CN112996370A - Power electronic equipment packaging structure suitable for high salt fog environment - Google Patents
Power electronic equipment packaging structure suitable for high salt fog environment Download PDFInfo
- Publication number
- CN112996370A CN112996370A CN202110446506.5A CN202110446506A CN112996370A CN 112996370 A CN112996370 A CN 112996370A CN 202110446506 A CN202110446506 A CN 202110446506A CN 112996370 A CN112996370 A CN 112996370A
- Authority
- CN
- China
- Prior art keywords
- unit
- heat dissipation
- power electronic
- power
- cavity structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Abstract
The invention relates to the field of packaging of power electronic equipment, and discloses a power electronic equipment packaging structure suitable for a high-salt fog environment, which comprises: the heating element is communicated with each other through electric connection, and the first unit, the second unit and the third unit are packaged in different cavity structures through different working heating values and different stable heating temperatures. According to the power electronic equipment packaging structure suitable for the high-salt-spray environment, different units are packaged independently, and heat dissipation efficiency of electronic devices in each unit is guaranteed through heat dissipation of the heat dissipation fins and packaging of the cover plate, so that the electronic devices among the units are prevented from being influenced mutually, and the power electronic devices are guaranteed to have good salt-spray environment corrosion resistance and rapid disassembly efficiency.
Description
Technical Field
The invention relates to the field of packaging of power electronic equipment, in particular to a power electronic equipment packaging structure suitable for a high-salt-spray environment.
Background
A typical power electronic device generally includes devices such as high power fets, igbts, power diodes, thyristors, high power resistors, power transformers/inductors, etc., which operate under high current or voltage conditions, and the devices themselves generate high heat.
The working temperature of the high-power electronic devices is usually limited, and the exceeding of the limited temperature can reduce the working efficiency of each electronic device and even cause the possibility of burning. Moreover, the high-power electronic device usually needs to be mounted on the printed circuit board together with other electronic components, which may not only generate heat by itself, but also generate heat by other electronic components, thereby causing mutual influence.
For the heat dissipation problem of the power electronic device itself, there are two main conventional ways at present: the first method is to increase the volume of the power electronic device, increase the contact area between the power electronic device and the outside by increasing the volume of the power electronic device, and reduce the mutual interference problem between the electronic components by dispersedly arranging the electronic components, but this greatly increases the manufacturing cost and maintenance cost of the power electronic device, and is inconvenient to use; the other mode is through setting up the radiator or forced air cooling solves the heat dissipation problem, and this kind of mode can carry out quick heat dissipation to power electronic equipment, but its electronic components can contact with outside air large tracts of land usually, and when power electronic equipment need be in high salt fog environment such as island reef, marine boats and ships and so on in the adverse circumstances, electronic components can be corroded fast under the salt fog atmosphere, leads to power electronic equipment unable normal work. Therefore, the problem of effective protection of the existing power electronic equipment in a severe environment cannot be solved in the existing technology.
Disclosure of Invention
In view of one or more of the above drawbacks or needs for improvement in the prior art, the present invention provides a power electronic device package structure suitable for use in a high salt spray environment, so as to solve the problem of heat dissipation of the conventional power electronic device in the high salt spray environment.
In order to achieve the above object, the present invention provides a power electronic device package structure suitable for high salt fog environment, comprising:
the device comprises a first unit, a second unit and a third unit which are electrically connected, wherein the heating values and stable heating temperatures of the units are different during working, and the units are packaged in different cavity structures;
the first unit is used for stabilizing direct current and converting the direct current into alternating current and comprises a power circuit board, a first radiating element and a second radiating element, wherein the first radiating element and the second radiating element are arranged on the power circuit board;
the second unit is used for outputting the alternating current output from the first unit after secondary current stabilization so as to be used by an external device;
the third unit is used for controlling the operation of the first unit and the second unit.
As a further improvement of the present invention, the operation heat generation amounts of the first unit, the second unit, and the third unit are sequentially reduced.
As a further improvement of the present invention, heat dissipation fins are respectively disposed on the cavity structures corresponding to the first unit and the second unit, and the heat dissipation fins are attached to the outer sides of the corresponding cavity structures.
As a further improvement of the invention, the first unit and the second unit are encapsulated in the cavity structure by a cover plate.
As a further development of the invention, the third unit is completely sealed within the cavity structure.
As a further improvement of the present invention, the power circuit board and the first heat dissipation element are disposed on one side of the cavity structure, which is tightly attached to the heat dissipation fins, and the heat conductive plastic package material is tightly attached to an inner wall surface of the cavity structure, which is away from the heat dissipation fins.
As a further improvement of the present invention, the first heat dissipation element and the second heat dissipation element are respectively disposed on two sides of the power circuit board.
As a further improvement of the present invention, the second heat dissipation element is attached to an inner wall of the cavity structure on a side away from the power circuit board, and a heat conduction pad is disposed between the second heat dissipation element and the inner wall of the cavity structure.
As a further improvement of the invention, a plurality of plugs are respectively arranged on each cavity structure and used for the electrical connection between corresponding cavity structures and the input and output of current signals.
