CN101097896A - 电源调整装置 - Google Patents

电源调整装置 Download PDF

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CN101097896A
CN101097896A CNA2007101276485A CN200710127648A CN101097896A CN 101097896 A CN101097896 A CN 101097896A CN A2007101276485 A CNA2007101276485 A CN A2007101276485A CN 200710127648 A CN200710127648 A CN 200710127648A CN 101097896 A CN101097896 A CN 101097896A
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power supply
circuit board
module
wafer package
adjusted
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戴维德·豪威尔
李艮生
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
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Abstract

本发明公开了一种电源调整装置，该电源调整装置包括电路板，收容晶片封装的电连接器和电源调整模组，电连接器和电源调整模组分别置于电路板相对的两面。电源调整模组与晶片封装相对布置，降低了电源调整模组和晶片封装之间的阻抗。

Description

电源调整装置
【技术领域】
本发明关于一种电源调整装置，尤其涉及一种在两个芯片封装间(如晶片封装，电源调整模组)提供低阻抗的电源调整装置。
【背景技术】
现代晶片封装需要输出高电流的同时相应的输出低电压，一般低电压的输出范围在0～5伏之间。晶片封装需要较高的电流，同时该电流在满足晶片封装需求的同时，要具有较大的波动范围。例如，晶片封装在休眠和待机状态，需要电流的改变范围在0.5A～5A；晶片封装在以较高的速度执行一个计算程序时需要的电流改变范围在10A～100A。虽然晶片封装需要电流在一个较大的范围内波动，但是不管晶片封装在那种状态下运作，提供给晶片封装的电压要保持相对稳定。
电源调整装置的利用可以满足电流较大变化范围的需求，将输出的电压不再直接回馈给晶片封装，取而代之，将调节后的电压传送给晶片封装。也就是说，电源调整装置既可以提供高水平的直流电，又可提供电源和晶片封装间最小限度的不确定的电压下降。
电源调整装置包括：电路板、电源调整模组和电连接器。其中，电连接器用来收容晶片封装。现有技术中电源调整模组必须靠近晶片封装安置，因为，如果电源调整模组被安置在远离晶片模组的位置，电源调整模组和晶片封装间的阻抗就会随着距离的增加而加大，影响稳压效果。此外，增加的阻抗会降低晶片封装的运行速度和影响晶片封装的能量传递。如今晶片封装朝着高速运行和高效的能量传递的方向发展，高阻抗变的越来越不可接受。
电源调整模组安装在电路板上并且靠近晶片封装，这种安装方式还存在的问题是，有些外围设备需要更加靠近晶片封装才能工作。例如，晶片封装上的散热片需要通过固持装置紧固于晶片封装的外围，直接安置于晶片封装上。此外，为了完整的传递信号，有些记忆体和集成电路也需要靠近晶片封装。因此，现有的电源调整装置，电源调整模组被放置在距离晶片封装较远的位置，因为上面提到的外围设备需要更靠近晶片封装，占据了电路板上有限的空间。明显的，如上所述，引来的结果是增大了阻抗且降低了能量传递的效能。
鉴于此，实有必要提供一种电源调整装置，以克服上述电源调整装置的缺陷。
【发明内容】
本发明的目的在于提供一种能加强稳压效能的电源调整装置。
为达成上述目的，本发明采用如下技术方案：一种电源调整装置，其包括：电路板、电源调整模组、电连接器。电路板的第一表面上设有若干第一连接端，同样与电路板的第一表面相对的第二表面上设有若干第二连接端。电连接器设置于电路板的第一表面上，通过电路板的第一连接端与电路板电性相连。电连接器用于收容晶片封装，并将晶片封装和电路板电性相连。电源调整模组置于电路板的第二表面，通过电路板的第二连接端与电路板电性相连。这样，利用这种电源调整装置就可以将稳定的电压传递给晶片封装。相比于先前技术，电源调整模组和晶片封装之间的阻抗会降低。
【附图说明】
图1是本发明电源调整装置的结构示意图。
图2是图1所示的电源调整装置的各部分连接关系的示意图。
图3是图1所示的电源调整装置中电源调整模组俯视图。
图4是图3所示的电源调整装置中电源调整模组沿I-I线的剖视图。
图5是图1所示的电源调整装置中电源调整模组底面视图。
【具体实施方式】
请参阅图1-5所示，本发明是一种电源调整装置其包括：电路板10、电源调整模组30和电连接器20。
电路板10上与电连接器20相连的表面为第一表面101，与第一表面101相对用来和电源调整模组30相连的表面为第二表面103。电路板10的第一表面101设有若干第一连接端111，与电路板的第一表面101相对的第二表面103上设有若干第二连接端113，置于电路板10的第一表面101上的电连接器20通过电路板10的第一连接端111与电路板10电性相连。
电连接器20用来收容晶片封装40(如CPU)，使晶片封装40与电路板10电性相连。
电源调整模组30置于电路板10的第二表面103，通过电路板10的第二连接端113与电路板10电性相连，同时电源调整模组30也通过电路板10和晶片封装40电性相连，利用这种电源调整装置将稳定的电压传递给晶片封装40。
植入于电路板10内的连接端具有多种形式，如：电性导通孔、电路走线、导电片。这些连接端分别用来传输信号、能量和接地。请参阅图2，本发明中位于电路板10相对的两个表面用于电性连接晶片封装40和电源调整装置30的第一、第二连接端111、113均为导电片。
电连接器20的中部为设有收容空腔的收容槽，该收容槽用于收容晶片封装40。收容槽的下方设有植入于电连接器20内的若干导电元件200，该导电元件可以为导电端子。在一些电连接器20中还设有夹紧机构，该夹紧机构利用夹紧力使晶片封装40组装于电连接器20中，并通过这种方式将晶片封装40和电连接器20上的导电元件200稳定接触，从而使晶片封装40和电连接器20获得稳定的电性连接。在本发明中，电连接器20的下表面设有若干锡球202，锡球202焊接到电路板10上相应的第一连接端111上，使得电连接器20和电路板10电性相连。另外，当将晶片封装40组设于电连接器20内，并将电连接器20置于电路板10的第一表面101上时，用于给晶片封装40散热确保晶片封装正常工作的散热片50(如风扇)紧固于电连接器20上。
本发明中，电源调整模组30包括其中的电子元件和位于该电子元件外围的壳体300，其中电子元件通过焊脚303焊接在壳体上。电源调整模组30的焊脚303上设有锡球302，通过锡球302电源调整模组30可以焊接到电路板10的第二表面103上。当将电源调整模组30组装在电路板10上时，电源调整模组30和晶片封装40在电路板10相对的两面上，相对于电路板10，电源调整模模组30与晶片封装40垂直布置并且靠近或稍微偏移晶片封装40。这样电源调整模组30和晶片封装40之间的阻抗就会低于先前技术中将电源调整模组30与晶片封装40平行并远离晶片封装40的这种布置形式的阻抗。
请参阅图4-5所示，电源调整模组30设有若干不同高度的热阻元件，其中高度稍低些的热阻元件为第一热阻元件305(如晶体管)、高度稍高些的热阻元件为第二热阻元件307(如电容和电感)。当将电源调整模组30组装于电路板10上时，散热器304固定在电源调整模组30的下部以利于电源调整模组30散热的需求。本发明中，第一热阻元件305(如晶体管)被散热器304完全覆盖，而第二热阻元件307(如电容、电感)部分伸出散热器304并露出于散热器304。另外，散热器304上对应于第二热阻元件307的位置上开设有通孔309，以利于第二热阻元件307从该通孔309中伸出散热器304，同样散热器304的高度高于第一热阻元件305，使得第一热阻元件305不会从散热器304中伸出。这样，通过适当的分配高低不同的热阻元件的位置，整个电源调整装置的高度也会得到有效的控制。
电源调整模组30内的电子元件组装在壳体300中是首选装配的方式，但是，如果电子元件没有外面的壳体300，直接组装在电路板10上也可以实现本发明的目的。
请参阅图1-2，组装时，首先将收容有晶片封装40的电连接器20通过其上的锡球202焊接到电路板10的第一表面101对应的第一连接端111上，从而使电连接器20和电路板10电性相连。然后将散热片50固持在电连接器20上，电源调整模组30在垂直于电路板10的方向上和晶片封装40相对布置，同时该电源调整模组30通过和电路板10的第二表面103上对应的第二连接端113接触，实现电源调整模组30与电路板10的电性相连。通过这种结构，电源调整模组30和晶片封装40之间会获得一个比较低的阻抗值。另外，一些外围设备也固定在电源调整装置30上，例如，第二热阻元件307穿过散热器304上相应的通孔309固定在散热器304上，第一热阻元件305直接被散热器304覆盖在里面。
应当指出，以上所述仅为本发明的优选实施方案，其它在本实施方案基础上进行的任何改进变换也应当不脱离本发明的技术方案。

Claims (7)

1.一种电源调整装置，其包括电路板、电连接器和电源调整模组，其中电路板的第一表面设有若干第一连接端，与电路板的第一表面相对的第二表面上设有若干第二连接端，置于电路板的第一表面上的电连接器通过电路板的第一连接端和电路板电性相连，晶片封装收容于电连接器内，并通过电连接器和电路板电性相连，其特征在于：电源调整模组置于电路板的第二表面上，电源调整模组在垂直于电路板的方向上和晶片封装相对布置。
2.如权利要求1所述的电源调整装置，其特征在于：所述电源调整模组还设有壳体。
3.如权利要求2所述的电源调整装置，其特征在于：所述电源调整模组设有若干焊接球，该焊接球将电源调整模组焊接到电路板的第二表面上。
4.如权利要求3所述的电源调整装置，其特征在于：所述电源调整模组上还设有散热器。
5.如权利要求4所述的电源调整装置，其特征在于：所述电源调整模组至少包括一个热阻元件，该热阻元件接近于散热器但没有伸出散热器。
6.如权利要求5所述的电源调整装置，其特征在于：所述散热器至少有一个通孔，以利于热阻元件从该通孔中伸出散热器。
7.如权利要求6所述的电源调整装置，其特征在于：所述电源调整模组在垂直于电路板的方向上位于晶片封装的下方。
CNA2007101276485A 2006-06-28 2007-06-15 电源调整装置 Pending CN101097896A (zh)

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Application Number Priority Date Filing Date Title
US11/476,318 US7778041B2 (en) 2006-06-28 2006-06-28 Interconnection system between CPU and voltage regulator
US11/476318 2006-06-28

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CN101097896A true CN101097896A (zh) 2008-01-02

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CN106332499A (zh) * 2015-06-26 2017-01-11 台达电子工业股份有限公司 一种用于芯片供电的组装结构、电子设备
CN114980504A (zh) * 2022-07-27 2022-08-30 之江实验室 一种针对晶圆级处理器的高密度供电装置

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CN105517336A (zh) * 2014-10-16 2016-04-20 南京瀚宇彩欣科技有限责任公司 低阻抗的电子装置
CN105517336B (zh) * 2014-10-16 2018-05-25 南京瀚宇彩欣科技有限责任公司 低阻抗的电子装置
CN106332499A (zh) * 2015-06-26 2017-01-11 台达电子工业股份有限公司 一种用于芯片供电的组装结构、电子设备
CN111315112A (zh) * 2015-06-26 2020-06-19 台达电子工业股份有限公司 一种用于芯片供电的组装结构、电子设备
CN114980504A (zh) * 2022-07-27 2022-08-30 之江实验室 一种针对晶圆级处理器的高密度供电装置
CN114980504B (zh) * 2022-07-27 2022-11-08 之江实验室 一种针对晶圆级处理器的高密度供电装置

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