CN101106112A - Packaging structure of electronic part, and its packaging method - Google Patents
Packaging structure of electronic part, and its packaging method Download PDFInfo
- Publication number
- CN101106112A CN101106112A CN 200710128349 CN200710128349A CN101106112A CN 101106112 A CN101106112 A CN 101106112A CN 200710128349 CN200710128349 CN 200710128349 CN 200710128349 A CN200710128349 A CN 200710128349A CN 101106112 A CN101106112 A CN 101106112A
- Authority
- CN
- China
- Prior art keywords
- tunicle
- electronic unit
- underfilling
- removal portion
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
Abstract
To provide a packaging structure of an electronic part in which processability and productivity are good without air bubbles (void) in an under fill, and to provide its packaging method. In the packaging structure of the electronic part of this invention, the insulating substrate 1 in which a plurality of terminals are provided, a via hole for suction is not needed, and, accordingly, a dead space by opening processing and the via hole are eliminated, and the miniaturization of the insulating substrate 1 can be attained. Since an insulating film 3 has a first coat exception portion 4 prepared where the terminal 2 is avoided, and a second coat exception portion 5 connected with the first coat exception portion 4 and prolonged toward the periphery of the main body 7a of the electronic part 7, in the under fill 8 provided between the insulating substrate 1 and the electronic part 7, air in the coat exception portion 4 is extruded at the second coat exception portion 5 side by a liquid-like under fill, and the under fill without air bubbles (void) is obtained.
Description
Technical field
The present invention relates to be applicable to the mounting structure and the installation method thereof of the electronic unit in various electronic equipments or the electronic circuit cell etc.
Background technology
If the mounting structure that relates to electronic unit in the past and the figure of installation method thereof are described, then Figure 19 illustrates the mounting structure of electronic unit in the past and the key diagram of installation method thereof.Below, according to Figure 19 the formation of the mounting structure of in the past electronic unit is described.The following formation of the mounting structure of electronic unit in the past: on insulated substrate 51, electronic unit 52 is installed with the state relative with through hole 51a with through hole 51a, and between this insulated substrate 51 and electronic unit 52, be provided with the underfilling (under fill) 53 (for example, referring to Patent Document 1) that forms by resin.
In addition, as shown in figure 19, the installation method of electronic unit in the past is being installed on the edge configuration point gum machine 54 of the electronic unit 52 on the insulated substrate 51, and at the bottom of through hole 51a configuration suction device 55, at first, inject liquid underfilling 53 to the whole periphery of electronic unit 52 by point gum machine 54, and, also to draw underfilling 53 (for example, referring to Patent Document 1) from through hole 51a to central portion one side draught of electronic unit 53 afterwards by suction device 55.
Patent documentation 1: the spy opens flat 10-261661 communique.
But,,, need carry out perforate processing to insulated substrate 51, and the position of through hole 51a becomes the dead band, thereby can't realize miniaturization for through hole 51a is set on insulated substrate 51 for the mounting structure of in the past electronic unit.In addition, for its installation method, owing to inject liquid underfilling 53 to the whole periphery of electronic unit 52 by point gum machine 54, and, also to draw underfilling 53 from through hole 51a to central portion one side draught of electronic unit 53 afterwards by suction device 55, thereby, need carry out injecting underfilling 53 and attracting the operation of underfilling 53 by suction device 55 to the whole periphery of electronic unit 52, its operation is loaded down with trivial details, the problem of production capacity variation thereby exist.
Summary of the invention
The present invention is in view of the situation of such prior art and make, and its purpose is, provides a kind of processability and generative nature good, and do not have bubble in the underfilling mounting structure and the installation method thereof of electronic unit in (space).
In order to achieve the above object, the invention is characterized in, comprising: insulated substrate is provided with a plurality of terminals; The insulation tunicle is arranged on the insulated substrate with the state of avoiding terminal; Electronic unit, the electrode that is arranged on the lower surface of main part is connected with described terminal; And, be arranged between insulation tunicle and the electronic unit and between insulated substrate and the electronic unit by the underfilling that resin forms; Wherein, the insulation tunicle has: the first tunicle removal portion is provided with along the arrangement of terminal with the state of avoiding terminal; And the second tunicle removal portion, be connected with this first tunicle removal portion, and extend towards the edge of main part.
