer 605 and conductive layer 603 as power line 518B.The input 520A of DC/DC transducer 520 is connected with conductive layer 605.The earth terminal 520C of DC/DC transducer 520 and smmothing capacitor 521 similarly be located at layer G1 on conductive layer 603 be connected, and not be located at layer G2 on conductive layer 604 be connected.The earth terminal 520C of DC/DC transducer 520 similarly is connected with conductive layer 603 with smmothing capacitor 521, earth terminal 520C can be connected with the shortest distance with smmothing capacitor 521 thus, thereby can reduces the impedance that produces in the ground connection 1002A.
With the digital signal processing appts 1001 of first execution mode in the same manner, in the digital signal processing appts 1002 of second execution mode, utilize capacitor 519,522 with less ESR and ESL, can fully guarantee in order to the required voltage of driver part 516.Parts 516 and clock signal synchronous operation.This clock signal can produce the high frequency radiation noise.DC/DC transducer 520 has switch element.This switch element produces switching noise.It is conductive layer 603,604 that this high frequency radiation noise and this switching noise flow to ground connection 1002A by capacitor 519,522, thereby can reduce high frequency radiation noise and switching noise that power line 518A goes up transmission greatly.In addition, decoupling capacitor 519 and smmothing capacitor 522 use solid electrolytic capacitor 201, can reduce digital noise greatly thus.Therefore, can significantly reduce the quantity of the capacitor 523 that is used to remove digital noise, make digital signal processing appts 1002 little and thin, and low price.
Figure 12 is the profile of the digital signal processing appts 1003 of comparative example.With digital signal processing appts 1002 shown in Figure 10 in the same manner, digital signal processing appts 1003 comprises the multilager base plate 601 that circuit shown in Figure 9 has been installed.In the digital signal processing appts 1003, the earth terminal 516C of parts 516 is connected with conductive layer 603 on being located at layer G1, and decoupling capacitor 519 is connected with conductive layer 604 on being located at layer G2.That is, different with decoupling capacitor 519, the earth terminal 516C of parts 516 is connected with conductive layer 603.This structure increased the earth terminal 516C of parts 516 and the circuit length between the decoupling capacitor 519, and the impedance in the ground connection 1002A uprises, thereby weakened the effect that reduces digital noise, and is therefore not preferred.
In first execution mode, smmothing capacitor 521 also can use the solid electrolytic capacitor 201 identical with decoupling capacitor 519 and smmothing capacitor 522.
As mentioned above, decoupling capacitor 519 and smmothing capacitor 522 use the solid electrolytic capacitor 201 of first execution mode, can reduce the digital noise that produces in the digital signal processing appts 1002 thus greatly.Therefore, can reduce the quantity of the capacitor 523 that is used to reduce digital noise, make digital signal processing appts 1002 little and thin, and low price.
The industrial utilization possibility
Digital signal processing appts of the present invention can not produce a large amount of digital noises, and can form little and thin Size, can be used for carrying out the household appliances of Digital Signal Processing, be particularly useful for television receiver.
Claims (16)
1. digital signal processing appts is characterized in that comprising:
Parts have power end, utilize the electric power that supplies to described power port to come processing digital signal;
Power line is supplied with described electric power to the described power end of described parts; With
Decoupling capacitor, it is connected between described power line and the ground connection, and have when 100kHz greater than 0 and during at the equivalent series resistance below the 25m Ω with at 500MHz greater than 0 and equivalent series inductance below 800pH.
2. digital signal processing appts according to claim 1 is characterized in that,
Described decoupling capacitor comprises:
First capacitor element has first solid electrolyte layer, first anode portion and first negative pole part, and described first solid electrolyte layer is made of conducting polymer;
The pectination anode terminal has first installed surface, and is connected with the described first anode portion of described first capacitor element;
The pectination cathode terminal has second installed surface, and is connected with described first negative pole part of described first capacitor element, and the distance of described second installed surface and described first installed surface is greater than 0 and below 2mm; And,
The insulation-encapsulated resin is so that the mode that described first installed surface and described second installed surface expose covers described pectination anode terminal, described pectination cathode terminal and described first capacitor element.
3. digital signal processing appts according to claim 2 is characterized in that,
Described second installed surface of described pectination cathode terminal has the roughly the same shape of described first negative pole part with described first capacitor element.
4. digital signal processing appts according to claim 2 is characterized in that,
Described pectination anode terminal has first placed side of the opposition side that is positioned at described first installed surface, and is placed with described first capacitor element on described first placed side,
Described pectination cathode terminal has second placed side of the opposition side that is positioned at described second installed surface, and is placed with described first capacitor element on described second placed side,
Described pectination anode terminal has first shielding part that is covered by described potting resin, this first shielding part from described first installed surface to not only extending towards described pectination cathode terminal but also towards the direction of described first capacitor element,
Described pectination cathode terminal has the secondary shielding portion that is covered by described potting resin, this secondary shielding portion from described second installed surface to not only extending towards described pectination anode terminal but also towards the direction of described first capacitor element.
