CN101175362A - Charge eliminating apparatus and method, and program storage medium - Google Patents
Charge eliminating apparatus and method, and program storage medium Download PDFInfo
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- CN101175362A CN101175362A CNA2007101466776A CN200710146677A CN101175362A CN 101175362 A CN101175362 A CN 101175362A CN A2007101466776 A CNA2007101466776 A CN A2007101466776A CN 200710146677 A CN200710146677 A CN 200710146677A CN 101175362 A CN101175362 A CN 101175362A
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- mounting table
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/206—Switches for connection of measuring instruments or electric motors to measuring loads
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a charge eliminating apparatus and method, and a program storage medium capable of capable of eliminating an influence of static electricity and improving test reliability for a target object having a highly miniaturized structure made using a post-65-nm process, while preventing a damage of a device on the target object. A charge eliminating apparatus eliminates, when an electrical characteristics test of a target object is performed by moving a mounting table mounting the target object thereon and a probe card relative to each other to bring the target object into electrical contact with the probe card, static electricity of the target object via the mounting table. The charge eliminating apparatus includes a grounding wiring for grounding the mounting table; a relay switch disposed on the grounding wiring; and a switch controller that controls the relay switch to be opened or closed.
Description
Technical field
The present invention relates to neutralizer, remove method for electrically and program recorded medium, in more detail, relate at the neutralizer that carries out to eliminate when tested electrical characteristics of having a medical check-up are checked electrostatic influence charged in tested having a medical check-up, remove method for electrically and program recorded medium.
Background technology
The operation of using testing fixture to check tested the having a medical check-up (for example wafer) that is formed with a plurality of devices under original state is arranged in the back operation of semiconductor manufacturing.This testing fixture comprises detection (prober) chamber that is used for by piece ground conveyance is incorporated in the load chamber of the wafer in the box and the electrical characteristics of the wafer that is used for carrying out accepting from this load chamber are checked.
Load chamber possesses: by piece wafer transfer mechanism and prealignment (prealignment) mechanism (to call " secondary chuck (sub chuck) " in the following text) of ground conveyance wafer, it is by during the wafer transfer mechanism conveyance wafer, makes the wafer orientation unanimity with the directional plane (orientation flat) or the otch of wafer as benchmark.On the other hand, detecting chamber possesses: the mounting wafer also moves along X, Y, Z direction, simultaneously at the mounting table (to call " main card dish " in the following text) of the positive and negative rotation of θ direction, the detecting card (probe card) that is configured in main card dish top and the aligning guide that the probe (probe) of detecting card is aimed at the wafer on the main card dish.In addition, go up setting and the measuring head that detecting card electrically contacts, between tester and detecting card, receive and dispatch the signal of regulation by measuring head at the cover plate (head plate) of detecting chamber.
When carrying out the inspection of wafer, the wafer in load chamber in the wafer transfer mechanism conveyance box, after carrying out prealignment by secondary chuck, wafer transfer mechanism is positioned in wafer on the main card dish in the detecting chamber.In detecting chamber, during X, Y, Z and θ direction move, carry out the aiming at of probe of wafer and detecting card by aligning guide at the main card dish.Afterwards, the main card dish moves to X, Y direction, make initial device be positioned at probe under after, the main card rim the Z direction rises, and device and probe are electrically contacted, and carries out the inspection of device.After the inspection, the main card dish descends, and the main card dish carries out the index conveyance of wafer, carries out the inspection of other device successively.After the inspection of wafer, make wafer return original position in the box, remain the inspection of wafer successively by main card dish and wafer transfer mechanism.
But when checking, when moving because of the main card dish and the friction of air etc., main card dish and wafer can be with static.This phenomenon is difficult to avoid, if ignore, then because of the influence of static, the distribution structure of device might sustain damage in checking process.Particularly owing to the fine structureization of device, it is obvious all the more that this phenomenon becomes.Therefore, the inventor has proposed a kind of electrical mechanisms of removing of main card dish in patent documentation 1.Remove in the electrical mechanisms at this, during carrying out the wafer handing-over between wafer transfer mechanism and the main card dish, remove the static of main card dish.
