CN101167174A - Electrostatic chuck device - Google Patents
Electrostatic chuck device Download PDFInfo
- Publication number
- CN101167174A CN101167174A CNA2005800496044A CN200580049604A CN101167174A CN 101167174 A CN101167174 A CN 101167174A CN A2005800496044 A CNA2005800496044 A CN A2005800496044A CN 200580049604 A CN200580049604 A CN 200580049604A CN 101167174 A CN101167174 A CN 101167174A
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- Prior art keywords
- power supply
- electrostatic chuck
- workpiece
- electrode pattern
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Abstract
An electrostatic chuck apparatus is provided, which is revered to a work piece capable of adsorption in a short time by a simple process. An electrode (1) is divided into a plurality of areas (1a) within a plane parallel to the work piece (W), independent electrode patterns (1b) are arranged for the areas (1a), respectively, power supply sections (1c) for the electrode patterns (1b) are arranged in the areas (1a), respectively, and power supply to the electrode pattern (1b) arranged on the discretionary area (1a) is partially stopped by cutting the discretionary power supply section (1c). Thus, even when a part of a film plane in the areas (1a) is destroyed, though the electrode pattern (1b) in the destroyed area (1a) selectively does not function as an electrostatic chuck, the electrode patterns (1b) in other areas (1a) function as electrostatic chucks.
Description
Technical area
The present invention relates to a kind of electrostatic chuck device, for example in the manufacture process of LCD (LCD) or plasma display flat-panel display panels such as (PDP), the substrate assembling apparatus of the baseplate-laminating machine that is used in the workpiece of glass substrates such as comprising absorption maintenance CF glass or TFT glass or synthetic resin system substrate etc. and fits, or the base board delivery device of conveyance substrate, or the semiconductor-fabricating device of the workpiece of processing silicon chip etc. etc.
Particularly, the present invention relates to by to mutually opposed with workpiece and with the electrode application voltage of planar configuration, and the electrostatic chuck device of Electrostatic Absorption workpiece.
Background technology
In the past, in a vacuum that two substrates is the overlapping baseplate-laminating machine, utilized electrostatic chuck to keep substrate, still, in recent years,, be difficult to make large-sized electrostatic chuck, and promptly allow to make and also become the very high high price product of price along with the maximization of substrate.
Therefore, in order to address the above problem, and, there is the electrostatic chuck device of a plurality of electrostatic chucks of alignment arrangements for corresponding large substrate.
Example as this electrostatic chuck device, on the pedestal (base plate) of the area that can adsorb large-scale workpiece (being adsorbed body), plural electrostatic chuck joint is fixed as same plane, simultaneously, by conducting in the electrode terminal of the internal electrode of each electrostatic chuck through hole by base plate, from the mutual electric distribution of pedestal dorsal part, thereby constitute electrostatic chuck unit (for example, with reference to patent documentation 1).
[patent documentation 1] Japanese Patent Application Laid-Open 2002-252274 communique (1-6 page or leaf, Fig. 1-7)
Summary of the invention
In lcd productive line that utilizes this electrostatic chuck device etc., especially in assembling, cullet (fragment) etc. can be transported on the glass substrate, along with the Electrostatic Absorption of substrate, by these cullet are clamped between the electrostatic chuck, thereby sometimes the face of this electrostatic chuck is partly destroyed and cause fault.
If the face of electrostatic chuck is even a part is destroyed, the whole functional of this electrostatic chuck then stops, simultaneously, expose and apply high-tension electrode, so, especially, when make-up machine uses under approaching the state of vacuum in as vacuum, and the grounding parts of metallic pedestal between carry out arc discharge or the unfavorable condition that overcurrent might appear taking place in plasma discharge etc. is carried out in the Paschen zone when vacuumizing.
For this point, following problem is arranged under the situation of patent documentation 1.Its problem is: because dispose plural electrostatic chuck, so, can use the electrostatic chuck except the ruined electrostatic chuck of face, still, the ruined electrostatic chuck of a face part can not be repaired at the scene, therefore, in order to prevent above-mentioned discharge, have to exchange a face part ruined electrostatic chuck itself, thereby cost rises, simultaneously, owing to can not restart the running of whole production line before this exchange end-of-job, running rate reduces.
In order to shorten the time of this electrostatic chuck of exchange, near the place is set, must always have the spare part of electrostatic chuck in advance, thereby exist the problem that total cost uprises.
