CN110936841A - Radiating assembly and charging module - Google Patents
Radiating assembly and charging module Download PDFInfo
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- CN110936841A CN110936841A CN201911423902.5A CN201911423902A CN110936841A CN 110936841 A CN110936841 A CN 110936841A CN 201911423902 A CN201911423902 A CN 201911423902A CN 110936841 A CN110936841 A CN 110936841A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
- B60L53/30—Constructional details of charging stations
- B60L53/31—Charging columns specially adapted for electric vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
- B60L53/30—Constructional details of charging stations
- B60L53/302—Cooling of charging equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02T90/10—Technologies relating to charging of electric vehicles
- Y02T90/12—Electric charging stations
Abstract
The invention discloses a radiating assembly and a charging module. The radiator is provided with a groove, and the power device is arranged in the groove of the radiator and/or on the surface of the radiator. The radiator is also provided with radiating fins to form a radiating air duct. Air duct partition plates may be disposed on the other four sides of the radiator and the power device combination unit except the inlet side and the outlet side of the heat dissipation air duct. And the inlet surface and/or the outlet surface of the heat dissipation air channel are/is provided with a heat dissipation fan for blowing and/or exhausting air to the heat dissipation air channel, so that the heat of the radiator is quickly dissipated into the air. This radiator unit, the electrified body of components and parts are kept apart with the radiating air that flows, avoid dust, moisture, electrically conductive dust and corrosive substance etc. to get into electrified position for product reliability and security can improve, have advantages such as small, radiating effect is good, environmental suitability is strong, make product life improve, do benefit to and accelerate electric automobile industry development.
Description
Technical Field
The invention relates to the technical field of direct-current charging piles, in particular to a heat dissipation assembly and a charging module.
Background
The electric vehicle is one of the most promising new energy vehicles at present, and is widely applied and popularized, and the charging pile technology is a key technology for electric vehicle development, and the efficiency, the service life, the charging reliability and stability, the service life and the environmental adaptability of the charging pile influence the comprehensive index of the cost of the electric vehicle, and even influence the application and development of the electric vehicle.
The current module of charging is walked line and various cable electrical connection through the PCB board by each electronic components, concentrates the setting in same casing, adopts the fan to carry out direct heat dissipation to the device that generates heat. A plurality of high heating devices are arranged nearby the PCB surface according to the signal transmission principle, and the temperature rise of the high heating devices directly influences the temperature rise of the low heating devices, so that the service life of the low heating devices is influenced.
Disclosure of Invention
The invention aims to provide a heat dissipation assembly and a charging module, which are used for separating heat generated by a high-heat-generating device from a low-heat-generating device and accelerating the heat dissipation speed of the high-heat-generating device so as to reduce the influence on the low-heat-generating device, further ensure the service lives of the charging module and a charging pile and save the cost.
In a first aspect, an embodiment provides a heat dissipation assembly, including: a heat sink, a power device;
the radiator is provided with one or more grooves, and part or all of the power device body is arranged in the groove of the radiator and/or arranged on the surface of the radiator;
the radiator is also provided with one or more groups of radiating fins to form one or more radiating air channels; air duct partition plates are arranged on one or two or three or all of the other four surfaces of the radiator and the power device combined unit except the inlet surface and the outlet surface of the heat dissipation air duct;
the mounting surface of the radiator for mounting the power device is provided with one or more groups of protruding platforms, and the air duct partition plate is arranged on the steps of the protruding platforms.
In an alternative embodiment, the heat sink groove provided with the power device is filled with insulating heat conduction materials.
In an alternative embodiment, the insulating and heat conducting material comprises a heat conducting pouring sealant; adding alumina powder and/or quartz sand powder and/or diamond powder and/or boron nitride powder and/or aluminum nitride powder and/or silicon nitride powder and/or magnesium oxide powder into the heat-conducting pouring sealant.
In an alternative embodiment, the inlet and/or the outlet of the heat dissipation air duct is provided with one or more heat dissipation fans.
