CN101090607A - Circuit substrate and method for making the same, and circuit assembly using the same - Google Patents
Circuit substrate and method for making the same, and circuit assembly using the same Download PDFInfo
- Publication number
- CN101090607A CN101090607A CNA2007101103236A CN200710110323A CN101090607A CN 101090607 A CN101090607 A CN 101090607A CN A2007101103236 A CNA2007101103236 A CN A2007101103236A CN 200710110323 A CN200710110323 A CN 200710110323A CN 101090607 A CN101090607 A CN 101090607A
- Authority
- CN
- China
- Prior art keywords
- electrode
- tellite
- electric conductor
- circuit substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a manufacturing method of cheap circuit baseplate with simple manufacturing process and the said circuit baseplate, and circuit module using the said circuit baseplate. After stacking up a first tellite (13) with through-hole (2a) and a second tellite (14) with conductive body (6), the step of applying pressure is performed to make the conductive body (6) irrupt into the through-hole (2a), and then an electrode (7) is on the same surface state with bared surface of the second tellite (14), thus the invention can namufacture cheap circuit baseplate by simple manufacturing process.
Description
Technical field
The present invention relates to manufacture method, the circuit substrate of the suitable circuit substrate that is used near radio device etc. and used the circuit unit (circuit module) of this circuit substrate.
Background technology
Fig. 6 is the manufacture method of expression available circuit substrate and the major part profile of this circuit substrate, if according to Fig. 6 the formation of existing circuit substrate is described, then multilayer board 51 is made of with a plurality of plywood 53a～53g that are laminated in this core substrate 52 core substrate 52.
In these plywoods 53a～53g, be respectively arranged with hole 51a, in the 51a of these holes, lay the electrode 56 that is equipped with the via hole conductor 55 that is used to be electrically connected between conductive pattern 54 and the conductive pattern 54 etc. and is positioned at topmost by electroless plating, and, this electrode 56 is provided with solder bump portion 57, thereby formed existing circuit substrate (for example, with reference to patent documentation 1).
In having the available circuit substrate of such formation, though do not illustrate here, semiconductor device is electrically connected with electrode 56 by solder bump portion 57, has formed existing circuit unit.
Then, with reference to Fig. 6 the manufacture method of circuit substrate is described, at first, coating becomes the photonasty resist of plywood 53a on core substrate 52, then, makes this photonasty resist be exposed development, after forming hole 51a, apply formation conductive pattern 54 by electroless plating.
Then, become the photonasty resist of plywood 53b becoming on the photonasty resist of plywood 53a coating, then, make this photonasty resist be exposed development, after having formed hole 51a, by the deposited via hole conductor 55 that forms of electroless plating.
Afterwards, the formation, exposure, development and the electroless plating that carry out this photonasty resist in plywood 53c～53g repeatedly apply, after having formed conductive pattern 54 and via hole conductor 55, at last, when in the 51a of the hole of plywood 53g, apply forming electrode 56 by electroless plating, finish its manufacturing (for example, with reference to patent documentation 1).
Patent documentation 1: the spy opens the 2001-284783 communique
But, in the manufacture method of existing circuit substrate and this circuit substrate and circuit unit, exist following problems: because repeat to implement to be used to form the coating of each photonasty resist of plywood 53a～53g, exposure, development and the electroless plating of each photonasty resist applies, form conductive pattern 54, via hole conductor 55 and electrode 56, so, cause making loaded down with trivial details and manufacturing process increases, make the cost up of circuit substrate.
Summary of the invention
The present invention makes in view of the actual conditions of above-mentioned prior art, and its purpose is, the manufacture method and the circuit substrate of the circuit substrate that a kind of manufacturing process is simple, price is cheap and the circuit unit that has used this circuit substrate are provided.