Among the present invention, scheme 1 described invention, its purpose is that restoring at short notice with simple processing is adsorbable workpiece.
In order to achieve the above object, the solution of the present invention 1 described invention, it is characterized in that, in the plane parallel, dividing electrodes become a plurality of zones with workpiece, in these each zones independently electrode pattern is set respectively, simultaneously, the power supply to each electrode pattern is set respectively in each zone, cut off power supply arbitrarily, and partly stop to being disposed at the power supply of the electrode pattern in zone arbitrarily.
Thereby can restore at short notice with simple processing is adsorbable workpiece.
Its result, with destroy and the discharge that causes must exchange the electrostatic chuck in the past of the ruined electrostatic chuck of face itself and compares by face in order to prevent, even the part of face is destroyed, need not exchange whole its electrostatic chuck in order to prevent discharge yet, so, not only can carry out several and repair, and can reduce total cost, simultaneously, also can reduce electrostatic chuck spare part have a number.
Especially, when use electrostatic chuck devices of the present invention such as lcd productive line, even the part of face is destroyed, also can prevent discharge definitely, simultaneously, restart the running of whole production line at short notice, so do not reduce running rate, and can expect stable output.
The invention of scheme 2, except that the effect of scheme 1 described invention, a plurality of power supplies are near each other to be arranged by making, simultaneously, near these power supplies, form the crack along this power supply, if insert cutleries such as cutter or scissors from the crack, then can cut off the power supply that aimed at one, simultaneously, can not cut off the edge at generation breaches such as the films that constitutes electrode from it.
Therefore, carry out the cut-out work in each zone easily, simultaneously, can prevent being injured once more of the electrode that causes by the breach diffusion of following cut-out work to produce.
The invention of scheme 3, outside scheme 1 or 2 described inventions, by mutually opposed with workpiece and a plurality of power supplies of configuration on the exterior lateral area of electrostatic chuck function face of electrode pattern are set, thereby the space in order to ensure power supply does not enter in the zone of electrostatic chuck function face, and can guarantee the effective area of broad binding domain.
Therefore, more do not reduce the Electrostatic Absorption function, and the space of occupying that can guarantee power supply.
Therefore, partly outstanding even follow the cut-out of power supply to handle, also can suppress bad influence to workpiece.
The invention of scheme 5, except that the effect of the invention of scheme 4, by the selective rhizotomy part of sealing power supply in the recess of pedestal, thereby the selective rhizotomy of power supply part is not exposed.
Therefore, can prevent discharge between selective rhizotomy part and the metal pedestal.
The invention of scheme 6 outside the effect of the invention of scheme 1,2,3,4 or 5, is disposed the annular seal material and is sealed in the mode around the selective rhizotomy part of power supply, thereby through annular seal material blocking cut-off parts and its outside atmosphere (environment).
Therefore, easy and definite encapsulation process can be carried out at short notice, simultaneously, containment member can be re-used.
Description of drawings
Fig. 1 is the transversal front elevation of the embodiment 1 of expression electrostatic chuck device of the present invention;
Fig. 2 is the transversal front elevation of the major part of part enlarged drawing 1;
Fig. 3 is the amplification vertical profile side view of (3)-(3) line along Fig. 2, and (a) expression just often (b) is represented to power when stopping;
Fig. 4 is the transversal front elevation of the embodiment 2 of expression electrostatic chuck device of the present invention;
Fig. 5 amplifies the vertical profile side view of major part for part, and (a) expression just often (b) is represented to power when stopping;
Fig. 6 amplifies the vertical profile side view of the embodiment 3 of electrostatic chuck device of the present invention for representing part, when the expression power supply stops;
Fig. 7 amplifies the transversal upward view of major part for part.
(description of reference numerals)
A... electrostatic chuck device W... workpiece
1... electrode 1 ' ... electrostatic chuck function face
1a... regional 1b... electrode pattern
1c... power supply 1c ' ... cut-off parts
3... the pedestal 3a... back side
4a, 4b... piece 4c... conclude member
5... cover material 6... annular seal material
11... holding plate 11a... substrate-side surface
Embodiment
Represent that electrostatic chuck device A of the present invention is configured in the situation of baseplate-laminating machine, this baseplate-laminating machine Electrostatic Absorption is as the glass substrate of LCD (LCD) panel of workpiece W etc. and fit.