In an alternative embodiment, an insulating material is disposed on the exposed charged portion of the power device disposed on the surface of the heat sink for covering.
In an alternative embodiment, the power device comprises a magnetic element and/or a semiconductor switching device and/or a resistive device; the magnetic elements comprise one or more transformers and/or one or more inductive elements; the semiconductor switching devices comprise one or more controllable semiconductor switching devices and/or one or more non-controllable semiconductor switching devices.
In an optional embodiment, the magnetic element and/or the semiconductor switching device and/or the resistor device are arranged in the heat sink in a partitioned manner, and a heat dissipation air duct is arranged between the connections of the areas.
In an alternative embodiment, the cooling air duct is divided into individual regions.
In an alternative embodiment, the heat sink is a mechanical combination of one or more heat sink modules 1 and/or one or more heat sink modules N, N being a positive integer excluding 1.
In a second aspect, embodiments provide a charging module, including a control unit and one or more heat dissipation assemblies as described in any of the previous embodiments.
The embodiment of the invention provides a heat dissipation assembly and a charging module, wherein the heat of a high-heat-generating device is separated from a low-heat-generating device as much as possible, and the heat of the high-heat-generating device is dissipated to the surrounding environment as quickly as possible, so that the influence on the low-heat-generating device is reduced, the environment adaptability of the charging module is further improved, the purpose of prolonging the service life and the reliability of a direct-current charging pile is achieved, the charging operation cost is reduced, the running consumption of an electric automobile is reduced, and the rapid development of the electric automobile is facilitated.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a conventional charging module;
fig. 2 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention;
fig. 3 is a rear view of a heat dissipation assembly according to an embodiment of the present invention;
fig. 4 is a schematic top view of a heat dissipation assembly according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat dissipation assembly with a heat dissipation fan according to an embodiment of the present invention;
FIG. 6 is a schematic structural view of a heat dissipating assembly with an air path divider according to an embodiment of the present invention;
FIG. 7 is a schematic view of another perspective structure of the heat dissipating assembly with an air path divider according to the embodiment of the present invention;
FIG. 8 is a schematic view of a modular assembly of the heat sink of an embodiment of the present invention in a split configuration;
FIG. 9 is a schematic view of a heat sink according to an embodiment of the present invention;
fig. 10 is a schematic structural view of a charging module without a housing according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a charging module according to an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
At present, in order to achieve the purpose of reducing the comprehensive cost of production, maintenance and the like of the direct current charging pile, the direct current charging piles with different powers are formed by connecting charging modules of standard specifications in parallel, so that the direct current charging pile is standardized and normalized, is suitable for flow production operation, and is favorable for reducing the production cost of the direct current charging pile and improving the reliability of the direct current charging pile. For example: adopt the optimal circuit topology and device of price/performance ratio, the module design that will charge is for specifications such as 15KW, 18KW, 20KW, 30KW or 50KW, then a plurality of parallelly connected of the module that will correspond charges, the direct current that forms different power fills electric pile, under this kind of condition, components and parts can batch purchase and management, the module that charges can mass flow line production, debugging, the better comprehensive cost of control module that charges, do benefit to the development needs that the direct current fills electric pile.