[patent documentation 1] TOHKEMY 2003-218175
But, because the removing electrical mechanisms and from the inspection of the inspection that the begins one piece of wafer wafer till finish, can't from the main card dish, remove static of patent documentation 1, therefore, in the inspection of one piece of wafer, static is accumulated on wafer and the main card dish gradually, along with the carrying out of checking, difference can appear in the check result between device, and the reliability of inspection might descend.Particularly, recently, if the distribution structure of device becomes the later structure of 65nm technology, then when checking to apply electric current minimum, so wafer is subjected to the influence of static to become obvious, influence to check result becomes big, and reliability reduces, even the distribution structure of device might sustain damage.
Summary of the invention
The present invention produces in order to solve above-mentioned problem, its purpose is to provide a kind of influence that can eliminate static, even tested the having a medical check-up of the hyperfine structure that 65nm technology is later also can be improved tested reliability of having a medical check-up, and can prevent reliably device damage neutralizer, remove method for electrically and program recorded medium.
First aspect present invention is a kind of neutralizer, it is characterized in that, in this neutralizer, tested mounting table of having a medical check-up and detecting card relatively move, above-mentioned tested on above-mentioned mounting table had a medical check-up and electrically contacted with above-mentioned detecting card and when checking above-mentioned tested electrical characteristics of having a medical check-up, remove above-mentioned tested static of having a medical check-up via above-mentioned mounting table, this neutralizer comprises: with the earthy distribution of above-mentioned mounting table ground connection; Be located at the relay switch in this earthy distribution and the controller of this relay switch of open and close controlling.
The neutralizer of second aspect present invention, according to the described neutralizer of first aspect, it is characterized in that above-mentioned mounting table has the top board that becomes above-mentioned tested mounting surface of having a medical check-up, above-mentioned earthy distribution is connected with formed first electrically conductive film on above-mentioned top board.
The neutralizer of third aspect present invention according to first or the described neutralizer of second aspect, is characterized in that above-mentioned mounting table is connected with measuring head via cable, and above-mentioned earthy distribution is electrically connected with the center conductor of above-mentioned cable.
The neutralizer of fourth aspect present invention according to second or the described neutralizer of the third aspect, is characterized in that the external conductor of above-mentioned cable is electrically connected with formed second electrically conductive film below above-mentioned top board.
The neutralizer of fifth aspect present invention, is characterized in that the external conductor of above-mentioned cable is connected with the receiver of above-mentioned relay switch via distribution according to the described neutralizer of fourth aspect.
The neutralizer of sixth aspect present invention, is characterized in that above-mentioned relay switch is can manually operated mode constituting according to the described neutralizer of either side in first～the 5th aspect.
Seventh aspect present invention is a kind of method for electrically that removes, it is characterized in that, in the method, tested mounting table of having a medical check-up and detecting card relatively move, have a medical check-up at mounting above-mentioned tested on above-mentioned mounting table and to electrically contact with above-mentioned detecting card and carry out above-mentioned tested electrical characteristics of having a medical check-up when checking, the relay switch that use is located in the earthy distribution of above-mentioned mounting table is removed above-mentioned tested static of having a medical check-up, this method comprises: first operation, it is above-mentioned tested having a medical check-up when not electrically contacting with above-mentioned detecting card, by the above-mentioned relay switch of closure, with above-mentioned mounting table ground connection, remove above-mentioned tested static of having a medical check-up; With second operation, it removes the ground connection of above-mentioned mounting table above-mentioned tested having a medical check-up when electrically contacting with above-mentioned detecting card by disconnecting above-mentioned relay switch.
The described method for electrically that removes of eighth aspect present invention according to the described method for electrically that removes in the 7th aspect, is characterized in that above-mentioned first operation is the operation that above-mentioned detecting card and above-mentioned mounting table relatively move.
The described method for electrically that removes of ninth aspect present invention, according to the described method for electrically that removes in the 7th aspect, it is characterized in that above-mentioned first operation comprises: the above-mentioned tested operation of having a medical check-up of mounting and on above-mentioned mounting table to above-mentioned tested having a medical check-up and operation that above-mentioned detecting card is aimed at.
The described method for electrically that removes of tenth aspect present invention according to the described method for electrically that removes in the 7th aspect, is characterized in that above-mentioned first operation comprises from above-mentioned mounting table removes above-mentioned tested operation of having a medical check-up.
