CN101128106A - Active heat dispersion power supply system with heat dispersion machine of power supply input part - Google Patents
Active heat dispersion power supply system with heat dispersion machine of power supply input part Download PDFInfo
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- CN101128106A CN101128106A CNA2006101156262A CN200610115626A CN101128106A CN 101128106 A CN101128106 A CN 101128106A CN A2006101156262 A CNA2006101156262 A CN A2006101156262A CN 200610115626 A CN200610115626 A CN 200610115626A CN 101128106 A CN101128106 A CN 101128106A
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- power supply
- radiating airflow
- supply input
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Abstract
The utility model discloses an active heat-dissipating power supply system type with power input component heat dissipation structure, which comprises a casing body, a plurality of electronic elements, an air flow drive device and power input components; wherein, with the casing comprises a first side surface, a first heat dissipation air flow passage and a second heat dissipation air flow passage; wherein, at least one first air flow inlet and outlet is arranged on the first side surface and communicated with the second heat dissipation air flow passage; the electronic components are arranged inside the casing body and the first heat dissipation air flow passage; the air flow drive device is arranged at the first side surface of the casing body; the power input components are arranged in the first side surface and the second heat dissipation air flow passage; wherein, the air flow drive device enables the heat dissipation air to flow between the first air flow inlet and outlet, the second heat dissipation air flow passage and the opening of the air flow drive device and heat dissipation is made for the power input components. The utility model has the advantages of capability of making effective heat dissipation for the power input components and being suitable for electricity safe temperature standardization.
Description
Technical field
The present invention refers to a kind of active heat removal formula power system with power supply input element cooling mechanism especially about a kind of active heat removal formula power system.
Background technology
Indispensable basic device when power system (power supply system) is the work of various electric equipment or information products.See also Fig. 1, it is the structural representation of traditional active heat removal formula power system.As shown in Figure 1, traditional active heat removal formula power system 1 comprises housing 11 (being represented by dotted lines), a plurality of electronic component 12, power supply input element 13 and power supply output element 14.Wherein, this power supply input element 13 is generally electric connector, and for example socket is imported civil power in order to the socket power line, this power supply output element 14 is then with so that active heat removal formula power system 1 is able to form with other electronic installation is electrically connected, and then power supply is to this electronic installation.In addition; because the electronic component 12 in the active heat removal formula power system 1 can produce heat when 1 work of active heat removal formula power system; and these heats will make that the temperature in the housing 11 is more and more higher; therefore on the housing 11 of active heat removal formula power system 1 one or more radiator fans 15 can be set usually; utilize the active heat removal mechanism of forced convertion; cool exterior air can be blown into heat radiation in the housing 11; or with the extraction of the hot-air in the housing 11 housing 11; reduce the temperature in the housing 11 whereby, damage or reduce the life-span because of overheated with the electronic component 12 of avoiding active heat removal formula power system 1.
As shown in Figure 1,, can arrive power supply input element 13 again, so the heat that produced of electronic component 12 will certainly have influence on the temperature of power supply input element 13 through electronic component 12 because air is after radiator fan 15 is sent into housing 11.In addition, along with the trend development of active heat removal formula power system 1 towards high power and miniaturization, power supply input element 13, socket for example, conducting terminal can produce higher heat because of the conducting high current and because of thermal resistance, therefore if can't then will make 13 pairs of active heat removal formulas of power supply input element power system 1 cause the problem of electrical safety aspect suitably to 13 heat radiations of power supply input element.What is more, according to the standard of present international standard safe temperature value, the temperature of power supply input element 13 under mode of operation of active heat removal formula power system 1 must be lower than for example below 70 ℃.Yet, along with the development of electronic product technology and for needs according to the user, electronic component 12 quantity of institute's load increase gradually in the active heat removal formula power system 1, the integrated level of electronic component 12 also promotes, and the wattage of required consumption increases significantly when making 1 operation of active heat removal formula power system.And along with the increase that consumes wattage, active heat removal formula power system 1 has inevitably improved the temperature of whole active heat removal formula power system 1 because of the heat that operation is produced, and then has also improved the temperature of power supply input element 13 indirectly.In general, the electronic component 12 of active heat removal formula power system 1 inside can be heat-resisting up to 110-150 ℃, but in order to meet the safe temperature standard of power supply input element 13, the design of electronic component 12 will be therefore limited, and then have influence on the development of active heat removal formula power system 1.
