CN101134303A - Polishing pad and method of producing the same - Google Patents
Polishing pad and method of producing the same Download PDFInfo
- Publication number
- CN101134303A CN101134303A CNA2006101263546A CN200610126354A CN101134303A CN 101134303 A CN101134303 A CN 101134303A CN A2006101263546 A CNA2006101263546 A CN A2006101263546A CN 200610126354 A CN200610126354 A CN 200610126354A CN 101134303 A CN101134303 A CN 101134303A
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- Prior art keywords
- polishing pad
- window
- manufacture method
- pad body
- polyurethane
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- 238000005498 polishing Methods 0.000 title claims abstract description 132
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000000126 substance Substances 0.000 claims abstract description 21
- 239000000084 colloidal system Substances 0.000 claims abstract description 10
- 239000004814 polyurethane Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229920002635 polyurethane Polymers 0.000 claims description 10
- 229920002319 Poly(methyl acrylate) Polymers 0.000 claims description 8
- 238000007517 polishing process Methods 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 238000005187 foaming Methods 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 11
- 239000002002 slurry Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention is one kind of polishing pad and its making process. The polishing pad includes one pad body and one window embedded by means of chemical bond onto the pad body. It is made through setting colloid into one mold, injecting polishing pad material into the mold, curing the colloid to form one window during forming the polishing pad, and forming chemical bond between the polishing pad material and the window to obtain the polishing pad with waterproof window.
Description
Technical field
The present invention relates to a kind of polishing pad, particularly a kind of polishing pad with water-proof window.
Background technology
Chemical-mechanical planarization (chemical mechanical planarization in recent years, be called for short CMP) be used in a large number on the semiconductor processes, when it grinds slurry and exert pressure in existence, make flattening wafer surface by the relative motion between wafer and polishing pad.See also Fig. 1, it is the schematic diagram of CMP equipment, the equipment of CMP is commonly referred to grinder, wafer 10 is placed in below the wafer support seat 12 in grinder, and on the platform 14 that is provided with wafer support seat subtend, settle polishing pad 16, grind slurry 18 and then be sprayed on the polishing pad by grinding slurry sprinkler 20, and between wafer and polishing pad.
Usually has window on the polishing pad, its purpose is used for terminal test (endpoint detection) is provided, in process of lapping, utilize laser light ray to penetrate window and arrive the grinding wafer surface surveying the crystal column surface state, and learn thus and whether material is ground to correct thickness.
See also Fig. 2, it is the schematic diagram of traditional polishing pad manufacture process, in the prior art, one is had cured in the making mould 102 that the macromolecular material window of finishing 100 is positioned over polishing pad, then the material 104 with polishing pad injects mould 102, the material that makes polishing pad forms polishing pad body 106 in die for molding, promptly finishes the polishing pad 110 with window.
This case inventor finds in traditional polishing pad 110, only exist physical action that both are combined between its window 100 and the polishing pad body 106, so the waterproof effect between window and polishing pad body is not good.In process of lapping, grind slurry and can infiltrate into the polishing pad below, make that the applying adhesive tape material between polishing pad and platform is affected, produce minute bubbles by the gap between window and polishing pad body, cause the adaptation between polishing pad and platform not good, and make pad interface uneven.So, will cause the CMP grinding effect of wafer not good, can't reach due planarization effect, and then cause the assembly on the wafer to make acceptance rate or reliability reduction.
Therefore, industry is needed the waterproof effect of improvement polishing pad windows badly, infiltrates between polishing pad and the platform to avoid grinding slurry, causes the grinding wafer poor effect.
Summary of the invention
The invention provides a kind of polishing pad, comprise that a window is embedded in the polishing pad body, wherein has chemical bond between this window and the polishing pad body.
The present invention more provides a kind of manufacture method of polishing pad, one uncured colloid is positioned in the mould of polishing pad, material with polishing pad flows in the mould then, the forming materials of polishing pad is formed the polishing pad main body, and make uncured colloid solidify to form window, wherein form chemical bond between window and the polishing pad body, then mould is removed to obtain having the polishing pad of window.