The described on the one hand method for electrically that removes of the present invention the tenth according to the described method for electrically that removes in the 7th aspect, is characterized in that above-mentioned second operation comprises the operation that above-mentioned mounting table is overdrived.
The present invention the 12 aspect is a kind of program recorded medium, it is characterized in that, be to write down to carry out the following recording medium that removes method for electrically, computer drives, in the method, tested mounting table of having a medical check-up and detecting card are relatively moved, tested on making above-mentioned mounting table had a medical check-up and electrically contacted with above-mentioned detecting card and carry out above-mentioned tested electrical characteristics of having a medical check-up when checking, be located at the relay switch in the earthy distribution of above-mentioned mounting table by use, remove above-mentioned tested static of having a medical check-up via above-mentioned mounting table, this program recorded medium is carried out following operation: first operation, it is above-mentioned tested having a medical check-up when not electrically contacting with above-mentioned detecting card, by the above-mentioned relay switch of closure,, remove above-mentioned tested static of having a medical check-up with above-mentioned mounting table ground connection; With second operation, it removes the ground connection of above-mentioned mounting table above-mentioned tested having a medical check-up when electrically contacting with above-mentioned detecting card by disconnecting above-mentioned relay switch.
The invention effect
According to the present invention, a kind of influence that can eliminate static can be provided, even tested the having a medical check-up of the hyperfine structure that 65nm technology is later also can be improved the reliability of tested inspection of having a medical check-up, and can prevent reliably that the neutralizer of the damage of device from reaching except that method for electrically and program recorded medium.
Description of drawings
Fig. 1 is that partly section represents to use the front elevation of structure example of testing fixture of an execution mode of neutralizer of the present invention.
Fig. 2 is the sectional drawing of the top board of testing fixture shown in Figure 1.
Fig. 3 is the calcspar of neutralizer shown in Figure 1.
Fig. 4 (a)～(c) is respectively the time flow chart that removes method for electrically of expression wafer.
Symbol description
10: testing fixture
14: main card dish (mounting table)
14A: top board
14C: first electrically conductive film
14D: second electrically conductive film
15: detecting card
15A: probe
18: cable (cable)
20: neutralizer
22: earthy distribution
23: relay switch
23C: box (case)
26: on-off controller
W: wafer
Embodiment
Below, according to Fig. 1～execution mode explanation the present invention shown in Figure 4.In addition, in each figure, Fig. 1 is that partly section represents to use the front elevation of structure example of testing fixture of an execution mode of neutralizer of the present invention, Fig. 2 is the sectional drawing of the top board of testing fixture shown in Figure 1, Fig. 3 is the calcspar of neutralizer shown in Figure 1, and Fig. 4 (a)～(c) is respectively the time flow chart that removes method for electrically of expression wafer.
Possess present embodiment neutralizer testing fixture 10 as shown in Figure 1, possess load chamber 11 and detecting chamber 12, constitute in the mode of the electrical characteristics inspection of under the control of controller (not shown), carrying out wafer W.
As shown in Figure 1, load chamber 11 possesses: take in the incorporating section (not shown) of a plurality of wafer W, wafer W moved into the secondary chuck (not shown) of wafer transfer mechanism (not shown) of taking out of the incorporating section and the prealignment that carries out wafer W.In load chamber 11, wafer transfer mechanism carries out carrying out the handing-over of wafer W after the prealignment between load chamber and detecting chamber 12 in secondary chuck during the conveyance wafer W.
As shown in Figure 1, detecting chamber 12 possesses: the mounting table that mounting wafer W and along continuous straight runs and above-below direction move (to call " main card dish " in the following text) 14, be configured in the detecting card 15 of these main card dish 14 tops and the aligning guide (not shown) that a plurality of probe 15A of this detecting card 15 are aimed at the wafer W on the main card dish 14.In detecting chamber 12, utilize aligning guide to the wafer W on the main card dish 14 with after a plurality of probe 15A of detecting card 15 aim at, a plurality of probe 15A and wafer W are electrically contacted, carry out the electrical characteristics inspection of wafer W.When wafer W being carried out the electrical characteristics inspection, via measuring head (test head) T that is configured in above the detecting card 15, the signal of transmitting-receiving regulation between tester (not shown) and detecting card 15.Moreover detecting card 15 is fixed on the peristome of cover plate 16.