As a further improvement of the present invention, a heat dissipation fan is disposed corresponding to the heat dissipation fin.
The above-described improved technical features may be combined with each other as long as they do not conflict with each other.
Generally, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:
(1) according to the power electronic equipment packaging structure suitable for the high-salt-spray environment, the heating components with different stable heating temperatures are packaged in different cavity structures independently, so that the heating components with different heating values operate in different cavity structures respectively, the contact heat dissipation area of each component and the outside can be increased by packaging each heating component in different cavities independently, and the heat dissipation efficiency of the power electronic equipment is improved; and the form that each heating element is packaged alone can avoid the mutual interference between the components and parts of different calorific capacities for the component temperature in the power electronic equipment all rises, leads to stably being heated the relatively lower heating element of temperature and is in a higher temperature work all the time, finally leads to some components and parts operating efficiency in the power electronic equipment to reduce or the operation is obstructed, influences the use of power electronic equipment.
(2) According to the power electronic equipment packaging structure suitable for the high-salt-spray environment, the power circuit board and the first radiating element are packaged in the heat-conducting plastic packaging material, the radiating fins are attached to the side walls close to the power circuit board and the first radiating element, heat on the power circuit board and the first radiating element is transferred to the side walls of the cavity structure through the heat-conducting plastic packaging material, and the radiating fins are utilized for quickly radiating, so that the overhigh temperature on the power circuit board and the first radiating element is avoided, and the stable operation of the power electronic equipment is guaranteed.
(3) According to the power electronic equipment packaging structure suitable for the high-salt-spray environment, the end face of the second heat dissipation element in the cavity structure is abutted against the inner wall of the side, away from the power circuit board, and the heat conduction pad is used for heat transfer, so that the second heat dissipation element can be prevented from being damaged due to the fact that the second heat dissipation element is directly contacted with the cover plate, and on the other hand, heat generated on the second heat dissipation element can be directly transferred to the side wall of the cavity structure through the heat conduction pad and dissipated to the outside, and the heat dissipation rate of the second heat dissipation element is increased.
(4) According to the power electronic equipment packaging structure suitable for the high-salt-spray environment, the radiating fan is connected to the outside of the cavity structure, the air outlet of the radiating fan faces the radiating fins, after heat in the first heating element and the second heating element is transmitted to the radiating fins through the side wall of the cavity structure, the heat dissipation rate of the radiating fins is increased through the radiating fan, and the phenomenon that the working efficiency is affected due to overhigh operating temperature of the first unit and the second unit is avoided.
(5) According to the power electronic equipment packaging structure suitable for the high-salt-spray environment, the second unit is independently packaged in the cavity structure, the second unit is mainly a current conversion device and can generate high-frequency magnetic field leakage during working, and the magnetic field generated by the second unit can be prevented from influencing the working of other heating components through the form of independently packaging the second unit, so that the working state of the power electronic equipment is stabilized.
(6) According to the power electronic equipment packaging structure suitable for the high-salt-spray environment, the cover plate structures are arranged on the cavity structures corresponding to the first unit and the second unit for sealing, when the electronic components in the first unit or the second unit have operation faults, the corresponding cavity structures can be quickly opened by disassembling the cover plates, and the electronic components in the power electronic equipment are quickly maintained or replaced within 1 minute, so that the loss caused by the faults of the power electronic equipment is reduced.
(7) According to the power electronic equipment packaging structure suitable for the high-salt fog environment, the first unit, the second unit and the third unit are packaged in different cavity structures respectively so as to avoid mutual interference among heating components, and the power circuit board and the first heat dissipation element in the first cavity structure are packaged in the heat-conducting plastic package material, so that heat generated by the power circuit board and the first heat dissipation element can be quickly transmitted to the heat dissipation fins through the side wall of the first cavity structure, and the heat dissipation efficiency of the power circuit board and the first heat dissipation element is improved; the second heat dissipation element is directly arranged in the first cavity structure, and the anti-corrosion performance of the second heat dissipation element is utilized to reduce the usage amount of the heat-conducting plastic package material in the first cavity structure and reduce the overall weight of the power electronic equipment; and the second radiating element accessible heat conduction pad is direct with the heat transfer who produces to the apron on to the outside of loss, greatly increased the inside electronic components of whole power electronic equipment generate thermal loss rate, and through chooseing for use different sealed modes to different cell structure, reduced the possibility that each unit is corroded.
Drawings
Fig. 1 is a schematic overall structure diagram of a power electronic device package structure suitable for a high salt fog environment in an embodiment of the present invention;
FIG. 2 is a schematic diagram of an internal structure of a first chamber structure according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the internal structure of a second cavity structure in an embodiment of the present invention;
FIG. 4 is a schematic diagram of the internal structure of a third cavity structure in an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat dissipation fan according to an embodiment of the invention.
