CN101138838A - Grinding pad with hollow fiber and manufacturing method thereof - Google Patents
Grinding pad with hollow fiber and manufacturing method thereof Download PDFInfo
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- CN101138838A CN101138838A CNA2006101286938A CN200610128693A CN101138838A CN 101138838 A CN101138838 A CN 101138838A CN A2006101286938 A CNA2006101286938 A CN A2006101286938A CN 200610128693 A CN200610128693 A CN 200610128693A CN 101138838 A CN101138838 A CN 101138838A
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- doughnut
- grinding pad
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Abstract
The present invention relates to a grinding pad with hollowing fibers and a production method thereof. The grinding pad includes a body which has a grinding surface and more than one hollow fiber. The hollow fibers are positioned in the body and have an opening in the grinding surface. The hollow area of the section of each hollow fiber is bigger than the section area of the grinding particle of the grinding slurry. Thereby the grinding slurry and particles can circulate on the grinding pad by the hollow fibers.
Description
Technical field
The present invention relates to the grinding pad and the manufacture method thereof of a kind of cmp (CMP) processing procedure, in particular to a kind of grinding pad and manufacture method thereof with doughnut.
Background technology
Polishing generally is meant in cmp (CMP) processing procedure, for the abrasion control that just is rough surface, the grinding milk that its utilization contains polishing particles on average is scattered in the upper surface of a grinding pad, rubs mill with the hands to repeat the rule action after simultaneously a polished element being propped up described grinding pad.Described polished element is such as objects such as semiconductor, medium base material, integrated circuit, LCD flat panel glass, optical glass and photoelectric panels.For the distribution of keeping described grinding milk with flow and cmp after planarization and grinding efficiency, can offer a plurality of grooves on the upper surface of described grinding pad usually or form a surface pattern.Therefore, described grinding pad is vulnerable to the influence of described groove or described surface pattern for the polishing effect of described polished object.
With reference to figure 1, show first kind of schematic top plan view with grinding pad of surface pattern commonly used.The surface pattern of described grinding pad 1 comprises the straight-line groove 11 that a plurality of groined types are arranged, and the degree of depth of wherein said straight-line groove 11, width and spacing are according to required and design.Though described straight-line groove 11 has preferable even distributivity to described grinding pad 1, can provide grinding milk preferable flowability, but owing to the passage that is communicated to described grinding pad 1 periphery 12 is more, and described groove 11 area occupied are quite big with respect to the milling area ratio of integral body, will cause a large amount of grinding milks to run off.
With reference to figure 2, show second kind of schematic top plan view with grinding pad of surface pattern commonly used.The surface pattern of described grinding pad 2 comprises a plurality of concentric circular groove 21, and the degree of depth of wherein said circular groove 21 and width are according to required and design.The shortcoming of described grinding pad 2 is that the milling area difference of its regional area is excessive, almost can't reach the homogeneity of groove area ratio.In addition, the impurity that is produced in the process of lapping is difficult for leaving described grinding pad 2 apace, thereby influences the service life of grinding precision and described grinding pad 2.
Therefore, be necessary to provide the grinding pad with doughnut and its manufacture method of a kind of innovation and tool progressive, to address the above problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of grinding pad with doughnut, comprises a body and a plurality of doughnuts.Described body has a lapped face.Described doughnut is positioned at described body and is opened on described lapped face, and wherein the hollow area in the cross section of each doughnut is greater than the sectional area of the polishing particles of a grinding milk.By this, grinding milk and polishing particles can reach comprehensive circulation via described doughnut on described grinding pad, and are subject to the shared milling area ratio of groove unlike the transmission of grinding milk in the conventional grinding pad.In addition, in the present invention, because the circulation of grinding milk and polishing particles is good, thus its act on the polished element action time comparatively evenly and can estimate and control, act on the action time on the polished element and can't estimate and control unlike grinding milk in the conventional grinding pad.