5. digital signal processing appts according to claim 4 is characterized in that,
Described pectination anode terminal and described pectination cathode terminal are configured on the prescribed direction,
Described pectination anode terminal has the two ends on the direction of intersecting with described prescribed direction,
Described pectination anode terminal comprises:
First connecting portion, from each end at the described two ends of described pectination anode terminal to intersect with described first placed side and away from the direction of described first placed side extend and
First planar portions for plane, is connected with described first connecting portion, and extends to the direction away from described first placed side.
6. digital signal processing appts according to claim 5 is characterized in that,
Described pectination cathode terminal has the two ends on the described direction of intersecting with described prescribed direction,
Described pectination cathode terminal comprises:
Second connecting portion, from each end at the described two ends of described pectination cathode terminal to intersect with described second placed side and away from the direction of described second placed side extend and
Second planar portions for plane, is connected with described second connecting portion, and extends to the direction away from described second placed side.
7. digital signal processing appts according to claim 2 is characterized in that,
Described decoupling capacitor also comprises:
Second capacitor element is stacked on described first capacitor element, has second solid electrolyte layer that is made of conducting polymer, and has the second plate portion and second negative pole part;
The pectination anode frame engages with described first anode portion and described second plate portion, and engages with described pectination anode terminal; With
Pectination negative electrode frame engages with described first negative pole part and described second negative pole part, and engages with described pectination cathode terminal.
8. digital signal processing appts according to claim 1 is characterized in that further comprising:
The DC/DC transducer has the input that is connected with power supply and is connected with power line to supply with the output of described electric power;
First smmothing capacitor is connected with the described input of described DC/DC transducer; With
Second smmothing capacitor is connected with the described output of described DC/DC transducer, and have when 100kHz greater than 0 and during at the equivalent series resistance below the 25m Ω with at 500MHz greater than 0 and equivalent series inductance below 800pH.
9. digital signal processing appts according to claim 8 is characterized in that,
Described second smmothing capacitor comprises:
First capacitor element has first solid electrolyte layer, first anode portion and first negative pole part, and described first solid electrolyte layer is made of conducting polymer;
The pectination anode terminal has first installed surface, and is connected with the described first anode portion of described first capacitor element;
The pectination cathode terminal has second installed surface, and is connected with described first negative pole part of described first capacitor element, and the distance of described second installed surface and described first installed surface is greater than 0 and below 2mm; With
The insulation-encapsulated resin is so that the mode that described first installed surface and described second installed surface expose covers described pectination anode terminal, described pectination cathode terminal and described first capacitor element.
10. digital signal processing appts according to claim 9 is characterized in that,
Described second installed surface of described pectination cathode terminal has the roughly the same shape of described first negative pole part with described first capacitor element.
11. digital signal processing appts according to claim 9 is characterized in that,
Described pectination anode terminal has first placed side of the opposition side that is positioned at described first installed surface, and is placed with described first capacitor element on described first placed side,
Described pectination cathode terminal has second placed side of the opposition side that is positioned at described second installed surface, and is placed with described first capacitor element on described second placed side,
Described pectination anode terminal has first shielding part that is covered by described potting resin, this first shielding part from described first installed surface to not only extending towards described pectination cathode terminal but also towards the direction of described first capacitor element,
Described pectination cathode terminal has the secondary shielding portion that is covered by described potting resin, this secondary shielding portion from described second installed surface to not only extending towards described pectination anode terminal but also towards the direction of described first capacitor element.
12. digital signal processing appts according to claim 11 is characterized in that,
Described pectination anode terminal and described pectination cathode terminal are configured on the prescribed direction,
Described pectination anode terminal has the two ends on the direction of intersecting with described prescribed direction,
Described pectination anode terminal comprises:
First connecting portion, from each end at the described two ends of described pectination anode terminal to intersect with described first placed side and away from the direction of described first placed side extend and
First planar portions for plane, is connected with described first connecting portion, and extends to the direction away from described first placed side.
13. digital signal processing appts according to claim 12 is characterized in that,
Described pectination cathode terminal has the two ends on the described direction of intersecting with described prescribed direction,
Described pectination cathode terminal comprises:
Second connecting portion, from each end at the described two ends of described pectination cathode terminal to intersect with described second placed side and away from the direction of described second placed side extend and
Second planar portions for plane, is connected with described second connecting portion, and extends to the direction away from described second placed side.
14. digital signal processing appts according to claim 8 is characterized in that,
Described second smmothing capacitor also comprises:
Second capacitor element is stacked on described first capacitor element, has second solid electrolyte layer that is made of conducting polymer, and has the second plate portion and second negative pole part;
The pectination anode frame engages with described first anode portion and described second plate portion, and engages with described pectination anode terminal; With
Pectination negative electrode frame engages with described first negative pole part and described second negative pole part, and engages with described pectination cathode terminal.