For above and other objects of the present invention, feature and advantage can be become apparent, cited below particularlyly go out preferred embodiment, and conjunction with figs., be described in detail below:
Description of drawings
Fig. 1 is the milling apparatus schematic diagram of existing chemical-mechanical planarization.
Fig. 2 is the schematic diagram of existing polishing pad manufacturing process.
Fig. 3 A is the plane of the polishing pad of the preferred embodiment of the present invention.
Fig. 3 B is the plane enlarged drawing of dashed region among Fig. 3 A.
Fig. 4 is the schematic diagram of the polishing pad manufacturing process of the preferred embodiment of the present invention.
Fig. 5 is the profile of the vacuum test of the preferred embodiment of the present invention with the polishing pad sample.
The primary clustering symbol description
10～wafer; 12～wafer support seat; 14～platform; 16～polishing pad; 18～grind slurry; 20～grind the slurry sprinkler; 100～the window that solidified; 102, the mould of 32～polishing pad; 104, the material of 38～polishing pad; 110～traditional polishing pad; 28～uncured colloid; 30～window; 106,40～polishing pad body; 50～polishing pad of the present invention; The zone of the polishing pad body of 301～window and part; A, B～chemical bond; The line of cut in C～cutting face; The line of cut of D～binding face; E～initial polishing pad thickness; The polishing pad thickness of sample that F～vacuum test is used; G～cutting thickness.
Embodiment
The invention provides a kind of polishing pad of improvement, it has a water-proof window and is embedded in the polishing pad body, wherein has chemical bond between window and the polishing pad body, therefore, window is very tight with combining of polishing pad body, can prevent to grind slurry from being penetrated between window and the polishing pad body under the polishing pad.
See also Fig. 3 A, it is the plane of polishing pad of the present invention, and wherein 30 is window, and 40 is the polishing pad body, the enlarged drawing of dotted line 301 area surrounded is shown in Fig. 3 B among Fig. 3 A, and arrow A and B represent the chemical bond of formation between window 30 and the polishing pad body 40 among the figure.
The manufacturing process of polishing pad of the present invention, see also Fig. 4, at first uncured colloid 28 is positioned in the mould 32 of polishing pad, material 38 with polishing pad injects mould then, make the material foaming of polishing pad, form polishing pad body 40, and make uncured colloid 28 solidify to form window 30, form chemical bond between window 30 and the polishing pad body 40 this moment, mould is removed, and the upper and lower surface of window 30 and polishing pad body 40 is cut to required size, can obtain having the polishing pad 50 of window, on resulting its window of polishing pad, on lower surface and the polishing pad body, lower surface is a copline.
Polishing pad body of the present invention can be macromolecular material, for example Chang Yong polyurethane (polyurethane is called for short PU).Window can be transparent macromolecular material, for example Merlon (polycarbonate is called for short PC), polyurethane (polyurethane is called for short PU) or PMA (polymethyl acrylate is called for short PMA) etc.The uncured colloid then macromolecular material with above-mentioned window is identical, but it does not finish curing reaction as yet.In an embodiment of the present invention, the chemical bond between window and the polishing pad body can be hydrogen bond, is the material of polishing pad with PU, and the material of window also is that PU is an example, sees also following Chemical formula 1, can produce hydrogen bond between window and polishing pad body:
Chemical formula 1
In addition, be the material of polishing pad with PU, it is example that window material is selected PC for use, sees also following Chemical formula 2, also can produce hydrogen bond between window and polishing pad body:
Chemical formula 2
In addition, be the polishing pad bulk material with PU, window material is selected PMA for use, equally also can produce hydrogen bond between window and polishing pad body, sees also following chemical formula 3:
Chemical formula 3
As mentioned above, has chemical bond between window in the polishing pad of the present invention and the polishing pad body, utilize the window and the polishing pad body of physical action combination tightr in its more traditional polishing pad, so the window in the polishing pad of the present invention has preferable waterproof effect, in process of lapping, can prevent to grind slurry from infiltrating between window and the polishing pad body under the polishing pad, and then reach preferable CMP and grind the result.
