CN101110406A - Multiple chip packaging structure and its packaging method - Google Patents
Multiple chip packaging structure and its packaging method Download PDFInfo
- Publication number
- CN101110406A CN101110406A CNA2006100291534A CN200610029153A CN101110406A CN 101110406 A CN101110406 A CN 101110406A CN A2006100291534 A CNA2006100291534 A CN A2006100291534A CN 200610029153 A CN200610029153 A CN 200610029153A CN 101110406 A CN101110406 A CN 101110406A
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- chip
- capsulation material
- lead frame
- packaging structure
- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a multi-chip packaging structure and packaging method, in particular to a multi-chip packaging structure and packaging method with a lead frame as a chip carrier, which technically provides a low-cost and high-density chip packaging structure and comprises a lead frame, a chip holder, inner pins, outer pins, at least two chips respectively arranged on two sides of the chip holder, a lead to electrically connect the chip with the inner pin, first plasticizing material to wrap the chip on a first surface of the chip holder, the lead and partial inner pins, second plasticizing material to wrap the first plasticizing material, the chip on a second surface of the chip holder, the lead and the inner pins of the lead frame. Besides, the present invention also provides a packaging method with the structure above and a multi-chip packaging structure with the lead frame as the chip carrier. The lead frame needs lower cost than a substrate, thus realizing a low-cost and high-density chip packaging structure.
Description
Technical field
The present invention relates to a kind of multichip packaging structure and method for packing thereof, relating in particular to a kind of is the multichip packaging structure and the method for packing thereof of chip carrier with the lead frame.
Background technology
In the information age now, electronic product is full of in fields of society, and the human life style and the mode of production have had unprecedented great change.Along with the continuous evolution of electronics technology, electronic product more humane, with better function arises at the historic moment thereupon.For miniaturization, low cost, high density and the multi-functional requirement of satisfying electronic product, with regard to Chip Packaging, occurred in a packaging body, coating a plurality of chips, such as multi-chip module (Multi-chip-module) technology, stacked chips (Stack Die) technology etc.
See also Fig. 1, Fig. 1 is the structural representation of the multi-chip module encapsulation of prior art.As shown in the figure, this encapsulating structure comprises substrate 110, a plurality of chip 120, a plurality of lead 130, tin ball 150 and capsulation material 160.Wherein, substrate 110 has a substrate surface 111 and a corresponding substrate back 112, at substrate 111 masks a plurality of chip carriers 113 and a plurality of lead weld pad 114 is arranged; At substrate 110 back sides 112 a plurality of tin ball pad 115 are arranged; Each chip 120 has the active surface 121 and the corresponding back side 122, is equipped with a plurality of lead weld pads 123 on its active surface 121.Chip 120 is bonded on the chip carrier 113 of substrate 110 by die bonding agent 140 with its back side 122.One end of lead 130 is electrically connected with lead weld pad 114 on substrate 110 fronts 111, and the other end then is electrically connected with the lead weld pad 123 of chip 120.Capsulation material 160 coats substrate 110, chip 120 and lead 130.Tin ball 150 is disposed on the tin ball pad 115 at substrate 110 back sides 112.
Though miniaturization, highdensity requirement have been satisfied in the multicore sheet encapsulation that with the substrate is chip carrier,, be not suitable for requiring low cost, highdensity product, for example some storage chips because the cost of substrate is higher.Therefore, encapsulating structure how to realize low-cost high-density has been important topic.
Summary of the invention
Technical problem to be solved by this invention provides a kind of low cost, highdensity chip-packaging structure, and it comprises: lead frame comprises: chip carrier, interior pin and outer pin; Place at least two chips on described chip carrier two sides respectively, described chip and described interior pin electrically connect with lead; Coat first capsulation material of pin in chip, lead and the part on first of the described chip carrier; And second capsulation material that coats the interior pin of chip on second of described first capsulation material, described chip carrier and lead and described lead frame.
In above-mentioned multichip packaging structure, a chip is placed on described chip carrier two sides respectively.
In above-mentioned multichip packaging structure, piling up on described at least one chip has at least one chip.
In above-mentioned multichip packaging structure, described first capsulation material is liquid capsulation material.
In above-mentioned multichip packaging structure, described second capsulation material is the injection molding capsulation material.