As shown in the attached drawing 1, the existing charging module is formed by arranging electronic components through a PCB board and electrically connecting various cables, and is intensively arranged in the same shell, a fan is adopted to blow air and/or exhaust air to directly dissipate heat of a heating device, a plurality of high-heat-generating devices (including a power magnetic element and a power semiconductor switch device) and low-heat-generating devices (including a resistor, a capacitor, an integrated element and the like) are arranged nearby the surface of the PCB board according to a signal transmission principle, the temperature rise of the high-heat-generating devices directly influences the temperature rise of the low-heat-generating devices, so that the service life of the low-heat-generating devices is influenced, and particularly for the capacitor devices, the influence of high. The charging module of the control scheme is limited in service life, particularly in an outdoor application scene of the direct-current charging pile, the aging of internal devices is further accelerated due to the rise of the environmental temperature, and the service life of the direct-current charging pile is obviously shortened. Dust accumulation in the charging module is easily caused by air cooling heat dissipation, so that the heat dissipation effect is influenced, and the reliability and the service life of the charging module are reduced; under the condition of moist air, the phenomenon of dust accumulation is easy to cause arc discharge inside the charging module, the service life of the charging module is influenced, and the charging module is more seriously and directly damaged; especially in the application scenario with conductive dust, the arcing phenomenon becomes more severe. And some service environments that have corrosive substance, some material can corrode PCB board and relevant device, make its life-span shorten to influence direct current and fill electric pile life. The module of charging of traditional scheme, almost all components and parts set up in the wind channel, in aforementioned various abominable application environment, cause the module of charging itself to obviously descend easily to make and fill electric pile life with regard to the direct current and descend, make the operation cost that charges increase, be unfavorable for the development of electric automobile trade very much.
Based on this, the heat dissipation assembly and the charging module provided by the embodiment of the invention can separate the heat generated by the high-heat-generation device from the low-heat-generation device, and accelerate the heat dissipation speed of the high-heat-generation device, so as to reduce the influence on the low-heat-generation device, further ensure the service life of the charging module and the charging pile, and save the cost.
The following is a detailed description by way of example.
Example 1
The embodiment of the invention provides a heat dissipation assembly, which separates heat of a high-heat-generating device from a low-heat-generating device as much as possible, and dissipates the heat of the high-heat-generating device into the surrounding environment as quickly as possible, so as to reduce the influence on the low-heat-generating device, further improve the environmental adaptability of a charging module, and achieve the purposes of prolonging the service life and reliability of a direct-current charging pile, thereby reducing the charging operation cost, reducing the running cost of an electric vehicle and facilitating the rapid development of the electric vehicle, and is particularly shown in fig. 2.
The heat dissipation assembly comprises a heat radiator and a power device. The power device comprises a magnetic element and a semiconductor switch device; the magnetic elements comprise one or more transformers and/or one or more inductive elements; the semiconductor switching devices comprise one or more controllable semiconductor switching devices and/or one or more non-controllable semiconductor switching devices. The controllable semiconductor switch device is an insulated gate bipolar transistor and/or a metal-oxide semiconductor field effect transistor and/or a thyristor, and the uncontrollable semiconductor switch device is a diode.
The radiator is also provided with one or more grooves, and the body part or the whole of the magnetic element is arranged in the groove of the radiator; the semiconductor switching device is arranged on the surface of the radiator.
Preferably, the magnetic element arranged in the radiator groove can be arranged in the radiator groove after the insulating material is firstly arranged to wrap the magnetic element so as to improve the insulating property of the magnetic element; or, an insulating heat conduction material is encapsulated in the groove of the radiator provided with the magnetic element, so that the insulating property of the magnetic element is improved, the heat of the magnetic element is accelerated to be brought to the radiator, and meanwhile, the effect of fixing the magnetic element is achieved, and the shock resistance of the magnetic element is enhanced; the insulating heat conduction material comprises heat conduction pouring sealant, transformer paint and the like;
furthermore, aluminum oxide powder and/or quartz sand powder and/or boron nitride powder and/or aluminum nitride powder and/or silicon nitride powder and/or magnesium oxide powder high-heat-conductivity insulating materials are added into the heat-conducting pouring sealant, so that the heat-conducting property is improved, the insulating property is better, the reliability and the safety of the product are favorably improved, and the service life of the product is prolonged.
As shown in fig. 3, the heat sink is further provided with one or more sets of heat dissipation fins to increase the heat dissipation surface area and form one or more heat dissipation air channels.
As shown in fig. 5, 6 and 7, preferably, air duct partition plates are disposed on all of the other four sides of the heat sink and the power device assembly unit except the inlet side and the outlet side of the heat dissipation air duct, so that the heat dissipation fins and the air duct partition plates are combined to form one or more divided heat dissipation air ducts, and the heat dissipation air is effectively controlled to flow only through the heat dissipation air ducts.