This baseplate-laminating machine, make two substrates remain on the phase opposed faces of the holding plate 11 of a pair of configuration up and down respectively as workpiece W, after division is formed at and reaches the specified vacuum degree in its confined space (not shown) on every side, holding plate relatively moves to the adjustment of XY θ direction up and down, carries out substrate location to each other.Afterwards, force to peel off upper substrate from last holding plate, ring-type bonding agent on infrabasal plate or the moment crimping of sealing material (not shown), thereby seal also superimposed between the two after, be used in the draught head of the inside and outside generation of two substrates, to be forced into predetermined gap between two substrates, thereby finish bonding process.
And, on the substrate-side of above-mentioned holding plate 11, it disposes electrostatic chuck device A of the present invention on the whole, perhaps a plurality of electrostatic chuck device A are engaged one another and with shape arranged side by side configuration so that each adsorption plane becomes same plane, thereby even also can adsorb maintenance definitely for large-scale workpiece (substrate) W.
Electrostatic chuck device A of the present invention is, as Fig. 1～shown in Figure 5, by mutually opposed with workpiece W and form planar electrode 1, be laminated in the dielectric layer 2 of this electrode 1 and be arranged at film like that the pedestal 3 with workpiece W opposition side constitutes or tabular laminated structure, with respect to the substrate-side surface 11a of above-mentioned holding plate 11 back side 3a loading and unloading assembling freely with this pedestal 3 along these.
Above-mentioned dielectric layer 2 is, the insulating properties organic material of the elastically deformable that constitutes by the engineering plastics of polyimides, polyether-ether-ketone (PEEK), PEN (PEN) etc. for example, form more than 2 layers or 3 layers or the film like of one deck, perhaps by for example Al
2O
3, SiC, AlN, Zr
2O
3Deng pottery or its outer inorganic material etc. form lamellarly, and only be bonded in the two sides that forms planar electrode 1 or workpiece side surface and stacked.
When the dielectric layer 2 of the organic material system of the workpiece side superficial layer laminated polyimide of above-mentioned electrode 1 or PEEK etc., the outstanding advantage of electrical characteristic is arranged.And, during the dielectric layer 2 of laminated ceramic system, these dielectric layer 2 hardening own, thereby even have cullet hard foreign matters such as (fragments) to be clamped into and workpiece W between the time also be not easy to damage the advantage of dielectric layer 2.
And the back side of the back side of above-mentioned dielectric layer 2 or electrode 1 and pedestal 3 can clip the adhesive linkage (not shown) of bonding material or bonding agent etc. and one attaches.
And, as Fig. 1 and shown in Figure 4, above-mentioned electrode 1 is divided into a plurality of regional 1a in the plane parallel with workpiece W, each regional 1a is provided with independently electrode pattern 1b respectively at these, simultaneously, be provided with respectively so that independent control to the power supply 1c of the power supply of each electrode pattern 1b, handle power supply 1c arbitrarily by cutting off with cut-out way described later, thereby part stops to being disposed at the power supply of the electrode pattern 1b of regional 1a arbitrarily at each regional 1a.
As shown in Figure 1, these a plurality of power supply 1c be disposed at mutually opposed with above-mentioned workpiece W and be provided with the electrostatic chuck function face 1 of electrode pattern 1b ' medial region, perhaps as shown in Figure 4, be disposed at electrostatic chuck function face 1 ' exterior lateral area, simultaneously, example is distinguished the approaching power supply 1c of concentrated area 1a and near a plurality of positions of difference decentralized configuration each regional 1a among a plurality of power supply 1c as shown, perhaps all power supply 1c centralized configuration is advisable at the regulation position.
So, concentrate a plurality of power supply 1c and when disposing, as shown in Figure 2, near each other and the almost parallel ground of a plurality of power supply 1c is arranged, simultaneously, near these power supplies 1c and be laminated on its above-mentioned dielectric layer 2, cut crack (breach) 1d of the suitable length that forms almost parallel in advance along this power supply 1c, thereby engineering afterwards, can insert for example cutlery such as cutter or scissors (not shown) for each crack 1d, simultaneously, utilizing this cutlery only can carry out selective rhizotomy to power supply 1c arbitrarily handles.
In the illustrated example, almost parallel ground cuts and forms a plurality of cracks (breach) 1d between the power supply 1c that almost parallel is arranged.
