TW200819016A - Packaging structure of electronic part, and its packaging method - Google Patents

Packaging structure of electronic part, and its packaging method Download PDF

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Publication number
TW200819016A
TW200819016A TW96122918A TW96122918A TW200819016A TW 200819016 A TW200819016 A TW 200819016A TW 96122918 A TW96122918 A TW 96122918A TW 96122918 A TW96122918 A TW 96122918A TW 200819016 A TW200819016 A TW 200819016A
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Taiwan
Prior art keywords
electronic component
film
main body
mounting structure
film removing
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TW96122918A
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Chinese (zh)
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TWI346521B (en
Inventor
Kazuo Chihiro
Tomoyuki Honma
Shuichi Takeda
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Alps Electric Co Ltd
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Priority claimed from JP2006189397A external-priority patent/JP4180622B2/en
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of TW200819016A publication Critical patent/TW200819016A/en
Application granted granted Critical
Publication of TWI346521B publication Critical patent/TWI346521B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

To provide a packaging structure of an electronic part in which processability and productivity are good without air bubbles (void) in an under fill, and to provide its packaging method. In the packaging structure of the electronic part of this invention, the insulating substrate 1 in which a plurality of terminals are provided, a via hole for suction is not needed, and, accordingly, a dead space by opening processing and the via hole are eliminated, and the miniaturization of the insulating substrate 1 can be attained. Since an insulating film 3 has a first coat exception portion 4 prepared where the terminal 2 is avoided, and a second coat exception portion 5 connected with the first coat exception portion 4 and prolonged toward the periphery of the main body 7a of the electronic part 7, in the under fill 8 provided between the insulating substrate 1 and the electronic part 7, air in the coat exception portion 4 is extruded at the second coat exception portion 5 side by a liquid-like under fill, and the under fill without air bubbles (void) is obtained.

Description

200819016 九、發明說明 【發明所屬之技術領域】 本發明關於適用於各種電子設備或電子電路單元等中 的電子零件的安裝構造及其之安裝方法。 【先前技術】 若對關於以往的電子零件的安裝構造及其安裝方法的 圖進行說明，則圖1 9是示出以往的電子零件的安裝構造 及其安裝方法的說明圖。下面，根據圖1 9對以往的電子 零件的安裝構造的構成進行說明。以往的電子零件的安裝 構造如下構成：在具有貫通？L 5 1 a的絕緣基板5 1上以與 貫通孔5 1 a相對的狀態安裝有電子零件52，並在該絕緣基 板5 1和電子零件5 2之間設有由樹脂形成的底層塡料（ underfill) 53 (例如，參考專利文獻1)。 此外，如圖1 9所示，以往的電子零件的安裝方法在 安裝於絕緣基板5 1上的電子零件5 2的邊緣配置點膠機5 4 ，並在貫通孔5 1 a的下部配置吸引裝置5 5，首先，透過點 膠機54向電子零件52的整個周邊注入液體狀的底層塡料 53，而且，之後還要透過吸引裝置55從貫通孔51a向電 子零件5 3的中央部一側吸引底層塡料5 3 (例如，參考專 利文獻1 )。 專利文獻1 :特開平1 0-26 1 66 1號公報。 【發明內容】 -5- 200819016 〔發明欲解決之課題〕 但是，對於以往的電子零件的安裝構造來說，爲了在 絕緣基板51上設置貫通孔5 1 a，需要對絕緣基板5 1進行 開孔加工，而且，貫通孔5 1 a的位置成爲死區，從而無法 實現小型化。此外，對於其安裝方法來說，由於透過點膠 機54向電子零件52的整個周邊注入液體狀的底層塡料53 ，而且，之後還要透過吸引裝置55從貫通孔51a向電子 零件5 3的中央部一側吸引底層塡料5 3，因而，需要進行 向電子零件52的整個周邊注入底層塡料53並透過吸引裝 置5 5來吸引底層塡料5 3的作業，從而存在其作業繁瑣、 生産能力變差的問題。 〔欲解決課題之手段〕 本發明就是鑒於這樣的現有技術的情況而作出的，其 目的在於，提供一種加工性和生產性良好，並且底層塡料 中無氣泡（空隙）的電子零件的安裝構造及其安裝方法。 爲了達到上述目的，本發明的特徵在於，具備有：絕 緣基板’設有複數個端子；絕緣皮膜，以避開端子的狀態 設置在絕緣基板上；電子零件，設置在主體部的下表面的 電極與前述端子連接；以及由樹脂形成的底層塡料，設置 在絕緣皮膜和電子零件之間、以及絕緣基板和電子零件之 間；其中，絕緣皮膜具有：第丨皮膜去除部，以避開端子 的狀態沿著端子的排列而設置；以及第2皮膜去除部，與 該第1皮膜去除部連接，並朝著主體部的邊緣延伸。 -6- 200819016 這樣構成的本發明不需要在設有複數個端子的絕緣基 板上設置用於吸引的貫通孔，因此不需要進行開孔加工， 而且消除了由貫通孔引起的死區（dead space )，從而能 夠實現絕緣基板的小型化，並且，由於絕緣皮膜具有以避 開端子的狀態沿著端子的排列而設置的第1皮膜去除部、 和與該第1皮膜去除部連接並朝著主體部的邊緣延伸的第 2皮膜去除部，因而底層塡料的塡充速度在第2皮膜去除 部的部分變慢，結果，底層塡料向邊緣塡充的時間（ timing )變緩，從而可獲得內側無氣泡（空隙）的底層塡 料。 此外，本發明在上述發明的基礎上具有如下特徵：絕 緣皮膜的厚度比端子厚。根據這樣構成的本發明，在絕緣 基板與電子零件的主體部之間（第1皮膜去除部）透過毛 細管現象而流動的液體狀底層塡料比在絕緣皮膜與電子零 件的主體部之間透過毛細管現象而流動的液體狀底層塡料 變得緩慢，因此，第1皮膜去除部中存在的空氣能夠向第 2皮膜去除部一側可靠地壓出，從而可獲得無氣泡（空隙 )的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：第 1皮膜去除部形成爲帶狀，並且，絕緣皮膜在與主體部的 下表面中央部相對的位置處設置了皮膜部。根據這樣構成 的本發明，在絕緣皮膜與電子零件的主體部之間透過毛細 管現象而流動的液體狀底層塡料比在絕緣基板與電子零件 的主體部之間（第1皮膜去除部）透過毛細管現象而流動 200819016 的液體狀底層塡料變得迅速，因此，能夠將存在於主體部 的中央部中的空氣快速地向外周一側壓出，從而可獲得主 體部的中央部中無氣泡（空隙）的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：端 子以從絕緣皮膜露出的狀態還形成在皮膜部的位置上，並 與電極連接。這樣構成的本發明還能夠在電子零件主體部 的中央部的位置與端子連接，從而能夠增加連接數。 此外，本發明在上述發明的基礎上具有如下特徵：第 2皮膜去除部向主體部的邊緣的外側延伸形成。根據這樣 構成的本發明，存在於主體部的下表面一側的空氣能夠透 過第2皮膜去除部而可靠地排出到主體部外，從而可獲得 無氣泡（空隙）的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：端 子沿著四角線而配置成四角形狀，第1皮膜去除部具有位 於互相平行的第1線上的第1刪除部、和與該第1刪除部 連接並位於互相平行的第2線上的第2刪除部。這樣構成 的本發明透過第1、第2刪除部相連接，即便在具有配置 成四角形狀（口字形）的端子的情況下，也可獲得無氣泡 (空隙）的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：具 有與其中一個第1刪除部連接的第2皮膜去除部，第2皮 膜去除部從其中一個第1刪除部的中央附近向主體部的邊 緣的外側延伸形成。這樣構成的本發明透過在其中一個第 1刪除部的中央附近設置第2皮膜去除部，能夠將存在於 -8- 200819016 第1皮膜去除部中的最後的空氣排出到主體部外’從而可 獲得無氣泡（空隙）的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：第 2皮膜去除部以與第1刪除部的兩端連接的狀態呈一條直 線地向主體部的邊緣的外側延伸形成。這樣構成的本發明 透過設置與第1刪除部的兩端部連接的第2皮膜去除部’ 能夠將存在於第1皮膜去除部中的空氣可靠地排出到主體 部外，從而可獲得無氣泡（空隙）的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：第 2皮膜去除部以與第2刪除部連接的狀態向主體部的邊緣 的外側延伸形成。這樣構成的本發明由於存在與第2刪除 部連接的第2皮膜去除部，使底層塡料的可濕性良好（流 動性好），在該情況下，能夠控制（延緩）主體部的下表 面外周部中的底層塡料的流動，從而可靠地排出主體部的 下表面外周部中的空氣。 此外，本發明在上述發明的基礎上具有如下特徵：絕 緣皮膜具有以包圍主體部的方式形成的第3皮膜去除部， 前述第2皮膜去除部與該第3皮膜去除部連接設置。這樣 構成的本發明能夠透過第3皮膜去除部來抑制底層塡料的 擴散，並且由於底層塡料在第3皮膜去除部的邊緣部停止 ，因而可使第3皮膜去除部淺並且寬度窄，從而能夠實現 小型化。 爲了達到上述目的，本發明的特徵在於：具備上述發 明中的第1至第5項中任一項所記載的電子零件的安裝構 -9 - 200819016 造，並具有配置於電子零件的邊緣且用於注入底層塡料的 點膠機，前述點膠機配置在與第1皮膜去除部垂直的位置 上，並在此狀態下注入底層塡料。 這樣構成的本發明不需要進行透過點膠機向電子零件 的周圍注入底層塡料，或者透過吸引裝置吸引底層塡料的 作業，從而可提高作業性、生産性，並且，由於點膠機配 置在與第1皮膜去除部垂直的位置上並在此狀態下注入底 層塡料，因而能夠將存在於第1皮膜去除部中的空氣可靠 地向第2皮膜去除部一側壓出，從而可獲得無氣泡（空氣 )的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：具 備本發明第6項所記載的電子零件的安裝構造，並具有配 置於電子零件的邊緣且用於注入底層塡料的點膠機，前述 點膠機配置在與第1、第2刪除部的一個垂直的位置上， 並在此狀態下注入底層塡料。 這樣構成的本發明不需要進行透過點膠機向電子零件 的周圍注入底層塡料，或者透過吸引裝置吸引底層塡料的 作業’從而可提高作業性、生産性，並且，由於點膠機配 置在與第1、第2刪除部的一個垂直的位置上並在此狀態 下注入底層塡料，因而透過第1、第2刪除部相連接，即 便在具有配置成4角形狀（口字形）的端子的情況下，也 可獲得無氣泡（空氣）的底層塡料。 此外，本發明在上述發明的基礎上具有如下特徵：具 備本發明的第7項至第9項中任一項所記載的電子零件的 -10- 200819016 安裝構造，並具有配置於電子零件的邊緣且用於注入底層 塡料的點膠機，該點膠機配置在與對置於在中央附近設有 前述第2皮膜去除部的前述其中一個第1刪除部的另一個 第1刪除部垂直的位置上，並在此狀態下注入前述底層塡 料。 這樣構成的本發明不需要進行透過點膠機向電子零件 的周圍注入底層塡料或者透過吸引裝置吸引底層塡料的作 業，從而可提高作業性、生産性，並且，由於點膠機配置 在與對置於在中央附近設有前述第2皮膜去除部的前述其 中一個第1刪除部的另一個第1刪除部垂直的位置上，並 在此狀態下注入前述底層塡料，因而能夠將存在於第1皮 膜去除部中的最後的空氣排出到主體部外，從而可獲得無 氣泡（空氣）的底層塡料。 