The present invention of Gou Chenging need not be provided with the through hole that is provided for attracting on the insulated substrate of a plurality of terminals like this, therefore do not need to carry out perforate processing, and eliminated the dead band that causes by through hole, thereby can realize the miniaturization of insulated substrate, and, owing to the insulation tunicle has with the state of avoiding terminal along the first tunicle removal portion that the arrangement of terminal is provided with, with the second tunicle removal portion that is connected with this first tunicle removal portion and extends towards the edge of main part, thereby the filling speed of underfilling is slack-off in the part of the second tunicle removal portion, the result, the time (timing) that underfilling is filled to the edge slows down, thereby can obtain the underfilling of inboard no bubble (space).
In addition, the present invention has following feature on the basis of foregoing invention: the thickness of insulation tunicle is thicker than terminal.The present invention according to such formation, flowing liquid shape underfilling becomes slow by capillarity between the main part of flowing liquid shape underfilling than insulating tunicle and electronic unit by capillarity in (the first tunicle removal portion) between the main part of insulated substrate and electronic unit, therefore, the air that exists in the first tunicle removal portion can extrude reliably to the second tunicle removal portion, one side, thereby can obtain not have the underfilling in bubble (space).
In addition, the present invention has following feature on the basis of foregoing invention: the first tunicle removal portion forms band shape, and the insulation tunicle is provided with by membranous part in the position relative with the lower surface central portion of main part.The present invention according to such formation, flowing liquid shape underfilling compares between the main part of insulated substrate and electronic unit (the first tunicle removal portion) flowing liquid shape underfilling becomes rapid by capillarity by capillarity between the main part of insulation tunicle and electronic unit, therefore, can be present in the central portion of main part air apace outwards side pressure Monday go out, thereby can obtain not have in the central portion of main part the underfilling in bubble (space).
In addition, the present invention has following feature on the basis of foregoing invention: terminal is with on also being formed on by the position of membranous part from the state that exposes of insulation tunicle, and is connected with electrode.The present invention of Gou Chenging can also be connected with terminal in the position of the central portion of electronic unit main part like this, thereby can increase linking number.
In addition, the present invention has following feature on the basis of foregoing invention: the second tunicle removal portion extends to form to the outside at the edge of main part.According to the present invention of such formation, the air that is present in lower surface one side of main part can be discharged to outside the main part reliably by the second tunicle removal portion, thereby can obtain not have the underfilling in bubble (space).
In addition, the present invention has following feature on the basis of foregoing invention: terminal is configured to square shape along four linea angulatas, and the first tunicle removal portion has the first deletion portion that is positioned on first line parallel to each other and is connected with this first deletion portion and is positioned at the second deletion portion on second line parallel to each other.The present invention of Gou Chenging is connected by first, second deletion portion like this, even if under the situation with the terminal that is configured to square shape (square shape), also can obtain not have the underfilling in bubble (space).
In addition, the present invention has following feature on the basis of foregoing invention: have the second tunicle removal portion that is connected with one first deletion portion, the second tunicle removal portion extends to form to the outside at the edge of main part near the central authorities of one first deletion portion.The present invention of Gou Chenging can be discharged to the last air that is present in the first tunicle removal portion outside the main part by the second tunicle removal portion is set near the central authorities of one first deletion portion like this, thereby can obtain not have the underfilling in bubble (space).
In addition, the present invention has following feature on the basis of foregoing invention: the state that the second tunicle removal portion is connected with the two ends with the first deletion portion is straight line ground and extends to form to the outside at the edge of main part.The present invention of Gou Chenging can be discharged to the air that is present in the first tunicle removal portion outside the main part reliably by the second tunicle removal portion that is connected with the both ends of the first deletion portion is set like this, thereby can obtain not have the underfilling in bubble (space).