As shown in Figure 1, main card dish 14 for example possesses top board 14A that can the vacuum suction wafer W and the elevating mechanism 14B that makes top board 14A lifting, and when moving by XY platform 17 along continuous straight runs, by elevating mechanism 14B the mode of top board 14A lifting is constituted.For example shown in Figure 2, top board 14A is formed by insulated substrates such as potteries, is formed with the first electrically conductive film 14C in the above, is formed with the second electrically conductive film 14D simultaneously in its lower section.First, second electrically conductive film 14C, 14D are formed by the film of for example metal.
In addition, as shown in Figure 1, top board 14A is by being electrically connected with measuring head T with employed cable 18 as measuring.Cable 18 as shown in Figure 3, comprise: become the center conductor 18A that measures voltage, measure the drive access of electric current, coat first external conductor (the first for example netted shielded conductor) 18B of center conductor 18A and coat second external conductor (for example netted secondary shielding conductor) 18C of the first shielded conductor 18B via insulating material via insulating material, and be electrically connected with measuring head T via the first connector 19A, simultaneously, be electrically connected with top board 14A one side via the second connector 19B.
As Fig. 1～shown in Figure 3, the center conductor 18A of cable 18 is electrically connected with the first electrically conductive film 14C of top board 14A, and the first shielded conductor 18B is electrically connected with the second electrically conductive film 14D of top board 14A.The secondary shielding conductor 18C of cable 18 is grounded as shown in Figure 3.Therefore, measuring head T sends the inspection signal by detecting card 15 to wafer W when detecting card 15 and wafer W electrically contact, simultaneously, the center conductor 18A by the cable 18 also first electrically conductive film 14C above top board 14A sends and checks signal, carries out the electrical characteristics inspection of wafer W.
So, the neutralizer 20 of present embodiment, as Fig. 1, shown in Figure 3, possess: the earthy distribution 22 that two ends are connected with ground wire 21 with the center conductor 18A of cable 18 respectively, be located at the relay switch 23 of the half-way of earthy distribution 22, be located at the earth resistance 24 between ground wire 21 and the relay switch 23, the supporting substrates 25 of supporting relay switch 23 and earth resistance 24, relay switch 23 is carried out the on-off controller 26 and the shell 27 of taking in on-off controller 26 part in addition of folding control, when carrying out the inspection of wafer W, its folding control relay switch 23 regularly under the control of on-off controller 26, remove in the top board 14 with static.As shown in Figure 1, this neutralizer 20 is installed on the cover plate 16 via shell 27.
As shown in Figure 3, relay switch 23 comprises coil 23A, in coil 23A along the axle core and switch 23B that is provided with and the box 23C that takes in coil 23A, it moves according to the signal from on-off controller 26.Coil 23A is electrically connected with controller cable 28 via distribution 23D.Controller cable 28 is electrically connected with on-off controller 26 by I/O plate 28A.The end of switch 23B is electrically connected with earthy distribution 21, according to signal from on-off controller 26, be electrically connected center conductor 18A and the ground wire 21 of cable 18 during by the application of force at coil 23A, releasing center conductor 18A and ground wire 21 is connected when coil 23A is disengaged the application of force.The first shielded conductor 18B of cable 18 is extended near switch 23B by distribution 22A, and be electrically connected with coil box 23C, therefore, switch 23B is set at the current potential that equates substantially with coil box 23C, like this, just can control and make an uproar from leakage current or the electricity of earthy distribution 22 or switch 23B.And the second electrically conductive film 18D below the first shielded conductor 18B of cable 18 and the top board 14 is electrically connected, therefore, also can apply and the identical voltage of first electrically conductive film 14C cardinal principle to the second electrically conductive film 14D.So just can suppress drain current, improve the mensuration precision of device from the first electrically conductive film 14C.
On-off controller 26 constitutes as the part of the controller of being made up of computer.On-off controller 26 is installed in the controller via writing down the recording medium of carrying out the program of removing method for electrically of the present invention.