〔發明效果〕 本發明由於在絕緣基板上設置了沿著端子排列而設的 第1皮膜去除部、和與該第1皮膜去除部連接並朝著電子 零件主體部的邊緣延伸的第2皮膜去除部，因而無需在絕 緣基板上設置貫通孔，可獲得無氣泡（空氣）的底層塡料 【實施方式】 下面，參考附圖對發明的實施方式進行說明。圖1是 關於本發明電子零件的安裝構造的要部剖面圖，圖2是關 -11 - 200819016 於本發明電子零件的安裝構造的絕緣基板的平面圖，圖3 是圖1的A部分的放大圖’圖4是示出本發明的電子零件 的安裝方法的主視圖，圖5是示出本發明的電子零件的安 裝方法的平面圖，圖6關於本發明的電子零件的安裝方法 ’是示出液體狀底層塡料的第1流動狀態的說明圖，圖7 關於本發明的電子零件的安裝方法，是示出液體狀底層塡 料的第2流動狀態的說明圖，圖8關於本發明的電子零件 的安裝方法，是示出液體狀底層塡料的第3流動狀態的說 明圖，圖9關於本發明的電子零件的安裝方法，是示出液 體狀底層塡料的第4流動狀態的說明圖。 此外’圖1 〇是關於本發明電子零件的安裝構造的其 他貫施方式的要部剖面圖’圖1 1是關於本發明電子零件 的安裝構造的其他實施方式的絕緣基板的平面圖，圖i 2 是示出本發明的電子零件的安裝方法的其他實施方式的主 視圖，圖1 3是示出本發明的電子零件的安裝方法的其他 實施方式的平面圖，圖1 4關於本發明的電子零件的安裝 方法的其他實施方式，是示出液體狀底層塡料的第1流動 狀態的說明圖，圖1 5關於本發明的電子零件的安裝方法 的其他實施方式，是示出液體狀底層塡料的第2流動狀態 的說明圖，圖1 6關於本發明的電子零件的安裝方法的其 他實施方式’是示出液體狀底層塡料的第3流動狀態的說 明圖’圖1 7關於本發明的電子零件的安裝方法的其他實 施方式’是示出液體狀底層塡料的第4流動狀態的說明圖 ’圖1 8關於本發明的電子零件的安裝方法的其他實施方 -12- 200819016 式，是示出液體狀底層塡料的第5流動狀態的說明圖。 接著，根據圖1至圖3對本發明的電子零件的安裝構 造進行說明。在由層疊基板構成的絕緣基板1上設置了作 爲電路圖案的一部分的複數個端子2，前述端子2沿著四 角線排成兩列並呈四角形狀（口字形）。 此外，由環氧類樹脂形成的阻焊劑等絕緣皮膜3以避 開端子2的狀態被設置在前述絕緣基板1上，前述絕緣皮 膜3具有沿著端子2的排列而設置的帶狀的第1皮膜去除 部4，該第1皮膜去除部4呈四角形狀（口字形），並具 有位置在彼此平行的四角形狀的第1線上的第1刪除部4a 、和與該第1刪除部4a相連並位於彼此平行的四角形狀 的第2線上的第2刪除部4b。 此外，絕緣皮膜3還具有：被設置在第1皮膜去除部 4所包圍的位置上的島狀皮膜部3 a、從第1刪除部4a的1 端與第1刪除部4a呈1條直線狀地延伸的第2皮膜刪除 部5、從1個第1刪除部4的中央附近呈直角向外延伸的 第2皮膜去除部5、以及與該第2皮膜去除部5相連的環 狀第3皮膜去除部6。 此外，絕緣皮膜3具有25 μιη左右的厚度，比端子2 的厚度（10 μιη)厚，並且，第1、第2皮膜去除部4、5 的寬度形成爲ΙΟμηι以上。 由半導體晶片等構成的長方體形狀的電子零件7具有 主體部7a和複數個電極7b，前述複數個電極7b設置於主 體部7 a的下面並排列成四角形狀（口字形），該電子零 -13- 200819016 件7透過用焊料或球柵陣列（b a 11 g r i d a r r a y )等將電極 7b連接到端子2上而被安裝。 此時，皮膜部3 a位於主體部7a的中央部，第2皮膜 去除部5從主體部7a的邊緣向外側突出，第3皮膜去除 部6以包圍主體部7a的附近的方式配置，並且絕緣基板1 和主體部7a的下表面之間的尺寸爲50〜80μιη左右。 由環氧類樹脂形成的底層塡料8被設置在絕緣皮膜3 和主體部7 a的下表面之間、絕緣基板1和主體部7 a的下 表面之間、以及主體部7a的邊緣部上，從而加固了電子 零件7的安裝。而且，前述底層塡料8從主體部7a的邊 緣部伸出，用於抑制擴散的第3皮膜去除部6在其邊緣部 抑制了所伸出的底層塡料8的擴散，從而如圖3所示，由 第3皮膜去除部6的邊緣部中的液體狀底層塡料8與絕緣 皮膜3構成的接觸角在90度〜135度的範圍內。 如果述液體狀底層填料8的接觸角小於9 0度，則 底層塡料8的流動性變高，從而底層塡料8成爲廣泛流出 的狀態。此外，如果液體狀底層塡料8的接觸角大於1 3 5 度，則底層塡料8的流動性變低，底層塡料8的流動變差 。另外，如果接觸角在90度〜1 3 5度的範圍內，則絕緣皮 膜3和底層塡料8處於難以潤濕的狀態。 接著，根據圖4至圖9對本發明的電子零件的安裝方 法進行說明。首先，如圖4、圖5所示，用於注入液體狀 底層塡料8的點膠機9配置在電子零件7邊緣中的與下述 第1刪除部4a垂直的位置上，前述第1刪除部4a是與在 -14- 200819016 中央附近設有第2皮膜去除部5的第1刪除部4a相對的 另1第1刪除部。 在此狀態下，如果透過點膠機9注入液體狀的底層塡 料8，則如圖6所示，由於絕緣皮膜3和主體部7a之間的 間隙小，底層塡料8透過毛細管現象而流入其中’接著， 從該絕緣皮膜3和主體部7a之間溢出的底層塡料8透過 毛細管現象而流入靠近點膠機9的第1刪除部4a中。 然後，從第1刪除部4a溢出的底層塡料8流入間隙 小的絕緣皮膜3和主體部7a之間，同時位於第2皮膜去 除部5的邊緣部的底層塡料8由於其量很少，因而借助於 底層塡料8的黏性而停止在第2皮膜去除部5的邊緣部， 處於不流入第2皮膜去除部5內的狀態。 如果進一步注入液體狀的底層塡料8，則如圖7所示 ，底層塡料8率先流入間隙小的絕緣皮膜3和主體部7a 之間，同時間隙大的第2刪除部4b逐漸被底層塡料8塡 埋，從而變成位於遠離點膠機9的位置上的第1刪除部4a 和第2刪除部4b的一部分被剩下的狀態，並且在此期間 ，空氣從第2皮膜去除部5排出。 如果進一步注入液體狀的底層塡料8，則如圖8所示 ，變成位於遠離點膠機9的位置上的第1刪除部4 a的1 部分和第2皮膜去除部5被剩下的狀態，如果接著注入液 體狀的底層塡料8，則位於遠離點膠機9的位置上的第1 刪除部4a的一部分中所存在的空氣從第2皮膜去除部5 排出’變成如圖9所示的狀態。 -15- 200819016 然後，在圖9的狀態下，從主體部7 a的下表面溢出 的底層塡料8塡埋主體部7a的邊緣，同時一部分向第3 皮膜去除部6 —側流出，但前述第3皮膜去除部6構成底 層塡料8的堰，從而以圖3所示的接觸角阻止底層塡料8 的進一步的流出，這樣完成了本發明的電子零件的安裝。 此外，圖1 0、圖1 1示出了本發明的電子零件的安裝 構造的其他實施方式，如果對該其他實施方式的構成進行 說明，則除了配置成口字形的端子2之外，還在皮膜部3 a 的位置以從絕緣皮膜3露出的狀態設置了複數個端子2a， 這些複數個端子2a與電極7相連，此外，第2皮膜去除 部5以與其中一個第1刪除部4a的中央附近、雙方的第1 刪除部4a的兩個端部、以及第2刪除部4b垂直連接的狀 態比主體部7a的邊緣更向外側延伸形成。 如此，透過存在與第2刪除部4b連接的第2皮膜去 除部5，在底層塡料8的可濕性良好（流動性好）的情況 下，能夠控制（延緩）主體部7a的下表面外周部中的底 層塡料8的流動，從而可靠地排出主體部7 a的下表面中 央部中的空氣。 其他結構與上述實施例的結構相同’因此’對於同一 零件標注相同的標號並省略其說明。 接著，根據圖1 2〜圖1 8對本發明的電子零件的安裝 方法的其他實施方式進行說明。首先，如圖1 2、圖1 3所 示，用於注入液體狀底層塡料8的點膠機9配置在電子零 件7邊緣中的與下述第1刪除部4 a垂直的位置上，前述 -16- 200819016 第1刪除部4a是與在中央附近設有第2皮膜去除部5的 第1刪除部4a相對的另一第1刪除部。 在此狀態下，如果透過點膠機9注入可濕性良好（流 動性好）的液體狀底層塡料8，則如圖1 4所示，由於絕緣 皮膜3和主體部7 a之間的間隙小，底層塡料8透過毛細 管現象而流入其中，接著，從該絕緣皮膜3和主體部7a 之間溢出的底層塡料8透過毛細管現象而流入靠近點膠機 9的第1刪除部4a和第2皮膜去除部5中。由此，絕緣皮 膜3和主體部7a之間、第1刪除部4a和第2皮膜去除部 5中的空氣被排出。 然後，如圖14所示，從第1刪除部4a和第2皮膜去 除部5溢出的可濕性良好的底層塡料8流入間隙小的主體 部7a的下表面中央部、以及下表面外周部與絕緣皮膜3 之間。 如果進1步注入液體狀的底層塡料8，則如圖1 5所示 ’底層塡料8率先流入間隙小的絕緣皮膜3和主體部7 & 之間’同時間隙大的第2刪除部4 b逐漸被底層塡料8塡 埋，並且在與桌2刪除部4b垂直連接的第2皮膜去除部5 的位置，可濕性良好的底層塡料8的流動被控制（延緩） 〇 透過前述底層塡料8的控制，主體部7a的下表面中 央部、第2刪除部4b中的空氣能夠透過與第2刪除部“ 垂直連接的第2皮膜去除部5而可靠排出。 如果進一步注入液體狀的底層塡料8，則如圖16所示 -17- 200819016 ，底層塡料8塡埋與第2刪除部4b垂直連接的第2皮膜 去除部5，並從其中溢出，同時率先流入間隙小的絕緣皮 膜3和主體部7a之間，並且間隙大的第2刪除部4b逐漸 被底層塡料8塡埋，從而變爲位於遠離點膠機9的位置上 的第1刪除部4a和第2刪除部4b的一部分被剩下的狀態 ，並且在此期間，空氣從第2皮膜去除部5排出。 如果進一步注入液體狀的底層塡料8，則如圖1 7所示 ，變成位於遠離點膠機9的位置上的第1刪除部4a的1 部分和第2皮膜去除部5被剩下的狀態，如果接著注入液 體狀的底層塡料8，則位於遠離點膠機9的位置上的第1 刪除部4a的1部分中所存在的空氣從第2皮膜去除部5 排出，變成如圖1 8所示的狀態。 然後，在圖1 8的狀態下，從主體部7a的下表面溢出 的底層塡料8塡埋主體部7 a的邊緣，同時一部分向第3 皮膜去除部6 —側流出，但前述第3皮膜去除部6構成底 層塡料8的堰，從而以圖3所示的接觸角阻止底層塡料8 的進一步的流出，這樣完成了本發明的電子零件的安裝。 【圖式簡單說明】 圖1是關於本發明的電子零件的安裝構造的要部剖面 圖。 圖2是關於本發明的電子零件的安裝構造的絕緣基板 的平面圖。 圖3是圖1的A部分的放大圖。 -18- 200819016 圖4是示出本發明的電子零件的安裝方法的主視圖。 圖5是示出本發明的電子零件的安裝方法的平面圖。 圖6關於本發明的電子零件的安裝方法，是示出液體 狀底層塡料的第1流動狀態的說明圖。 Η 7關於本發明的電子零件的安裝方法，是示出液體 狀底層塡料的第2流動狀態的說明圖。 圖8關於本發明的電子零件的安裝方法，是示出液體 狀底層塡料的第3流動狀態的說明圖。 圖9關於本發明的電子零件的安裝方法，是示出液體 狀底層塡料的第4流動狀態的說明圖。 圖1 〇是關於本發明的電子零件的安裝構造的其他實 施方式的要部剖面圖。 圖1 1是關於本發明的電子零件的安裝構造的其他實 施方式的絕緣基板的平面圖。 圖1 2是示出本發明的電子零件的安裝方法的其他實 施方式的主視圖。 圖1 3是示出本發明的電子零件的安裝方法的其他實 施方式的平面圖。 圖1 4關於本發明的電子零件的安裝方法的其他實施 方式，是示出液體狀底層塡料的第1流動狀態的說明圖。 圖1 5關於本發明的電子零件的安裝方法的其他實施 方式，是示出液體狀底層塡料的第2流動狀態的說明圖。 圖1 6關於本發明的電子零件的安裝方法的其他實施 方式，是示出液體狀底層塡料的第3流動狀態的說明圖。 -19- 200819016 圖1 7關於本發明的電子零件的安裝方法的其他貫施 方式，是示出液體狀底層塡料的第4流動狀態的說明圖。 圖18關於本發明的電子零件的安裝方法的其他實施 方式，是示出液體狀底層塡料的第5流動狀態的說明圖。 圖19是示出以往的電子零件的安裝構造及其安裝方 法的說明圖。 【主要元件符號說明】 1 :絕緣基板 2 :端子 2a :端子 3 :絕緣皮膜 3 a :皮膜部 4 :第1皮膜去除部 4a :第1刪除部 4b :第2刪除部 5 :第2皮膜去除部 6 :第3皮膜去除部 7 :電子零件 7 a :主體部 7b :電極 8 :底層塡料 9 :點膠機 -20-[Technical Field] The present invention relates to a mounting structure of an electronic component suitable for use in various electronic devices, electronic circuit units, and the like, and a mounting method therefor. [Prior Art] A diagram showing a mounting structure of a conventional electronic component and a mounting method thereof will be described with reference to a conventional electronic component mounting structure and a mounting method thereof. Next, the configuration of a conventional electronic component mounting structure will be described with reference to Fig. 19. The mounting structure of the conventional electronic components is as follows: An electronic component 52 is mounted on the insulating substrate 51 of the L 5 1 a so as to face the through hole 5 1 a, and an underlying material formed of a resin is provided between the insulating substrate 51 and the electronic component 52 ( Underfill) 53 (for example, refer to Patent Document 1). Further, as shown in FIG. 19, in the conventional method of mounting an electronic component, a dispenser 54 is disposed on the edge of the electronic component 