In all the figures, the same reference numerals denote the same features, in particular:
1. a first cavity structure; 2. a second cavity structure; 3. a third cavity structure; 4. a heat dissipating fin; 5. a cover plate; 6. a heat radiation fan; 7. a plug; 8. a wire harness;
101. a power circuit board; 102. a rectifier bridge; 103. a power diode; 104. a field effect transistor; 105. an electrolytic capacitor; 106. a dummy load; 107. a thermally conductive pad;
201. a second unit;
301. and a third unit.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Example (b):
the power electronic device packaging structure suitable for the high-salt fog environment in the preferred embodiment of the invention comprises a first unit, a second unit 201 and a third unit 301 which are electrically connected, wherein the first unit, the second unit 201 and the third unit 301 are independently packaged in different cavity structures according to different working heating values and stable heating temperatures; the first unit is mainly used for stabilizing current and converting current, converting direct current into alternating current after direct current-direct current conversion and transmitting the alternating current to the second unit, and comprises a power circuit board 101, a first heat dissipation element and a second heat dissipation element, wherein the first heat dissipation element and the second heat dissipation element are arranged on the power circuit board 101; the second unit 201 is used for performing secondary conversion on the alternating current transmitted by the first unit, so that the alternating current meets the normal use requirement of an external electric appliance and is transmitted to the external electric appliance; the third unit 301 is mainly used to control the operation of the first and second units 201.
According to the invention, the first unit, the second unit 201 and the third unit 301 of the electronic packaging equipment are respectively arranged in three different cavity structures, so that the heat dissipation efficiency in the electronic packaging equipment can be greatly improved; the power circuit board 101 and the first radiating element are wrapped in the heat-conducting plastic package material, so that the good radiating efficiency of the power circuit board 101 and the first radiating element is guaranteed, meanwhile, the efficiency of erosion of the power circuit board 101 by a high-salt fog environment in the external environment is reduced, the cavity structure enables the internal electronic components to be correspondingly opened for quick maintenance when the internal electronic components break down, and the maintenance efficiency of the power electronic equipment is greatly improved. Furthermore, under the high salt spray environment, the insulation strength between the electronic components cannot be ensured simply by depending on the electric clearance and the creepage distance of the electronic components, and the creepage problem between the electronic components can be effectively solved by independently packaging the electronic components, so that the mutual interference between the electronic components is avoided.
In conventional switching power supply's application, especially similar to this kind of power electronic equipment the power is great and can choose for use heat conduction plastic packaging material to carry out the encapsulating and promote radiating effect and reliability to the higher equipment of reliability requirement, heat conduction plastic packaging material can make the components and parts of the point that generate heat balanced, and it also can make the partial temperature of other components and parts can be higher than self generating heat. The main problem of power electronic equipment is that some electronic devices with control function cannot guarantee normal operation at high temperature, which results in instability of the whole system, and some heating elements are often insensitive to temperature and still operate normally at high temperature, which results in damage to other elements of the power electronic equipment.
Therefore, here encapsulate power electronic equipment's first unit, second unit 201 and third unit 301 respectively in first cavity structure 1, second cavity structure 2 and third cavity structure 3, through the form of encapsulating respectively, not only can greatly reduced each unit structure between the problem of mutual heat conduction between different electronic components, avoid damaging or the trouble to the temperature sensitive components and parts, and through the form of separating each electronic components, can avoid all kinds of electronic components to generate heat each other in a cavity and influence, cause the interior temperature of cavity to rise sharply. Through the arrangement of a plurality of separation cavity structures, the total heat dissipation surface area of the power electronic equipment can be greatly increased, and the heat dissipation of internal electronic components is facilitated.
Further, different electronic components can be packaged in different forms by packaging the different electronic components separately. If the power circuit board 101, the first heat dissipation element and the second heat dissipation element in the first cavity structure 1 generate heat relatively seriously, the power circuit board 101 and the electronic components in the first cavity structure 1 adopt a heat conduction plastic package material partial encapsulation mode, heat dissipation is carried out by utilizing the heat dissipation fins 4 and the cover plate 5, and meanwhile, a space is reserved in the first cavity structure 1, so that the heat in the first cavity structure 1 is accelerated to be diffused to the outside; the second unit 201 in the second cavity structure 2 is a current conversion device, which is a secondary heating element, and the current conversion device in the second cavity structure 2 adopts a full encapsulation mode, and only needs to use the cover plate 5 for heat transfer; the third unit 301 in the third cavity structure 3 is a control device, which basically generates no heat when working, works stably, and does not have the problem of multi-frequency maintenance basically, so that the control device in the third cavity structure 3 preferably adopts an integral sealing form, and can effectively avoid the erosion of a high-salt-spray environment.
Further, all plastic packages can lead to the gum volume of colloid material to be big, and is with high costs, greatly increased power electronic equipment's dead weight, influence the use of equipment, consequently only carry out the plastic package with heat conduction plastic package material on power circuit board 101 and first radiating element in the first cavity structures 1 of this department, it is when guaranteeing the good anti-erosion performance of power circuit board 101 and first radiating element, at the interior headspace of first cavity, and certain clearance can persist to apron 5 sealed form itself, guarantee certain air convection, improve the heat loss speed in the first cavity greatly, avoid power circuit board 101 and first radiating element high temperature.