As Fig. 3 or shown in Figure 5, by the rear side of the rear side of above-mentioned a plurality of power supply 1c and electrode pattern 1b is constituted, mutually opposed through above-mentioned dielectric layer 2 or adhesive linkage with pedestal 3, with each opposed position of power supply 1c on be formed with recess 3b, even making arbitrarily by described selective rhizotomy processing, the cut-off parts 1c ' of power supply 1c becomes to workpiece W with the outstanding shape of convex, when Electrostatic Absorption workpiece W, this cut-out convex shaped part is entered in the above-mentioned recess 3b, thereby cut off convex shaped part for workpiece W and compare partly not powerful crimping with other parts.
And, above-mentioned pedestal 3, when for example forming by metal such as aluminium or its outer electric conducting material, through the insulator 4 that constitutes by the insulating properties material, the cut-off parts 1c ' that utilizes described cut-out to handle the 1c of power supply arbitrarily that optionally cuts off carries out encapsulation process, expose thereby prevent to apply high-tension cut-off parts 1c ', and the phenomenon of " plasma discharge " or " arc discharge " etc. can not take place.
Below, with reference to accompanying drawing, various embodiments of the present invention are described.
As Fig. 1～shown in Figure 3, this embodiment 1 expression, above-mentioned electrode pattern 1b be have+electrode of the utmost point and-the ambipolar electrostatic chuck of the electrode of the utmost point, with these+utmost point and-the electrode pattern 1b of the utmost point inserts between the dielectric layer 2 that is sealed in by the engineering plastics formation of polyimides or polyether-ether-ketone (PEEK) etc., simultaneously, electrostatic chuck function face 1 ' medial region on the above-mentioned a plurality of power supply 1c of decentralized configuration, thereby constitute the electrostatic chuck film of integrative-structure, and this electrostatic chuck film is bonded on the metal pedestal 3, recess 3b is formed at the surperficial 3c of pedestal 3, so as with the opposed situation of above-mentioned power supply 1c.
In illustrated example, above-mentioned zone 1a is rectangular-shaped, above-mentioned electrode pattern 1b+utmost point and-utmost point forms mutually chimeric broach shape at grade respectively, for example is configured to, pair of electrodes pattern 1b is chimeric mutually on the regional 1a of about 500mm * 300mm.
And, as the electrode structure beyond the illustrated example, also can use for example as open at Japanese Patent Application Laid-Open 2005-64105 communique, clip the dielectric layer (insulating barrier) that the insulating properties material by polyimide film etc. constitutes, stacked the 1st electrode pattern and the 2nd electrode pattern along its two sides, simultaneously, cover the electrostatic chuck on surface of these two electrode patterns or the electrostatic chuck of one pole type by the dielectric layer (insulating properties film) of polyimide film etc.
And, in illustrated example, with be disposed at electrode pattern 1b on three regional 1a that arrange with row+utmost point and-it is one group that the utmost point is concentrated respectively, and constitutes power supply 1c, and these power supply 1c decentralized configuration in groups are formed at space between each electrode pattern 1b in division.
Secondly, the cut-out way to this electrostatic chuck device A describes.
When the workpiece W of Electrostatic Absorption substrate etc., for example owing to cullet (fragment) are clamped into and the electrostatic chuck function face 1 of electrostatic chuck device A ' between, therefore, if be equivalent to this electrostatic chuck function face 1 ' face dielectric layer 2 and to be disposed at the electrode pattern 1b of regional 1a of privileged site partly destroyed and break down, then since overcurrent and on corresponding to the regional 1a of this electrode pattern 1b other Electrostatic Absorption zone also inoperative, therefore carry out the cut-out of the power supply 1c that is communicated with the electrode pattern 1b of the regional 1a of this destruction and handle, and partly stop power supply to this electrode pattern 1b.
More specifically, as shown in Figure 2, the either party of two crack 1d that dispose from the power supply 1c that clips ruined regional 1a inserts for example cutlery such as cutter or scissors to the opposing party, then can be only to the power supply 1c of aiming optionally, cut off simply.
Carried out the cut-off parts 1c ' of the power supply 1c of this selective rhizotomy processing, might become outstanding shape to workpiece W, simultaneously, exist that electric wire after the cut-out exposes and the possibility that is contacted with outer air, so, as Fig. 3 (a) (b) shown in, the cut-off parts 1c ' of this power supply 1c is pressed in the recess 3b of pedestal 3 after, carry out encapsulation process through the insulator 4 that constitutes by the insulating properties material.