Preferably, one or more heat dissipation fans are arranged at the inlet and/or the outlet of the heat dissipation air duct, and the heat of the heat sink is dissipated into the ambient air by blowing and/or exhausting the heat through the heat dissipation fans; the combination of the radiator with the radiating fins, the radiating air duct and the radiating fan can dissipate heat of the heating components to the surrounding environment quickly, and service life of the heating components is prolonged to design parameter values. The arrangement ensures that the heat dissipation air duct is separated from part or all power devices, the self insulation arrangement of the power devices which are not isolated from the air duct is very high, and in addition, the air volume of the heat dissipation fan for blowing and/or exhausting air only flows through the heat dissipation air duct, so that the substances such as dust, moisture, conductive dust, corrosive gas and the like in the air can be effectively prevented from entering the electrified position of the electrified power device and/or the power device, and the adverse effect on the insulation performance of the electrified position of the electrified power device and/or the power device is avoided. Meanwhile, the surfaces of the power device and the radiator which generate heat greatly are separated from the control unit, so that the heat generated by the power device which generates heat greatly is divided to one side of the heat dissipation air duct as far as possible, and the influence of the power device which generates heat greatly on the temperature rise of the components of the control unit which generates heat lowly is greatly reduced. This setting effectively promotes product environmental suitability for product protection level, reliability, security and life obviously promote.
Preferably, an insulating substance is arranged on the exposed electrified part of the power device arranged on the surface of the radiator for wrapping, so that the electrified part of the power device has sufficient insulating property and moisture-proof, waterproof and dustproof capabilities, and the short circuit or arc discharge phenomenon of an electrified body of the power device caused by various dusts can be effectively prevented; the insulating substances comprise heat-conducting pouring sealant, three-proofing paint, hot melt adhesive and other similar materials; by adopting the heat-conducting pouring sealant, the three-proofing requirement is met, and the heat dissipation performance of the power device can be improved;
furthermore, alumina powder and/or quartz sand powder and/or diamond powder and/or boron nitride powder and/or aluminum nitride powder and/or silicon nitride powder and/or magnesium oxide powder are added into the heat-conducting pouring sealant, so that the heat-conducting property is improved, the insulating property is better, and the reliability, the safety and the service life of the product are favorably improved.
Preferably, an insulating heat-conducting fin is arranged between the heat dissipation surface of the semiconductor switch device with the electrified heat dissipation surface and the radiator, so that an insulating layer meeting design requirements is formed between the semiconductor switch device with the electrified heat dissipation surface and the radiator, and the safety of the heat dissipation assembly is improved; the insulating heat conducting fin comprises one or more of an alumina ceramic wafer, a heat conducting silica gel sheet, a mica sheet and the like.
Preferably, the magnetic elements and the semiconductor switch devices are arranged in the radiator in different areas, and the heat dissipation air ducts are arranged among the connections of the areas, so that the magnetic elements with higher temperature resistance and the semiconductor switch devices with lower temperature resistance can be controlled within the optimal temperature working range respectively, mutual influence is avoided, the product design rationality is improved, and the use amount of raw materials of the radiator is reduced.
Preferably, as shown in fig. 4 and 7, the mounting surface of the heat sink for mounting the semiconductor switching device is provided with one or more groups of protruding platforms, and the air duct partition plate is arranged on the step of the protruding platform, so that the convenience in assembling the air duct partition plate and the formation of the heat dissipation air duct at the position close to the semiconductor switching device are facilitated, the surface of the heat sink is arranged in the heat dissipation air duct as much as possible, the semiconductor switching device is arranged close to the heat dissipation air duct as much as possible, the heat of the semiconductor switching device is dissipated to the air in the surrounding environment through the air duct as much as possible, and the heat dissipation effect is improved.