The heat-conducting plastic package material is one of epoxy resin, organic silicon material or polyurethane, wherein organic silicon resin is preferably adopted for glue filling. In the conventional electronic equipment packaging process, epoxy resin, organosilicon material or polyurethane are all good packaging materials, but the three have the characteristics and can be respectively suitable for different environments.
The epoxy resin has good modification capacity, can adjust the self heat conductivity coefficient at will according to different encapsulation products, and has excellent electrical insulation capacity, but the epoxy resin has poor cold and heat change resistance, and fine cracks are easy to appear in the cold and heat alternation process, so that the moisture resistance of electronic components is influenced; and the solidified colloid has high hardness, and although the solidified colloid has good impact resistance, the solidified colloid is easy to damage electronic components. The hardness of the cured polyurethane colloid is also high, the working temperature can only reach 150 ℃, the higher temperature can be aged to lose the packaging performance, but the cost is lower compared with that of the organic silicon resin.
The organic silicon plastic package material has better modification capability and electrical insulation capability than epoxy resin and polyurethane, has quite excellent cold and heat impact resistance, can bear cold and heat impact at-60-200 ℃, does not crack and keeps elasticity, and can improve the moisture resistance of electronic components. And the plastic packaging material made of the organic silicon material also has good shock resistance, outdoor ultraviolet ray resistance and atmospheric aging resistance after being cured. The power electronic equipment packaging structure is mainly applied to the island-reef high-salt-spray environment, has excellent erosion resistance and good outdoor ultraviolet ray and atmospheric aging resistance, is very troublesome to maintain in the extreme high-salt-spray environment, ensures that maintenance personnel can maintain the power electronic equipment within 1 minute when a power circuit board 101 or an electronic component loaded on the power circuit board 101 or the electronic component in the power electronic equipment is damaged or fails in the island-reef environment, has good elasticity after being cured, has high speed when a plastic packaging material made of organic silicon is removed, and can effectively avoid secondary damage to the power circuit board 101 or the electronic component in the plastic packaging material removing process.
Specifically, as shown in fig. 1 and 2, the first cavity structure 1 in the preferred embodiment of the present invention is mainly used for placing the power circuit board 101, the power circuit board 101 is located on the bottom surface of one end far away from the opening of the first cavity structure 1, a first heat dissipation element is attached to one side of the power circuit board 101 away from the opening of the first cavity structure 1, and the first heat dissipation element includes a rectifier bridge 102, a power diode 103, and a field effect transistor 104. Because the rectifier bridge 102, the power diode 103 and the field effect transistor 104 generate heat seriously and have weak anti-corrosion capability, the power circuit board 101, the rectifier bridge 102, the power diode 103 and the field effect transistor 104 are plastically packaged by using an insulating plastic packaging material, so that the power circuit board, the rectifier bridge 102, the power diode 103 and the field effect transistor 104 are prevented from being corroded, heat generated by the electronic components is transferred to the shell of the first cavity structure 1 by using the good heat transfer performance of the plastic packaging material, and the heat is dissipated by using other heat dissipation devices. Preferably, the field effect transistor 104 on the power circuit board 101 may be replaced by an insulated gate bipolar transistor.
Further, as one of the preferred embodiments, a second heat dissipation element is further disposed on the power circuit board 101 in the first cavity structure 1, and the second heat dissipation element includes an electrolytic capacitor 105 and a dummy load 106. The electrolytic capacitor 105 mainly plays a role in power filtering, decoupling, signal coupling, time constant setting, dc blocking and the like, and the dummy load 106 is mainly arranged because a large-capacity dc capacitor is often arranged inside the high-power device, so that the damage of electronic components caused by the instantaneous inrush current generated by charging the electrolytic capacitor 105 at the moment of power-on is avoided, and the dummy load 106 is arranged to avoid the condition, wherein the dummy load 106 is preferably a soft-start resistor.
As a preferred embodiment of the invention, the electrolytic capacitor 105 and the dummy load 106 are arranged on the side of the power circuit board 101 away from the rectifier bridge 102, the power diode 103 and the field effect transistor 104, the electrolytic capacitor 105 and the dummy load 106 are connected with the power circuit board 101 and are arranged on the end face of the cover plate 5 in an attaching mode, and heat generated on the electrolytic capacitor 105 and the dummy load 106 is transferred out through the cover plate 5.
Further, in order to ensure that the end surfaces of the electrolytic capacitors 105 and the dummy loads 106 of different types and sizes can be abutted against the cover plate 5, the heat conducting pads 107 are further provided on the contact end surfaces of the cover plate 5 with the electrolytic capacitors 105 and the dummy loads 106, and since the types and sizes of the electrolytic capacitors 105 and the dummy loads 106 may be different, it is difficult to ensure that the electrolytic capacitors 105 and the dummy loads 106 can be abutted against the cover plate 5 after being loaded on the power circuit board 101 in the actual installation process. In order to ensure that the heat generated in the electrolytic capacitor 105 and the dummy load 106 is transferred to the outside through the lid plate 5, the heat generated in the electrolytic capacitor 105 and the dummy load 106 is transferred to the lid plate 5 by providing the thermal pad 107. And the heat conducting pad 107 has certain shock resistance, so that the electrolytic capacitor 105 and the dummy load 106 can be prevented from colliding with the cover plate 5 to damage the electrolytic capacitor 105 and the dummy load 106.