Therefore, how to develop a kind of power system that can effectively dispel the heat to the power supply input element, real in pressing for the problem of solution at present.
Summary of the invention
Main purpose of the present invention is to provide a kind of active heat removal formula power system with power supply input element cooling mechanism, it can be effectively to the power supply input element, for example socket dispels the heat, with the temperature that reduces the power supply input element and make it meet the electrical safety standard.
For reaching above-mentioned purpose, of the present invention than broad sense embodiment for a kind of active heat removal formula power system with power supply input element cooling mechanism is provided, it comprises: housing, have first side, the first radiating airflow passage and the second radiating airflow passage, wherein this first side has at least one first air-flow import and export, and this first air-flow is imported and exported and is connected with this second radiating airflow passage; A plurality of electronic components are arranged in this enclosure interior and this first radiating airflow passage; Air flow drive device is arranged at this first side of this housing; And the power supply input element, be arranged in this first side and this second radiating airflow passage of this housing.Wherein, this air flow drive device flows radiating airflow between the opening of these first air-flow import and export, this second radiating airflow passage and this air flow drive device, so that this power supply input element is dispelled the heat.
According to described active heat removal formula power system, wherein this power supply input element is a socket, and this air flow drive device is a radiator fan.
According to described active heat removal formula power system, wherein this housing also has second side, and this second side has that at least one second air-flow is imported and exported and this second side is relative with this first side.
According to described active heat removal formula power system, wherein this first radiating airflow passage is when this air flow drive device driving radiating airflow flows, make between this radiating airflow this opening to pass in and out, to form this first radiating airflow passage in this enclosure interior space by these the second air-flow import and export on this second side and this air flow drive device.
According to described active heat removal formula power system, wherein this first air-flow on this of this housing first side is imported and exported and is adjacent to this power supply input element.
According to described active heat removal formula power system, wherein the sidewall of this air flow drive device is adjacent to this power supply input element in fact.
According to described active heat removal formula power system, also comprise thermal insulation board, this thermal insulation board is arranged between this power supply input element and the described a plurality of electronic component, and forms this second radiating airflow passage with this sidewall of this air flow drive device and this first side, the 3rd side and the upper side of this housing.
According to described active heat removal formula power system, wherein also demarcation strip can be set between this air flow drive device and this power supply input element, this second radiating airflow passage is formed by this thermal insulation board, this first side, the 3rd side, this upper side and the definition of this demarcation strip.
According to described active heat removal formula power system, wherein this second radiating airflow passage has the air-flow import and export, this air-flow is imported and exported and is made this second radiating airflow passage and this first radiating airflow channel connection, and wherein formed gap is these air-flow import and export of this second radiating airflow passage between this sidewall of this air flow drive device and this thermal insulation board.
According to described active heat removal formula power system, also comprise:
Circuit board is provided with described a plurality of electronic component on this circuit board, and this power supply input element is connected with this circuit board; And
The power supply output element is arranged on this housing and with this circuit board and is connected.
According to described active heat removal formula power system, wherein this second radiating airflow passage by described a plurality of electronic components one of them, this first side, the 3rd side and the upper side and the formation that this air flow drive device defines of this housing.
According to described active heat removal formula power system, wherein this housing has recess in the position of contiguous this power supply input element, also has the 3rd air-flow on the bottom surface of this recess and imports and exports.
According to described active heat removal formula power system, wherein this power supply input element has at least one first opening, at least one second opening and gas channel, wherein this first opening, this second opening are connected with this gas channel, and this second opening is connected with this second radiating airflow passage.
Active heat removal formula power system with power supply input element cooling mechanism of the present invention has the first radiating airflow passage and the second radiating airflow passage, wherein this first radiating airflow passage can guide radiating airflow that the heat that a plurality of electronic component produced is derived housing, and the heat that the second radiating airflow passage can guide radiating airflow that the power supply input element is produced is derived housing, and can not be subjected to the heat effects that a plurality of electronic component produces, so just, can be effectively to the power supply input element, socket for example, dispel the heat, with the temperature that reduces the power supply input element and make it meet the electrical safety standard.