In order to achieve the above object, the present invention is characterised in that form ceramic substrate by following operation: the hole that forms through hole in first tellite that is formed by ceramic material forms operation; The conductor that forms electric conductor in second tellite that is formed by ceramic material forms operation; Make electric conductor and through hole opposed, the stacked operation of stacked first, second tellite; First, second tellite after stacked is exerted pressure, make electric conductor protrude into the operation of exerting pressure in the through hole with the state that the exposing surface with first tellite becomes with one side; With the firing process that first, second tellite is burnt till; Become the electric conductor of same surface state to become the electrode that is used to be connected electronic unit with the exposing surface of ceramic substrate.
So the present invention who constitutes, the operation of under first tellite that is provided with through hole and the state of the second green sheet layers poststack that is provided with electric conductor, exerting pressure, make electric conductor protrude in the through hole, form the electrode that becomes same surface state with the exposing surface of first tellite, therefore, can obtain making simple and the few cheap circuit substrate of manufacturing process.
And, the present invention is in foregoing invention, with exert pressure under the state that forms electric conductor than the big area of through hole operation and firing process, electric conductor has the electrode that becomes same surface state with the exposing surface of ceramic substrate, with be connected, be positioned between first, second tellite with this electrode, be i.e. conductor introduction between the lamination of ceramic substrate.
So the present invention who constitutes, owing to form electrode and conductor introduction by the electric conductor that is arranged in second tellite, therefore reduced manufacturing process, obtain cheap circuit substrate, and conductor introduction can not expose near electrode, therefore, can reliably bottom filler (underfill) be injected between ceramic substrate and the semiconductor device, can form bubble-free bottom filler.
And the present invention is in foregoing invention, and the operation of exerting pressure is undertaken by the isotropism pressure in the liquid.
So the present invention who constitutes by isotropism pressure, can carry out exerting pressure of tellite equably, feasible pressurization precision height.
In order to achieve the above object, the present invention possesses the ceramic substrate that is made of first, second plywood at least, the electric conductor that is arranged on second layer lamination is in second layer lamination protrudes into the through hole that is arranged at the ground floor lamination, and the electronic unit that electric conductor is formed with the exposing surface of ground floor lamination becomes same surface state is connected the electrode of usefulness.
So the present invention who constitutes, because second layer lamination protrudes in the through hole that is arranged at the ground floor lamination with the electric conductor that is arranged on this second layer lamination, form the electrode that becomes same surface state with the exposing surface of ground floor lamination, therefore, can obtain making simple and few, the cheap circuit substrate of manufacturing process.
In addition, the present invention in foregoing invention, electric conductor have become the electrode of same surface state with the exposing surface of ground floor lamination and be connected with this electrode, the conductor introduction between first, second plywood.
So the present invention who constitutes, owing to form electrode and conductor introduction by the electric conductor that is arranged on second layer lamination, therefore, can obtain few, the cheap circuit substrate of manufacturing process, and conductor introduction can not expose near electrode, thereby the bottom filler can be injected between ceramic substrate and the semiconductor device reliably, can form does not have the bottom of bubble filler.
And the present invention is in foregoing invention, and electrode is provided with solder bump portion.
So the present invention who constitutes, when electric component was semiconductor device, semiconductor device can be welded in solder bump portion, made its installation become easy.
In order to achieve the above object, the present invention possesses any described circuit substrate in the technical scheme 4～6, and electronic unit is connected with electrode by welding.
So the present invention who constitutes, because electronic unit is installed to the electrode that is formed by electric conductor easily, and, second layer lamination protrudes in the through hole that is arranged on the ground floor lamination with the electric conductor that is arranged on this second layer lamination, form the electrode that becomes same surface state with the exposing surface of ground floor lamination, therefore, can obtain making simple and the few cheap circuit substrate of manufacturing process.
And the present invention is in foregoing invention, and electronic unit is formed by semiconductor device, and semiconductor device is welded in electrode, and has formed the bottom filler between semiconductor device and circuit substrate.