Another object of the present invention is to provide a kind of manufacture method with grinding pad of doughnut, it may further comprise the steps: a plurality of doughnuts (a) are provided; (b) described doughnut is vertically arranged on the substrate; (c) form a body, to cover described doughnut; (d) remove described substrate.
Description of drawings
Fig. 1 shows first kind of schematic top plan view with grinding pad of surface pattern commonly used;
Fig. 2 shows second kind of schematic top plan view with grinding pad of surface pattern commonly used;
Fig. 3 shows that the present invention has the generalized section of the grinding pad of doughnut;
Fig. 4 shows the SEM photo figure of doughnut used in the present invention;
Fig. 5 shows that the present invention has the generalized section of another kind enforcement aspect of the grinding pad of doughnut; With
Fig. 6 to 7 shows that the present invention has the fabrication steps schematic diagram of the grinding pad of doughnut.
The specific embodiment
The invention provides a kind of grinding pad with doughnut, described grinding pad is applied in cmp (CMP) processing procedure a polished element be ground or polishes.Described polished element includes but not limited to objects such as semiconductor, medium base material, integrated circuit, LCD flat panel glass, optical glass and photoelectric panel.
With reference to figure 3, show that the present invention has the generalized section of the grinding pad of doughnut, described grinding pad 3 comprises body 31 and a plurality of doughnuts 32.Described body 31 has a lapped face 33.The material of described in the present embodiment body 31 is the PU of high solid composition (High Solid), and its inside has the hole 34 of a plurality of continous ways or discontinuous formula.Yet be understandable that the material of described body 31 also can be acryl resin or other resins.
With reference to figure 4, show the SEM photo figure of doughnut used in the present invention.Doughnut used in the present invention is conventional doughnut.Please also refer to Fig. 3, described doughnut 32 is positioned at described body 31 and is opened on described lapped face 33, and the even dispersed arrangement of the opening of described doughnut 32.In the present embodiment, the material of described doughnut 32 is selected from the group who is made up of polypropylene (PP), polyester (PET) and nylon (Nylon).The ratio (hollow rate) of the hollow area in the cross section of each described doughnut 32 and its total sectional area is 10 to 30%.
In the present invention, the hollow area in the cross section of each doughnut 32 is beneficial to grinding milk and polishing particles and flows in described doughnut 32 greater than the sectional area of the polishing particles (not shown) of a grinding milk.By this, grinding milk and polishing particles can reach comprehensive circulation via described doughnut 32 on described grinding pad 3, and are subject to the shared milling area ratio of groove unlike the transmission of grinding milk in the conventional grinding pad 1,2 (Fig. 1 and Fig. 2).In addition, in the present invention, because the circulation of grinding milk and polishing particles is good, therefore its act on the polished element action time comparatively evenly and can estimate and control, unlike also can't estimating and control the action time that grinding milk in the conventional grinding pad 1,2 (Fig. 1 and Fig. 2) acts on the polished element.
In the present embodiment, the even dispersed arrangement of the opening of described doughnut 32, promptly described doughnut 32 is dispersed in described lapped face 33, and described doughnut 32 is vertical with described lapped face 33.Yet be understandable that the opening of described doughnut 32 also can be arranged out specific pattern, for example be arranged in a plurality of concentric circles, or be arranged in groined type.
Preferably, aspect other enforcements in, described doughnut 32 more protrudes in outside the described lapped face 33, as shown in Figure 5, the toughness characteristics that this kind enforcement aspect can utilize described doughnut 32 itself to be had can reach the effect of the detritus after cleaning is ground.
Preferably, described grinding pad 3 more comprises a plurality of groove (not shown), is positioned at described lapped face 33.See that to overlook described groove can be the straight-line groove that a plurality of groined types are arranged, or a plurality of concentric circular groove.