Description of drawings
Fig. 1 is the structural representation of traditional active heat removal formula power system.
Fig. 2 is the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of the preferred embodiment of the present invention.
Fig. 3 shows the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of another preferred embodiment of the present invention.
Fig. 4 shows the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of the another preferred embodiment of the present invention.
Fig. 5 shows the present invention's structural representation of the active heat removal formula power system with power supply input element cooling mechanism of a preferred embodiment again.
Fig. 6 shows the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of the another preferred embodiment of the present invention.
Wherein, description of reference numerals is as follows:
1: active heat removal formula power system 11: housing
12: electronic component 13: the power supply input element
14: power supply output element 15: radiator fan
2: active heat removal formula power system with power supply input element cooling mechanism
21: housing 22: electronic component
221: magnetic element or electronic component 23: power supply input element
24: air flow drive device 25: circuit board
26: 27: the first radiating airflow passages of thermal insulation board
28: the second radiating airflow passages 30: demarcation strip
212: the second sides, 211: the first sides
213: the first air-flows are imported and exported 214: the second air-flows and are imported and exported
216: the three air-flows in 215: the three sides are imported and exported
232: the second openings of 231: the first openings
233: gas channel 241: opening
242: sidewall 281: air-flow is imported and exported
A: radiating airflow A ": radiating airflow
B: radiating airflow B ': radiating airflow
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different embodiment, its neither departing from the scope of the present invention, and explanation wherein and graphic be when the usefulness that explain in itself, but not in order to restriction the present invention.
See also Fig. 2, be the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of the preferred embodiment of the present invention.As shown in Figure 2, this active heat removal formula power system 2 with power supply input element cooling mechanism comprises housing 21 (being represented by dotted lines), a plurality of electronic component 22, power supply input element 23, air flow drive device 24 and power supply output element (not icon).Wherein, a plurality of electronic components 22 are arranged at housing 21 inside and are arranged on the circuit board 25, power supply input element 23 is arranged at first side 211 of housing 21 and is connected with circuit board 25, and power supply output element (not icon) is arranged on the housing 21 and with circuit board 25 and is connected.First side 211 of this housing 21 has at least one first air-flow and imports and exports 213, and second side 212 of this housing 21 has at least one second air-flow and imports and exports 214, and wherein this second side 212 is serving as preferred with respect to first side 211.These a plurality of electronic components 22 are between first side 211 and second side 212 of housing 21, and this air flow drive device 24, for example radiator fan then is arranged at first side 211, and the sidewall 242 of this air flow drive device 24 is adjacent to power supply input element 23 in fact.In addition, first air-flow on first side 211 of housing 21 is imported and exported 213 and is adjacent to power supply input element 23.
Please consult Fig. 2 again, the inside of housing 21 has the first radiating airflow passage 27, this first radiating airflow passage 27 mainly is when air flow drive device 24 driving radiating airflows flow, make 241 turnover of opening of this radiating airflow, whereby to form this first radiating airflow passage 27 in housing 21 inner spaces by import and export 214 of second air-flow on second side 212 and air flow drive device 24.In addition, the inside of housing 21 also has thermal insulation board 26, this thermal insulation board 26 is arranged between power supply input element 23 and a plurality of electronic component 22, and forms the second radiating airflow passage 28 with the sidewall 242 of air flow drive device 24 and first side 211, the 3rd side 215 and the upper side of housing 21 further.This second radiating airflow passage 28 has air-flow and imports and exports 281,26 formed gaps of the sidewall 242 of air flow drive device 24 and thermal insulation board for example, it can be imported and exported 213 with first air-flow on first side 211 and cooperatively interact, to pass in and out the gateway of this first radiating airflow passage 27 and this second radiating airflow passage 28 as radiating airflow.