52 attached to the insulating substrate 51, and a suction device is disposed below the through hole 51a. 5, first, the liquid underlayer material 53 is injected into the entire periphery of the electronic component 52 through the dispenser 54, and then sucked from the through hole 51a toward the central portion of the electronic component 53 through the suction device 55. The underlying material 5 3 (for example, refer to Patent Document 1). Patent Document 1: Japanese Patent Publication No. Hei 1 0-26 1 66 No. 1. [5] In the conventional electronic component mounting structure, in order to provide the through hole 5 1 a in the insulating substrate 51, it is necessary to open the insulating substrate 51. Further, the position of the through hole 5 1 a becomes a dead zone, and the miniaturization cannot be achieved. Further, as for the mounting method, the liquid underlayer material 53 is injected into the entire periphery of the electronic component 52 through the dispenser 54, and then passes through the suction device 55 from the through hole 51a to the electronic component 53. Since the bottom portion of the central portion attracts the underlying material 5 3 , it is necessary to inject the underlying material 53 into the entire periphery of the electronic component 52 and to attract the underlying material 5 3 through the suction device 5 5 , which results in cumbersome work and production. The problem of poor ability. [Means for Solving the Problems] The present invention has been made in view of the circumstances of the prior art, and an object of the present invention is to provide an electronic component mounting structure having good workability and productivity and having no air bubbles (voids) in the underlying material. And its installation method. In order to achieve the above object, the present invention is characterized in that the insulating substrate is provided with a plurality of terminals, the insulating film is provided on the insulating substrate in a state avoiding the terminals, and the electronic component is provided on the lower surface of the main body. Connected to the aforementioned terminal; and an underlying material formed of a resin, disposed between the insulating film and the electronic component, and between the insulating substrate and the electronic component; wherein the insulating film has a first film removing portion to avoid the terminal The state is provided along the arrangement of the terminals; and the second film removing portion is connected to the first film removing portion and extends toward the edge of the body portion. -6- 200819016 The present invention thus constituted does not require a through hole for suction to be provided on an insulating substrate provided with a plurality of terminals, so that it is not necessary to perform the drilling process, and the dead space caused by the through holes is eliminated (dead space) In addition, the insulating film can be miniaturized, and the insulating film has a first film removing portion provided along the terminal in a state avoiding the terminal, and is connected to the first film removing portion toward the main body. When the second film removing portion is extended at the edge of the portion, the filling speed of the underlying material is slowed in the portion of the second film removing portion, and as a result, the timing at which the underlying material is filled toward the edge becomes slow, and thus it is obtained. The bottom layer without bubbles (voids) on the inside. Further, the present invention is characterized in that the thickness of the insulating film is thicker than the terminal, in addition to the above invention. According to the invention thus constituted, the liquid underlayer material flowing between the insulating substrate and the main body portion of the electronic component (the first film removing portion) through the capillary phenomenon penetrates the capillary between the insulating film and the main body portion of the electronic component Since the liquid-like underlying material flowing in the phenomenon becomes slow, the air existing in the first film removing portion can be reliably pushed out toward the second film removing portion side, and the underlying material without bubbles (voids) can be obtained. . Furthermore, the present invention is characterized in that the first film removing portion is formed in a strip shape, and the insulating film is provided with a film portion at a position facing the central portion of the lower surface of the main body portion. According to the invention thus constituted, the liquid-like underlayer material flowing through the capillary between the insulating film and the main body portion of the electronic component passes through the capillary between the insulating substrate and the main body portion of the electronic component (the first film removing portion) Since the liquid-like underlying material flowing in 200819016 becomes rapid, the air existing in the central portion of the main body portion can be quickly pushed out toward the outer peripheral side, and the central portion of the main body portion can be free from air bubbles (voids). The underlying material. Furthermore, the present invention is characterized in that the terminal is further formed at a position of the film portion in a state of being exposed from the insulating film, and is connected to the electrode. According to the present invention thus constituted, the position of the central portion of the electronic component main body portion can be connected to the terminal, and the number of connections can be increased. Furthermore, the present invention is characterized in that the second film removing portion is formed to extend outward of the edge of the main body portion. According to the present invention having such a configuration, the air existing on the lower surface side of the main body portion can be reliably discharged to the outside of the main body portion through the second film removing portion, and the underlying material without bubbles (voids) can be obtained. Further, according to the invention of the present invention, the terminal is arranged in a quadrangular shape along the square line, and the first film removing portion has the first