Push-button switch 29 is installed on the shell 27 of neutralizer 20, by operator's pressing operation push-button switch 29, just can apply effect to relay switch 23, removes.As shown in Figure 3, this push-button switch 29 is electrically connected with the distribution 23D of coil 23A via diode 29A.When carrying out the inspection of wafer W, do not use push-button switch 29, for example, when maintenance, just use.
Below, with reference to Fig. 4 (a)～(c), an execution mode that removes method for electrically of the present invention that uses neutralizer 20 is described.Of the present inventionly remove method for electrically as mentioned above, be recorded in the controller via recording medium as on-off controller 26 its programs.
When carrying out the inspection of wafer W, in load chamber 11, wafer transfer mechanism takes out of wafer W from the incorporating section, in secondary chuck, carry out after the prealignment, with wafer W mounting (loading) on the main card dish 14 of standby in detecting chamber 12.Wafer W on from the incorporating section to the top board 14A that is loaded in main card dish 14 during, shown in Fig. 4 (a), on-off controller 26 startings apply effect to relay switch 23.Utilize the effect of relay switch 23, switch 23B closure, the first electrically conductive film 14C of top board 14A is grounded via the center conductor 18A and the earthy distribution 22 of cable 18.Like this, via top board 14A remove on wafer W and top board 14A with static.
If wafer transfer mechanism is positioned in wafer W on the top board 14A, then after by top board 14A vacuum suction wafer W, main card dish 14 will move along horizontal direction.During this period, main card dish 14 carries out the aiming at of probe 15A of wafer W and detecting card 15 with the aligning guide coordination.During this period, though in wafer W and top board 14A, will be with static,, because top board 14A is grounded, therefore, to wafer W with till the 15A that pops one's head in contacts during, the static of wafer W and top board 14A is removed via top board 14A, so can not be with static on the wafer W.After the aligning of wafer W finishes, the initial device in the wafer W be positioned at probe 15A under, in this position, the elevating mechanism 14B of main card dish 14 drives, so wafer W rises, device contacts with the 15A that pops one's head in.In this contact, on-off controller 26 actions, so, relay switch 23 releasing effects, switch 23B opens, and removes the ground connection of top board 14A, interrupts removing from wafer W and top board 14A.
After device and probe the contacting of 15A, elevating mechanism 14B via main card dish 14, wafer W overdrive (overdriver), wafer W electrically contacts with probe 15A, send inspection signal from tester to detecting card 15 by measuring head T, simultaneously, also apply as detecting via the first electrically conductive film 14C of center conductor 18A above top board 14A of cable 18 from measuring head T and to use voltage of signals, carry out the electrical characteristics inspection of device.At this moment, be applied on the second electrically conductive film 14D below the top board 14A with the roughly the same voltage of the first electrically conductive film 14C.Like this, just can suppress drain current, improve the mensuration precision of device from the first electrically conductive film 14C.Because the second electrically conductive film 14D below the top board 14A is electrically connected with box 23C by the first shielded conductor 18B and the distribution 22A of cable 18, so, the current potential that can not only make the switch 23B that is located in the earthy distribution 22 and box 23C and can suppress to make an uproar from leakage current or the electricity of ground connection distribution 22 or switch 23B about equally.
In case finish the inspection of initial device, top board 14A will descend by elevating mechanism 14B, so device is disengaged with contacting of 15A of probe.In this down maneuver, according to command signal from on-off controller 26, relay switch 23 actions, Closing Switch 23B makes the first electrically conductive film 14C ground connection of top board 14, shown in Fig. 4 (b), in checking process, via top board 14A remove in wafer W and top board 14A with static.Main card dish 14 moves and wafer W is carried out the index conveyance to directions X or Y direction, next device arrive probe 15A under after, top board 14A rises by elevating mechanism 14B, device electrically contacts with probe 15A.The down maneuver from top board 14A begin till the contact action during, remove the static of wafer W and top board 14A via top board 14A.When 15A contact with probe, according to the command signal from on-off controller 26, operational relay switch 23 was opened switch 23B in wafer W, interrupt from top board 14A except that.Under this state, send inspection from measuring head T via probe 15A and use signal, repeat the electrical characteristics inspection of above-mentioned device.