And, as the sealing example, insulator 4 is layered in this recess 3b inner bottom surface, on this insulator 4, covering material 5 by insulating properties bonding agent etc. carries out that mold is handled and sealing and fixing has been cut off the cut-off parts 1c ' of the power supply 1c of processing, just can carry out encapsulation process simply.
And, carry out this selective rhizotomy when handling or before and after it, remove the cullet that sandwich, and with the surface grinding of the dielectric layer 2 that destroys and planarization, can continue to use after then.
Handle according to this selective rhizotomy, electrode pattern 1b in the ruined regional 1a does not work as electrostatic chuck,, because the electrode pattern 1b of the regional 1a that it is outer works as electrostatic chuck, and also can continue later on to use, so can restore at short notice with simple cut-out work of treatment is adsorbable workpiece W.
At this moment, by increasing the number of cutting apart of regional 1a, can reduce and when a part breaks down because of breakage etc., make the inoperative zone of Electrostatic Absorption, but, with the bipolar electrode pattern in one deck the time, because need be for distribution is arranged into the distribution space of power supply 1c and the space of guaranteeing power supply 1c from electrode pattern 1b, so as if counting many cutting apart of regional 1a, then with respect to electrostatic chuck function face 1 ' the zone, also increase to the distribution space of power supply 1c and the space ratio of occupying of power supply 1c from the electrode pattern 1b that does not originally work as electrostatic chuck, thus the effective area of minimizing binding domain.
The Electrostatic Absorption function reduces thus, therefore requires the best number of cutting apart.
And, in with one deck, only apply the monopolar configuration of single current potential or bipolar and each layer is divided under the situation of each layer, distribution arrangement space from electrode pattern 1b to power supply 1c also can be used as to be utilized the effective space of Electrostatic Absorption, cuts apart so can not dwindle the effective area of absorption.
And, because crack 1d is placed in dielectric layer 2 in advance, can prevent from the effect of being injured once more of the breach of handling the cut-out end cause by selective rhizotomy to dielectric layer 2 diffusions of other power supplies 1c or regional 1a so have.
And, in illustrated example, covering material 5 discarded ruined electrostatic chuck films with the insulating properties bonding agent of on the insulator 4 of this recess 3b, being handled etc. by mold, and be exchanged for new electrostatic chuck film, then pedestal 3 can utilize again, thereby comprises that with exchange the conventional art of the whole electrostatic chuck device A of pedestal 3 compares and can reduce cost.
This embodiment 2, as Fig. 4～shown in Figure 5, with above-mentioned a plurality of power supply 1c, decentralized configuration mutually opposed with workpiece W and be provided with the electrostatic chuck function face 1 of electrode pattern 1b ' exterior lateral area, thereby constitute the electrostatic chuck film of integrative-structure that can be crooked, and power supply 1c that these are outstanding laterally are adhesively fixed along the side 3d warpage of pedestal 3, perhaps with the mode warpage of the back side 3a that arrives this pedestal 3 and be adhesively fixed, and on the side of these pedestals 3 3d or back side 3a, form recess 3b, thereby the formation of the cut-off parts 1c ' of the cut power supply 1c of encapsulation process, be different from above-mentioned Fig. 1～embodiment 1 shown in Figure 3, the embodiment 1 of its outer formation and Fig. 1～shown in Figure 3 is identical.
Therefore, at Fig. 4～embodiment 2 shown in Figure 5, can obtain the action effect identical with the above embodiments 1, and need guarantee for distribution is not changed from this point of distribution space that electrode pattern 1b is arranged into power supply 1c, but, because do not need to be used to guarantee the space of power supply 1c, even so increase the number of cutting apart of regional 1a, with respect to electrostatic chuck function face 1 ' the zone, also only increase distribution space from the original electrode pattern 1b that does not work as electrostatic chuck to power supply 1c, thereby, can guarantee effective area than the broader binding domain of embodiment 1.
Its result, its advantage is: when increasing the cutting apart number and can not reduce electrostatic adsorption regional of regional 1a, do not require than above-mentioned Fig. 1～embodiment 1 shown in Figure 3 and more suitably cut apart number, thereby in the time of easily corresponding, more do not reduce the Electrostatic Absorption function and the space of occupying that can guarantee power supply 1c.
And, the electrostatic chuck device A of embodiment 2 is configured under the situation of baseplate-laminating machine, wherein this baseplate-laminating machine Electrostatic Absorption is as the glass substrate and the pressurizing attaching of panel of LCD of workpiece W etc., on the surperficial 3c of pedestal 3, do not form recess 3b, so, have the favourable part of the uneven possibility of when glass adhering substrate, not pressurizeing fully.