deleting portion located on the first line parallel to each other, and the first deletion portion The part is connected to the second deletion unit on the second line parallel to each other. According to the present invention, the first and second erasing portions are connected to each other, and even when the terminals are arranged in a quadrangular shape (mouth shape), the underlying material without bubbles (voids) can be obtained. Further, according to the invention of the present invention, the second film removing portion is connected to one of the first deleting portions, and the second film removing portion is from the vicinity of the center of one of the first deleting portions to the edge of the main body portion. The outer extension is formed. According to the present invention, the second film removing portion is provided in the vicinity of the center of one of the first deleting portions, and the last air existing in the first film removing portion of -8-200819016 can be discharged outside the main body portion. Bottom-free material without bubbles (voids). Furthermore, the present invention is characterized in that the second film removing portion is formed to extend outward from the outer edge of the main body portion in a straight line in a state of being connected to both ends of the first erasing portion. According to the present invention, the second film removing unit that is connected to both end portions of the first deleting portion can reliably discharge the air existing in the first film removing portion outside the main body portion, thereby obtaining no air bubbles ( The underlying material of the void). Furthermore, the present invention is characterized in that the second film removing portion is formed to extend outward from the edge of the main body portion in a state of being connected to the second erasing portion. According to the present invention, the second film removing portion connected to the second deleting portion has a good wettability (good fluidity) of the underlying material, and in this case, the lower surface of the main body portion can be controlled (delayed). The flow of the underlying material in the outer peripheral portion is thereby reliably discharged from the air in the outer peripheral portion of the lower surface of the main body portion. Furthermore, the present invention is characterized in that the insulating film has a third film removing portion formed to surround the main body portion, and the second film removing portion is connected to the third film removing portion. According to the present invention configured as described above, the third film removing portion can suppress the diffusion of the underlying material, and since the underlying material is stopped at the edge portion of the third film removing portion, the third film removing portion can be made shallow and narrow. Can be miniaturized. In order to achieve the above object, the present invention is characterized in that the electronic component mounting structure of any one of the first to fifth aspects of the invention is provided in the present invention, and is provided on the edge of the electronic component. In the dispenser for injecting the underlying material, the dispenser is disposed at a position perpendicular to the first film removing portion, and the underlying material is injected in this state. The present invention thus constituted does not require the operation of injecting the underlying material into the periphery of the electronic component through the dispenser, or the operation of sucking the underlying material through the suction device, thereby improving workability and productivity, and since the dispenser is disposed at By injecting the underlying material at a position perpendicular to the first film removing portion, the air present in the first film removing portion can be reliably pushed out toward the second film removing portion, and the obtained air can be obtained. The bottom layer of air bubbles (air). Further, the present invention is characterized in that, in addition to the above-described invention, the electronic component mounting structure according to the sixth aspect of the present invention includes the dispenser disposed on the edge of the electronic component and used for injecting the underlying material. The dispenser is disposed at a position perpendicular to the first and second deletion portions, and the bottom layer is injected in this state. The present invention thus constituted does not require the operation of injecting the underlying material into the periphery of the electronic component through the dispenser, or the operation of sucking the underlying material through the suction device, thereby improving workability and productivity, and since the dispenser is disposed at Since the underlying material is injected in a state perpendicular to one of the first and second deletion portions, the first and second deletion portions are connected to each other, and even the terminal having the four-corner shape (mouth shape) is provided. In the case of the case, a bubble-free (air) bottom layer can also be obtained. Further, the present invention is characterized in that, in addition to the above-described invention, the -10-200819016 mounting structure of the electronic component according to any one of the seventh to ninth aspects of the present invention is provided on the edge of the electronic component. And a dispenser for injecting the underlying material, the dispenser is disposed perpendicular to the other first deletion portion of the one of the first deletion portions that is disposed adjacent to the center and is provided with the second film removal portion Position and inject the aforementioned underlying material in this state. The present invention thus constituted does not require an operation of injecting the underlying material into the periphery of the electronic component through the dispenser or sucking the underlying material through the suction device, thereby improving workability and productivity, and since the dispenser is disposed in The other first deletion portion of the one of the first deletion portions provided with the second film removal portion in the vicinity of the center is perpendicular to the first deletion portion, and the bottom layer is injected in this state. The last air in the first film removing portion is discharged to the outside of the main body portion, whereby a bubble-free (air) bottom layer can be obtained. [Effect of the Invention] In the present invention, the first film removal portion provided along the terminal array is provided on the insulating substrate, and the second film removal portion that is connected to the first film removal portion and extends toward the edge of the electronic component body portion is provided. Therefore, it is not necessary to provide a through hole in the insulating substrate, and a bubble-free (air) bottom layer can be obtained. [Embodiment] Hereinafter, embodiments of the invention will be described with reference to the drawings. 1 is a cross-sectional view of an essential part of a mounting structure of an electronic component according to the present invention, and FIG. 2 is a plan view of an insulating substrate of the mounting structure of the electronic component of the present invention, and FIG. 3 is an enlarged view of a portion A of FIG. 4 is a front view showing a mounting method of an electronic component of the present invention, FIG. 5 is a plan view showing a mounting method of the electronic component of the present invention, and FIG. 6 is a liquid showing a mounting method of the electronic component of the present invention. FIG. 7 is an explanatory view showing a second flow state of the liquid underlayer material, and FIG. 8 is an explanatory view showing a first flow state of the liquid underfill material. FIG. FIG. 9 is an explanatory view showing a fourth flow state of the liquid underlayer material in the method of attaching the electronic component according to the present invention. 1 is a cross-sectional view of an essential part of another embodiment of the mounting structure of the electronic component of the present invention. FIG. 11 is a plan view of an insulating substrate according to another embodiment of the mounting structure of the electronic component of the present invention, and FIG. It is a front view showing another embodiment of the mounting method of the electronic component of the present invention, and FIG. 13 is a plan view showing another embodiment of the mounting method of the electronic component of the present invention, and FIG. 14 relates to the electronic component of the present invention. Another embodiment of the mounting method is an explanatory view showing a first flow state of the liquid underlying material, and FIG. 15 shows another embodiment of the method of mounting the electronic component of the present invention, which is a liquid-like underlying material. FIG. 16 is an explanatory view showing a third flow state of the liquid-based underlying material, and FIG. 1 is an explanatory view showing a third flow state of the liquid-based underlying material. FIG. Another embodiment of the method of mounting a part is an explanatory view showing a fourth flow state of the liquid underlying material. FIG. 1 is an installation of the electronic component of the present invention. Other Embodiments of the Method -12-200819016 is an explanatory view showing a fifth flow state of the liquid bottom layer. Next, the mounting structure of the electronic component of the present invention will be described with reference to Figs. 1 to 3 . On the insulating substrate 1 composed of a laminated substrate, a plurality of terminals 2 as a part of a circuit pattern are provided, and the terminals 2 are arranged in two rows along a square line and have a quadrangular shape (slot shape). In addition, the insulating film 3 such as a solder resist formed of an epoxy resin is provided on the insulating substrate 1 in a state in which the terminal 2 is avoided, and the insulating film 3 has a strip-shaped first portion provided along the arrangement of the terminals 2. In the film removing unit 4, the first film removing unit 4 has a quadrangular shape (a square shape), and has a first deleting unit 4a positioned on a first line of a quadrangular shape parallel to each other, and is connected to the first deleting unit 4a. The second deletion portion 4b located on the second line of the quadrangular shape parallel to each other. In addition, the insulating film 3 has an island-shaped film portion 3a provided at a position surrounded by the first film removing portion 4, and has a linear shape from the one end of the first deleting portion 4a and the first deleting portion 4a. The second film removing portion 5 that extends in the ground, the second film removing portion 5 that extends outward at a right angle from the vicinity of the center of the first first deleting portion 4, and the annular third film that is connected to the second film removing portion 5 The removal portion 6. Further, the insulating film 3 has a thickness of about 25 μm, is thicker than the thickness (10 μm) of the terminal 2, and the widths of the first and second film removing portions 4 and 5 are ΙΟμηι or more. The rectangular parallelepiped electronic component 7 composed of a semiconductor wafer or the like has a main body portion 7a and a plurality of electrodes 7b. The plurality of electrodes 7b are disposed on the lower surface of the main body portion 7a and arranged in a quadrangular shape (mouth shape). - 200819016 Item 7 is mounted by connecting the electrode 7b to the terminal 2 with a solder or a ball grid array (ba 11 gridarray) or the like. At this time, the film portion 3 a is located at the center portion of the main body portion 7a, the second film removing portion 5 protrudes outward from the edge of the main body portion 7a, and the third film removing portion 6 is disposed so as to surround the vicinity of the main body portion 7a, and is insulated. The size between the substrate 1 and the lower surface of the main body portion 7a is about 50 to 80 μm. The underlying batting 8 formed of an epoxy resin is disposed between the insulating film 3 and the lower surface of the main body portion 7a, between the insulating substrate 1 and the lower surface of the main body portion 7a, and on the edge portion of the main body portion 7a. Thereby reinforcing the mounting of the electronic component 7. Further, the underlying batting 8 