So the present invention who constitutes, owing to form electrode and extraction electrode by the electric conductor that is arranged on second layer lamination, so, can obtain few, the cheap circuit substrate of manufacturing process, and extraction electrode does not expose near electrode, thereby the bottom filler can be injected between ceramic substrate and the semiconductor device reliably, and can form does not have the bottom of bubble filler.
The invention effect
When the present invention exerts pressure operation under the state that first tellite that is provided with through hole and second green sheet layers that is provided with electric conductor are folded, electric conductor protrudes in the through hole, form the electrode that becomes same surface state with the exposing surface of first tellite, therefore can obtain making simple and few, the cheap circuit substrate of manufacturing process.
Description of drawings
Fig. 1 is the major part profile of circuit unit of the present invention.
Fig. 2 is the major part profile of circuit substrate of the present invention.
Fig. 3 is the key diagram of the first related operation of expression circuit substrate manufacturing method of the present invention.
Fig. 4 is the key diagram of the second related operation of expression circuit substrate manufacturing method of the present invention.
Fig. 5 is the key diagram of the 3rd related operation of expression circuit substrate manufacturing method of the present invention.
Fig. 6 is the manufacture method of existing circuit substrate and the major part profile of representing this circuit substrate.
Among the figure: 1-ceramic substrate, 2-ground floor lamination, 2a-through hole, 3-second layer lamination, a 3a-part, 4-the 3rd plywood, 5-the 4th plywood, 6-electric conductor, 7-electrode, the 8-conductor introduction, 9-solder bump portion, 10-semiconductor device (electronic unit), the 11-projection, 12-bottom filler, 13-first tellite, 14-second tellite, 15-the 3rd tellite, 16-the 4th tellite.
Embodiment
With reference to accompanying drawing embodiments of the present invention are described, Fig. 1 is the major part profile of circuit unit of the present invention, Fig. 2 is the major part profile of circuit substrate of the present invention, Fig. 3 is the key diagram of the first related operation of expression circuit substrate manufacturing method of the present invention, Fig. 4 is the key diagram of the second related operation of expression circuit substrate manufacturing method of the present invention, and Fig. 5 is the key diagram of the 3rd related operation of expression circuit substrate manufacturing method of the present invention.
Then, the formation of circuit unit of the present invention and circuit substrate is described according to Fig. 1, Fig. 2, by the ceramic substrate 1 that multilayer board constitutes, the second layer lamination 3, the stacked above one another that are protruded in the through hole 2a by the ground floor lamination 2 with a plurality of through hole 2a, the bottom that is layered in this ground floor lamination 2 and a part of 3a form at the 3rd, the 4th plywood 4,5 of the bottom of this second layer lamination 3.
The electric conductor 6 that forms conductive pattern is by copper or comprise that the alloy etc. of copper forms, and this electric conductor 6 has: a part of 3a that is arranged on ground floor lamination 3 with the state that is positioned at through hole 2a goes up, forms with the exposing surface of ground floor lamination 2 is the electrode 7 of same surface state; Be connected with this electrode 7, be positioned at the conductor introduction 8 of 2,3 of first, second plywoods.
This conductor introduction 8 forms with the state that does not expose near the surface of the ground floor lamination 2 the electrode 7, and between the surface and lamination of ceramic substrate 1, though do not illustrate, is formed with the electric conductor that becomes conductive pattern here.
And electrode 7 is provided with the scolding tin lug boss 9 that the fusion by paste scolding tin forms, thereby has formed circuit substrate of the present invention shown in Figure 2.
Circuit substrate of the present invention with formation like this as shown in Figure 1, the projection 11 that forms by gold etc. as the semiconductor device 10 of electronic unit, be electrically connected with electrode 7 by solder bump portion 9, be connected with electric loop via conductor introduction 8, and, between ceramic substrate 1 and semiconductor device 10, be provided with bottom filler 12, thus, formed circuit unit of the present invention.