The present invention also provides a kind of method for packing of multichip packaging structure, and described encapsulating structure comprises: lead frame, at least two chips, lead, first capsulation material and second capsulation materials, and described method comprises:
(1) one side at described lead frame covers the film that one deck does not combine with described first capsulation material;
(2) on the another side of described lead frame by binding agent with the chip carrier of described first chip attach at described lead frame on;
(3) with the described lead bonding that goes between, finish the electric connection of first chip and described lead frame;
(4) with described first capsulation material coat described first chip, the first chip place face lead and the part in pin;
(5) solidify described first capsulation material;
(6) throw off the described film that covers on the lead frame;
(7) on the one side of lead frame, carry out the stickup of second chip with the method for step (2);
(8) finish the electric connection of described second chip and described lead frame with the method for step (3);
(9) coat the lead of described first capsulation material, second chip, the second chip place face and the interior pin in the described lead frame with second capsulation material;
(10) solidify described second capsulation material;
(11) whole encapsulating structure is cut with pin process.
In the method for packing of above-mentioned multichip packaging structure, described first capsulation material is liquid capsulation material.
In the method for packing of above-mentioned multichip packaging structure, described second capsulation material is the injection molding capsulation material.
In the method for packing of above-mentioned multichip packaging structure, step (2) afterwards step (4) add following steps before: use chip-stacked technology on described first chip, to place at least one chip; With the described lead bonding that goes between, finish the electric connection of these chips and described lead frame.
In the method for packing of above-mentioned multichip packaging structure, step (7) afterwards step (9) add following steps before: use chip-stacked technology on described second chip, to place at least one chip; With the described lead bonding that goes between, finish the electric connection of these chips and described lead frame.
The invention provides a kind of is the multichip packaging structure of chip carrier with the lead frame.Because of the cost of lead frame will be more much lower than substrate, thereby can realize low cost, highdensity chip-packaging structure.
Description of drawings
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail, wherein:
Fig. 1 is the structural representation of the multi-chip module encapsulation of prior art;
Fig. 2 is the structural representation of an embodiment of multichip packaging structure of the present invention;
Fig. 3 is the structural representation of another embodiment of multichip packaging structure of the present invention;
Fig. 4-Fig. 8 illustrates the making step of an embodiment of multichip packaging structure of the present invention.
Embodiment
See also Fig. 2, Fig. 2 is the structural representation of an embodiment of multichip packaging structure of the present invention.As shown in the figure, encapsulating structure of the present invention comprises: lead frame 210, first chip 220 and second chip 230, liquid capsulation material 260 and injection molding capsulation material 270.
Wherein, lead frame 210 comprises chip carrier 213, interior pin 214 and outer pin 215.First chip 220 is bonded at by die bonding agent 240 on 211 of chip carrier 213 of lead frame 210.Two plain conductor 250 1 ends link to each other with the interior pin 214 of lead frame 210, and the other end links to each other with the weld pad 221 of first chip 220, thereby realize the electric connection of first chip 220 and lead frame 210.Second chip 230 sticks on by identical mode on 212 of chip carrier 213 of lead frame 210, electrically connects with identical method simultaneously.Liquid capsulation material 260 (its characteristics be normal temperature under for liquid, be solid-state after the heating) coat first chip 220, the one side of pin 214 at 211 lead 250 of lead frame 210 and partly.(its characteristics are for solid-state under the normal temperature to injection molding capsulation material 270, change into liquid state after the heating earlier, be solid-state again) coat the interior pin 214 and the chip carrier 213 of liquid shape closure material 260, second chip 230, lead 250 and lead frame 210, form final plastic-sealed body.
Next introduce the concrete method for packing of the encapsulating structure of present embodiment.Please see Figure 4-Fig. 8, Fig. 4-Fig. 8 illustrates the making step of an embodiment of multichip packaging structure of the present invention.
Method for packing comprises:
(1) as shown in Figure 4, masking tape 280 on 212 of lead frame 210.
(2) then as shown in Figure 5, on 211 of lead frame 210, first chip 220 is sticked on the chip carrier 213 by chip attach agent 240.Chip attach agent 240 can comprise silver slurry (adding the epoxy resin of silver-colored inserts) etc.
(3) bonding (Wire Bonding) that goes between is then finished the electric connection of first chip 220 and lead frame 210.
