CN101123247B - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
- Publication number
- CN101123247B CN101123247B CN2006101042524A CN200610104252A CN101123247B CN 101123247 B CN101123247 B CN 101123247B CN 2006101042524 A CN2006101042524 A CN 2006101042524A CN 200610104252 A CN200610104252 A CN 200610104252A CN 101123247 B CN101123247 B CN 101123247B
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- China
- Prior art keywords
- light
- emitting diode
- lens arrangement
- backlight unit
- chip
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Abstract
The invention relates to a luminescent diode encapsulation structure, which comprises at least: a plurality of pins, at least two luminescent diode chips of different colors fixed on the pins and having an electrical connection with the pins, and an encapsulation colloid packs the luminescent diode chips and part of the pins. The encapsulation colloid forms a lens structure on each of the luminescent diode chips and the luminescent diode chips of different colors have lens structures with different structures. The luminescent diode encapsulation structure of the invention effectively increasesthe luminescent and optical mixing evenness degree of the whole encapsulation body.
Description
Technical field
The present invention relates to a kind of semiconductor package structure, particularly relate to a kind of encapsulating structure of light-emitting diode.
Background technology
In recent years, the range of application of light-emitting diode enlarges rapidly, and up-to-date application at present comprises the backlight module of various electronic apparatus screens.
Backlight module comprises a plurality of package structure for LED, and the light-emitting diode that has multiple different colours is in order to be mixed into white light.Light-emitting diode (LED) backlight module is except continuous increase brightness and strengthening dispelling the heat, and its uniformity also is the emphasis of another challenge.How the encapsulated phase at light-emitting diode just begins to solve the problem of even light mixing degree, is the focus that each manufacturer pays close attention to.
Summary of the invention
Technical problem to be solved by this invention is, a kind of package structure for LED is provided, and solves the problem of the uniformity of luminous and mixed light.
To achieve these goals, the invention discloses a kind of package structure for LED, comprise at least: many pins; The light-emitting diode chip for backlight unit of at least two different colors is fixed on the described pin and with those light-emitting diode chip for backlight unit of its electric connection and comprises a green LED chip, a blue led chips and a red light emitting diodes chip wherein two; An and packing colloid, pack the part of described light-emitting diode chip for backlight unit and described pin, wherein this packing colloid forms lens arrangement on each light-emitting diode chip for backlight unit, and the light-emitting diode chip for backlight unit of different colors has the lens arrangement of different structure, the pairing lens arrangement of this green LED chip has the plane that a smooth surface and connects this smooth surface, the pairing lens arrangement of this blue led chips has a last plane and the smooth surface around plane on this that is positioned at the central area of this lens arrangement, and should go up the plane and be connected with this smooth surface, this red light emitting diodes chip has the side that a smooth surface and two connects this smooth surface.
The height of described lens arrangement is lower than 2mm.
Package structure for LED of the present invention, at least two light-emitting diode chip for backlight unit are packaged in the same packaging body, and be the lens arrangement of versicolor light-emitting diode chip for backlight unit design different structure, make that the uniformity of luminous and mixed light of whole packaging body is effectively promoted.
Description of drawings
Fig. 1 is the stereogram according to a kind of package structure for LED of a preferred embodiment of the present invention; And
Fig. 2 is the vertical view according to a kind of package structure for LED of a preferred embodiment of the present invention.
Wherein, Reference numeral:
100: package structure for LED 102: packing colloid
110/120a/120b/130: lens arrangement 112a/112b: plane
114a/114b/116: pin 121: light-emitting diode chip for backlight unit
122a/122b: plane 124a/124b/126: pin
127a/127b/129: pin 132: plane
134a/134b/136: pin
Embodiment
As mentioned above, the light-emitting diode chip for backlight unit that the invention provides different colours is packaged in the same packaging body, and be the lens arrangement of versicolor light-emitting diode chip for backlight unit design different structure, make the uniformity of luminous and mixed light of whole packaging body effectively to promote.
See also Fig. 1, be stereogram according to a kind of package structure for LED of a preferred embodiment of the present invention.In this preferred embodiment, four light-emitting diode chip for backlight unit (one be red, one for blue, two for green in addition) in the packaged same package structure for LED 100.With one of them green LED chip is example (other be not shown in drawing), and light-emitting diode chip for backlight unit 121 is fixed on pin 124a and the 124b, and electrically connects with pin 124a, 124b and 126.Other light-emitting diode chip for backlight unit also is fixed on its corresponding pin.After four light-emitting diode chip for backlight unit were all consolidated crystalline substance and routing (electrically connecting with corresponding pin), the part of a packing colloid 102 those light-emitting diode chip for backlight unit of packing and pin formed its lens arrangement simultaneously on each light-emitting diode chip for backlight unit.The light-emitting diode chip for backlight unit of different colors has the lens arrangement of different structure, and for example the red light emitting diodes chip has lens arrangement 110; The green LED chip has lens arrangement 120a and 120b; Blue led chips has lens arrangement 130.Generally speaking, when the height of lens arrangement is lower than 2mm, can meet the demand of backlight module.This preferred embodiment only is the usefulness of demonstration, and the light-emitting diode chip for backlight unit that a package structure for LED is comprised is not restricted to four.As long as package structure for LED comprises at least two and have the light-emitting diode chip for backlight unit of different colours, all do not break away from spirit of the present invention.