protrudes from the edge portion of the main body portion 7a, and the third film removing portion 6 for suppressing diffusion suppresses the diffusion of the protruding underlying material 8 at the edge portion thereof, thereby being as shown in Fig. 3. The contact angle between the liquid underlayer 8 and the insulating film 3 in the edge portion of the third film removing portion 6 is in the range of 90 to 135 degrees. If the contact angle of the liquid underfill 8 is less than 90 degrees, the fluidity of the underlying material 8 becomes high, so that the underlying material 8 becomes a state of widespread outflow. Further, if the contact angle of the liquid underlying material 8 is more than 135 degrees, the fluidity of the underlying material 8 becomes low, and the flow of the underlying material 8 deteriorates. Further, if the contact angle is in the range of 90 to 135 degrees, the insulating film 3 and the underlying material 8 are in a state in which they are hard to wet. Next, a method of mounting the electronic component of the present invention will be described with reference to Figs. 4 to 9 . First, as shown in FIGS. 4 and 5, the dispenser 9 for injecting the liquid underlayer 8 is disposed at a position perpendicular to the first deletion portion 4a below the edge of the electronic component 7, and the first deletion is performed. The portion 4a is another first deletion portion that faces the first deletion portion 4a in which the second membrane removal portion 5 is provided in the vicinity of the center of -14-200819016. In this state, if the liquid underlayer 8 is injected through the dispenser 9, as shown in Fig. 6, since the gap between the insulating film 3 and the main portion 7a is small, the underlying material 8 flows through the capillary phenomenon. Then, the underlying material 8 overflowing from between the insulating film 3 and the main body portion 7a passes through the capillary phenomenon and flows into the first deleting portion 4a close to the dispenser 9. Then, the underlying material 8 overflowing from the first erasing portion 4a flows between the insulating film 3 having a small gap and the main body portion 7a, and the underlying material 8 located at the edge portion of the second film removing portion 5 is small in amount. Therefore, the edge portion of the second film removing portion 5 is stopped by the viscosity of the underlying material 8 and is in a state where it does not flow into the second film removing portion 5. When the liquid underlayer material 8 is further injected, as shown in Fig. 7, the underlying material 8 first flows between the insulating film 3 having a small gap and the main body portion 7a, and the second deleting portion 4b having a large gap is gradually smashed. The material 8 is buried, and the first deletion portion 4a and the second deletion portion 4b located at a position away from the dispenser 9 are left in a state where the air is discharged from the second film removal portion 5 during this period. . When the liquid bottom layer material 8 is further injected, as shown in Fig. 8, the first portion of the first deletion portion 4a located at a position away from the dispenser 9 and the second film removal portion 5 are left. When the liquid underlayer material 8 is subsequently injected, the air existing in a portion of the first deletion portion 4a located at a position away from the dispenser 9 is discharged from the second film removal portion 5 to become as shown in FIG. status. -15-200819016 Then, in the state of Fig. 9, the underlying material 8 overflowing from the lower surface of the main body portion 7a is buried in the edge of the main body portion 7a, and a part of the bottom layer 8a flows out to the side of the third film removing portion 6, but the foregoing The third film removing portion 6 constitutes the crucible of the underlying material 8 to prevent further outflow of the underlying material 8 at the contact angle shown in Fig. 3, thus completing the mounting of the electronic component of the present invention. 10 and FIG. 11 show another embodiment of the mounting structure of the electronic component of the present invention. When the configuration of the other embodiment is described, in addition to the terminal 2 arranged in a square shape, The position of the film portion 3a is provided with a plurality of terminals 2a in a state of being exposed from the insulating film 3, and the plurality of terminals 2a are connected to the electrode 7, and the second film removing portion 5 is centered with one of the first deleting portions 4a. The state in which the two end portions of the first deletion portion 4a and the second deletion portion 4b are vertically connected to each other is formed to extend outward from the edge of the main body portion 7a. When the wettability of the underlying material 8 is good (fluidity is good), the second film removing portion 5 connected to the second removing portion 4b can control (delay) the outer periphery of the lower surface of the main body portion 7a. The flow of the underlying material 8 in the portion is thereby reliably discharged from the air in the central portion of the lower surface of the main body portion 7a. The other structures are the same as those of the above-described embodiment. Therefore, the same components are denoted by the same reference numerals and the description thereof will be omitted. Next, another embodiment of the method of mounting the electronic component of the present invention will be described with reference to Figs. 12 to 18. First, as shown in Figs. 2 and 3, the dispenser 9 for injecting the liquid underlayer 8 is disposed at a position perpendicular to the first deletion portion 4a below the edge of the electronic component 7, the aforementioned -16- 200819016 The first deletion unit 4a is another first deletion unit that faces the first deletion unit 4a in which the second film removal unit 5 is provided in the vicinity of the center. In this state, if the liquid-like underlayer 8 having good wettability (good fluidity) is injected through the dispenser 9, as shown in Fig. 14, due to the gap between the insulating film 3 and the main body portion 7a. Small, the underlying material 8 flows into it through the capillary phenomenon, and then the underlying material 8 overflowing from between the insulating film 3 and the main body portion 7a passes through the capillary phenomenon and flows into the first deleting portion 4a and the first portion close to the dispenser 9. 