In addition, the present invention has following feature on the basis of foregoing invention: the second tunicle removal portion extends to form to the outside at the edge of main part with the state that is connected with the second deletion portion.The present invention of Gou Chenging is owing to exist the second tunicle removal portion that is connected with the second deletion portion like this, make the wettability good (good fluidity) of underfilling, in this case, can control flowing of underfilling in the lower surface peripheral part of (delaying) main part, thereby discharge the air in the lower surface peripheral part of main part reliably.
In addition, the present invention has following feature on the basis of foregoing invention: the insulation tunicle has the 3rd tunicle removal portion that forms in the mode of surrounding main part, and the described second tunicle removal portion is connected setting with the 3rd tunicle removal portion.The present invention of Gou Chenging can suppress the diffusion of underfilling by the 3rd tunicle removal portion like this, and because underfilling stops at the edge part of the 3rd tunicle removal portion, thereby can make the 3rd tunicle removal portion shallow and width is narrow, thereby can realize miniaturization.
In order to achieve the above object, the invention is characterized in: the mounting structure that possesses each the described electronic unit in the 5th of first in the foregoing invention, and have the edge that is disposed at electronic unit and be used to inject the point gum machine of underfilling, described point gum machine is configured on the position vertical with the first tunicle removal portion, and injects underfilling under this state.
The present invention of Gou Chenging does not need to carry out to inject underfilling by point gum machine around electronic unit like this, perhaps attract the operation of underfilling by suction device, thereby can improve operation, productivity, and, because point gum machine is configured on the position vertical with the first tunicle removal portion and injects underfilling under this state, thereby the air that is present in the first tunicle removal portion can be gone out to one side pressure of the second tunicle removal portion reliably, thereby can obtain not have the underfilling of bubble (air).
In addition, the present invention has following feature on the basis of foregoing invention: the mounting structure that possesses the 6th described electronic unit of the present invention, and have the edge that is disposed at electronic unit and be used to inject the point gum machine of underfilling, described point gum machine be configured in one of first, second deletion portion vertical position on, and under this state, inject underfilling.
The present invention of Gou Chenging does not need to carry out to inject underfilling by point gum machine around electronic unit like this, perhaps attract the operation of underfilling by suction device, thereby can improve operation, productivity, and, since point gum machine be configured in one of first, second deletion portion vertical position on and under this state, inject underfilling, thereby be connected by first, second deletion portion, even if under situation, also can obtain not have the underfilling of bubble (air) with the terminal that is configured to square shape (square shape).
In addition, the present invention has following feature on the basis of foregoing invention: the mounting structure that possesses each described electronic unit in the 7th to the 9th of the present invention, and have the edge that is disposed at electronic unit and be used to inject the point gum machine of underfilling, this point gum machine is configured in and is opposite near the vertical position of another first deletion portion of described one the first deletion portion that is provided with the described second tunicle removal portion central authorities, and injects described underfilling under this state.
The present invention of Gou Chenging does not need to carry out to inject underfilling or attract the operation of underfilling by suction device around electronic unit by point gum machine like this, thereby can improve operation, productivity, and, because point gum machine is configured in and is opposite near the vertical position of another first deletion portion of described one the first deletion portion that is provided with the described second tunicle removal portion central authorities, and under this state, inject described underfilling, thereby the last air that is present in the first tunicle removal portion can be discharged to outside the main part, thereby can obtain not have the underfilling of bubble (air).
The invention effect
The present invention arranges the first tunicle removal portion establish and is connected with a described tunicle removal portion and towards the second tunicle removal portion of the edge extension of electronic unit main part owing to being provided with on insulated substrate along terminal, thereby need not on insulated substrate, to be provided with through hole, can obtain not have the underfilling of bubble (air).
Description of drawings
Fig. 1 relate to electronic unit of the present invention mounting structure want portion's sectional view.
Fig. 2 relates to the plane graph of insulated substrate of the mounting structure of electronic unit of the present invention.
Fig. 3 is the enlarged drawing of the A part of Fig. 1.
Fig. 4 is the front view that the installation method of electronic unit of the present invention is shown.
Fig. 5 is the plane graph that the installation method of electronic unit of the present invention is shown.
Fig. 6 relates to the installation method of electronic unit of the present invention, is the key diagram that first flow regime of liquid underfilling is shown.