In such circuit unit of the present invention, at least at face the resist film (not shown) is not set with semiconductor device 10 opposed ceramic substrates 1, electrode 7 becomes same surface state with the surface of ceramic substrate 1, and therefore, the injection of bottom filler 12 can be carried out smoothly.
In addition, in the present embodiment, also the electronic unit beyond the semiconductor device 10 can be connected with electrode 7, and in ceramic substrate 1, carry various electronic units, form the electric loop of expectation.
Then, according to Fig. 3～Fig. 5 the manufacture method of the circuit substrate among the present invention is described, at first as shown in Figure 3 as first operation, prepare: be used to form first tellite 13 that is formed by ceramic material of ground floor lamination 2, this ground floor lamination 2 is formed with through hole 2a by hole formation operation; Be used to form second tellite 14 that is formed by ceramic material of second layer lamination 3, this second layer lamination 3 forms operation by conductors such as printings and is formed with the area electric conductor 6 bigger than through hole 2a; With the 3rd, the 4th tellite 15,16 that is formed by ceramic material, it is used to form the 3rd, the 4th plywood 4,5.
Then, as second operation as shown in Figure 4, make electric conductor 6 and through hole 2a opposed, stacked first, second tellite 13,14, and, after the stacked operation of stacked the 3rd, the 4th tellite 15,16 has been carried out in the bottom of second tellite 14, then, as the 3rd operation as shown in Figure 5, the isotropism pressure in the liquid etc. is passed through in execution, to the operation of exerting pressure that first after stacked～the 4th tellite 13～16 is exerted pressure.
So as shown in Figure 5, the part of the electric conductor 6 and second tellite 14 protrudes in the through hole 2a, electric conductor 6 becomes and the same surface state of the exposing surface of first tellite 13.
Then, pass through firing process, first～the 4th tellite 13～16 and electric conductor 6 are burnt till, form the ceramic substrate 1 that constitutes by first～the 4th plywood 2～5 shown in Figure 2, and, electric conductor 6 is formed with: with the exposing surface of ceramic substrate 1 be the electrode 7 of same surface state, and be connected with this electrode 7, the conductor introduction 8 between first, second plywood 2,3.
Then, as shown in Figure 2, on electrode 7, form solder bump portion 9 as required, finish the manufacturing of circuit substrate of the present invention, and the sheet number that is used to form the tellite of ceramic substrate 1 can suitably selected more than two.
Claims (8)
1, a kind of manufacture method of circuit substrate forms operation by the hole that forms through hole in first tellite that is formed by ceramic material; The conductor that forms electric conductor in second tellite that is formed by ceramic material forms operation; Make described electric conductor and described through hole opposed, the stacked operation of stacked described first, second tellite; Described first, second tellite after stacked is exerted pressure, make described electric conductor protrude into the operation of exerting pressure in the described through hole with the state that the exposing surface with described first tellite becomes with one side; With the firing process that described first, second tellite is burnt till, form ceramic substrate, the described electric conductor that becomes same surface state with the exposing surface of described ceramic substrate becomes the electrode that is used to be connected electronic unit.
2, the manufacture method of circuit substrate according to claim 1 is characterized in that,
Forming under the state of described electric conductor with the area bigger than described through hole, carry out described operation and the described firing process of exerting pressure, described electric conductor has: become the described electrode of same surface state with the exposing surface of described ceramic substrate, with be connected, be positioned between described first, second tellite with this electrode, be i.e. conductor introduction between the lamination of described ceramic substrate.
3, the manufacture method of circuit substrate according to claim 1 and 2 is characterized in that,
The described operation of exerting pressure is carried out based on the isotropism pressure in the liquid.
4, a kind of circuit substrate is characterized in that,
Possesses the ceramic substrate that constitutes by first, second plywood at least, the electric conductor that is arranged on described second layer lamination protrudes in the through hole that is arranged at described ground floor lamination with described second layer lamination, and the electronic unit that described electric conductor is formed with the exposing surface of described ground floor lamination becomes same surface state is connected the electrode of usefulness.