The structure of this embodiment 3, as Fig. 6～shown in Figure 7, for above-mentioned a plurality of power supply 1c by decentralized configuration electrostatic chuck function face 1 ' exterior lateral area can be crooked the electrostatic chuck film, make these power supplies 1c along the side 3d of pedestal 3 or back side 3a bending and be adhesively fixed, and, will be on these sides 3d or back side 3a and the recess 3b that form mutually opposed with above-mentioned power supply 1c, form and open and close hermetically-sealed construction freely, and portion puts into the cut-off parts 1c ' of cut power supply 1c and encapsulation process within it, be different from above-mentioned Fig. 1～embodiment 1 and Fig. 4～embodiment 2 shown in Figure 5 shown in Figure 3, its outer formation with at the embodiment 1 of Fig. 1～shown in Figure 3 and identical at the embodiment 2 of Fig. 4～shown in Figure 5.
In illustrated example, pedestal 3 is a metallic, in its recess 3b, open and close piece 4a, 4b freely as insulator 4 configurations that constitute by above-mentioned insulating properties material, simultaneously, in these pieces 4a, 4b, put into the cut-off parts 1c ' of cut power supply 1c, the mode of its encirclement is for example utilized annular seal material 6 sealing and fixing of O ring etc.
And, clip above-mentioned power supply 1c respectively disposes O ring etc. between its both sides and piece 4a, 4b annular seal material 6, but, only also can seal with any annular seal material 6 according to experiment.
And piece 4a, 4b are not limited to illustrated shape, can also change to other shape.And utilize the member 4c loading and unloading of concluding of screw etc. freely to link these pieces 4a, 4b, but can also utilize the binding of other kinds.
And, have the following advantages at Fig. 6～embodiment 3 shown in Figure 7.Its advantage is: can obtain the action effect identical with described embodiment 1 and embodiment 2, and, handle with the mold of the cut-off parts 1c ' of the power supply 1c of the covering material 5 that utilizes insulating properties bonding agent etc. shown in embodiment 1 or the embodiment 2 and to compare, can carry out easy and definite encapsulation process at short notice, simultaneously, can re-use containment member.
And, represented that electrostatic chuck device of the present invention is disposed at the situation of baseplate-laminating machine, but be not limited thereto, be configured in the substrate assembling apparatus beyond this baseplate-laminating machine or the base board delivery device of conveyance substrate, perhaps Electrostatic Absorption LCD panel is with the substrate beyond the glass substrate and keep also can.
And, the up and down baseplate-laminating machine of a pair of substrate of fitting in a vacuum as workpiece W has been described, but has been not limited thereto that the baseplate-laminating machine of a pair of substrate up and down of fitting is also passable in atmosphere, at this moment, also can obtain the action effect identical with above-mentioned vacuum abutted machine.
And, represented that at the foregoing description above-mentioned zone 1a is rectangular-shaped situation, but be not limited thereto that the shape beyond the illustrated example such as fan-shaped or concentric circles also can.At this moment, also can obtain the action effect identical with the foregoing description 1 and embodiment 2.
And, represented to concentrate a plurality of power supply 1c or whole power supply 1c and situation about disposing, but be not limited thereto, can also make whole power supply 1c be dispersed in suitable position respectively and dispose.
And, represented above-mentioned electrode pattern 1b is inserted situation about being sealed in by between the dielectric layer 2 of the insulating properties organic material formation of polyimides or polyether-ether-ketone (PEEK) etc., but be not limited thereto, only at the stacked dielectric layer 2 that constitutes by organic material in the workpiece side surface of electrode pattern 1b, and the stacked dielectric layer 2 that constitutes by inorganic material of side overleaf, perhaps stacked its outer insulating properties organic material or the insulating barrier that is made of other materials, perhaps the also stacked dielectric layer 2 that is made of inorganic material is also passable on the workpiece side surface of electrode pattern 1b.
Claims (according to the modification of the 19th of treaty)
1. electrostatic chuck device, by to mutually opposed with workpiece (W) and apply voltage with the electrode (1) of planar configuration, and Electrostatic Absorption workpiece (W) is characterized in that:
In the plane parallel, above-mentioned electrode (1) is divided into a plurality of zones (1a) with workpiece (W), in these each zones (1a) independently electrode pattern (1b) is set respectively, simultaneously power supply (1c) to each electrode pattern (1b) is set respectively at each zone (1a), make above-mentioned a plurality of power supply (1c) near each other and when arranging, near these power supplies (1c), form crack (1d) along this power supply (1c), cut off power supply (1c) arbitrarily, and partly stop power supply to the electrode pattern that is disposed at arbitrary region (1b).