For example, when air flow drive device 24 started, the radiating airflow of relatively large amount can be imported and exported 214 via second air-flow on second side 212 of housing 21 from external environment condition and enter the first radiating airflow passage 27.At this moment, the mode of radiating airflow A can be produced a plurality of electronic components 22 when working Btu utilization heat exchange is taken away, and derives via the opening 241 of air flow drive device 24 along the first radiating airflow passage 27 again.In addition, part radiating airflow B relatively in a small amount can import and export 213 via first air-flow on first side 211 of housing 21 and enter the second radiating airflow passage 28.After the mode of the Btu utilization heat exchange that power supply input element 23 is produced is taken away, formed radiating airflow B ' can be entered in the first radiating airflow passage 27 and with radiating airflow A by the air-flow import and export 281 of the second radiating airflow passage 28 and mix, after radiating airflow B ' is sneaked into radiating airflow A, mixed radiating airflow A " just can derive via the opening 241 of air flow drive device 24, therefore just can reach the temperature that the heat that makes power supply input element 23 efficiently radiates heats and avoid a plurality of electronic installations 22 to be produced directly has influence on power supply input element 23.
In this embodiment, thermal insulation board 26 can completely cut off heat transferred that a plurality of electronic components 22 are produced on the one hand to power supply input element 23, also can form the second radiating airflow passage 28 on the other hand with the side of housing 21 and the sidewall 242 of air flow drive device 24, make the radiating airflow of a part directly to enter the second radiating airflow passage 28 via the import and export of first air-flow on first side plate 211 213, so just can utilize the radiating airflow of lower temperature and under the situation of a plurality of electronic components 22 of the heat production of not flowing through, directly derive through the opening 241 of air flow drive device 24, and then this power supply input element 23 dispelled the heat, reducing the thermal effect that 22 pairs of power supply input elements 23 of a plurality of electronic components are caused, and reach the purpose that makes power supply input element 23 meet the electrical safety temperature profile.
In certain embodiments, if it is that opening 241 by air flow drive device 24 is when entering that air flow drive device 24 drives the flow direction of radiating airflows, the radiating airflow of the first radiating airflow passage 27 and the second radiating airflow passage 28 of flowing through also can flow with opposite direction, similarly can reach a plurality of electronic components 22 heat radiations that make housing 21 inside and the purpose that makes power supply input element 23 efficiently radiates heats.
Please consult Fig. 3 again, show the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of another preferred embodiment of the present invention.As shown in Figure 3, in this embodiment, internal structure and the function of active heat removal formula power system 2 with power supply input element cooling mechanism is to embodiment illustrated in fig. 2 similar, be that thermal insulation board 26 in embodiment illustrated in fig. 2 can utilize relatively large magnetic element or the electronic component 221 of volume in a plurality of electronic components 22, transformer for example, substitute, structure that it is whole and principle repeat no more in this with shown in the aforementioned embodiment.
Please consult Fig. 4 again, show the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of the another preferred embodiment of the present invention.As shown in Figure 4, in this embodiment, internal structure and the function of active heat removal formula power system 2 with power supply input element cooling mechanism is to embodiment illustrated in fig. 2 similar, just between the sidewall 242 of air flow drive device 24 and power supply input element 23, also demarcation strip 30 can be set, the second radiating airflow passage 28 like this just can pass through thermal insulation board 26 (or large-scale electronic component or magnetic element 221), first side 211, the 3rd side 215, upper side and demarcation strip 30 formation that defines, structure that it is whole and principle repeat no more in this with shown in the aforementioned embodiment.
Please consult Fig. 5 again, show the present invention's structural representation of the active heat removal formula power system with power supply input element cooling mechanism of a preferred embodiment again.As shown in Figure 5, in this embodiment, internal structure and the function of active heat removal formula power system 2 with power supply input element cooling mechanism be to embodiment illustrated in fig. 2 similar, just housing 21 in shape with embodiment illustrated in fig. 2 different.Housing 21 can form recess in the position of contiguous power supply input element 23, have the 3rd air-flow on the bottom surface of this recess and import and export 216, so, radiating airflow similarly can be imported and exported 216 via the 3rd air-flow and enter the second radiating airflow passage 28, and then, derive via the opening 241 of air flow drive device 24 with after the radiating airflow of the first radiating airflow passage 27 mixes.Structure that it is whole and principle repeat no more in this with shown in the aforementioned embodiment.Certainly, the recess of housing 21 also can cooperatively interact with the inner walls of system (not shown), to form the gas channel of housing 21 outsides, so similarly can reach the purpose that makes 23 heat radiations of power supply input element.