Preferably, the thermal pad 107 is preferably a thermal conductive silicone pad, which has good thermal conductivity and elasticity, and can effectively transfer heat generated when the electrolytic capacitor 105 and the dummy load 106 operate to the cover plate 5 and dissipate the heat to the outside through the cover plate 5.
Preferably, the heat-conducting plastic package material only seals the surfaces of the power circuit board 101, the rectifier bridge 102, the power diode 103 and the field effect transistor 104, and does not need to completely seal electronic components inside the first cavity structure 1, which is mainly because the surfaces of the electrolytic capacitor 105 and the dummy load 106 are usually subjected to anti-corrosion treatment, after the first cavity structure 1 is packaged by the cover plate 5, the electrolytic capacitor 105 and the dummy load 106 can be effectively prevented from directly contacting with an external high-salt-mist air environment, and on the premise that the electrolytic capacitor 105 or the dummy load 106 have certain anti-corrosion performance, the corrosion of the high-salt-mist environment to the electrolytic capacitor 105 and the dummy load 106 can be greatly reduced. Under the condition that the electrolytic capacitor 105 and the dummy load 106 are not sealed by the insulating plastic package material, a large space can be reserved in the first cavity structure 1, heat dissipation of electronic components in the first cavity structure 1 can be further increased, and the heat conduction plastic package material can quickly transfer and average the heat of the electronic components packaged in the plastic package material under the condition of good heat conduction and plastic package capacity, so that the heating temperature among the electronic components is consistent, the electrolytic capacitor 105 and the dummy load 106 are at a high heating temperature, and further the electrolytic capacitor 105 and the dummy load 106 are in failure, which is just the reason that the power electronic components in the power electronic equipment are respectively packaged in different cavity structures.
Further, as shown in fig. 3, the second unit 201 in the preferred embodiment of the present invention is packaged in the second cavity structure 2, and the second unit 201 is preferably a power inductor or a transformer. Since the second unit 201 is separately packaged by the second cavity structure 2, the size and form of the second cavity structure 2 may be selected and replaced according to the size of the second unit 201. After the second unit 201 is packaged in the second cavity structure 2, it is packaged by a heat conductive plastic package material. Because only set up second unit 201 in the second cavity structure 2, it does not have the condition of multiple unit device common operation itself to it is not serious that second unit 201 itself generates heat when running, consequently chooses the second cavity structure 2 that the size is suitable for use after, and whole cavity is packaged to rethread heat conduction plastic packaging material, and it possesses better anti-corrosion performance in comparison with the electronic components in first cavity structure 1. And the whole cavity of heat conduction plastic packaging material encapsulation can make the direct transmission of heat that produces on the second unit 201 then the loss on second cavity structure 2 lateral wall, possesses better radiating effect. Moreover, the second unit 201 is packaged separately because the power inductor or the transformer generates heat during operation, and generates a high-frequency magnetic field leakage, and the single packaging can shield the influence of the high-frequency magnetic field on other electronic components and avoid the interference on the electronic components in the first cavity structure 1 and the third cavity structure 3.
Preferably, when the second unit 201 is packaged, a positioning frame may be disposed on an outer surface of the second unit 201 for clamping, so as to prevent the second unit 201 from contacting an inner wall of the second cavity structure 2, which may cause abrasion on the surface of the second unit 201. In general, an additional insulating layer, such as a heat-shrinkable insulating material, a polyimide film, teflon and the like, is arranged outside a winding enameled wire of the power inductor or transformer, instead of only one insulating paint film, so that the power inductor or transformer can be directly encapsulated inside the second cavity structure; when the insulation effect of the power inductor and the enameled wire on the transformer is poor or thin, a positioning framework can be arranged to prevent the enameled wire from being directly attached to the inner wall of the cavity structure.
Further, as shown in fig. 4, a third unit 301 for controlling operations of electronic components in the power electronic device according to the preferred embodiment of the present invention is packaged in the third cavity structure 3, and the third unit 301 is a control circuit board. When the power electronic device is operated, the control circuit board has relatively low power consumption, no obvious heating element, low heat productivity, low operation failure frequency and no high-voltage part, and can be directly sealed inside the third cavity structure 3, and the third cavity structure 3 is made of a material with good heat insulation performance, so that the influence of heat generated by the external first unit 201 and the external second unit 201 on the operation of the third unit 301 is avoided. Preferably, therefore, the third cavity structure 3 is not sealed by the cover plate 5, and the third cavity structure 3 is directly arranged in an integrally closed form, so as to reduce the possibility of the third unit 301 being corroded by the high-salt-mist air.