Fig. 7 relates to the installation method of electronic unit of the present invention, is the key diagram that second flow regime of liquid underfilling is shown.
Fig. 8 relates to the installation method of electronic unit of the present invention, is the key diagram that the 3rd flow regime of liquid underfilling is shown.
Fig. 9 relates to the installation method of electronic unit of the present invention, is the key diagram that the 4th flow regime of liquid underfilling is shown.
Figure 10 relate to electronic unit of the present invention mounting structure other execution modes want portion's sectional view.
Figure 11 relates to the plane graph of insulated substrate of other execution modes of the mounting structure of electronic unit of the present invention.
Figure 12 is the front view of other execution modes that the installation method of electronic unit of the present invention is shown.
Figure 13 is the plane graph of other execution modes that the installation method of electronic unit of the present invention is shown.
Figure 14 relates to other execution modes of the installation method of electronic unit of the present invention, is the key diagram that first flow regime of liquid underfilling is shown.
Figure 15 relates to other execution modes of the installation method of electronic unit of the present invention, is the key diagram that second flow regime of liquid underfilling is shown.
Fig. 16 relates to other execution modes of the installation method of electronic unit of the present invention, is the key diagram that the 3rd flow regime of liquid underfilling is shown.
Figure 17 relates to other execution modes of the installation method of electronic unit of the present invention, is the key diagram that the 4th flow regime of liquid underfilling is shown.
Figure 18 relates to other execution modes of the installation method of electronic unit of the present invention, is the key diagram that the 5th flow regime of liquid underfilling is shown.
Figure 19 illustrates the mounting structure of electronic unit in the past and the key diagram of installation method thereof.
Embodiment
Below, with reference to the accompanying drawings the working of an invention mode is described.Fig. 1 relate to electronic unit of the present invention mounting structure want portion's sectional view, Fig. 2 relates to the plane graph of insulated substrate of the mounting structure of electronic unit of the present invention, Fig. 3 is the enlarged drawing of the A part of Fig. 1, Fig. 4 is the front view that the installation method of electronic unit of the present invention is shown, Fig. 5 is the plane graph that the installation method of electronic unit of the present invention is shown, Fig. 6 relates to the installation method of electronic unit of the present invention, it is the key diagram that first flow regime of liquid underfilling is shown, Fig. 7 relates to the installation method of electronic unit of the present invention, it is the key diagram that second flow regime of liquid underfilling is shown, Fig. 8 relates to the installation method of electronic unit of the present invention, it is the key diagram that the 3rd flow regime of liquid underfilling is shown, Fig. 9 relates to the installation method of electronic unit of the present invention, is the key diagram that the 4th flow regime of liquid underfilling is shown.
In addition, Figure 10 relate to electronic unit of the present invention mounting structure other execution modes want portion's sectional view, Figure 11 relates to the plane graph of insulated substrate of other execution modes of the mounting structure of electronic unit of the present invention, Figure 12 is the front view of other execution modes that the installation method of electronic unit of the present invention is shown, Figure 13 is the plane graph of other execution modes that the installation method of electronic unit of the present invention is shown, Figure 14 relates to other execution modes of the installation method of electronic unit of the present invention, it is the key diagram that first flow regime of liquid underfilling is shown, Figure 15 relates to other execution modes of the installation method of electronic unit of the present invention, it is the key diagram that second flow regime of liquid underfilling is shown, Figure 16 relates to other execution modes of the installation method of electronic unit of the present invention, it is the key diagram that the 3rd flow regime of liquid underfilling is shown, Figure 17 relates to other execution modes of the installation method of electronic unit of the present invention, it is the key diagram that the 4th flow regime of liquid underfilling is shown, Figure 18 relates to other execution modes of the installation method of electronic unit of the present invention, is the key diagram that the 5th flow regime of liquid underfilling is shown.
Then, according to Fig. 1 to Fig. 3 the mounting structure of electronic unit of the present invention is described.Be provided with a plurality of terminals 2 as the part of circuit pattern on the insulated substrate 1 that is made of multilayer board, described terminal 2 is lined up two row and is square shape (square shape) along four linea angulatas.