2. electrostatic chuck device according to claim 1 is characterized in that: going up formation recess (3b) with the opposed pedestal of above-mentioned power supply (1c) (3).
3. electrostatic chuck device according to claim 2 is characterized in that: the selective rhizotomy of the above-mentioned power supply of sealing (1c) part (1c ') in the recess (3b) of pedestal (3).
4. according to claim 1,2 or 3 described electrostatic chuck devices, it is characterized in that: dispose annular seal material (6) and seal in mode around the selective rhizotomy of above-mentioned power supply (1c) part (1c ').
Claims (6)
1. electrostatic chuck device, by electrode (1) relative with workpiece (W) and that put with planar configuration is applied voltage, and Electrostatic Absorption workpiece (W) is characterized in that:
In the plane parallel, above-mentioned electrode (1) is divided into a plurality of zones (1a) with workpiece (W), in these each zones (1a) independently electrode pattern (1b) is set respectively, simultaneously power supply (1c) to each electrode pattern (1b) is set respectively at each zone (1a), cut off power supply (1c) arbitrarily, and partly stop to being disposed at the power supply of the electrode pattern (1b) in zone (1a) arbitrarily.
2. electrostatic chuck device according to claim 1 is characterized in that: make above-mentioned a plurality of power supply (1c) near each other and when arranging, these power supplies (1c) near along this power supply (1c) formation crack (1d).
3. electrostatic chuck device according to claim 1 and 2 is characterized in that: mutually opposed with workpiece (W) and be provided with configuration above-mentioned a plurality of power supplies (1c) on the exterior lateral area of electrostatic chuck function face (1 ') of electrode pattern (1b).
4. according to claim 1,2 or 3 described electrostatic chuck devices, it is characterized in that: going up formation recess (3b) with the opposed pedestal of above-mentioned power supply (1c) (3).
5. electrostatic chuck device according to claim 4 is characterized in that: the selective rhizotomy of the above-mentioned power supply of sealing (1c) part (1c ') in the recess (3b) of pedestal (3).
6. according to claim 1,2,3,4 or 5 described electrostatic chuck devices, it is characterized in that: dispose annular seal material (6) and seal in mode around the selective rhizotomy of above-mentioned power supply (1c) part (1c ').
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2005/008227 WO2006117871A1 (en) | 2005-04-28 | 2005-04-28 | Electrostatic chuck apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101167174A true CN101167174A (en) | 2008-04-23 |
| CN100481369C CN100481369C (en) | 2009-04-22 |
Family
ID=37307678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800496044A Expired - Fee Related CN100481369C (en) | 2005-04-28 | 2005-04-28 | Electrostatic chuck device |
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| Country | Link |
|---|---|
| JP (1) | JP3995706B2 (en) |
| KR (1) | KR100940549B1 (en) |
| CN (1) | CN100481369C (en) |
| TW (1) | TWI381479B (en) |
| WO (1) | WO2006117871A1 (en) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4976915B2 (en) | 2007-05-08 | 2012-07-18 | 新光電気工業株式会社 | Electrostatic chuck and method of manufacturing electrostatic chuck |
| KR101612091B1 (en) * | 2008-10-20 | 2016-04-12 | 가부시키가이샤 크리에이티브 테크놀러지 | Method for inspecting electrostatic chuck, and electrostatic chuck apparatus |
| JP5328726B2 (en) | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same |
| JP5677785B2 (en) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same |
| US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| KR101084184B1 (en) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | Apparatus for thin layer deposition |
| KR101174875B1 (en) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
| KR101193186B1 (en) | 2010-02-01 | 2012-10-19 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
| KR101156441B1 (en) | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | Apparatus for thin layer deposition |
| KR101202348B1 (en) | 2010-04-06 | 2012-11-16 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
| US8894458B2 (en) | 2010-04-28 | 2014-11-25 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
| KR101223723B1 (en) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
| KR101678056B1 (en) | 2010-09-16 | 2016-11-22 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