The present invention more comprises the manufacture method of described grinding pad 3, and it may further comprise the steps.At first, provide a plurality of doughnuts 32 as Fig. 4.Then, with reference to figure 6, described doughnut 32 is vertically arranged on the substrate 40.Utilize the mode of Electrostatic Absorption that described doughnut 32 is arranged on the described substrate 40 in the present embodiment.In the present embodiment, described doughnut 32 evenly is vertically arranged on the described substrate 40 dispersedly, yet is understandable that, described doughnut 32 can also be arranged out specific pattern, for example is arranged in a plurality of concentric circles, or is arranged in groined type.
Then,, form a body 31, to cover described doughnut 32 with reference to figure 7.The material of described in the present embodiment body 31 is the PU of high solid composition (High Solid), and its inside has the hole 34 of a plurality of continous ways or discontinuous formula.Yet be understandable that the material of described body 31 also can be acryl resin or other resins.
At last, remove described substrate 40, turn over turnback again and promptly form grinding pad shown in Figure 33.
But the foregoing description only is explanation principle of the present invention and its effect, but not in order to restriction the present invention.Therefore, the those skilled in the art can make amendment to the foregoing description without prejudice to spirit of the present invention and change.Interest field of the present invention should be listed as appending claims.
Claims (15)
1. grinding pad with doughnut comprises:
One body has a lapped face; With
A plurality of doughnuts are positioned at described body.
2. grinding pad as claimed in claim 1, wherein said doughnut is opened on described lapped face.
3. grinding pad as claimed in claim 1, wherein said doughnut protrudes in described lapped face.
4. grinding pad as claimed in claim 1, wherein the hollow area in the cross section of each doughnut is greater than the sectional area of the polishing particles of a grinding milk.
5. grinding pad as claimed in claim 1 more comprises a plurality of grooves, is positioned at described lapped face.
6. grinding pad as claimed in claim 1, the even dispersed arrangement of the opening of wherein said doughnut.
7. grinding pad as claimed in claim 1, the opening of wherein said doughnut is arranged in a plurality of concentric circles.
8. grinding pad as claimed in claim 1, the opening of wherein said doughnut is arranged in groined type.
9. grinding pad as claimed in claim 1, the material of wherein said body are resin.
10. grinding pad as claimed in claim 1, wherein the ratio of the hollow area in the cross section of each described doughnut and its total sectional area is 10 to 30%.
11. the manufacture method with grinding pad of doughnut, it may further comprise the steps:
(a) provide a plurality of doughnuts;
(b) described doughnut is vertically arranged on the substrate;
(c) form a body, to cover described doughnut; With
(d) remove described substrate.
12. method as claimed in claim 11, doughnut evenly is vertically arranged on the described substrate dispersedly described in the wherein said step (b).
13. method as claimed in claim 11, doughnut is arranged in a plurality of concentric circles described in the wherein said step (b).
14. method as claimed in claim 11, doughnut is arranged in groined type described in the wherein said step (b).
15. method as claimed in claim 11 utilizes the mode of Electrostatic Absorption that described doughnut is arranged on the described substrate in the wherein said step (b).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101286938A CN100534722C (en) | 2006-09-08 | 2006-09-08 | Grinding pad with hollow fiber and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101286938A CN100534722C (en) | 2006-09-08 | 2006-09-08 | Grinding pad with hollow fiber and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101138838A true CN101138838A (en) | 2008-03-12 |
| CN100534722C CN100534722C (en) | 2009-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101286938A Expired - Fee Related CN100534722C (en) | 2006-09-08 | 2006-09-08 | Grinding pad with hollow fiber and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100534722C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107717720A (en) * | 2016-08-11 | 2018-02-23 | 宋建宏 | Polishing pad and method for manufacturing the same |
-
2006
- 2006-09-08 CN CNB2006101286938A patent/CN100534722C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107717720A (en) * | 2016-08-11 | 2018-02-23 | 宋建宏 | Polishing pad and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100534722C (en) | 2009-09-02 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090902 Termination date: 20190908 |