In addition, the insulation tunicles 3 such as solder resist that formed by epoxylite are set on the described insulated substrate 1 with the state of avoiding terminal 2, described insulation tunicle 3 has the first tunicle removal portion 4 of the band shape that is provided with along the arrangement of terminal 2, this first tunicle removal portion 4 is square shape (square shape), and have on first line parallel to each other that is positioned at square shape first 4a of deletion portion with link to each other with this first deletion 4a of portion and be positioned at second 4b of deletion portion on second line parallel to each other of square shape.
In addition, insulation tunicle 3 also has: the locational island that the first tunicle removal portion 4 that is set at is surrounded by membranous part 3a, from an end and first 4a of deletion portion of first 4a of deletion portion be the second tunicle deletion portion 5 of straight line shape ground extension, near second tunicle removal portion 5 that extends outward at right angles the central authorities of one first deletion portion 4 and ring-type the 3rd tunicle removal portion 6 that links to each other with this second tunicle removal portion 5.
In addition, insulation tunicle 3 has the thickness about 25 μ m, and is thicker than the thickness (10 μ m) of terminal 2, and the width of first, second tunicle removal portion 4,5 forms more than the 10 μ m.
The electronic unit 7 of the rectangular shape that is made of semiconductor chip etc. has main part 7a and a plurality of electrode 7b, described a plurality of electrode 7b is arranged at the following of main part 7a and is arranged in square shape (square shape), and this electronic unit 7 is mounted by with scolder or ball grid array (ball grid array) etc. electrode 7b being connected on the terminal 2.
At this moment, be positioned at the central portion of main part 7a by membranous part 3a, the second tunicle removal portion 5 is outstanding laterally from the edge of main part 7a, the 3rd tunicle removal portion 6 disposes near the mode of surrounding main part 7a, and is of a size of about 50～80 μ m between the lower surface of insulated substrate 1 and main part 7a.
The underfilling 8 that is formed by epoxylite is set between the lower surface of insulation tunicle 3 and main part 7a, between the lower surface of insulated substrate 1 and main part 7a and on the edge part of main part 7a, thereby the installation of having reinforced electronic unit 7.And, described underfilling 8 stretches out from the edge part of main part 7a, the 3rd tunicle removal portion 6 that is used to suppress to spread has suppressed the diffusion of the underfilling 8 that stretched out at its edge part, thereby spend in the scope of～135 degree 90 as shown in Figure 3, by liquid underfilling in the edge part of the 3rd tunicle removal portion 68 and the contact angle that insulation tunicle 3 constitutes.
If the contact angle of described liquid underfilling 8 is less than 90 degree, then the flowability of underfilling 8 uprises, thereby underfilling 8 becomes the state of extensive outflow.In addition, if the contact angle of liquid underfilling 8 is greater than 135 degree, the mobile step-down of underfilling 8 then, the mobile variation of underfilling 8.In addition, if contact angle is spent in the scope of～135 degree 90, then insulate tunicle 3 and underfilling 8 are in and are difficult to wetting state.
Then, according to Fig. 4 to Fig. 9 the installation method of electronic unit of the present invention is described.At first, as Fig. 4, shown in Figure 5, the point gum machine 9 that is used for injecting liquid underfilling 8 is configured in electronic unit 7 edges and the following first deletion portion vertical position of 4a, and described first 4a of deletion portion is another first deletion portion relative with near first 4a of deletion portion that is provided with the second tunicle removal portion 5 central authorities.
Under this state, if inject liquid underfilling 8 by point gum machine 9, then as shown in Figure 6, because the gap between insulation tunicle 3 and the main part 7a is little, underfilling 8 flows into wherein by capillarity, then, the underfilling 8 that overflows between this insulation tunicle 3 and main part 7a flows near first 4a of deletion portion of point gum machine 9 by capillarity.
Then, the underfilling 8 that overflows from first 4a of deletion portion flows between gap little the insulation tunicle 3 and main part 7a, be positioned at simultaneously the second tunicle removal portion 5 edge part underfilling 8 since its amount seldom, thereby stop at the edge part of the second tunicle removal portion 5 by means of the viscosity of underfilling 8, be in the state that does not flow in the second tunicle removal portion 5.