In addition, in certain embodiments, the position that is provided with of first air-flow of first side 211 import and export 213 is not limited to above power supply input element 23, and it also can be arranged at the below and the right and left of power supply input element 23, and not as limit.In addition, second air-flow is imported and exported 214 and also is not limited to be arranged on second side 212, and certainly, this second air-flow is imported and exported 214 and also can be arranged on any side of housing 21 except that first side 211.
Please consult Fig. 6 again, show the structural representation of the active heat removal formula power system with power supply input element cooling mechanism of the another preferred embodiment of the present invention.In this embodiment, power supply input element 23 can be a modular construction, it can be combined (not icon) by power supply input element body and shell body, this shell body combines with this power supply input element body and forms at least one first opening 231, at least one second opening 232 and gas channel 233, first opening 231 wherein, second opening 232 is connected with gas channel 233, therefore pass through first opening 231 of power supply input element 23, second opening 232 just can make radiating airflow enter gas channel 233 by first opening 231 of power supply input element 23 with gas channel 233 further, and then be directed at the second radiating airflow passage 28 via second opening 232, so just can reach the purpose that makes power supply input element 23 efficiently radiates heats.
In sum, active heat removal formula power system 2 with power supply input element cooling mechanism of the present invention has the first radiating airflow passage 27 and the second radiating airflow passage 28, wherein this first radiating airflow passage 27 can guide radiating airflow that the heat that a plurality of electronic components 22 are produced is derived housing 21, and the heat that the second radiating airflow passage 28 can guide radiating airflow that power supply input element 23 is produced is derived housing 21, and can not be subjected to the heat effects that a plurality of electronic components 22 are produced, so just, can be effectively to power supply input element 23, socket for example, dispel the heat, with the temperature that reduces power supply input element 23 and make it meet the electrical safety standard.
Claims (13)
1. active heat removal formula power system with power supply input element cooling mechanism, it comprises:
Housing has first side, the first radiating airflow passage and the second radiating airflow passage, and wherein this first side has at least one first air-flow import and export, and this first air-flow is imported and exported and is connected with this second radiating airflow passage;
A plurality of electronic components are arranged in this enclosure interior and this first radiating airflow passage;
Air flow drive device is arranged at this first side of this housing; And
The power supply input element is arranged in this first side and this second radiating airflow passage of this housing;
Wherein, this air flow drive device flows radiating airflow between the opening of these first air-flow import and export, this second radiating airflow passage and this air flow drive device, so that this power supply input element is dispelled the heat.
2. active heat removal formula power system as claimed in claim 1, wherein this power supply input element is a socket, and this air flow drive device is a radiator fan.
3. active heat removal formula power system as claimed in claim 1, wherein this housing also has second side, and this second side has that at least one second air-flow is imported and exported and this second side is relative with this first side.
4. active heat removal formula power system as claimed in claim 3, wherein this first radiating airflow passage is when this air flow drive device driving radiating airflow flows, make between this radiating airflow this opening to pass in and out, to form this first radiating airflow passage in this enclosure interior space by these the second air-flow import and export on this second side and this air flow drive device.
5. active heat removal formula power system as claimed in claim 1, wherein this first air-flow on this of this housing first side is imported and exported and is adjacent to this power supply input element.
6. active heat removal formula power system as claimed in claim 1, wherein the sidewall of this air flow drive device is adjacent to this power supply input element in fact.
7. active heat removal formula power system as claimed in claim 6, also comprise thermal insulation board, this thermal insulation board is arranged between this power supply input element and the described a plurality of electronic component, and forms this second radiating airflow passage with this sidewall of this air flow drive device and this first side, the 3rd side and the upper side of this housing.
8. active heat removal formula power system as claimed in claim 7, wherein also demarcation strip can be set between this air flow drive device and this power supply input element, this second radiating airflow passage is formed by this thermal insulation board, this first side, the 3rd side, this upper side and the definition of this demarcation strip.