2 in the film removal unit 5. Thereby, the air between the insulating film 3 and the main body portion 7a, the first deletion portion 4a, and the second film removal portion 5 is discharged. Then, as shown in FIG. 14, the bottom layer 8 having good wettability which overflows from the first deletion portion 4a and the second film removal portion 5 flows into the lower surface central portion of the main body portion 7a having a small gap and the outer peripheral portion of the lower surface. Between the insulation film 3. If the liquid bottom layer material 8 is injected in a step, as shown in Fig. 15, the bottom layer material 8 first flows into the second deletion portion between the insulating film 3 having a small gap and the main body portion 7 & 4 b is gradually buried by the underlying material 8 and the flow of the underlying material 8 having good wettability is controlled (delayed) at the position of the second film removing portion 5 which is perpendicularly connected to the table 2 deleting portion 4b. By the control of the bottom layer material 8, the air in the lower surface central portion of the main body portion 7a and the second deletion portion 4b can be reliably discharged through the second film removal portion 5 that is vertically connected to the second deletion portion. The bottom layer material 8 is as shown in Fig. 16-17-200819016, and the bottom layer 8 is buried in the second film removing portion 5 which is vertically connected to the second deleting portion 4b, and overflows therefrom, and the flow gap is small first. The second deletion portion 4b having a large gap between the insulating film 3 and the main body portion 7a is gradually buried by the underlying material 8 to become the first deletion portion 4a and the second deletion located at a position away from the dispenser 9. Part of part 4b is left in the state, and during this time, air The second film removing unit 5 is discharged. When the liquid bottom layer 8 is further injected, as shown in Fig. 17, the first portion and the second film of the first deleting portion 4a located away from the dispenser 9 are formed. In the remaining state of the removal portion 5, if the liquid underlayer material 8 is subsequently injected, the air present in the first portion of the first deletion portion 4a located at a position away from the dispenser 9 is removed from the second film removal portion. 5, the discharge becomes the state shown in Fig. 18. Then, in the state of Fig. 18, the underlying material 8 overflowing from the lower surface of the main body portion 7a is buried in the edge of the main body portion 7a, and a part is directed to the third The film removing portion 6 is outflowed, but the third film removing portion 6 constitutes a crucible of the underlying material 8 to prevent further flow of the underlying material 8 at the contact angle shown in Fig. 3, thus completing the electron of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of an essential part of an electronic component mounting structure according to the present invention. Fig. 2 is a plan view showing an insulating substrate of an electronic component mounting structure according to the present invention. A magnified view of Part A of -18. -18- 20081 9016 is a front view showing a mounting method of an electronic component of the present invention. Fig. 5 is a plan view showing a mounting method of an electronic component of the present invention. Fig. 6 is a view showing a method of mounting an electronic component according to the present invention. FIG. 7 is an explanatory view showing a second flow state of the liquid-based underfill material. FIG. 8 is an explanatory view showing a second flow state of the liquid-based underfill material. FIG. 9 is an explanatory view showing a fourth flow state of the liquid underlayer material in the method of attaching the electronic component according to the present invention. Fig. 1 is a cross-sectional view of an essential part of another embodiment of the mounting structure of the electronic component of the present invention. Fig. 11 is a plan view showing an insulating substrate according to another embodiment of the mounting structure of the electronic component of the present invention. Fig. 12 is a front view showing another embodiment of the method of mounting the electronic component of the present invention. Fig. 13 is a plan view showing another embodiment of the mounting method of the electronic component of the present invention. Fig. 14 is an explanatory view showing a first flow state of the liquid underlayer material in the other embodiment of the method of mounting the electronic component of the present invention. Fig. 15 is an explanatory view showing a second flow state of the liquid underlayer material in the other embodiment of the method of mounting the electronic component of the present invention. Fig. 16 is an explanatory view showing a third flow state of the liquid underlayer material in the other embodiment of the method of mounting the electronic component of the present invention. -19-200819016 Fig. 1 is an explanatory view showing a fourth flow state of the liquid underlayer material in the other embodiment of the method of mounting the electronic component of the present invention. Fig. 18 is an explanatory view showing a fifth flow state of the liquid underlayer material in the other embodiment of the method of mounting the electronic component of the present invention. Fig. 19 is an explanatory view showing a mounting structure of a conventional electronic component and a mounting method thereof. [Description of main component symbols] 1 : Insulating substrate 2 : Terminal 2a : Terminal 3 : Insulating film 3 a : Film portion 4 : First film removing portion 4 a : First deleting portion 4 b : Second deleting portion 5 : Second film removal Part 6 : Third film removal unit 7 : Electronic component 7 a : Main body portion 7b : Electrode 8 : Underlying material 9 : Dispenser -20-

Claims (1)

200819016 十、申請專利範園 1. 一種電子零件的安裝構造，其特徵在於： 具備有： 絕緣基板，設有複數個端子； 絕緣皮膜，以避開前述端子的狀態設置在前述絕緣基 板上； 電子零件，爲設置在主體部的下表面的電極與前述端 子連接；以及 由樹脂形成的底層塡料，設置在前述絕緣皮膜和前述 電子零件之間、以及前述絕緣基板和前述電子零件之間； 前述絕緣皮膜具有：第1皮膜去除部，以避開前述端 子的狀態沿著前述端子的排列而設置；以及第2皮膜去除 部，與該第1皮膜去除部連接，並朝著前述主體部的邊緣 延伸。 2 .如申請專利範圍第1項所記載的電子零件的安裝構 造，其中，前述絕緣皮膜的厚度比前述端子厚。 3 .如申請專利範圍第1或2項所記載的電子零件的安 裝構造，其中，前述第1皮膜去除部形成爲帶狀，並且， 前述絕緣皮膜在與前述主體部的下表面中央部相對的位置 處設置了皮膜部。 4 ·如申請專利範圍第3項所記載的電子零件的安裝構 造’其中，前述端子也以從前述絕緣皮膜露出的狀態形成 在前述皮膜部的位置上，並與前述電極連接。 5 ·如申請專利範圍第1項所記載的電子零件的安裝構 -21 - 200819016 造，其中，前述第2皮膜去除部向前述主體部的邊緣外側 延伸形成。 6. 如申請專利範圍第5項所記載的電子零件的安裝構 造，其中，前述端子沿著四角線而配置成四角形狀，前述 第1皮膜去除部具有位於互相平行的第1線上的前述第1 刪除部、和與該第1刪除部連接並位於互相平行的第2線 上的前述第2刪除部。 7. 如申請專利範圍第6項所記載的電子零件的安裝構 造，其中，具有與其中一個前述第1刪除部連接的前述第 2皮膜去除部，前述第2皮膜去除部從前述其中一個第1 刪除部的中央附近向前述主體部的邊緣的外側延伸形成。 8 .如申請專利範圍第7項所記載的電子零件的安裝構 造，其中，前述第2皮膜去除部以與前述第1刪除部的兩 端連接的狀態呈一條直線地向前述主體部的邊緣的外側延 伸形成。 9.如申請專利範圍第7或8項所記載的電子零件的安 裝構造，其中，前述第2皮膜去除部以與前述第2刪除部 連接的狀態向前述主體部的邊緣的外側延伸形成。 1 〇 .如申請專利範圍第5至8項中任一項所記載的電 子零件的安裝構造，其中，前述絕緣皮膜具有以包圍前述 主體部的方式形成的第3皮膜去除部，前述第2皮膜去除 部與該第3皮膜去除部連接設置。 1 1 . 一種電子零件的安裝方法，其特徵在於，具備申 請專利範圍第1項所記載的電子零件的安裝構造，並具有 -22- 200819016 配置於前述電子零件的邊緣且用於注入前述底層塡料的點 膠機，該點膠機配置在與前述第1皮膜去除部垂直的位置 上’並在此狀態下注入前述底層塡料。 12·—種電子零件的安裝方法，其特徵在於，具備申 請專利範圍第6項所記載的電子零件的安裝構造，並具有 配置於前述電子零件的邊緣且用於注入前述底層塡料的點 膠機，該點膠機配置在與前述第1、第2刪除部的一個垂 直的位置上，並在此狀態下注入前述底層塡料。 1 3 · —種電子零件的安裝方法，其特徵在於，具備申 請專利範圍第7或8項所記載的電子零件的安裝構造，並 具有配置於[述電子零件的邊緣且用於注入肖ij述底層境料 的點膠機，該點膠機配置在與對置於在中央附近設有前述 第2皮膜去除部的前述其中一個第1刪除部的另一個第1 刪除部垂直的位置上，並在此狀態下注入前述底層塡料。 -23-200819016 X. Patent application garden 1. An electronic component mounting structure, comprising: an insulating substrate provided with a plurality of terminals; an insulating film disposed on the insulating substrate in a state avoiding the terminal; a part for connecting an electrode provided on a lower surface of the main body portion to the terminal; and a bottom layer formed of a resin, disposed between the insulating film and the electronic component, and between the insulating substrate and the electronic component; The insulating film has a first film removing portion that is provided along the arrangement of the terminals while avoiding the terminal, and a second film removing portion that is connected to the edge of the main body portion and connected to the first film removing portion. extend. The mounting structure of the electronic component according to the first aspect of the invention, wherein the thickness of the insulating film is thicker than the terminal. The mounting structure of the electronic component according to the first or second aspect of the invention, wherein the first film removing portion is formed in a strip shape, and the insulating film is opposed to a central portion of a lower surface of the main body portion. The film portion is set at the position. 4. The mounting structure of the electronic component according to the third aspect of the invention, wherein the terminal is also formed at a position of the film portion in a state of being exposed from the insulating film, and is connected to the electrode. The mounting of the electronic component according to the first aspect of the invention, wherein the second film removing portion is formed to extend outside the edge of the main body portion. 6. The electronic component mounting structure according to the fifth aspect of the invention, wherein the terminal is arranged in a quadrangular shape along a square line, and the first film removing unit has the first line located on a first line parallel to each other. The deletion unit and the second deletion unit connected to the first deletion unit and located on the second line parallel to each other. 7. The attachment structure of the electronic component according to the sixth aspect of the invention, wherein the second film removal unit is connected to one of the first deletion units, and the second film removal unit is from the first one. The vicinity of the center of the deletion portion is formed to extend outward of the edge of the main body portion. The mounting structure of the electronic component according to the seventh aspect of the invention, wherein the second film removing portion is linearly directed to the edge of the main body portion in a state of being connected to both ends of the first deleting portion. The outer side is formed to extend. The mounting structure of the electronic component according to the seventh aspect of the invention, wherein the second film removing portion is formed to extend outside the edge of the main body portion in a state of being connected to the second erasing portion. The electronic component mounting structure according to any one of the fifth aspect of the present invention, wherein the insulating film has a third film removing portion that surrounds the main body portion, and the second film The removal portion is connected to the third film removal portion. 1 . A method of mounting an electronic component, comprising: the mounting structure of the electronic component according to the first aspect of the patent application, having -22-200819016 disposed at an edge of the electronic component and for injecting the underlying layer 塡The dispenser of the material is disposed at a position perpendicular to the first film removing portion and injects the underlying material in this state. A method of mounting an electronic component, comprising: the mounting structure of the electronic component according to claim 6; and the dispensing of the edge of the electronic component for injecting the underlying material The dispenser is disposed at a position perpendicular to one of the first and second deletion portions, and the bottom layer is injected in this state. A method for mounting an electronic component, comprising: the mounting structure of the electronic component according to the seventh or eighth aspect of the invention, and having the edge disposed on the edge of the electronic component; a dispenser for a bottom layer material, wherein the dispenser is disposed at a position perpendicular to another first deletion portion of the one of the first deletion portions that is disposed adjacent to the center of the second film removal portion, and The aforementioned underlayer material is injected in this state. -twenty three-
TW96122918A 2006-07-10 2007-06-25 Packaging structure of electronic part, and its packaging method TW200819016A (en)

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