If further inject liquid underfilling 8, then as shown in Figure 7, underfilling 8 takes the lead in flowing between gap little the insulation tunicle 3 and main part 7a, simultaneously big second 4b of deletion portion in gap is gradually by underfilling 8 landfills, be positioned at away from locational first 4a of deletion portion of point gum machine 9 and the remaining state of part quilt of second 4b of deletion portion thereby become, and during this period, air is discharged from the second tunicle removal portion 5.
If further inject liquid underfilling 8, then as shown in Figure 8, become the part and the remaining state of the second tunicle removal portion, 5 quilts that are positioned at away from locational first 4a of deletion portion of point gum machine 9, if then inject liquid underfilling 8, then be arranged in away from the existing air of a part of locational first 4a of deletion portion of point gum machine 9 and discharge, become state as shown in Figure 9 from the second tunicle removal portion 5.
Then, under the state of Fig. 9, the edge of the underfilling 8 landfill main part 7a that overflow from the lower surface of main part 7a, a part goes out to the 3rd tunicle removal portion 6 one effluents simultaneously, but described the 3rd tunicle removal portion 6 constitutes the dykes and dams of underfilling 8, thereby, finished the installation of electronic unit of the present invention like this with the further outflow of contact angle prevention underfilling 8 shown in Figure 3.
In addition, Figure 10, Figure 11 shows other execution modes of the mounting structure of electronic unit of the present invention, if the formation to these other execution modes describes, then except the terminal 2 that is configured to square shape, also be provided with a plurality of terminal 2a with the state that exposes from insulation tunicle 3 by the position of membranous part 3a, these a plurality of terminal 2a link to each other with electrode 7, in addition, the second tunicle removal portion 5 with the central authorities of one first 4a of deletion portion near, two ends of both sides' first 4a of deletion portion, and second 4b of deletion portion state connected vertically extends to form more laterally than the edge of main part 7a.
So, by there being the second tunicle removal portion 5 that is connected with second 4b of deletion portion, under the situation of the wettability of underfilling 8 good (good fluidity), can control flowing of underfilling 8 in the lower surface peripheral part of (delaying) main part 7a, thereby discharge the air in the lower surface central portion of main part 7a reliably.
Other structures are identical with the structure of the foregoing description, therefore, mark identical label and omit its explanation for same parts.
Then, according to Figure 12～Figure 18 other execution modes of the installation method of electronic unit of the present invention are described.At first, as shown in Figure 12 and Figure 13, the point gum machine 9 that is used for injecting liquid underfilling 8 is configured in electronic unit 7 edges and the following first deletion portion vertical position of 4a, and described first 4a of deletion portion is another first deletion portion relative with near first 4a of deletion portion that is provided with the second tunicle removal portion 5 central authorities.
Under this state, if inject the liquid underfilling 8 of wettability good (good fluidity) by point gum machine 9, then as shown in figure 14, because the gap between insulation tunicle 3 and the main part 7a is little, underfilling 8 flows into wherein by capillarity, then, the underfilling 8 that overflows between this insulation tunicle 3 and main part 7a flows near first 4a of deletion portion and the second tunicle removal portion 5 of point gum machine 9 by capillarity.Thus, between insulation tunicle 3 and the main part 7a, the air in first 4a of deletion portion and the second tunicle removal portion 5 is discharged from.
Then, as shown in figure 14, the good underfilling 8 of wettability that overflows from first 4a of deletion portion and the second tunicle removal portion 5 flows into the lower surface central portion of the little main part 7a in gaps and lower surface peripheral part and insulate between the tunicle 3.
If further inject liquid underfilling 8, then as shown in figure 15, underfilling 8 takes the lead in flowing between gap little the insulation tunicle 3 and main part 7a, simultaneously big second 4b of deletion portion in gap is gradually by underfilling 8 landfills, and with the position of second 4b of deletion portion, the second tunicle removal portion 5 connected vertically, the mobile Be Controlled (delaying) of the underfilling 8 that wettability is good.