Further, the outer walls of the first cavity structure 1 and the second cavity structure 2 in the preferred embodiment of the present invention are attached with heat dissipation fins 4. In order to facilitate the application of the power electronic device, the first cavity structure 1 and the second cavity structure 2 are attached to the same heat dissipation fin 4, and the heat dissipation fin 4 is disposed near the side wall of the power circuit board 101, so that heat generated in the power circuit board 101 and the first heat dissipation element, which generate heat more seriously in the first cavity structure 1, is dissipated by the heat dissipation fin 4 as soon as possible, and the first heat dissipation element and the power circuit board 101 are prevented from being broken down due to over-high temperature as much as possible.
Preferably, the surface smoothness of the attaching surfaces of the first cavity structure 1 and the second cavity structure 2 and the heat dissipation fins 4 is higher than 10 microns, and a heat conduction silicone grease coating is coated on the contact surfaces of the first cavity structure 1 and the second cavity structure 2 so as to improve the heat transfer efficiency between the heat dissipation fins 4 and the electronic components in the first cavity structure 1 and the second cavity structure 2.
Further, as shown in fig. 5, a heat dissipation fan 6 is connected to the outside of the first cavity structure 1 in the preferred embodiment of the present invention, and is connected to the power circuit board 101, and an air outlet of the heat dissipation fan 6 faces the heat dissipation fins 4, so that heat dissipation on the heat dissipation fins 4 can be accelerated in a forced air cooling manner.
Further, plugs 7 are arranged on the first cavity structure 1, the second cavity structure 2 and the third cavity structure 3 in the preferred embodiment of the invention, and the cavity structures, the cavity structures and the external power supply and the load are communicated with each other by connecting the plugs 7 through wiring harnesses 8. The plug 7 and the wiring harness 8 can ensure the interconnection and operation of all electronic components without influencing the sealing performance of all cavities.
Preferably, in order to avoid corrosion in the island environment and penetration into the electronic power equipment in the outside rainy weather environment, the aviation plug is used as the plug 7 herein, and the protection grade of the aviation plug is not lower than IP65, which can be completely dustproof and can prevent the intrusion of sprayed water, and the aviation plug harness 8 is also used as a higher protection grade aviation plug harness.
Further, in the preferred embodiment of the present invention, the first cavity structure 1, the second cavity structure 2, and the cover plate 5 are sealed by bolts, which has a good sealing effect and can be quickly opened for maintenance when the electronic components in the two cavity structures are damaged. Here first cavity structure 1 and second cavity structure 2 adopt the form of the encapsulation of apron 5, and do not directly adopt the form of totally enclosed, its main reason is that the erosion problem of high salt fog environment is comparatively serious, and under special environment such as reef island, when requiring power electronic equipment to break down, maintenance personal need accomplish the equipment maintenance within 1 minute, first unit and second unit 201 belong to the great component of calorific capacity, it is relatively more frequently that it breaks down, only through the encapsulation form of apron 5, and just can dismantle the maintenance fast to power electronic equipment when the maintenance through the encapsulation of organosilicon material, with the maintenance efficiency of guarantee power electronic equipment, reduce maintenance operating time.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A power electronic equipment packaging structure suitable for a high-salt fog environment is characterized by comprising a first unit, a second unit and a third unit which are electrically connected, wherein the heating values and stable heating temperatures of the units during working are different, and the units are packaged in different cavity structures;
the first unit is used for stabilizing direct current and converting the direct current into alternating current and comprises a power circuit board, a first radiating element and a second radiating element, wherein the first radiating element and the second radiating element are arranged on the power circuit board;
the second unit is used for outputting the alternating current output from the first unit after secondary current stabilization so as to be used by an external device;
the third unit is used for controlling the operation of the first unit and the second unit.
2. The power electronic device package structure suitable for use in high salt fog environment of claim 1, wherein the operating heating values of the first unit, the second unit and the third unit are reduced in sequence.
3. The power electronic device package structure suitable for the high-salt fog environment of claim 1, wherein heat dissipation fins are respectively disposed on the cavity structures corresponding to the first unit and the second unit, and the heat dissipation fins are attached to the outer sides of the corresponding cavity structures.
4. The power electronic device package structure suitable for use in high salt spray environment of claim 3, wherein the first unit and the second unit are packaged in the cavity structure with a cover plate.
5. The power electronics package structure of claim 3, wherein the third unit is completely sealed within the cavity structure.
6. The power electronic device package structure suitable for the high salt spray environment of claim 3, wherein the power circuit board and the first heat dissipation element are disposed on one side of the cavity structure, which is close to the heat dissipation fins, and the heat conductive plastic package material is close to an inner wall surface of the cavity structure, which faces away from the heat dissipation fins.
7. The power electronic device package structure suitable for use in high salt spray environment of claim 4, wherein the first heat dissipation element and the second heat dissipation element are disposed on two sides of the power circuit board.
8. The power electronic device package structure suitable for use in high salt spray environment of claim 7, wherein the second heat dissipation element is attached to an inner wall of the cavity structure on a side away from the power circuit board, and a thermal pad is disposed between the second heat dissipation element and the inner wall of the cavity structure.