Preferably, as shown in fig. 8 and 9, the heat sink is one or more heat sink modules and/or a mechanical combination of one or more heat sink modules N, N being a positive integer excluding 1; a heat dissipation air duct is arranged between the connection of the radiator modules, so that the magnetic element with higher temperature resistance and the semiconductor switch device with lower temperature resistance can be controlled in the optimal temperature working range respectively, and mutual influence is avoided; the radiator that many radiator modules constitute does benefit to and reduces the radiator production and processing degree of difficulty, can die sinking assembly line production, also does benefit to radiator unit assembly line assembly work effectively reduces radiator unit's the production degree of difficulty promotes production efficiency to reduction in production cost.
Due to the adoption of the technical scheme, the heat dissipation assembly has the beneficial effects that: the magnetic element is subjected to insulation setting and/or encapsulation, and the semiconductor switch device is separated from the heat dissipation air channel, so that the three-proofing performance of the power device in the heat dissipation assembly is improved, and the adverse effects of dust, moisture, conductive dust, corrosive gas and the like in heat dissipation air on the power device in the heat dissipation assembly and other components outside the air channel are effectively avoided. Meanwhile, the heat of the power device with large heat generation and the surface of the radiator are controlled in the heat dissipation air duct as much as possible, so that the heat can be dissipated to the ambient air; furthermore, the temperature rise influence of the heat of the power device with large heat generation on the low-heat-generation components outside the assembly is reduced, and the service life of the low-heat-generation components is favorably prolonged to reach the design index of the low-heat-generation components; this radiator unit, processing and assembly process are easy, do benefit to batchization assembly line production, have accomplished to promote the power density, the environmental suitability and the life of the module of charging when reducing the module cost of charging.
Example 2
As shown in fig. 2 to 6, a heat dissipating module has substantially the same structure as that of embodiment 1, except that: the electrified part of the semiconductor switch device exposed on the surface of the radiator is provided with the three-proofing paint for wrapping, so that the electrified part of the semiconductor switch device has enough insulating property and moisture-proof and waterproof capabilities, and the short circuit or arc discharge phenomenon of the electrified body of the semiconductor switch device caused by various dusts and moisture can be effectively prevented.
Due to the adoption of the technical scheme, the heat dissipation assembly has the beneficial effects that: the three-proofing performance is more excellent, and the semiconductor switch device arranged on the surface of the radiator can be directly ventilated and radiated, so that the radiator is beneficial to being used in severe environment places.
Example 3
As shown in fig. 10 and 11, the charging module includes a housing and at least one set of control unit; further comprising at least one heat dissipation assembly as described in embodiments 1-2; the heat dissipation assembly is electrically and/or mechanically connected with the control unit.
Preferably, the heat dissipation assembly and the control unit are arranged in a stacked arrangement structure, and components of the control unit, the magnetic elements and the semiconductor switch devices on the heat sink are arranged in a partition mode through the PCB and/or the heat insulation material, so that the influence of the magnetic elements and the semiconductor switch devices with large heat productivity on the components of the control unit with small heat productivity is greatly reduced; the stacked arrangement is beneficial to the connection of each device of the radiating assembly and each circuit of the control unit nearby, so that the integration degree of the controller is improved, the parasitic parameters of each circuit are reduced, the strength of interference signals of mutual crosstalk is effectively reduced, the safety, the reliability and the electromagnetic compatibility of the charging module are effectively improved, the loss of the charging module is reduced, and the efficiency is improved.
According to the charging module, due to the adoption of the heat dissipation assembly and the preferred scheme, the magnetic element and the semiconductor switch device with larger heat productivity in the charging module and the components of the low-heat control unit are arranged in a partitioning mode, so that the influence of the heat productivity of the high-heat power device on the low-heat device is greatly reduced, and due to the fact that the heat dissipation air duct and the control unit are arranged in a separating mode, cooling air cannot enter the control unit, and the situation that the service life of circuits and the components of the control unit is shortened or the components of the control unit are directly damaged due to the influence of dust, moisture, conductive dust and corrosive gas is avoided. The charging module disclosed by the invention has the advantages of higher integration degree, strong adaptability to use environment, better working effect and long service life, is suitable for being assembled on a production table of a flow production line, and is convenient to popularize and apply in the field of direct-current charging piles.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein.