| KR101723506B1 (en) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
| KR101738531B1 (en) | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | Method for manufacturing of organic light emitting display apparatus, and organic light emitting display apparatus manufactured by the method |
| KR20120045865A (en) | 2010-11-01 | 2012-05-09 | 삼성모바일디스플레이주식회사 | Apparatus for organic layer deposition |
| KR20120065789A (en) | 2010-12-13 | 2012-06-21 | 삼성모바일디스플레이주식회사 | Apparatus for organic layer deposition |
| KR101760897B1 (en) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | Deposition source and apparatus for organic layer deposition having the same |
| KR101923174B1 (en) | 2011-05-11 | 2018-11-29 | 삼성디스플레이 주식회사 | ESC, apparatus for thin layer deposition therewith, and method for manufacturing of organic light emitting display apparatus using the same |
| KR101840654B1 (en) | 2011-05-25 | 2018-03-22 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
| KR101852517B1 (en) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
| KR101857249B1 (en) | 2011-05-27 | 2018-05-14 | 삼성디스플레이 주식회사 | Patterning slit sheet assembly, apparatus for organic layer deposition, method for manufacturing organic light emitting display apparatus and organic light emitting display apparatus |
| KR101826068B1 (en) | 2011-07-04 | 2018-02-07 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition |
| KR20130004830A (en) | 2011-07-04 | 2013-01-14 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
| KR20130069037A (en) | 2011-12-16 | 2013-06-26 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus |
| CN103545460B (en) | 2012-07-10 | 2017-04-12 | 三星显示有限公司 | Organic light-emitting display device, organic light-emitting display apparatus, and method of manufacturing organic light-emitting display apparatus |
| KR101959974B1 (en) | 2012-07-10 | 2019-07-16 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
| KR102013318B1 (en) | 2012-09-20 | 2019-08-23 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus |
| KR102108361B1 (en) | 2013-06-24 | 2020-05-11 | 삼성디스플레이 주식회사 | Apparatus for monitoring deposition rate, apparatus for organic layer deposition using the same, method for monitoring deposition rate, and method for manufacturing of organic light emitting display apparatus using the same |
| KR102162797B1 (en) | 2013-12-23 | 2020-10-08 | 삼성디스플레이 주식회사 | Method for manufacturing of organic light emitting display apparatus |
| KR102155584B1 (en) * | 2018-06-25 | 2020-09-14 | (주) 엔피홀딩스 | preventing diffused reflection type electro static chuck of laminating apparatus and laminating apparatus |
| KR102155583B1 (en) * | 2018-06-25 | 2020-09-14 | (주) 엔피홀딩스 | Back electrodes type electro static chuck of laminating apparatus, its manufacturing method and laminating apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291562A (en) * | 1992-04-09 | 1993-11-05 | Toshiba Corp | Electrostatic chuck device |
| US5801915A (en) * | 1994-01-31 | 1998-09-01 | Applied Materials, Inc. | Electrostatic chuck having a unidirectionally conducting coupler layer |
| JP4493251B2 (en) * | 2001-12-04 | 2010-06-30 | Ｔｏｔｏ株式会社 | Electrostatic chuck module and substrate processing apparatus |
| KR100511854B1 (en) * | 2002-06-18 | 2005-09-02 | 아네르바 가부시키가이샤 | Electrostatic chuck device |
| CN100345274C (en) * | 2003-02-27 | 2007-10-24 | 株式会社日立高新技术 | Method of producing electrostatic suction cup |
| JP5004436B2 (en) * | 2005-05-23 | 2012-08-22 | 東京エレクトロン株式会社 | Electrostatic adsorption electrode and processing device |
-
2005
- 2005-04-28 KR KR1020077026621A patent/KR100940549B1/en not_active IP Right Cessation
- 2005-04-28 WO PCT/JP2005/008227 patent/WO2006117871A1/en active Application Filing
- 2005-04-28 JP JP2006552399A patent/JP3995706B2/en not_active Expired - Fee Related
- 2005-04-28 CN CNB2005800496044A patent/CN100481369C/en not_active Expired - Fee Related
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2006
- 2006-01-20 TW TW095102287A patent/TWI381479B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN100481369C (en) | 2009-04-22 |
| JPWO2006117871A1 (en) | 2008-12-18 |
| JP3995706B2 (en) | 2007-10-24 |
| TW200644148A (en) | 2006-12-16 |
| TWI381479B (en) | 2013-01-01 |
| KR100940549B1 (en) | 2010-02-10 |
| KR20080009285A (en) | 2008-01-28 |
| WO2006117871A1 (en) | 2006-11-09 |
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