9. active heat removal formula power system as claimed in claim 7, wherein this second radiating airflow passage has the air-flow import and export, this air-flow is imported and exported and is made this second radiating airflow passage and this first radiating airflow channel connection, and wherein formed gap is these air-flow import and export of this second radiating airflow passage between this sidewall of this air flow drive device and this thermal insulation board.
10. active heat removal formula power system as claimed in claim 1 also comprises:
Circuit board is provided with described a plurality of electronic component on this circuit board, and this power supply input element is connected with this circuit board; And
The power supply output element is arranged on this housing and with this circuit board and is connected.
11. active heat removal formula power system as claimed in claim 1, wherein this second radiating airflow passage by described a plurality of electronic components one of them, this first side, the 3rd side and the upper side and the formation that this air flow drive device defines of this housing.
12. active heat removal formula power system as claimed in claim 1, wherein this housing has recess in the position of contiguous this power supply input element, also has the 3rd air-flow on the bottom surface of this recess and imports and exports.
13. active heat removal formula power system as claimed in claim 1, wherein this power supply input element has at least one first opening, at least one second opening and gas channel, wherein this first opening, this second opening are connected with this gas channel, and this second opening is connected with this second radiating airflow passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610115626A CN100579351C (en) | 2006-08-17 | 2006-08-17 | Active heat dispersion power supply system with heat dispersion mechanism of power supply input part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610115626A CN100579351C (en) | 2006-08-17 | 2006-08-17 | Active heat dispersion power supply system with heat dispersion mechanism of power supply input part |
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| Publication Number | Publication Date |
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| CN101128106A true CN101128106A (en) | 2008-02-20 |
| CN100579351C CN100579351C (en) | 2010-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610115626A Active CN100579351C (en) | 2006-08-17 | 2006-08-17 | Active heat dispersion power supply system with heat dispersion mechanism of power supply input part |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103314490A (en) * | 2010-11-09 | 2013-09-18 | 服务器技术股份有限公司 | Equipment-rack power distribution system with cooling |
| CN110957652A (en) * | 2019-12-09 | 2020-04-03 | 江阴市天马电源制造有限公司 | Modular power supply assembly process |
| CN111182712A (en) * | 2020-01-14 | 2020-05-19 | Oppo广东移动通信有限公司 | Electronic device |
| TWI695670B (en) * | 2019-03-21 | 2020-06-01 | 大陸商台達電子企業管理（上海）有限公司 | Power structure |
-
2006
- 2006-08-17 CN CN200610115626A patent/CN100579351C/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103314490A (en) * | 2010-11-09 | 2013-09-18 | 服务器技术股份有限公司 | Equipment-rack power distribution system with cooling |
| CN103314490B (en) * | 2010-11-09 | 2016-10-12 | 服务器技术股份有限公司 | The equipment rack distribution system of band cooling |
| TWI695670B (en) * | 2019-03-21 | 2020-06-01 | 大陸商台達電子企業管理（上海）有限公司 | Power structure |
| US11183801B2 (en) | 2019-03-21 | 2021-11-23 | Delta Electronics (Shanghai) Co., Ltd. | Power supply structure |
| CN110957652A (en) * | 2019-12-09 | 2020-04-03 | 江阴市天马电源制造有限公司 | Modular power supply assembly process |
| CN111182712A (en) * | 2020-01-14 | 2020-05-19 | Oppo广东移动通信有限公司 | Electronic device |
| CN111182712B (en) * | 2020-01-14 | 2021-05-14 | Oppo广东移动通信有限公司 | Electronic device |
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| Publication number | Publication date |
|---|---|
| CN100579351C (en) | 2010-01-06 |
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Assignee: Taida Electronic and Power Source (Dongguang) Co., Ltd. Assignor: Delta Optoelectronics Inc. Contract record no.: 2011990000746 Denomination of invention: Active heat dispersion power supply system with heat dispersion machine of power supply input part Granted publication date: 20100106 License type: Exclusive License Open date: 20080220 Record date: 20110803 |