By the control of described underfilling 8, the air among the lower surface central portion of main part 7a, second 4b of deletion portion can be discharged by reliable with second 4b of deletion portion, the second tunicle removal portion 5 connected vertically.
If further inject liquid underfilling 8, then as shown in figure 16, underfilling 8 landfills and second 4b of the deletion portion second tunicle removal portion 5 connected vertically, and from wherein overflowing, take the lead in simultaneously flowing between gap little the insulation tunicle 3 and main part 7a, and big second 4b of deletion portion in gap is gradually by underfilling 8 landfills, be positioned at away from locational first 4a of deletion portion of point gum machine 9 and the remaining state of part quilt of second 4b of deletion portion thereby become, and during this period, air is discharged from the second tunicle removal portion 5.
If further inject liquid underfilling 8, then as shown in figure 17, become the part and the remaining state of the second tunicle removal portion, 5 quilts that are positioned at away from locational first 4a of deletion portion of point gum machine 9, if then inject liquid underfilling 8, then be arranged in away from the existing air of a part of locational first 4a of deletion portion of point gum machine 9 and discharge, become state as shown in figure 18 from the second tunicle removal portion 5.
Then, under the state of Figure 18, the edge of the underfilling 8 landfill main part 7a that overflow from the lower surface of main part 7a, a part goes out to the 3rd tunicle removal portion 6 one effluents simultaneously, but described the 3rd tunicle removal portion 6 constitutes the dykes and dams of underfilling 8, thereby, finished the installation of electronic unit of the present invention like this with the further outflow of contact angle prevention underfilling 8 shown in Figure 3.
Claims (13)
1. the mounting structure of an electronic unit is characterized in that, comprising:
Insulated substrate is provided with a plurality of terminals;
The insulation tunicle is arranged on the described insulated substrate with the state of avoiding described terminal;
Electronic unit, the electrode that is arranged on the lower surface of main part is connected with described terminal; And
By the underfilling that resin forms, be arranged between described insulation tunicle and the described electronic unit and between described insulated substrate and the described electronic unit;
Wherein, described insulation tunicle has: the first tunicle removal portion, with the state of avoiding described terminal along the arrangement of described terminal and be provided with; And the second tunicle removal portion, be connected with this first tunicle removal portion, and extend towards the edge of described main part.
2. the mounting structure of electronic unit as claimed in claim 1 is characterized in that, the thickness of described insulation tunicle is thicker than described terminal.
3. the mounting structure of electronic unit as claimed in claim 1 or 2 is characterized in that, the described first tunicle removal portion forms band shape, and described insulation tunicle is provided with by membranous part in the position relative with the lower surface central portion of described main part.
4. the mounting structure of electronic unit as claimed in claim 3 is characterized in that, described terminal also is formed on described by on the position of membranous part with the state that exposes from described insulation tunicle, and is connected with described electrode.
5. the mounting structure of electronic unit as claimed in claim 1 is characterized in that, the described second tunicle removal portion extends to form to the outside, edge of described main part.
6. the mounting structure of electronic unit as claimed in claim 5, it is characterized in that, described terminal is configured to square shape along four linea angulatas, and the described first tunicle removal portion has the described first deletion portion that is positioned on first line parallel to each other and is connected with this first deletion portion and is positioned at the described second deletion portion on second line parallel to each other.
7. the mounting structure of electronic unit as claimed in claim 6, it is characterized in that, have the described second tunicle removal portion that is connected with described first a deletion portion, the described second tunicle removal portion extends to form to the outside at the edge of described main part near the central authorities of described one first deletion portion.
8. the mounting structure of electronic unit as claimed in claim 7 is characterized in that, the state that the described second tunicle removal portion is connected with the two ends with the described first deletion portion is straight line ground and extends to form to the outside at the edge of described main part.
9. as the mounting structure of claim 7 or 8 described electronic units, it is characterized in that the described second tunicle removal portion extends to form to the outside at the edge of described main part with the state that is connected with the described second deletion portion.
10. as the mounting structure of each described electronic unit in the claim 5 to 8, it is characterized in that, described insulation tunicle has the 3rd tunicle removal portion that forms in the mode of surrounding described main part, and the described second tunicle removal portion is connected setting with the 3rd tunicle removal portion.