(4) then as shown in Figure 6, coat first chips 220 with liquid capsulation material 260 and pin 210 at 211 plain conductor 250 and partly.Liquid capsulation material 260 can comprise the liquid-state epoxy resin capsulation material, for example the FP4450HF of Le Tai company.Owing to the covering of adhesive tape 280 is arranged, on 212 of lead frame 210, will not have the liquid capsulation material.
(5) heating is subsequently solidified liquid capsulation material 260.Different material cured condition differences, for example the curing temperature of the FP4450HF of Le Tai company is 150 degree, needs heating 2 hours.
(6) then as shown in Figure 7, throw off the adhesive tape 280 of 212 of coverings.
(7) simultaneously carry out the stickup of second chip 230 with identical method at this then.
(8) bonding that goes between is finished the electric connection of second chip 230 and lead frame 210.
(9) then as shown in Figure 8, use injection molding capsulation material 270 to coat the interior pin of liquid shape closure material 260, second chip 230, lead 250 and lead frame 210, form final plastic-sealed body with the method for injection moulding.Injection molding capsulation material 270 can comprise the epoxy-plastic packaging material, for example 7470 of Ri Dong company.
(10) capsulation material 270 that is heating and curing afterwards.Different material cured condition differences, for example 7470 of Ri Dong company curing temperature is 175 degree, needs heating 4 hours.
(11) whole encapsulating structure is cut with pin process at last.
Should understand, capsulation material of the present invention is not limited to liquid capsulation material 260 and the injection molding capsulation material 270 in the foregoing description, does not get final product so long as the plastic packaging condition of the different capsulation material of two kinds of plastic packaging conditions and second kind of capsulation material can not be destroyed the plastic packaging effect of first kind of capsulation material.Equally, also available other thin-film material of adhesive tape 280 replaces, first capsulation material combination as long as this kind film is got along well.
Introduce an alternative embodiment of the invention according to Fig. 3 at last.Fig. 3 is the structural representation of another embodiment of multichip packaging structure of the present invention.As shown in Figure 3, can use the technology of piling up (Stack Die) to place a plurality of chips on the chip carrier two sides simultaneously.Its method for packing was compared with last embodiment, step (2) afterwards step (4) before and/or step (7) afterwards step (9) add following steps before: use chip-stacked technology on first or second chip, to place at least one chip; With the lead bonding that goes between, finish the electric connection of these chips and lead frame.
In the above-described embodiments, respectively pile up two chips on chip carrier 313 two sides.Should be understood that the present invention can pile up any a plurality of chip in theory as required.
The foregoing description is only given an example for convenience of description, is not the restriction to scope of the present invention.For the general personnel in present technique field, can under the situation that does not break away from spirit of the present invention, make many variations.Therefore, the scope that the present invention advocated should be as the criterion so that the claim in claims is described.
Claims (10)
1. multichip packaging structure comprises:
Lead frame comprises: chip carrier, interior pin and outer pin;
Place at least two chips on described chip carrier two sides respectively, described chip and described interior pin electrically connect with lead;
Coat first capsulation material of pin in chip, lead and the part on first of the described chip carrier; And
Coat second capsulation material of the interior pin of chip on second of described first capsulation material, described chip carrier and lead and described lead frame.
2. multichip packaging structure as claimed in claim 1 is characterized in that, a chip is placed on described chip carrier two sides respectively.
3. multichip packaging structure as claimed in claim 2 is characterized in that, piling up on described at least one chip has at least one chip.
4. as the described multichip packaging structure of claim 1-3, it is characterized in that described first capsulation material is liquid capsulation material.
5. as the described multichip packaging structure of claim 1-3, it is characterized in that described second capsulation material is the injection molding capsulation material.
6. the method for packing of a multichip packaging structure, described encapsulating structure comprises: lead frame, at least two chips, lead, first capsulation material and second capsulation materials, described method comprises:
(1) one side at described lead frame covers the film that one deck does not combine with described first capsulation material;
(2) on the another side of described lead frame by binding agent with the chip carrier of described first chip attach at described lead frame on;
(3) with the described lead bonding that goes between, finish the electric connection of first chip and described lead frame;
(4) with described first capsulation material coat described first chip, the first chip place face lead and the part in pin;
(5) solidify described first capsulation material;
(6) throw off the described film that covers on the lead frame;
(7) on the one side of lead frame, carry out the stickup of second chip with the method for step (2);
(8) finish the electric connection of described second chip and described lead frame with the method for step (3);
(9) coat the lead of described first capsulation material, second chip, the second chip place face and the interior pin in the described lead frame with second capsulation material;
(10) solidify described second capsulation material;
(11) whole encapsulating structure is cut with pin process.
