WO2023151708A2 - Electronic element heat dissipation assembly - Google Patents

Abstract

Disclosed in the present utility model is an electronic element heat dissipation assembly, comprising a mounting plate. A heat dissipation layer is arranged on an upper surface of the mounting plate, and one side face of the heat dissipation layer is provided with a grid-shaped heat dissipation wall; a heat dissipation fan is located above the heat dissipation layer; and several data interfaces are arranged on a lower surface of the mounting plate. The heat dissipation layer provided with the heat dissipation wall is designed in the present application, thereby enhancing the air mobility of the periphery of the entire heat dissipation assembly, and improving the heat dissipation effect. An electric motor is connected to a heat conduction pad, and matches a heat conduction shell on the periphery of the fan, such that effective cooling of the electric motor is achieved.

Description

An electronic component cooling component technical field

The utility model relates to the technical field of cooling fans, in particular to a cooling assembly for electronic components.

Background technique

Electronic components will generate heat when they work, leading to an increase in the overall temperature, which may cause the electrical components to burn out. Usually, electronic components will have heat dissipation components. The current heat dissipation components basically use fans on the electronic components to dissipate heat, but directly adding fans leads to weak airflow on the surface of the electronic components and no effective airflow guidance, resulting in poor heat dissipation effect.

Therefore, it is necessary to design a new cooling assembly to solve the technical problem of poor air flow.

Utility model content

The purpose of the utility model is to provide a cooling assembly for electronic components.

To achieve the above object, the utility model adopts the following content:

A heat dissipation assembly for electronic components, comprising: a mounting plate, a heat dissipation layer is arranged on the upper surface of the heat dissipation layer, a grid-shaped heat dissipation wall is provided on one side of the heat dissipation layer; a heat dissipation fan is arranged above the heat dissipation layer ; The lower surface of the mounting plate is provided with several data interfaces.

Preferably, the heat dissipation layer includes: a heat dissipation plate, a heat dissipation wall, and a heat conduction pad; one side of the heat dissipation plate is provided with two pillars for connecting the mounting plate, and the other side is connected to the mounting plate through the heat dissipation wall; The heat dissipation wall is as long as the heat dissipation plate, and the lower part passes through the installation plate There are plug terminals; the heat conduction pad is attached to the lower surface of the heat dissipation plate; the upper surface of the heat dissipation plate is provided with a heat dissipation fan.

Preferably, the heat dissipation wall includes: a grid bar abutted against the heat dissipation plate and a housing for accommodating the grid bars; the grid bars are equidistantly distributed on the sides of the heat dissipation plate; the housing The two sides of the side wall extend toward the direction of the heat dissipation plate.

Preferably, the heat dissipation fan includes: a motor, a fan and a heat conduction housing; the motor is arranged on the heat dissipation layer and connected to the heat conduction pad through the heat dissipation plate; the fan is arranged on the heat dissipation layer On the motor; the outer side of the fan is provided with a heat conduction shell.

Preferably, heat dissipation channels are provided on both sides of the heat conduction housing.

Preferably, the data interface is a USB data interface, an HDMI high-definition interface and a network interface.

Preferably, the number of the plug terminals corresponds to the number of the grid bars.

The utility model has the following advantages:

1. This application designs a heat dissipation layer with a heat dissipation wall, which enhances the air flow around the entire heat dissipation component and improves the heat dissipation effect.

2. In this application, the motor is connected to the heat conduction pad, and the heat conduction shell around the fan is used to realize the effective cooling of the motor.

Description of drawings

Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in further detail;

Fig. 1 is a schematic structural diagram of an electronic component cooling assembly of the present invention;

Fig. 2 is a cooling assembly for electronic components of the present invention Fig. 1 removes the cooling fan Schematic;

Fig. 3 is a schematic diagram of the bottom structure of Fig. 2 of an electronic component cooling assembly of the present invention;

Fig. 4 is a side view structure diagram of an electronic component heat dissipation assembly of the present invention without a heat dissipation fan;

Fig. 5 is a structural schematic diagram of a heat dissipation fan of an electronic component heat dissipation assembly of the present invention;

Fig. 6 is a schematic diagram of the bottom view structure of Fig. 5 of an electronic component heat dissipation assembly of the present utility model;

Fig. 7 is a structural schematic diagram of a heat dissipation fan of an electronic component heat dissipation assembly of the present invention with the heat conduction shell removed;

In the figure, each reference sign is:
1-installation plate, 2-radiation layer, 201-radiation plate, 2011-pillar, 202-radiation wall, 2021-
Grille bar, 2022-housing, 203-thermal pad, 204-plug terminal, 3-cooling fan, 301-motor, 302-fan, 303-thermal shell, 3031-cooling channel, 4-data interface, 401- USB data interface, 402-HDMI high-definition interface, 403-network interface.

Detailed ways

In order to illustrate the utility model more clearly, the utility model will be further described below in conjunction with preferred embodiments. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present utility model.

In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "front", "rear" Wait for the indicated bearing or position off Based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it cannot be understood as a limitation of the present utility model.

In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection", and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or It is detachably connected, set, or integrally connected, set. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations.