In case the inspection of the last device in the end wafer W, top board 14A will descend.In this down maneuver, according to the command signal from on-off controller 26, the switch 23B of relay switch 23 closes, and carries out remove electric (with reference to Fig. 4 (c)) of wafer W and top board 14A.Main card dish 14 is checked the wafer W finish and to load chamber 11 1 side shiftings in order to transmit, the wafer W on the wafer transfer mechanism of standby in the load chamber 11 unloading main card dish 14.After unloading wafer W, after the wafer W that wafer transfer mechanism finishes inspection is sent the incorporating section back to, from the incorporating section, take out of next wafer W.Wafer transfer mechanism will be transmitted by the main card dish 14 of the wafer W behind the secondary chuck prealignment to standby in detecting chamber 12.After wafer W being positioned on the main card dish 14, repeat the inspection that wafer W is carried out in above-mentioned action, and, when wafer W does not contact with probe 15A, carry out removing from wafer W and top board 14A.Moreover, also can use and have the wafer transfer mechanism of two carrying arms up and down, carrying arm by a side is taken out of wafer W from the incorporating section, carry out prealignment and wait for the wafer W that inspection finishes, in the moment of the wafer W arrival wafer transfer mechanism that inspection finishes, by the opposing party's carrying arm unloading wafer W, afterwards, load by a side carrying arm.
As mentioned above, outside when wafer W contacts with probe 15A, remove the static of wafer W and top board 14A via top board 14A, therefore, the chance of static is minimum on the wafer W band, can both keep identical substantially a little charge from initial device to last device, therefore, the check result of initial device during the last device can be not uneven, thereby can carry out the high inspection of reliability.In addition, because of the quantity of electric charge in the wafer W is few, so also can damage device in checking process.
As described above, according to present embodiment, neutralizer 20 comprises: with the earthy distribution 22 of main card dish 14 ground connection, be located at the on-off controller 26 that this relay switch 23 is controlled in relay switch 23 and folding in this earthy distribution 22, can carry out following operation: when wafer W does not electrically contact with probe 15A, make the top board 14A ground connection of main card dish 14, the operation of removing the static of wafer W and top board 14A by closing relay switch 23; With when wafer W electrically contacts with probe 15A, remove the operation of the ground connection of top board 14A by opening relay switch 23, therefore, in the checking process of wafer W, can accumulate static hardly in wafer W, even the wafer W of the hyperfine structure that 65nm technology is later also can improve the reliability of inspection, and can prevent the damage of device distribution structure reliably.
According to present embodiment, because the top board 14A of main card dish 14 is connected with measuring head T by cable 18, earthy distribution 22 is electrically connected with the center conductor 18A of cable 18, so the center conductor 18A of cable 18 can be used as the earthy distribution of neutralizer 20.
In addition, according to present embodiment, because the first shielded conductor 18B of cable 18 is electrically connected with the receiver 23C of relay switch 23 by distribution 22A, therefore, by switch 23B and box 23C being set at current potential about equally, just can suppress to make an uproar from leakage current or the electricity of earthy distribution 22 or switch 23B.In addition, because the second electrically conductive film 14D of the first shielded conductor 18B below top board 14A of cable 18 is connected, so, can apply roughly the same voltage to the second electrically conductive film 14D with the first electrically conductive film 14C, like this, just can suppress leakage current, improve the mensuration precision of device from the first electrically conductive film 14C.Because relay switch 23 is connected with push-button switch 29, and adopts and can manually operated mode constitute, so, when checking, take place by pushbutton switch 29, just can remove the static of wafer W under the situation of the unusual grade that static caused with promptly protecting.
Moreover, in the above-described embodiment, be illustrated relative to the testing fixture that detecting card moves for main card dish (mounting table), still, also can be the testing fixture that detecting card moves relative to mounting table.In addition, in the above-described embodiment, the neutralizer that is applied in the testing fixture of checking wafer W is illustrated, still, the present invention also can be applicable in the wafer testing fixture in addition.
Industrial applicibility
The present invention is suitable for being applied in the testing fixture of field of semiconductor manufacture.