7. the method for packing of multichip packaging structure as claimed in claim 6 is characterized in that, described first capsulation material is liquid capsulation material.
8. the method for packing of multichip packaging structure as claimed in claim 6 is characterized in that, described second capsulation material is the injection molding capsulation material.
9. the method for packing of multichip packaging structure as claimed in claim 6 is characterized in that, step (2) afterwards step (4) add following steps before: use chip-stacked technology on described first chip, to place at least one chip; With the described lead bonding that goes between, finish the electric connection of these chips and described lead frame.
10. the method for packing of multichip packaging structure as claimed in claim 6 is characterized in that, step (7) afterwards step (9) add following steps before: use chip-stacked technology on described second chip, to place at least one chip; With the described lead bonding that goes between, finish the electric connection of these chips and described lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610029153A CN100589245C (en) | 2006-07-20 | 2006-07-20 | Method for packaging multiple chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610029153A CN100589245C (en) | 2006-07-20 | 2006-07-20 | Method for packaging multiple chip packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101110406A true CN101110406A (en) | 2008-01-23 |
| CN100589245C CN100589245C (en) | 2010-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610029153A Expired - Fee Related CN100589245C (en) | 2006-07-20 | 2006-07-20 | Method for packaging multiple chip packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN100589245C (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101941674A (en) * | 2009-07-01 | 2011-01-12 | 罗伯特·博世有限公司 | Be used to make the method for electronic unit |
| CN102104028A (en) * | 2010-11-05 | 2011-06-22 | 南通富士通微电子股份有限公司 | Semiconductor plastic-sealed body and layered scanning method |
| CN102203927A (en) * | 2011-06-22 | 2011-09-28 | 华为终端有限公司 | Method for device plastic packaging and packaging structure |
| CN102368484A (en) * | 2011-10-11 | 2012-03-07 | 常熟市广大电器有限公司 | Multichip integrated circuit packaging structure |
| CN101989581B (en) * | 2009-07-31 | 2012-07-04 | 日月光半导体制造股份有限公司 | Packaging structure and packaging method |
| CN103035631A (en) * | 2011-09-28 | 2013-04-10 | 万国半导体(开曼)股份有限公司 | Semi-conductive device for joint encapsulation of high-end chip and low-end chip and manufacture method thereof |
| CN103487175A (en) * | 2013-09-02 | 2014-01-01 | 无锡慧思顿科技有限公司 | Method for manufacturing pressure sensor packaged by plastic |
| CN104681553A (en) * | 2013-11-27 | 2015-06-03 | 英飞凌科技股份有限公司 | Electronic component |
| CN104882440A (en) * | 2014-02-28 | 2015-09-02 | 英飞凌科技股份有限公司 | Semiconductor Device Having Multiple Chips Mounted to a Carrier |
| CN109935577A (en) * | 2017-12-18 | 2019-06-25 | 无锡华润安盛科技有限公司 | A kind of packaging body |
| CN110504173A (en) * | 2018-05-16 | 2019-11-26 | 无锡华润安盛科技有限公司 | Packaging technology |
| CN112786460A (en) * | 2019-11-08 | 2021-05-11 | 珠海格力电器股份有限公司 | Chip packaging method and chip packaging module |
| CN112996370A (en) * | 2021-04-25 | 2021-06-18 | 中国人民解放军海军工程大学 | Power electronic equipment packaging structure suitable for high salt fog environment |
| CN113053847A (en) * | 2019-12-26 | 2021-06-29 | 珠海格力电器股份有限公司 | Chip packaging structure and preparation method thereof |
| CN113823606A (en) * | 2021-08-12 | 2021-12-21 | 紫光宏茂微电子(上海)有限公司 | Chip stacking and packaging structure and manufacturing method thereof |
-
2006
- 2006-07-20 CN CN200610029153A patent/CN100589245C/en not_active Expired - Fee Related