Claims (10)
1. A heat sink assembly, comprising: a heat sink, a power device;
the radiator is provided with one or more grooves, and part or all of the power device is arranged in the groove of the radiator and/or on the surface of the radiator;
the radiator is also provided with one or more groups of radiating fins to form one or more radiating air channels; air duct partition plates are arranged on one or two or three or all of the other four surfaces of the radiator and the power device combined unit except the inlet surface and the outlet surface of the heat dissipation air duct;
one or more groups of protruding platforms are arranged on the mounting surface of the radiator for mounting the power device,
the air duct partition plate is arranged on the step of the protruding platform.
2. The heat dissipation assembly of claim 1, wherein an insulating and thermally conductive material is potted within the heat sink recess in which the power device is disposed.
3. The heat dissipation assembly of claim 2, wherein the insulating and thermally conductive material comprises a thermally conductive potting adhesive; adding alumina powder and/or quartz sand powder and/or diamond powder and/or boron nitride powder and/or aluminum nitride powder and/or silicon nitride powder and/or magnesium oxide powder into the heat-conducting pouring sealant.
4. The heat dissipation assembly of claim 1, wherein the inlet and/or outlet of the heat dissipation duct is provided with one or more heat dissipation fans.
5. The heat sink assembly as claimed in claim 1, wherein the power device disposed on the surface of the heat sink is covered with an insulating material at exposed charged portions.
6. The heat dissipation assembly of claim 1, wherein the power device comprises a magnetic element and/or a semiconductor switching device and/or a resistive device; the magnetic elements comprise one or more transformers and/or one or more inductive elements; the semiconductor switching devices comprise one or more controllable semiconductor switching devices and/or one or more non-controllable semiconductor switching devices.
7. The heat dissipation assembly of claim 6, wherein the magnetic element and/or the semiconductor switching device and/or the resistor device are arranged in the heat sink in a partitioned manner, and a heat dissipation air duct is arranged between each region connection.
8. The heat dissipation assembly of claim 6, wherein each region is divided by the heat dissipation duct.
9. The heat sink assembly of claim 1, wherein the heat sink is one or more heat sink modules 1 and/or a mechanical combination of one or more heat sink modules N, N being a positive integer excluding 1.
10. A charging module comprising a control unit and one or more heat dissipation assemblies as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911423902.5A CN110936841A (en) | 2019-12-31 | 2019-12-31 | Radiating assembly and charging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911423902.5A CN110936841A (en) | 2019-12-31 | 2019-12-31 | Radiating assembly and charging module |
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| Publication Number | Publication Date |
|---|---|
| CN110936841A true CN110936841A (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911423902.5A Pending CN110936841A (en) | 2019-12-31 | 2019-12-31 | Radiating assembly and charging module |
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| CN (1) | CN110936841A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4346045A1 (en) * | 2022-09-29 | 2024-04-03 | Huawei Digital Power Technologies Co., Ltd. | Charging module and charging pile |
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2019
- 2019-12-31 CN CN201911423902.5A patent/CN110936841A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4346045A1 (en) * | 2022-09-29 | 2024-04-03 | Huawei Digital Power Technologies Co., Ltd. | Charging module and charging pile |
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Country or region after: China Address after: 618000, No.19 Tumenjiang Road, Deyang City, Sichuan Province Applicant after: Sichuan Yingjie New Energy Co.,Ltd. Address before: 618000 northeast corner of Minshan road and Tumenjiang Road, Jingyang District, Deyang City, Sichuan Province Applicant before: SICHUAN WEIYU ELECTRIC Co.,Ltd. Country or region before: China |