Claims (12)
1. a neutralizer is characterized in that,
In this neutralizer, tested mounting table of having a medical check-up and detecting card relatively move, described tested on described mounting table had a medical check-up and electrically contacted with described detecting card and when checking described tested electrical characteristics of having a medical check-up, remove described tested static of having a medical check-up via described mounting table, and this neutralizer comprises:
Earthy distribution with described mounting table ground connection; Be located at the relay switch in this earthy distribution and the controller of this relay switch of open and close controlling.
2. neutralizer according to claim 1 is characterized in that,
Described mounting table has the top board that becomes described tested mounting surface of having a medical check-up, and described earthy distribution is connected with formed first electrically conductive film on described top board.
3. neutralizer according to claim 1 and 2 is characterized in that,
Described mounting table is connected with measuring head via cable, and described earthy distribution is electrically connected with the center conductor of described cable.
4. according to claim 2 or 3 described neutralizers, it is characterized in that,
The external conductor of described cable is electrically connected with formed second electrically conductive film below described top board.
5. neutralizer according to claim 4 is characterized in that,
The external conductor of described cable is connected with the receiver of described relay switch via distribution.
6. according to each described neutralizer in the claim 1～5, it is characterized in that,
Described relay switch is can manually operated mode constituting.
7. one kind is removed method for electrically, it is characterized in that,
In the method, tested mounting table of having a medical check-up and detecting card relatively move, have a medical check-up at mounting described tested on described mounting table and to electrically contact with described detecting card and carry out described tested electrical characteristics of having a medical check-up when checking, the relay switch that use is located in the earthy distribution of described mounting table is removed described tested static of having a medical check-up, and this method comprises:
First operation, it by the described relay switch of closure, with described mounting table ground connection, removes described tested static of having a medical check-up described tested having a medical check-up when not electrically contacting with described detecting card; With second operation, it removes the ground connection of described mounting table described tested having a medical check-up when electrically contacting with described detecting card by disconnecting described relay switch.
8. the method for electrically that removes according to claim 7 is characterized in that,
Described first operation is the operation that described detecting card and described mounting table relatively move.
9. the method for electrically that removes according to claim 7 is characterized in that,
Described first operation comprises: the described tested operation of having a medical check-up of mounting and to described tested having a medical check-up and operation that described detecting card is aimed on described mounting table.
10. the method for electrically that removes according to claim 7 is characterized in that,
Described first operation comprises from described mounting table removes described tested operation of having a medical check-up.
11. the method for electrically that removes according to claim 7 is characterized in that,
Described second operation comprises the operation that described mounting table is overdrived.
12. a program recorded medium is characterized in that,
Be to write down to carry out the following recording medium that removes method for electrically, computer drives, in described method, tested mounting table of having a medical check-up and detecting card are relatively moved, tested on making described mounting table had a medical check-up and electrically contacted with described detecting card and carry out described tested electrical characteristics of having a medical check-up when checking, be located at the relay switch in the earthy distribution of described mounting table by use, remove described tested static of having a medical check-up via described mounting table, this program recorded medium is carried out following operation:
First operation, it by the described relay switch of closure, with described mounting table ground connection, removes described tested static of having a medical check-up described tested having a medical check-up when not electrically contacting with described detecting card; With second operation, it removes the ground connection of described mounting table described tested having a medical check-up when electrically contacting with described detecting card by disconnecting described relay switch.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-297979 | 2006-11-01 | ||