Then please refer to Fig. 5, it is for the profile of polishing pad of the present invention, wherein dotted line institute area surrounded 30 is a window, and 40 is the polishing pad body, is copline by the upper and lower surface of the upper and lower surface that can know the window 30 of learning polishing pad among the figure and polishing pad body 40.
In order to test the window waterproof effect of polishing pad, with the upper and lower skin cut of the initial conditions after the polishing pad moulding, obtain the polishing pad on comparatively smooth upper and lower surface, to make the polishing pad sample that vacuum test is used.Please consult Fig. 5 again, the face that cuts along dotted line C is called cutting face (polishing side), and it is conduct and the contact-making surface that grinds slurry in process of lapping; Face along dotted line D cutting is called binding face (back side), its in process of lapping as with the binding face of platform, wherein initial polishing pad thickness E is about 5.5mm, and the polishing pad thickness F after the cutting is about 4.85mm, and the thickness G on the upper and lower surface that is cut away is about 0.35mm.
Its method of testing of window waterproof effect of polishing pad is for utilizing vacuum test, polishing pad specimen after the cutting is attached on the platform, and vacuum extractor is positioned on the cutting face of window, stop after vacuumizing for 5 seconds, wait for measuring after 30 seconds the changing value of its vacuum quietly, resulting changing value is littler, and the air leakage of expression window is less, represents that promptly the waterproof effect of window is preferable.
With polishing pad of the present invention, with traditional polishing pad comparison, be the material of polishing pad with PU, PC is that the material of window is an example, the vacuum test result such as the following table 1 of its window waterproof effect are listed:
Table 1
| Polishing pad vacuum of the present invention changes test (psi) | Traditional polishing pad vacuum changes test (psi) | |||||
| Time | 5 |
30 seconds | Changing value | 5 |
30 seconds | Changing value |
| The cutting face | 80.2 | 79.9 | 0.3 | 80 | 79.4 | 0.6 |
| Binding face | 80.3 | 80 | 0.3 | 80.1 | 79.5 | 0.6 |
Test result by table 1 can learn that its vacuum changing value of polishing pad of the present invention is 0.3, and the vacuum changing value 0.6 of the polishing pad of making than traditional approach is low, and therefore the more traditional polishing pad of its window waterproof effect of polishing pad of the present invention doubles.
Though the present invention discloses preferred embodiment as above; so it is not to be used for limiting the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can do a little change and modification, so protection scope of the present invention should be with being as the criterion that appending claims was defined.
Claims (15)
1. polishing pad comprises:
One polishing pad body; And
One window, it is embedded in this polishing pad body,
Wherein has chemical bond between this window and this polishing pad body.
2. polishing pad as claimed in claim 1, wherein this polishing pad body is a macromolecular material.
3. polishing pad as claimed in claim 2, wherein this polishing pad body is polyurethane (polyurethane is called for short PU).
4. polishing pad as claimed in claim 1, wherein this window is transparent macromolecular material.
5. polishing pad as claimed in claim 4, wherein this window is Merlon (polycarbonate is called for short PC), polyurethane (polyurethane is called for short PU) or PMA (polymethyl acrylate is called for short PMA).
6. polishing pad as claimed in claim 1, wherein totally one plane, the upper and lower surface of the upper and lower surface of this window and this polishing pad body.
7. polishing pad as claimed in claim 1, wherein this chemical bond comprises hydrogen bond.
8. the manufacture method of a polishing pad comprises:
One uncured colloid is positioned in the mould of a polishing pad;
The material of one polishing pad is flow in this mould;
The forming materials of this polishing pad is formed a polishing pad body, and make this uncured colloid solidify to form a window, wherein form chemical bond between this window and this polishing pad body; And
This mould is removed, to obtain the polishing pad of a tool window.
9. the manufacture method of polishing pad as claimed in claim 8, wherein the material of this polishing pad is a macromolecular material.
10. the manufacture method of polishing pad as claimed in claim 9, wherein the material of this polishing pad is a polyurethane.
11. the manufacture method of polishing pad as claimed in claim 8, wherein this window is transparent macromolecular material.