Please refer to Fig. 2, it is the vertical view according to a kind of package structure for LED of a preferred embodiment of the present invention.For the uniformity of the luminous and mixed light that makes whole packaging body can effectively promote, the present invention is the lens arrangement of versicolor light-emitting diode chip for backlight unit design different structure.For example, the lens arrangement 110 that the red light emitting diodes chip has is that a smooth surface adds two plane 112a and the 112b that are positioned at side; Lens arrangement 120a that the green LED chip has or 120b are that a smooth surface adds a plane 122a or a 122b who is positioned at side; The lens arrangement 130 that blue led chips has is that a smooth surface adds a plane 132, and plane 132 is positioned at the central area of lens arrangement 130, and smooth surface is around plane 132.The uniformity that makes luminous and mixed light of can working in coordination between the lens arrangement of different colours can effectively promote.For example, the lens arrangement that red light emitting diodes chip and green LED chip are had, its plane can be in correspondence with each other (for example plane 112a corresponding flat 122a, plane 112b corresponding flat 122b).Working in coordination between the lens arrangement of above-mentioned different colours only is the usefulness of demonstration.And the lens arrangement of the designed cooperation of every kind of color LEDs chip is not absolute yet.For example, be applicable to the lens arrangement of this preferred embodiment (four light-emitting diode chip for backlight unit), not necessarily be applicable to the embodiment that comprises three light-emitting diode chip for backlight unit; Be applicable to the cooperation between the lens arrangement of this preferred embodiment, also not necessarily be applicable to the embodiment that comprises three light-emitting diode chip for backlight unit.In addition, 114a, 114b, 116,127a, 127b, 129,134a, 134b, 136 are all pin among the figure, distribute to be arranged on each side of encapsulating structure.
By the invention described above preferred embodiment as can be known, use package structure for LED of the present invention, at least two light-emitting diode chip for backlight unit are packaged in the same packaging body, and be the lens arrangement of versicolor light-emitting diode chip for backlight unit design different structure, make that the uniformity of luminous and mixed light of whole packaging body is effectively promoted.
Though the present invention with preferred embodiment openly as above; but it is not in order to qualification the present invention, any those of ordinary skill in the art, without departing from the spirit and scope of the present invention; can do various changes and modification, so protection scope of the present invention is looked the accompanying Claim book person of defining and is as the criterion.
Claims (2)
1. a package structure for LED is characterized in that, comprises at least:
Many pins;
The light-emitting diode chip for backlight unit of at least two different colors, be fixed on the described pin and with its electric connection, those light-emitting diode chip for backlight unit comprise a green LED chip, a blue led chips and a red light emitting diodes chip wherein two; And
One packing colloid, pack the part of described light-emitting diode chip for backlight unit and described pin, wherein this packing colloid forms lens arrangement on each light-emitting diode chip for backlight unit, and the light-emitting diode chip for backlight unit of different colors has the lens arrangement of different structure, the pairing lens arrangement of this green LED chip has the plane that a smooth surface and connects this smooth surface, the pairing lens arrangement of this blue led chips has a last plane and the smooth surface around plane on this that is positioned at the central area of this lens arrangement, and should go up the plane and be connected with this smooth surface, this red light emitting diodes chip has the side that a smooth surface and two connects this smooth surface.
2. package structure for LED as claimed in claim 1 is characterized in that the height of this lens arrangement is lower than 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101042524A CN101123247B (en) | 2006-08-07 | 2006-08-07 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101042524A CN101123247B (en) | 2006-08-07 | 2006-08-07 | LED encapsulation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101123247A CN101123247A (en) | 2008-02-13 |
| CN101123247B true CN101123247B (en) | 2010-06-09 |
Family
ID=39085498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101042524A Expired - Fee Related CN101123247B (en) | 2006-08-07 | 2006-08-07 | LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101123247B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020232668A1 (en) * | 2019-05-22 | 2020-11-26 | Cree Huizhou Solid State Lighting Company Limited | Arrangements for light emitting diode packages |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1540201A (en) * | 2003-04-21 | 2004-10-27 | 株式会社小糸制作所 | Headlamp of vehicle |
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2006
- 2006-08-07 CN CN2006101042524A patent/CN101123247B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1540201A (en) * | 2003-04-21 | 2004-10-27 | 株式会社小糸制作所 | Headlamp of vehicle |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平10-173242A 1998.06.26 |
| JP特开平6-177425A 1994.06.24 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101123247A (en) | 2008-02-13 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100609 Termination date: 20110807 |