9. The power electronic device package structure suitable for use in high salt spray environment of claim 3, wherein each cavity structure is provided with a plurality of plugs for electrical connection between the corresponding cavity structures and input and output of current signals.
10. The power electronic device package structure suitable for use in high salt spray environment of claim 3, wherein a heat dissipation fan is disposed corresponding to the heat dissipation fin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110446506.5A CN112996370B (en) | 2021-04-25 | 2021-04-25 | Power electronic equipment packaging structure suitable for high salt fog environment |
| PCT/CN2021/130462 WO2022227498A1 (en) | 2021-04-25 | 2021-11-12 | Power electronic device packaging structure suitable for heavy-salt-fog environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110446506.5A CN112996370B (en) | 2021-04-25 | 2021-04-25 | Power electronic equipment packaging structure suitable for high salt fog environment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112996370A true CN112996370A (en) | 2021-06-18 |
| CN112996370B CN112996370B (en) | 2021-08-06 |
Family
ID=76340106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110446506.5A Active CN112996370B (en) | 2021-04-25 | 2021-04-25 | Power electronic equipment packaging structure suitable for high salt fog environment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112996370B (en) |
| WO (1) | WO2022227498A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113928530A (en) * | 2021-10-14 | 2022-01-14 | 盐城神海机械有限公司 | Low-noise marine water chilling unit with protection function |
| CN115835608A (en) * | 2023-02-16 | 2023-03-21 | 深圳市中旭新能源有限公司 | Packaging structure for distributed heat dissipation planning and photovoltaic power optimizer |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278809A (en) * | 2005-03-30 | 2006-10-12 | Kyocera Corp | Package for housing electronic components |
| CN101110406A (en) * | 2006-07-20 | 2008-01-23 | 威宇科技测试封装有限公司 | Multiple chip packaging structure and its packaging method |
| CN102364683A (en) * | 2011-10-21 | 2012-02-29 | 华为终端有限公司 | Packaging structure and method thereof, and electronic equipment |
| CN102368484A (en) * | 2011-10-11 | 2012-03-07 | 常熟市广大电器有限公司 | Multichip integrated circuit packaging structure |
| KR20120040901A (en) * | 2010-10-20 | 2012-04-30 | 하나 마이크론(주) | Method for manufacturing light-emitting diode package |
| CN103413790A (en) * | 2013-08-16 | 2013-11-27 | 中国科学院深圳先进技术研究院 | Packaging structure of integrated power control unit |
| CN203827682U (en) * | 2014-04-24 | 2014-09-10 | 中兴通讯股份有限公司 | Mobile communication terminal |
| CN104064551A (en) * | 2014-06-05 | 2014-09-24 | 华为技术有限公司 | Chip-stacking encapsulation structure and electronic equipment |
| CN204271924U (en) * | 2014-12-26 | 2015-04-15 | 安徽华祝电气技术有限公司 | Based on the power cell valve body structure of modular |
| CN104579226A (en) * | 2014-12-30 | 2015-04-29 | 广东大普通信技术有限公司 | Method for improving temperature accuracy of crystal oscillator, oscillator and packaging method of crystal oscillator |
| CN106997875A (en) * | 2016-01-23 | 2017-08-01 | 重庆三峡学院 | A kind of PoP stack package structures and its manufacture method |
| CN107180801A (en) * | 2016-03-11 | 2017-09-19 | 联芯科技有限公司 | Stack assembling encapsulating structure and chip, wafer-level package chip, electronic equipment |
| CN206743565U (en) * | 2017-05-27 | 2017-12-12 | 南京泛和电力自动化有限公司 | Wireless base station |
| CN109427759A (en) * | 2017-08-29 | 2019-03-05 | 华为技术有限公司 | A kind of chip-packaging structure and preparation method thereof, electronic equipment |
| US10284106B1 (en) * | 2015-06-05 | 2019-05-07 | Vlt, Inc. | Power adapter |
| CN209882448U (en) * | 2019-03-18 | 2019-12-31 | 石家庄德堃电子科技有限公司 | Simple and compact power regulator |
| CN212573229U (en) * | 2020-07-28 | 2021-02-19 | 天津通盛科技有限公司 | Power electronic component packaging hardware |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208016152U (en) * | 2018-02-24 | 2018-10-26 | 丰郅(上海)新能源科技有限公司 | Electronic device filled with heat conduction capsulation material |
| US10575433B2 (en) * | 2018-04-12 | 2020-02-25 | Stored Energy Systems, a Limited Liability Company | Enclosure and cooling system for electronic equipment |
| CN109361240A (en) * | 2018-12-10 | 2019-02-19 | 阳光电源股份有限公司 | Power cabinet, photovoltaic parallel in system and container |
-
2021
- 2021-04-25 CN CN202110446506.5A patent/CN112996370B/en active Active
- 2021-11-12 WO PCT/CN2021/130462 patent/WO2022227498A1/en unknown