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101941674B (en) * | 2009-07-01 | 2016-09-21 | 罗伯特·博世有限公司 | For the method manufacturing electronic unit |
| CN101941674A (en) * | 2009-07-01 | 2011-01-12 | 罗伯特·博世有限公司 | Be used to make the method for electronic unit |
| CN101989581B (en) * | 2009-07-31 | 2012-07-04 | 日月光半导体制造股份有限公司 | Packaging structure and packaging method |
| CN102104028A (en) * | 2010-11-05 | 2011-06-22 | 南通富士通微电子股份有限公司 | Semiconductor plastic-sealed body and layered scanning method |
| CN102104028B (en) * | 2010-11-05 | 2012-12-12 | 南通富士通微电子股份有限公司 | Semiconductor plastic-sealed body and layered scanning method |
| US9082777B2 (en) | 2011-06-22 | 2015-07-14 | Huawei Device Co., Ltd. | Method for encapsulating semiconductor and structure thereof |
| CN102203927A (en) * | 2011-06-22 | 2011-09-28 | 华为终端有限公司 | Method for device plastic packaging and packaging structure |
| WO2011150879A3 (en) * | 2011-06-22 | 2012-05-24 | 华为终端有限公司 | Method for encapsulating component and structure thereof |
| CN102203927B (en) * | 2011-06-22 | 2013-04-24 | 华为终端有限公司 | Method for device plastic packaging and packaging structure |
| CN103035631B (en) * | 2011-09-28 | 2015-07-29 | 万国半导体(开曼)股份有限公司 | Combine the semiconductor device and manufacture method thereof that encapsulate high-end and low side chip |
| CN103035631A (en) * | 2011-09-28 | 2013-04-10 | 万国半导体(开曼)股份有限公司 | Semi-conductive device for joint encapsulation of high-end chip and low-end chip and manufacture method thereof |
| CN102368484A (en) * | 2011-10-11 | 2012-03-07 | 常熟市广大电器有限公司 | Multichip integrated circuit packaging structure |
| CN103487175A (en) * | 2013-09-02 | 2014-01-01 | 无锡慧思顿科技有限公司 | Method for manufacturing pressure sensor packaged by plastic |
| CN103487175B (en) * | 2013-09-02 | 2015-09-30 | 无锡慧思顿科技有限公司 | A kind of manufacture method of pressure sensor of Plastic Package |
| CN104681553A (en) * | 2013-11-27 | 2015-06-03 | 英飞凌科技股份有限公司 | Electronic component |
| CN104882440A (en) * | 2014-02-28 | 2015-09-02 | 英飞凌科技股份有限公司 | Semiconductor Device Having Multiple Chips Mounted to a Carrier |
| CN104882440B (en) * | 2014-02-28 | 2019-04-05 | 英飞凌科技股份有限公司 | Have mounted to the semiconductor devices of multiple chips of carrier |
| CN109935577A (en) * | 2017-12-18 | 2019-06-25 | 无锡华润安盛科技有限公司 | A kind of packaging body |
| CN110504173A (en) * | 2018-05-16 | 2019-11-26 | 无锡华润安盛科技有限公司 | Packaging technology |
| CN110504173B (en) * | 2018-05-16 | 2021-03-23 | 无锡华润安盛科技有限公司 | Packaging process |
| CN112786460A (en) * | 2019-11-08 | 2021-05-11 | 珠海格力电器股份有限公司 | Chip packaging method and chip packaging module |
| CN112786460B (en) * | 2019-11-08 | 2023-04-18 | 珠海格力电器股份有限公司 | Chip packaging method and chip packaging module |
| CN113053847A (en) * | 2019-12-26 | 2021-06-29 | 珠海格力电器股份有限公司 | Chip packaging structure and preparation method thereof |
| CN113053847B (en) * | 2019-12-26 | 2023-06-20 | 珠海格力电器股份有限公司 | Chip packaging structure and preparation method thereof |
| CN112996370A (en) * | 2021-04-25 | 2021-06-18 | 中国人民解放军海军工程大学 | Power electronic equipment packaging structure suitable for high salt fog environment |
| CN113823606A (en) * | 2021-08-12 | 2021-12-21 | 紫光宏茂微电子(上海)有限公司 | Chip stacking and packaging structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100589245C (en) | 2010-02-10 |
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Assignee: Advanced Semiconductor Engineering (Kunshan) Limited Assignor: ASE Assembly & Test (Shanghai) Limited Contract record no.: 2012310000090 Denomination of invention: Method for packaging multiple chip packaging structure Granted publication date: 20100210 License type: Exclusive License Open date: 20080123 Record date: 20120614 |
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