| JP2006297979 | 2006-11-01 | ||
| JP2006297979 | 2006-11-01 | ||
| JP2007063310A JP4068127B2 (en) | 2006-11-01 | 2007-03-13 | Static elimination device, static elimination method, and program recording medium |
| JP2007-063310 | 2007-03-13 | ||
| JP2007063310 | 2007-03-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101175362A true CN101175362A (en) | 2008-05-07 |
| CN101175362B CN101175362B (en) | 2011-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101466776A Active CN101175362B (en) | 2006-11-01 | 2007-08-24 | Charge eliminating apparatus and method, and program storage medium |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4068127B2 (en) |
| KR (1) | KR100834176B1 (en) |
| CN (1) | CN101175362B (en) |
| TW (1) | TW200826213A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101728298B (en) * | 2008-10-15 | 2011-12-21 | 东京毅力科创株式会社 | Mounting table |
| CN101714517B (en) * | 2008-09-30 | 2013-01-30 | 东京毅力科创株式会社 | Inspecting apparatus and method |
| CN101604075B (en) * | 2008-06-13 | 2013-04-10 | 统宝光电股份有限公司 | Lighting test electrostatic defending device of liquid crystal display panel and method |
| CN103839848A (en) * | 2012-11-20 | 2014-06-04 | 三星显示有限公司 | Substrate static electricity inspection device and substrate manufacturing method |
| CN105530750A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备（上海）有限公司 | Wafer static conductive apparatus |
| CN107976576A (en) * | 2016-10-24 | 2018-05-01 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN111257714A (en) * | 2020-01-17 | 2020-06-09 | 上海华力集成电路制造有限公司 | Electrostatic measuring apparatus and electrostatic measuring method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011054762A (en) * | 2009-09-02 | 2011-03-17 | Tokyo Electron Ltd | Device and method for monitoring static eliminator, and monitoring program for static eliminator |
| JP6227262B2 (en) | 2013-03-06 | 2017-11-08 | 株式会社荏原製作所 | Surface potential measuring apparatus and surface potential measuring method |
| KR101515719B1 (en) * | 2013-12-23 | 2015-04-27 | 세메스 주식회사 | Probe station |
| JP7153181B2 (en) * | 2018-03-29 | 2022-10-14 | 株式会社東京精密 | Continuity test equipment, prober |
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| CN2076241U (en) * | 1990-09-30 | 1991-05-01 | 朱少武 | Explosion-proof earthing controller |
| CN2303378Y (en) * | 1997-07-29 | 1999-01-06 | 马思正 | Automatic earthing and cutting amplitude arrangement for electric appliance |
| US6346428B1 (en) | 1998-08-17 | 2002-02-12 | Tegal Corporation | Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing |
| JP2003100821A (en) | 2001-09-27 | 2003-04-04 | Sony Corp | Wafer inspecting system and inspecting method |
| JP4048412B2 (en) * | 2002-01-23 | 2008-02-20 | 東京エレクトロン株式会社 | Static elimination mechanism and inspection device for mounting table |
| KR20050018063A (en) * | 2003-08-13 | 2005-02-23 | 삼성전자주식회사 | An apparatus for wafer chucking/dechucking of semiconductor manufacturing equipment and methode at the same |
| CN100381883C (en) * | 2004-05-24 | 2008-04-16 | 统宝光电股份有限公司 | Static neutralization apparatus and machine thereof |
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2007
- 2007-03-13 JP JP2007063310A patent/JP4068127B2/en active Active
- 2007-08-24 CN CN2007101466776A patent/CN101175362B/en active Active
- 2007-09-17 KR KR1020070094236A patent/KR100834176B1/en active IP Right Grant
- 2007-10-31 TW TW096140984A patent/TW200826213A/en unknown
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101604075B (en) * | 2008-06-13 | 2013-04-10 | 统宝光电股份有限公司 | Lighting test electrostatic defending device of liquid crystal display panel and method |
| CN101714517B (en) * | 2008-09-30 | 2013-01-30 | 东京毅力科创株式会社 | Inspecting apparatus and method |
| CN101728298B (en) * | 2008-10-15 | 2011-12-21 | 东京毅力科创株式会社 | Mounting table |
| CN103839848A (en) * | 2012-11-20 | 2014-06-04 | 三星显示有限公司 | Substrate static electricity inspection device and substrate manufacturing method |
| CN105530750A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备（上海）有限公司 | Wafer static conductive apparatus |
| CN107976576A (en) * | 2016-10-24 | 2018-05-01 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN111257714A (en) * | 2020-01-17 | 2020-06-09 | 上海华力集成电路制造有限公司 | Electrostatic measuring apparatus and electrostatic measuring method |
| CN111257714B (en) * | 2020-01-17 | 2022-11-29 | 上海华力集成电路制造有限公司 | Electrostatic measuring apparatus and electrostatic measuring method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101175362B (en) | 2011-12-14 |
| KR100834176B1 (en) | 2008-05-30 |
| TW200826213A (en) | 2008-06-16 |
| JP2007180580A (en) | 2007-07-12 |
| KR20080039784A (en) | 2008-05-07 |
| JP4068127B2 (en) | 2008-03-26 |
| TWI362712B (en) | 2012-04-21 |
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