12. the manufacture method of polishing pad as claimed in claim 11, wherein this window is Merlon, polyurethane or PMA.
13. the manufacture method of polishing pad as claimed in claim 8, wherein this chemical bond comprises hydrogen bond.
14. the manufacture method of polishing pad as claimed in claim 8, wherein totally one plane, the upper and lower surface of the upper and lower surface of this window and this polishing pad body.
15. the manufacture method of polishing pad as claimed in claim 8, wherein the forming materials mode of this polishing pad is a foaming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101263546A CN101134303A (en) | 2006-08-30 | 2006-08-30 | Polishing pad and method of producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101263546A CN101134303A (en) | 2006-08-30 | 2006-08-30 | Polishing pad and method of producing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101134303A true CN101134303A (en) | 2008-03-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101263546A Pending CN101134303A (en) | 2006-08-30 | 2006-08-30 | Polishing pad and method of producing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101134303A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950550A (en) * | 2011-08-16 | 2013-03-06 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing chemical mechanical polishing layers |
| CN103260828A (en) * | 2010-09-30 | 2013-08-21 | 内克斯普拉纳公司 | Polishing pad for eddy current end-oint detection |
| KR20130108172A (en) * | 2012-03-22 | 2013-10-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Method of manufacturing chemical mechanical polishing layers having a window |
| KR20130108168A (en) * | 2012-03-22 | 2013-10-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Method of manufacturing chemical mechanical polishing layers |
| CN103692370A (en) * | 2012-09-27 | 2014-04-02 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing grooved chemical mechanical polishing layers |
| CN114670118A (en) * | 2017-08-04 | 2022-06-28 | 应用材料公司 | Polishing pad with window and method of manufacturing the same |
-
2006
- 2006-08-30 CN CNA2006101263546A patent/CN101134303A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260828A (en) * | 2010-09-30 | 2013-08-21 | 内克斯普拉纳公司 | Polishing pad for eddy current end-oint detection |
| CN103260828B (en) * | 2010-09-30 | 2017-08-15 | 嘉柏微电子材料股份公司 | The method for making the polishing pad for polishing Semiconductor substrate |
| CN102950550B (en) * | 2011-08-16 | 2015-10-28 | 罗门哈斯电子材料Cmp控股股份有限公司 | The method of preparative chemistry machine glazed finish layer |
| CN102950550A (en) * | 2011-08-16 | 2013-03-06 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing chemical mechanical polishing layers |
| CN103358226B (en) * | 2012-03-22 | 2016-02-24 | 罗门哈斯电子材料Cmp控股股份有限公司 | There is the manufacture method of the chemical mechanical polishing layer of window |
| CN103358238A (en) * | 2012-03-22 | 2013-10-23 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing chemical mechanical polishing layers |
| CN103358226A (en) * | 2012-03-22 | 2013-10-23 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing chemical mechanical polishing layers having a window |
| CN103358238B (en) * | 2012-03-22 | 2016-02-24 | 罗门哈斯电子材料Cmp控股股份有限公司 | The manufacture method of chemical mechanical polishing layer |
| KR20130108168A (en) * | 2012-03-22 | 2013-10-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Method of manufacturing chemical mechanical polishing layers |
| KR20130108172A (en) * | 2012-03-22 | 2013-10-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Method of manufacturing chemical mechanical polishing layers having a window |
| KR102028207B1 (en) * | 2012-03-22 | 2019-10-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Method of manufacturing chemical mechanical polishing layers |
| KR102028208B1 (en) * | 2012-03-22 | 2019-10-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Method of manufacturing chemical mechanical polishing layers having a window |
| CN103692370A (en) * | 2012-09-27 | 2014-04-02 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing grooved chemical mechanical polishing layers |
| CN103692370B (en) * | 2012-09-27 | 2016-08-17 | 罗门哈斯电子材料Cmp控股股份有限公司 | The method preparing reeded chemical mechanical polishing layer |
| CN114670118A (en) * | 2017-08-04 | 2022-06-28 | 应用材料公司 | Polishing pad with window and method of manufacturing the same |
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