15. digital signal processing appts according to claim 1 is characterized in that,
Also comprise substrate, described substrate comprises first conductive layer and the insulating barrier that is arranged on described first conductive layer,
Described parts also have the earth terminal that is connected with described conductive layer,
Described decoupling capacitor is connected between described power line and the described conductive layer.
16. digital signal processing appts according to claim 15 is characterized in that,
Described substrate also comprises second conductive layer that is connected with described first conductive layer.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP144987/2005 | 2005-05-18 | ||
| JP2005144987 | 2005-05-18 | ||
| JP309360/2005 | 2005-10-25 | ||
| JP309361/2005 | 2005-10-25 | ||
| JP2005309360A JP4770391B2 (en) | 2005-05-18 | 2005-10-25 | Digital signal processing board |
| JP2005309361A JP2007123309A (en) | 2005-10-25 | 2005-10-25 | Digital signal processing substrate |
| PCT/JP2006/309630 WO2006123597A1 (en) | 2005-05-18 | 2006-05-15 | Digital signal processor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101180692A true CN101180692A (en) | 2008-05-14 |
| CN101180692B CN101180692B (en) | 2011-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800173292A Expired - Fee Related CN101180692B (en) | 2005-05-18 | 2006-05-15 | Digital signal processing device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7787234B2 (en) |
| EP (1) | EP1883085A4 (en) |
| KR (1) | KR100919337B1 (en) |
| CN (1) | CN101180692B (en) |
| WO (1) | WO2006123597A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101902141A (en) * | 2009-04-29 | 2010-12-01 | 通用汽车环球科技运作公司 | Power module assembly |
| CN105515164A (en) * | 2016-01-27 | 2016-04-20 | 京东方科技集团股份有限公司 | Power supply module and electronic device |
| CN108140633A (en) * | 2015-09-25 | 2018-06-08 | 高通股份有限公司 | Metal-oxide-metal (mom) capacitor of magnetic coupling and high series resonance frequency with the reduction with peripheral circuit |
| CN111225489A (en) * | 2018-11-26 | 2020-06-02 | 杭州海康威视数字技术股份有限公司 | Power transmission circuit and electronic equipment |
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| US8451807B2 (en) * | 2006-12-20 | 2013-05-28 | Honeywell International Inc. | Configuration aware packet routing in an ad-hoc network |
| JP2008172868A (en) * | 2007-01-09 | 2008-07-24 | Denso Corp | Dc-dc converter and its design method |
| JP2012074586A (en) * | 2010-09-29 | 2012-04-12 | Ebara Corp | Electromagnet control device |
| WO2012054061A1 (en) | 2010-10-22 | 2012-04-26 | Hewlett-Packard Development Company, L.P. | Handle module |
| US20140078647A1 (en) * | 2012-09-14 | 2014-03-20 | Apaq Technology Co., Ltd. | Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the same |
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| JP2000031650A (en) * | 1998-07-14 | 2000-01-28 | Sony Corp | Printed circuit board |
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- 2006-05-15 KR KR1020077025089A patent/KR100919337B1/en not_active IP Right Cessation
- 2006-05-15 WO PCT/JP2006/309630 patent/WO2006123597A1/en active Application Filing
- 2006-05-15 CN CN2006800173292A patent/CN101180692B/en not_active Expired - Fee Related
- 2006-05-15 US US11/885,458 patent/US7787234B2/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101902141A (en) * | 2009-04-29 | 2010-12-01 | 通用汽车环球科技运作公司 | Power module assembly |
| CN101902141B (en) * | 2009-04-29 | 2013-03-27 | 通用汽车环球科技运作公司 | Power module assembly |
| CN108140633A (en) * | 2015-09-25 | 2018-06-08 | 高通股份有限公司 | Metal-oxide-metal (mom) capacitor of magnetic coupling and high series resonance frequency with the reduction with peripheral circuit |
| CN105515164A (en) * | 2016-01-27 | 2016-04-20 | 京东方科技集团股份有限公司 | Power supply module and electronic device |
| CN105515164B (en) * | 2016-01-27 | 2018-04-13 | 京东方科技集团股份有限公司 | Power supply module and electronic equipment |
| US10284005B2 (en) | 2016-01-27 | 2019-05-07 | Boe Technology Group Co., Ltd. | Power supply assembly and electronic device |
| CN111225489A (en) * | 2018-11-26 | 2020-06-02 | 杭州海康威视数字技术股份有限公司 | Power transmission circuit and electronic equipment |
| CN111225489B (en) * | 2018-11-26 | 2021-06-11 | 杭州海康威视数字技术股份有限公司 | Power transmission circuit and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1883085A4 (en) | 2010-05-12 |
| US20090160579A1 (en) | 2009-06-25 |
| KR20080002903A (en) | 2008-01-04 |
| EP1883085A1 (en) | 2008-01-30 |
| WO2006123597A1 (en) | 2006-11-23 |
| US7787234B2 (en) | 2010-08-31 |
| CN101180692B (en) | 2011-01-12 |
| KR100919337B1 (en) | 2009-09-25 |
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