11. the installation method of an electronic unit, it is characterized in that, the mounting structure that possesses the described electronic unit of claim 1, and have the edge that is disposed at described electronic unit and be used to inject the point gum machine of described underfilling, this point gum machine is configured on the position vertical with the described first tunicle removal portion, and injects described underfilling under this state.
12. the installation method of an electronic unit, it is characterized in that, the mounting structure that possesses the described electronic unit of claim 6, and have the edge that is disposed at described electronic unit and be used to inject the point gum machine of described underfilling, this point gum machine be configured in one of described first, second deletion portion vertical position on, and under this state, inject described underfilling.
13. the installation method of an electronic unit, it is characterized in that, the mounting structure that possesses claim 7 or 8 described electronic units, and have the edge that is disposed at described electronic unit and be used to inject the point gum machine of described underfilling, this point gum machine is configured in and is opposite near the vertical position of another first deletion portion of described one the first deletion portion that is provided with the described second tunicle removal portion central authorities, and injects described underfilling under this state.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006189397A JP4180622B2 (en) | 2005-11-16 | 2006-07-10 | Electronic component mounting structure and mounting method thereof |
| JP2006189397 | 2006-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101106112A true CN101106112A (en) | 2008-01-16 |
Family
ID=38999928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710128349 Pending CN101106112A (en) | 2006-07-10 | 2007-07-10 | Packaging structure of electronic part, and its packaging method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101106112A (en) |
| TW (1) | TW200819016A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409823A (en) * | 2015-08-03 | 2017-02-15 | 爱思开海力士有限公司 | Semiconductor package including planar stacked semiconductor chips |
-
2007
- 2007-06-25 TW TW96122918A patent/TW200819016A/en not_active IP Right Cessation
- 2007-07-10 CN CN 200710128349 patent/CN101106112A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409823A (en) * | 2015-08-03 | 2017-02-15 | 爱思开海力士有限公司 | Semiconductor package including planar stacked semiconductor chips |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI346521B (en) | 2011-08-01 |
| TW200819016A (en) | 2008-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100452903B1 (en) | Tape for chip on film and semiconductor therewith | |
| CN113276359B (en) | Injection mold and injection molding method | |
| US20080237892A1 (en) | Semiconductor device | |
| CN102709259B (en) | Flip chip molding structure and method of non-array bump | |
| KR20130071792A (en) | Pcb(printed circuit board) for muf(molded underfill) and molding structure of the same pcb | |
| US10325783B2 (en) | Semiconductor device including structure to control underfill material flow | |
| JP4180622B2 (en) | Electronic component mounting structure and mounting method thereof | |
| CN109545754B (en) | Chip packaging structure, chip packaging method and display device | |
| US11820058B2 (en) | Injection mould and injection moulding method | |
| TWI452660B (en) | Flip-chip molded package having non-array bumps | |
| CN101106112A (en) | Packaging structure of electronic part, and its packaging method | |
| JP2009182155A (en) | Lsi package and lsi package loading type electronic component | |
| KR100523714B1 (en) | Semiconductor device | |
| JP2006269772A (en) | Semiconductor package, wiring board, and semiconductor device | |
| JP4176792B2 (en) | Electronic component mounting structure and mounting method thereof | |
| KR100963151B1 (en) | Mold for manufacturing semiconductor package and method for molding using the same | |
| CN115230080A (en) | SIP makeup Mold, manufacturing method and using method | |
| US6743069B2 (en) | Facilitating the spread of encapsulant between surfaces of electronic devices | |
| JP4203513B2 (en) | Electronic component mounting structure | |
| JP2008283004A (en) | Semiconductor device | |
| US11430706B2 (en) | Packaging structure | |
| KR20120032764A (en) | Substrate for flip chip package and method of manufacturing flip chip package using the same | |
| CN100539108C (en) | The installation constitution of electronic unit with and installation method | |
| KR20160121839A (en) | Printed circuit board and method of manufacturing the same | |
| US8398211B2 (en) | Liquid-ejecting recording head having an element that generates energy and method of producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |