CN101152755B - 盘片基板及其成形用模具、成形方法和镜面板 - Google Patents
盘片基板及其成形用模具、成形方法和镜面板 Download PDFInfo
- Publication number
- CN101152755B CN101152755B CN2007101416758A CN200710141675A CN101152755B CN 101152755 B CN101152755 B CN 101152755B CN 2007101416758 A CN2007101416758 A CN 2007101416758A CN 200710141675 A CN200710141675 A CN 200710141675A CN 101152755 B CN101152755 B CN 101152755B
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- China
- Prior art keywords
- mirror board
- disc substrates
- layer
- metal
- meltallizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 95
- 238000000465 moulding Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 68
- 239000002184 metal Substances 0.000 claims abstract description 68
- 238000001816 cooling Methods 0.000 claims abstract description 46
- 239000002826 coolant Substances 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims description 73
- 239000011800 void material Substances 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000001746 injection moulding Methods 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 abstract description 12
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 12
- 239000007921 spray Substances 0.000 abstract description 2
- 229910001120 nichrome Inorganic materials 0.000 description 47
- 239000000463 material Substances 0.000 description 31
- 238000007493 shaping process Methods 0.000 description 29
- 230000002093 peripheral effect Effects 0.000 description 25
- 229910052804 chromium Inorganic materials 0.000 description 24
- 239000011651 chromium Substances 0.000 description 24
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 20
- 238000000576 coating method Methods 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 230000002950 deficient Effects 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 16
- 238000005755 formation reaction Methods 0.000 description 16
- 238000010023 transfer printing Methods 0.000 description 14
- 229910010293 ceramic material Inorganic materials 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 229910009043 WC-Co Inorganic materials 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 210000000981 epithelium Anatomy 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000007750 plasma spraying Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 229910000792 Monel Inorganic materials 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001235 nimonic Inorganic materials 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000002520 cambial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-225154 | 2006-08-22 | ||
| JP2006225154 | 2006-08-22 | ||
| JP2006225154 | 2006-08-22 | ||
| JP2007-188026 | 2007-07-19 | ||
| JP2007188026 | 2007-07-19 | ||
| JP2007188026A JP4223537B2 (ja) | 2006-08-22 | 2007-07-19 | ディスク基板の成形用金型およびその鏡面板ならびにディスク基板の成形方法およびディスク基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101152755A CN101152755A (zh) | 2008-04-02 |
| CN101152755B true CN101152755B (zh) | 2012-03-14 |
Family
ID=39346629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101416758A Expired - Fee Related CN101152755B (zh) | 2006-08-22 | 2007-08-17 | 盘片基板及其成形用模具、成形方法和镜面板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4223537B2 (https=) |
| CN (1) | CN101152755B (https=) |
| TW (1) | TW200812776A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI380891B (zh) * | 2008-04-01 | 2013-01-01 | Au Optronics Corp | 壓模及其製造方法 |
| JP5093809B2 (ja) * | 2008-04-21 | 2012-12-12 | 株式会社名機製作所 | ディスク基板成形機およびディスク基板成形方法 |
| JP5234640B2 (ja) * | 2009-02-02 | 2013-07-10 | 株式会社名機製作所 | 極薄導光板の成形金型および成形方法 |
| JP6252098B2 (ja) * | 2012-11-01 | 2017-12-27 | 信越化学工業株式会社 | 角形金型用基板 |
| CN104260297B (zh) * | 2014-08-25 | 2017-05-24 | 健大电业制品（昆山）有限公司 | 用于加工多孔工业连接器的塑胶模内镶针冷却装置 |
-
2007
- 2007-07-19 JP JP2007188026A patent/JP4223537B2/ja not_active Expired - Fee Related
- 2007-08-09 TW TW96129444A patent/TW200812776A/zh not_active IP Right Cessation
- 2007-08-17 CN CN2007101416758A patent/CN101152755B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101152755A (zh) | 2008-04-02 |
| JP2008074088A (ja) | 2008-04-03 |
| JP4223537B2 (ja) | 2009-02-12 |
| TWI327953B (https=) | 2010-08-01 |
| TW200812776A (en) | 2008-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120314 Termination date: 20120817 |