As shown in Figures 1 to 7, a cooling assembly for electronic components includes: a mounting plate 1, a heat dissipation layer 2 is provided on the upper surface of the mounting plate 1, and a grid-shaped heat dissipation wall 202 is provided on one side of the heat dissipation layer 2 ; A heat dissipation fan 3 is arranged above the heat dissipation layer 2 ; several data interfaces 4 are arranged on the lower surface of the installation board 1 .

It should be noted that the mounting board is a circuit board or other components that require heat dissipation, and the design purpose of this application is to dissipate heat more efficiently for components that need heat dissipation through the heat dissipation design of this application.

Further, the heat dissipation layer 2 includes: a heat dissipation plate 201, a heat dissipation wall 202, and a heat conduction pad 203; one side of the heat dissipation plate 201 is provided with two pillars 2011 for connecting the mounting plate 1, and the other side is passed through the heat dissipation wall. 202 is connected to the mounting plate 1; the heat dissipation wall 202 is as long as the heat dissipation plate 201, and the insertion terminal 204 is installed on the mounting plate 1 below; the heat conduction pad 203 is attached to the bottom of the heat dissipation plate 201 Surface; the upper surface of the heat dissipation plate 201 is provided with a heat dissipation fan 3 .

There is a space between the cooling plate and the mounting plate, when the fan works, the air flow from the cooling plate and After passing through the grill bars between the mounting plates, the air is blown out by a fan, so that the air flow can pass through the entire upper surface of the mounting plates, which has a good heat dissipation effect.

Further, the heat dissipation wall 202 includes: grid bars 2021 abutting against the heat dissipation plate 201 and a housing 2022 for accommodating the grid bars; the grid bars 2021 are equally spaced on the sides of the heat dissipation plate 201 Above; the two sides of the casing 2022 extend toward the direction of the heat sink 201 to form side walls.

The grill strips can effectively conduct heat, transferring the temperature of the mounting plate and the surrounding temperature of the cooling fan.

Further, the heat dissipation fan 3 includes: a motor 301, a fan 302 and a heat conduction housing 303; the motor 301 is arranged on the heat dissipation layer 2, and is connected to the heat conduction pad 203 through the heat dissipation plate 201; The fan 302 is disposed on the motor 301 ; a heat conduction housing 303 is disposed outside the fan 302 .

Further, heat dissipation channels 3031 are provided on both sides of the heat conduction housing 303 .

Further, the data interface 4 is a USB data interface 401 , an HDMI high-definition interface 402 and a network interface 403 .

The number of plug terminals 204 corresponds to the number of grid bars 2021 .

The present application designs a heat dissipation layer with a heat dissipation wall, which enhances the air flow around the entire heat dissipation component and improves the heat dissipation effect.

In this application, the motor is connected to the heat conduction pad, and the heat conduction shell around the fan is used to realize the effective cooling of the motor.

Obviously, the above-mentioned embodiments of the utility model are only examples for clearly illustrating the utility model, rather than limiting the implementation of the utility model. For those of ordinary skill in the field, on the basis of the above description, other different forms of changes or changes can also be made, and all implementation modes cannot be exhaustively listed here, and it is obvious that all the technical solutions that belong to the utility model are derived Changes or variations still fall within the protection scope of the present utility model.

Claims (7)

A heat dissipation assembly for electronic components, characterized in that it comprises: a mounting plate, the upper surface of the mounting plate is provided with a heat dissipation layer, and one side of the heat dissipation layer has a grid-shaped heat dissipation wall; A cooling fan is provided; several data interfaces are provided on the lower surface of the installation board. The heat dissipation assembly for electronic components according to claim 1, wherein the heat dissipation layer comprises: a heat dissipation plate, a heat dissipation wall, and a heat conduction pad; one side of the heat dissipation plate is provided with two The other side of the pillar is connected to the mounting plate through the heat dissipation wall; the heat dissipation wall is as long as the heat dissipation plate, and a plug-in terminal is provided through the mounting plate below; the heat conduction pad is attached to the bottom of the heat dissipation plate Surface; the upper surface of the heat dissipation plate is provided with a heat dissipation fan. The cooling assembly for electronic components according to claim 2, wherein the heat dissipation wall comprises: a grid bar abutting on the heat dissipation plate and a housing for accommodating the grid bar; the grid bars are equally spaced Distributed on the side of the heat dissipation plate; the two sides of the housing extend out of the side walls towards the direction of the heat dissipation plate. The heat dissipation assembly for electronic components according to claim 2, wherein the heat dissipation fan comprises: a motor, a fan, and a heat conduction housing; the motor is arranged on the heat dissipation layer and passes through the heat dissipation plate connected to the heat conduction pad; the fan is arranged on the motor; the outside of the fan is provided with a heat conduction shell. The heat dissipation assembly for electronic components according to claim 4, wherein heat dissipation passages are provided on both sides of the heat conduction housing. The electronic component cooling assembly according to claim 1, wherein the data interface is a USB data interface, an HDMI high-definition interface and a network interface. The heat dissipation assembly for electronic components according to claim 3, wherein the number of the plug-in terminals corresponds to the number of the grid bars.