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278809A (en) * | 2005-03-30 | 2006-10-12 | Kyocera Corp | Package for housing electronic components |
| CN101110406A (en) * | 2006-07-20 | 2008-01-23 | 威宇科技测试封装有限公司 | Multiple chip packaging structure and its packaging method |
| KR20120040901A (en) * | 2010-10-20 | 2012-04-30 | 하나 마이크론(주) | Method for manufacturing light-emitting diode package |
| CN102368484A (en) * | 2011-10-11 | 2012-03-07 | 常熟市广大电器有限公司 | Multichip integrated circuit packaging structure |
| CN102364683A (en) * | 2011-10-21 | 2012-02-29 | 华为终端有限公司 | Packaging structure and method thereof, and electronic equipment |
| CN103413790A (en) * | 2013-08-16 | 2013-11-27 | 中国科学院深圳先进技术研究院 | Packaging structure of integrated power control unit |
| CN203827682U (en) * | 2014-04-24 | 2014-09-10 | 中兴通讯股份有限公司 | Mobile communication terminal |
| CN104064551A (en) * | 2014-06-05 | 2014-09-24 | 华为技术有限公司 | Chip-stacking encapsulation structure and electronic equipment |
| CN204271924U (en) * | 2014-12-26 | 2015-04-15 | 安徽华祝电气技术有限公司 | Based on the power cell valve body structure of modular |
| CN104579226A (en) * | 2014-12-30 | 2015-04-29 | 广东大普通信技术有限公司 | Method for improving temperature accuracy of crystal oscillator, oscillator and packaging method of crystal oscillator |
| US10284106B1 (en) * | 2015-06-05 | 2019-05-07 | Vlt, Inc. | Power adapter |
| CN106997875A (en) * | 2016-01-23 | 2017-08-01 | 重庆三峡学院 | A kind of PoP stack package structures and its manufacture method |
| CN107180801A (en) * | 2016-03-11 | 2017-09-19 | 联芯科技有限公司 | Stack assembling encapsulating structure and chip, wafer-level package chip, electronic equipment |
| CN206743565U (en) * | 2017-05-27 | 2017-12-12 | 南京泛和电力自动化有限公司 | Wireless base station |
| CN109427759A (en) * | 2017-08-29 | 2019-03-05 | 华为技术有限公司 | A kind of chip-packaging structure and preparation method thereof, electronic equipment |
| CN209882448U (en) * | 2019-03-18 | 2019-12-31 | 石家庄德堃电子科技有限公司 | Simple and compact power regulator |
| CN212573229U (en) * | 2020-07-28 | 2021-02-19 | 天津通盛科技有限公司 | Power electronic component packaging hardware |
Non-Patent Citations (1)
| Title |
|---|
| 陈益芳，洪瑜鹏，康武闯，赵海霞: "《大电流EMI滤波器气密性金属封装的研制》", 《电子与封装》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113928530A (en) * | 2021-10-14 | 2022-01-14 | 盐城神海机械有限公司 | Low-noise marine water chilling unit with protection function |
| CN115835608A (en) * | 2023-02-16 | 2023-03-21 | 深圳市中旭新能源有限公司 | Packaging structure for distributed heat dissipation planning and photovoltaic power optimizer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112996370B (en) | 2021-08-06 |
| WO2022227498A1 (en) | 2022-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112996370B (en) | Power electronic equipment packaging structure suitable for high salt fog environment | |
| CN104143926B (en) | Integrated electrically and thermally solution for inverter DC bus capacitance packaging | |
| US7848104B2 (en) | Power module | |
| EP2149903B1 (en) | Semiconductor module for electric power | |
| CN101673730A (en) | Stack assemblies containing semiconductor devices | |
| EP3334254B1 (en) | Electric driver and illumination device | |
| EP4280241A1 (en) | Aluminum electrolytic capacitor integrated module | |
| CN111696936A (en) | Power module of integrated radiator and manufacturing method thereof | |
| CN112968247A (en) | Radiator, battery package and consumer | |
| CN113628838A (en) | Transformer protection component convenient to heat dissipation | |
| CN111917311A (en) | Power conversion device | |
| CN208285207U (en) | A kind of shell for Switching Power Supply | |
| US20220192052A1 (en) | Choke structure with water cooling | |
| CN212313310U (en) | Radiating assembly and charging module | |
| US10499514B2 (en) | Vehicular control device | |
| CN204991686U (en) | Power device heat abstractor of well high -voltage electrical equipment | |
| CN216648278U (en) | Dry type encapsulating structure for high-voltage device | |
| CN209833393U (en) | Power module of electric automobile | |
| CN111082641A (en) | Power box and method for assembling power supply of unmanned aerial vehicle | |
| CN203104246U (en) | Switch reluctance motor with built-in position sensor | |
| CN207743846U (en) | Frequency converter | |
| CN110936841A (en) | Radiating assembly and charging module | |
| EP4322212A1 (en) | Power module, inverter, and vehicle | |
| CN218004830U (en) | Power module assembly, motor controller and vehicle | |
| CN217544598U (en) | Packaging structure for semiconductor chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |