CN101092008A - Solder of phosphorus-copper alloy - Google Patents

Abstract

The invention discloses a phosphorus-copper alloy welding solder that includes Ag 1.8-2.2wt%, P 6.8-7.5wt%, indium 0.5-1.0wt%, gallium 0.1-0.5wt% and the rest is copper and impurity. In the invention, gallium is 0.1-0.3wt% of the total mass of alloy solder. The invention has the following advantages: little In and Ga adding into alloy solder to make Ag about 2%, and the capacity is similar with the alloy solder containing high silver content. Thus, the cost of alloy solder is sharply decreased.

Description

Solder of phosphorus-copper alloy

Technical field

The present invention relates to a kind of copper-base alloy tin solder, especially relate to a kind of solder of phosphorus-copper alloy.

Background technology

The red copper of refrigeration industry cross valve, stop valve, particularly outlet shutoff valve, pipe group and brass, brass and flavones, brass and copper alloy soldering, the content of scolder silver originally is higher substantially, reach more than 20%, for example: the scolder welding of the trades mark such as BAg30CuZnCd or BAg20Cu-P.Because in recent years, nonferrous metal price went up fast, and (for example: scolders such as BAg30CuZnCd or BAg20Cu-P) higher owing to containing the Ag amount, cost is higher, is difficult to adapt to user's demand for the scolder of high silver content.Yet the decline of silver content can make the liquid of scolder, solidus extremely rise, and therefore, it is low how to obtain a kind of silver content, and to keep the solder composition suitable with high silver content solder performance be the present focus of development.In addition, the solder of phosphorus-copper alloy than high silver content is arranged, when welding, need carry out surface treatment (for example pickling), cause easily polluting.

Technology contents

The solder of phosphorus-copper alloy that the purpose of this invention is to provide a kind of low cost, environmental protection, the summation performance of this solder is still better.

The present invention adopts following technical scheme:

A kind of solder of phosphorus-copper alloy, comprise copper, phosphorus, silver, indium, and gallium, its proportioning is: Ag accounts for the solder gross mass: 1.8%～2.2%, and P accounts for the solder gross mass: 6.8%～7.5%, indium accounts for the solder gross mass: 0.5%～1.0%, gallium accounts for the solder gross mass: 0.1%～0.5%, and surplus is copper and unavoidable impurities.In the technical program, the percentage that gallium accounts for the solder gross mass is preferably: 0.1%～0.3%.Indium accounts for the solder gross mass and is preferably: 0.8%～1.0%.

With respect to prior art, the present invention obtains following technique effect;

1. in the solder of the present invention since the adding of novelty a spot of low-melting In and Ga (the few cost of amount is lower), make Ag have only about 2%, and its fusion temperature (comprises performances such as liquidus temperature and solidus temperature, see the form among the embodiment) etc. the combination property of each side suitable with combination property than the solder of high silver content, therefore reduced the cost of solder greatly.

2. the present invention is owing to added properly mixed low-melting In and Ga (160 ℃ of the fusing points of In, 29.8 ℃ of the fusing points of Ga), make that the content of Ag is lower, when flame welds, only need to adopt the gas scaling powder, just can omit the surface treatment means (pickling) after the original more welding of Ag content; If in the pricker soldering furnace, weld, then need not the scaling powder and the surface treatment means such as pickling in later stage.Therefore the design of this alloy helps the simplification of welding procedure, thereby reduces use cost.On the other hand, because the use of scaling powder pollutes the environment, and the present invention need not use scaling powder, so more environmental protection of the present invention.

3. the present invention adds In and Ga in Cu base alloy, has reduced the fusing point of alloy on the one hand, makes its solidus and liquidus temperature be in 640 ℃-720 ℃; On the other hand the adding of In and Ga also refinement the crystal grain of scolder (shown in the metallograph of accompanying drawing, along with the increase of addition, grain size attenuates), increased weld strength, improved wetability.Yet the too high levels of In causes the increase of cost easily, and the too high levels of Ga, brittle failure takes place in the poor processability of scolder easily, sees Table 2.

4. among the present invention, low excessively In content easily causes scolder melting temperature solidus and liquidus temperature too high, is difficult to reach 620 ℃-720 ℃, too high In content, easily cause scolder cost height, under the prerequisite of guaranteed performance, the consideration In content minimum for cost is controlled at 0.5-1.0%; Crossing low Ga content easily causes not having the effect of refinement scolder crystal grain, melting temperature solidus and liquidus temperature and does not reach 620 ℃-710 ℃, too high Ga content, easily cause solidus temperature to reduce, in scolder processing and manufacturing process, easily cause the scolder brittle failure, can't process, cause adverse influence, therefore the preferable range of Ga content of the present invention is 0.1-0.3%wt, and in this scope, solder is difficult for taking place the brittle failure phenomenon.

Description of drawings

Accompanying drawing 1 is the metallograph of solder of phosphorus-copper alloy, the trade mark: BCu91PAgInGa, and wherein In content is 0.5%-1%, the content of Ga is 0.1-0.3%.

Accompanying drawing 2 is the metallograph of solder of phosphorus-copper alloy, and the trade mark: BCu91PAg. does not wherein contain In and Ga.

Accompanying drawing 3 is the metallograph of solder of phosphorus-copper alloy, and the trade mark: BCu91PAg. is the content of In＜0.5% wherein, the content of Ga＜0.1%.

Accompanying drawing 4 is the metallograph of solder of phosphorus-copper alloy, and the trade mark: BCu91PAg. is the content of In＞1% wherein, the content of Ga＞0.3%.

Accompanying drawing 5 is the metallograph of solder of phosphorus-copper alloy, and the trade mark: BCu91PAg. is the content of In＞1% wherein, the content of Ga＞0.2%.

Accompanying drawing 6 is the metallograph of solder of phosphorus-copper alloy, and the trade mark: BCu91PAg. is the content of In＞0.8% wherein, the content of Ga＞0.3%.

Above multiplication factor is 1000 times

The specific embodiment

Embodiment 1

A kind of solder of phosphorus-copper alloy is characterized in that comprising copper, phosphorus, silver, indium, and gallium, proportioning is: Ag accounts for the solder gross mass: 1.8%～2.2%, for example can be chosen for 1.85%, 1.90%, 1.94%, 2.0%, 2.06%, 2.1%, P accounts for the solder gross mass: 6.9%～7.5%, for example can be chosen for 7%, 7.1%, 7.15%, 7.20%, 7.23%, 7.32%, 7.34%, 7.39%, 7.43%, 7.45%, 7.48%, indium accounts for the solder gross mass: 0.5%～1.0%, for example can be chosen for: 0.55%, 0.65%, 0.75%, 0.8%, 0.9%, 0.95% gallium: 0.1%～0.5%, surplus is copper and unavoidable impurities, total impurities＜0.15%, for example siliceous, trace impurities such as iron.

Embodiment 2

The concrete same embodiment of proportion, with comparative example, composition sees Table 1 simultaneously:

The composition of table 1 embodiment of the invention and comparative example

Sequence number	Cu	P(％)	Ag(％)	In(％)	Ga(％)	Impurity (%)
							1	Surplus	6.9	2.0	0.1	0.35	＜0.15
2	7.0	2.0	0.2	0.35
					3	7.1	2.0		0.4	0.35
4	7.2	2.0	0.55	0.35
					5	7.3	2.0		0.65	0.35
6	7.3	2.0	0.6	0.3
					7	7.4	2.0		0.75	0.35
8	7.0	2.0	0.8	0.35
					9	7.0	2.0		0.9	0.35
10	7.0	2.0	1.0	0.35
					11	7.0	2.0		0.65	0.1
12	7.0	2.0	0.65	0.2
					13	7.5	2.0		0.65	0.3
14	7.2	2.0	0.65	0.4
					15	7.3	2.0		0.65	0.45
16	7.4	2.0	0.65	0.5
					17	7.5	2.0		0.65	0.55
18	7.3	2.0	0.65	0.6
					19	7.2	2.0		0.65	0.7
20	7.0	2.0	0.65	0.8

The performance of embodiment and comparative example in table 2 table 1

Sequence number	Solidus (℃)	Liquidus curve (℃)	Tensile strength (MPa)	Torsional forces (NM)	Grain size number mm	Spreading property cm 2	Joint filling length m m	Remarks
										1	640	790	180	-	0.09	10	7
2	640	780	180	40	0.09	10	7
									3	640	760	180	39	0.09	11	7
4	640	760	185	39	0.08	11	7
									5	620	710	178	38	0.09	13	8
6	620	706	203	45	0.08	16	8	ok
									7	596	707	168	36	0.09	15	8
8	620	745	170	35	0.09	13	7
									9	620	740	190	43	0.09	13	8
10	600	730	162	40	0.09	11	8
									11	640	780	198	45	0.09	9	7	The temperature height
12	640	780	198	45	0.09	9	7	The temperature height
									13	596	705	185	42	0.08	17	8
14	625	720	195	44	0.08	15	8
									15	610	705	189	43	0.09	13	8	The brittle failure of silk material
16	610	705	180	40	0.09	14	8	The brittle failure of silk material
									17	610	700	175	39	0.09	15	8	The brittle failure of silk material
18	610	700	160	35	0.08	16	8	The brittle failure of silk material
									19	620	720	160	32	0.08	14	8	The brittle failure of silk material
20	640	760	152	40	0.07	12	8

The present invention can prepare with following technology

1, trial production material source of the present invention, technical indicator, consumption are as shown in table 3

Table 3 material source, technical indicator, consumption (calculating) by kilogram

Sequence number	The main material title	The source	Consumption (kg)	Index request	Remarks
							1	Ag	Shanghai Smeltery	0.02	99.95
2	Cu	Shanghai Smeltery	0.897	99.95
						3	P		0.073	High-class product
4	In		0.007	99.99
						5	Ga		0.003	99.99

2, before trial-production melting product, to make indium gallium alloy earlier.Calculate the pure indium of having weighed by composition requirement ratio and place in the crucible, heat up and be heated to 160 ℃, after the indium ingot melts fully, add by composition requirement ratio then and calculate the pure gallium of having weighed, because the fusing point of gallium is 29.8 ℃, at this moment, can not heat when adding pure gallium.To stir as early as possible.After treating that gallium melts fully, solution is poured in the metal mold, can be obtained indium gallium intermediate alloy.

When 3, manufacturing experimently the melting product, proportionately the branch ratio requires to calculate the cathode copper and the electrolytic silver (buying from market) of having weighed and puts into crucible, open the intermediate frequency device, when the molten bath occurring Deng the cathode copper that adds, adding proportionately, the branch ratio requires to calculate phosphor bronze alloy (buying from market) good and that weighed, after cathode copper, electrolytic silver, phosphor bronze alloy melt fully, be cooled to 750 ℃ ± 10 (measuring) with the far-infrared temperature instrument.Stir 50～80 circles clockwise, fully cathode copper, electrolytic silver, phosphor bronze alloy metal liquid alloy are stirred.Be incubated 5～8 minutes, remove the scum silica frost thing on cathode copper, electrolytic silver, the phosphor bronze alloy metal liquid alloy, add with the homemade indium gallium of said method intermediate alloy, stir, open the device of falling the stove, melted BCu91PAgInGa solder liquid is poured in the premelt furnace, be incubated 740 ℃ (measuring) with the far-infrared temperature measuring instrument.Draw with automatic tractor through crystallizer, cut off automatically, obtain BCu91PAgInGa solder alloy ingot casting of the present invention.

The scope of application of alloy of the present invention:

The BCu91PAgInGa cored solder is applicable to the welding of refrigeration accessory brass and brass, brass and red copper, red copper and red copper and copper alloy.

Welding method: in flame when welding, add the gas scaling powder in burning gases, and welding red copper and red copper, brass and red copper can obtain to exempt from the weld seam of pickling.Belong to the environment-friendly type new product.

Welding brass and red copper, brass and copper alloy in gas protecting soldering furnace, the surface of the work of welding is bright and clean, oxide-free, can exempt from pickling, genus environment-friendly type new product.

Points for attention:

Packing, transportation, storage are noted damp proof, moistureproof.The welding job environment is noted ventilating circulation of air.Note during work wearing safety goggles.

The analysis of components result that the employing EDX energy depressive spectroscopy of table 4 solder obtains:

	1	2	3	4	5	6	7	MW
									Cu	89.9	89.9	90.0	89.9	89.9	89.9	89.9	89.9
P	7.26	7.26	7.22	7.24	7.26	7.22	7.24	7.24
									Ag	2.02	2.06	2.02	2.06	2.04	2.02	2.06	2.04
In	0.56	0.57	0.56	0.56	0.54	0.56	0.57	0.56
									Ga	0.2	0.21	0.2	0.21	0.22	0.21	0.21	0.20

The trade mark is: BAg20Cu-P, and wherein Ag content is 20%, and P content is 65%, and Cu is a surplus, its performance is: tensile strength: 185MPa, and solidus temperature is 635 ℃, 725 ℃ of liquidus temperatures, torsional forces is more than or equal to 45N.m, and grain size number is smaller or equal to 0.08mm, spreading property 1.4cm ², joint filling length 9.8mm.

Claims (3)

1, a kind of solder of phosphorus-copper alloy, it is characterized in that comprising copper, phosphorus, silver, indium, and gallium, its proportioning is: silver accounts for the solder gross mass: 1.8%～2.2%, and phosphorus accounts for the solder gross mass: 6.8%～7.5%, indium accounts for the solder gross mass: 0.5%～1.0%, gallium accounts for the solder gross mass: 0.1%～0.5%, and surplus is copper and unavoidable impurities.

2, solder of phosphorus-copper alloy according to claim 1 is characterized in that gallium accounts for the solder gross mass: 0.1%～0.3%.

3, solder of phosphorus-copper alloy according to claim 1 and 2 is characterized in that indium accounts for the solder gross mass: 0.8%～1.0%.

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