5, circuit substrate according to claim 4 is characterized in that,
Described electric conductor has the described electrode that becomes same surface state with the exposing surface of described ground floor lamination and is connected, is positioned at conductor introduction between described first, second plywood with this electrode.
6, according to claim 4 or 5 described circuit substrates, it is characterized in that,
Described electrode is provided with solder bump portion.
7, a kind of circuit unit is characterized in that,
Possess any described circuit substrate in the claim 4～5 of the present invention, described electronic unit is connected with described electrode by welding.
8, circuit unit according to claim 7 is characterized in that,
Described electronic unit is formed by semiconductor device, and described semiconductor device is welded in described electrode, and is formed with the bottom filler between described semiconductor device and described circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006166147A JP2007335653A (en) | 2006-06-15 | 2006-06-15 | Circuit board, method of manufacturing the same, and circuit module using the same |
| JP2006166147 | 2006-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101090607A true CN101090607A (en) | 2007-12-19 |
Family
ID=38934827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101103236A Pending CN101090607A (en) | 2006-06-15 | 2007-06-13 | Circuit substrate and method for making the same, and circuit assembly using the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2007335653A (en) |
| KR (1) | KR100908674B1 (en) |
| CN (1) | CN101090607A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200107237A (en) | 2019-03-07 | 2020-09-16 | 주식회사 바이오로그디바이스 | the improved welding method of multi-coil and flexible printed circuit board |
| KR20200107239A (en) | 2019-03-07 | 2020-09-16 | 주식회사 바이오로그디바이스 | the improved welding method of multi-coil and flexible printed circuit board |
| KR20200107238A (en) | 2019-03-07 | 2020-09-16 | 주식회사 바이오로그디바이스 | the improved welding method of multi-coil and flexible printed circuit board |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60137092A (en) * | 1983-12-19 | 1985-07-20 | 株式会社東芝 | Circuit board |
| JPS60182195A (en) * | 1984-02-29 | 1985-09-17 | 株式会社東芝 | Circuit board |
| JPS6187388A (en) * | 1984-10-05 | 1986-05-02 | 株式会社東芝 | Manufacture of circuit board |
| JP2729731B2 (en) * | 1992-09-11 | 1998-03-18 | 株式会社住友金属エレクトロデバイス | Manufacturing method of ceramic multilayer substrate |
| JPH10107079A (en) * | 1996-10-01 | 1998-04-24 | Citizen Watch Co Ltd | Semiconductor device |
| JP2001244299A (en) * | 2000-02-29 | 2001-09-07 | Sony Corp | Wiring board and method of manufacturing the same |
| JP2001284783A (en) * | 2000-03-30 | 2001-10-12 | Shinko Electric Ind Co Ltd | Substrate for surface-mounting and surface-mounting structure |
| KR100811138B1 (en) * | 2001-11-13 | 2008-03-07 | 오리온피디피주식회사 | method of manufacturing a multilayer circuit board using low temperature cofired ceramic on metal, and a multilayer circuit board manufactured thereby |
| JP4038610B2 (en) * | 2002-06-04 | 2008-01-30 | 株式会社村田製作所 | Manufacturing method of ceramic substrate |
| JP4038611B2 (en) * | 2002-06-04 | 2008-01-30 | 株式会社村田製作所 | Ceramic substrate |
| JP2004095767A (en) * | 2002-08-30 | 2004-03-25 | Murata Mfg Co Ltd | Ceramic multilayer substrate and its manufacturing method |
-
2006
- 2006-06-15 JP JP2006166147A patent/JP2007335653A/en not_active Withdrawn
-
2007
- 2007-06-13 CN CNA2007101103236A patent/CN101090607A/en active Pending
- 2007-06-14 KR KR1020070058252A patent/KR100908674B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100908674B1 (en) | 2009-07-22 |
| KR20070119552A (en) | 2007-12-20 |
| JP2007335653A (en) | 2007-12-27 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |