CN101084572A - Singulating and de-tapping arrays of semiconductor packages - Google Patents
Singulating and de-tapping arrays of semiconductor packages Download PDFInfo
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- CN101084572A CN101084572A CNA2004800445419A CN200480044541A CN101084572A CN 101084572 A CN101084572 A CN 101084572A CN A2004800445419 A CNA2004800445419 A CN A2004800445419A CN 200480044541 A CN200480044541 A CN 200480044541A CN 101084572 A CN101084572 A CN 101084572A
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- adhesive tape
- assembly
- chip encapsulation
- encapsulation assembly
- package assembling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses an apparatus and method for separating at least one semiconductor package (504) formed on a substrate and a tape (302) removably adhered to the semiconductor package (504). The apparatus comprises a transferring unit (702) for engaging and displacing the semiconductor package (504) and a station (700) for disposing the semiconductor package (504) and the tape (302) thereon and for securing the tape (302). The semiconductor package (504) and the tape (302) are separable by initially the station (700) securing the tape (302) and providing thermal energy to the tape (302) for reducing the adhesion whereby the tape (302) is removably adhered to the semiconductor package (504) and subsequently the station (700) securing the tape (302) and the transferring unit (702) securing and displacing the semiconductor package (504) from the tape (302).
Description
Technical field
The present invention relates to the chip encapsulation assembly diced system basically.It relates more specifically to and can go up the cutting of an array chip encapsulation assembly and remove sticking system for being formed on the base version.
Background technology
Integrated circuit (ICs) forms from the semiconductor crystal wafer manufacturing, generally via an encapsulation flow process integrated circuit is encapsulated, and processing integrated circuit is become easily, and can be connected with an external circuit as integrated circuit version (PCB).The substrate package assembly is by an example forming of encapsulation flow process, and the array of being made up of individual integrated circuits wherein is arranged in the formation of ranks and is encapsulated on base version or the lead frame.The example of another encapsulation flow process is a chip-scale package, promptly encapsulates flow process and carries out on wafer.
Encapsulation is to cut apart or cut flow process after the flow process, to obtain individual other chip encapsulation assembly, as ball grid array (BGA) package assembling and quad flat non-pin (QFN) package assembling.A cutting blade typically is used for cutting apart chip encapsulation assembly.
When cutting flow process, chip encapsulation assembly normally is fixed on one in a different manner and cuts on the table, required stablizing with accurate when obtaining cutting.A kind of habitual fixing means is chip encapsulation assembly to be fixed on cutting with the base version shelve on the rubber vacuum cup of mould.Vacuum is fixed on chip encapsulation assembly on the sucker when cutting or after the cutting by the vacuum holes of rubber vacuum cup.But this habitual fixing means is the less chip encapsulation assembly of fixed volume effectively but.This is because of the chip encapsulation assembly that volume is less, and the tangential stress of being born when cutting is enough to cause its dislocation and has shifted out original position.This influences the quality and the income of cutting flow process possibly.The dislocation of chip encapsulation assembly also may make vacuum capacity reduce, and consequently whole base version is come out from the sucker dislocation, thereby causes cutting the failure of flow process.Certain limitation has appearred when therefore, this habitual fixing means is used for fixing the less chip encapsulation assembly of volume.
Another will be formed on, and the base version goes up or the fixing conventional process of chip encapsulation assembly of wafer chip level is that this assembly is bonded on a slice ultraviolet ray (UV) adhesive tape, cuts then.Chase or wafer circle on this base version or wafer be fixed on the cutting table.But, the chip encapsulation assembly that take out after the cutting is but very difficult.Though this is that chip encapsulation assembly still is bonded on the adhesive tape because adhesive tape diminishes through adhesion strength after the ultraviolet exposure.Therefore chip encapsulation assembly also needs to use knock-pin to separate it and adhesive tape.This will make this assembly be damaged easily, thereby cause the decline of rate of finished products.Slow down speed that chip encapsulation assembly and adhesive tape separate and can relax damage chip encapsulation assembly.In addition, though chase or wafer circle can automatically be bonded on the adhesive tape on habitually practising, after the cutting flow process was finished, adhesive tape but needed by artificial method it and chase or wafer to be separated.This must will influence production efficiency.
With noted earlier, thus this moment a kind of instrument of needs and method can be shown as reaching high efficiency, and can cut and except that gluing the less chip encapsulation assembly of volume.
Summary of the invention
Embodiments of the invention disclose as after, be used to enhance productivity.Meanwhile, embodiments of the invention are applicable to cutting and remove the sticking less chip encapsulation assembly of volume.
The one purpose according to the present invention, disclose a kind of as the separate chip package assembling with can glue the instrument that takes off the adhesive tape on this assembly.This instrument comprises the usefulness of a Moving Unit as fixing and dislocation chip encapsulation assembly; And platform.This can dispose chip encapsulation assembly and adhesive tape, as fixing glue adhesive tape and the usefulness that provides heat energy to come the separate chip package assembling and can glue the adhesive tape that takes off on chip encapsulation assembly.Wherein chip encapsulation assembly with can glue separating of the adhesive tape that takes off on this assembly; At first be adhesive tape to be fixed, and provide heat energy to lower to glue the adhesion strength of taking off the adhesive tape on this assembly by this; This fixes adhesive tape then, and Moving Unit is then fixed chip encapsulation assembly, and chip encapsulation assembly is come out from the adhesive tape dislocation.
Another purpose according to the present invention, disclose a kind of as the separate chip package assembling with can glue the method for taking off the adhesive tape on this assembly.The step that this method comprises comprises the fixed chip package assembling; Provide heat energy as the adhesion strength that lowers adhesive tape, adhesive tape can glue on chip encapsulation assembly and take off; The fixing glue adhesive tape; With the process chip package assembling as this assembly is come out from the adhesive tape dislocation.The step that wherein lowers the adhesive tape adhesion strength is before the process chip package assembling is as the step that chip encapsulation assembly is come out from the adhesive tape dislocation, and adhesive tape can glue and take off on chip encapsulation assembly.
Description of drawings
Indivedual embodiment of the present invention is described by following by accompanying drawing, wherein:
Fig. 1 is one group of upside figure that is formed on the molded side of the chip encapsulation assembly on the support substrate;
Fig. 2 is one group of upside figure that is formed on the working face of the chip encapsulation assembly on the support substrate;
Fig. 3 is the perspective view of chip encapsulation assembly and support substrate and adhesive tape and saw jig;
Fig. 4 is the cross-sectional view before cutting according to chip encapsulation assembly in Fig. 1 and support substrate;
Fig. 5 is the cross-sectional view after cutting according to chip encapsulation assembly in Fig. 1 and support substrate;
Fig. 6 is at the cross-sectional view after super-dry according to the chip encapsulation assembly in Fig. 1 and support substrate;
Fig. 7 is the cross-sectional view when heat energy is provided to adhesive tape according to chip encapsulation assembly in Fig. 1 and support substrate;
Fig. 8 is the cross-sectional view after chip encapsulation assembly and adhesive tape separate according to chip encapsulation assembly in Fig. 1 and support substrate.
The specific embodiment mode
With reference to the accompanying drawings, disclose a kind of according to the present invention instrument and the method for some embodiment, and be applied to the diced chip package assembling and enhance productivity.
Some have been proposed before this as the conventional process of cutting a core assembly sheet package assembling and enhancing productivity.Yet these conventional processes are used in the limitation that has occurred production quality and output on the less chip encapsulation assembly of cutting volume.Other conventional process need be separated it and chase or wafer by manual method because of the adhesive tape that uses, and has influenced production efficiency.
For asking clear brief, the present invention's explanation is limited in cutting and removes in the application of sticking chip encapsulation assembly.Yet this is not to get rid of the application of some embodiment of the present invention to other, as the chip encapsulation assembly of wafer chip level, needs the running performance classes like cutting and remove the sticking upward application of chip encapsulation assembly of base version that is formed on.The functional at all principle of the embodiment of the invention is identical to different embodiment.
The some embodiment of the present invention disclose as after, promptly a kind of instrument and method are as the diced chip package assembling and the purposes of separating this assembly and a slice adhesive tape.According to the 1st to 8 figure in detail embodiments of the invention are described in detail at this, wherein similar assembly is considered as similar reference number number.
The 1st figure shows a kind of chip encapsulation assembly flat board 100 of exemplary type.Be formed on array chip package assembling 102 typical cases on the support base version 104 as lead frame or ceramic base version.Every core assembly sheet package assembling 102 comprises the integrated circuit (ICs) of the array shape that is arranged in rows.This integrated circuit is sealed in the molding 106 of dull and stereotyped 100 1 molded side 108 of chip encapsulation assembly.Three groups of above chip encapsulation assemblies 102 are arranged on the support substrate 104 usually.The 2nd figure shows that the another side of chip encapsulation assembly flat board 100 is working faces 202, and the line 204 that is used for dividing each chip encapsulation assembly 102 is promptly arranged.Some examples of this assembly are ball grid array (BGA) package assemblings, quad flat non-pin (QFN) package assembling and miniature lead frame (MLP) package assembling.
The perspective view of the 3rd figure display chip package assembling flat board 100.This flat board has a core assembly sheet package assembling 102, a slice adhesive tape 302 and saw jig 304 that is formed on the support substrate 104.Saw jig 304 comprises one and comes down to rectangular chase 306.The middle body of this chase 306 has one group of vacuum cup 308.Each vacuum cup 308 comes down to the plane, and many close holes that are separated by are arranged.Vacuum cup 308 is preferably with rubber to be made.
The temperature that provides above predetermined heat energy to make adhesive tape 302 rises, and impels the miniature bladder of heat-swellable to spume, and causes the surface of adhesive tape 302 tiny ripple to occur.This has reduced the surface that is contacted between adhesive tape 302 and the molding 106 significantly.Afterwards, when the temperature of adhesive tape 302 rose to proper level, for example between 90 ℃ and 170 ℃, the adhesion strength between adhesive tape 302 and support base version 104 molded side 108 will be effectively by the place to go.Adhesive tape 302 is being pasted the dull and stereotyped 100 o'clock favourable needs of having removed any tension force from of chip encapsulation assembly.This is because when cutting one core assembly sheet package assembling 102, adhesive tape 302 can not enlarge.This guarantees that chip encapsulation assembly 102 can dislocation when cutting flow process.
The cross-sectional view of the 4th figure display chip package assembling flat board 100 before diced chip package assembling 102 on the cutting bed 400.Adhesive tape 302 and package assembling flat board 100 are to be placed on the saw jig 304, and adhesive tape 302 has direct the contact with vacuum cup 308.Vacuum cup 308 is to be placed on the upside of saw jig 304 rectangle chases 306.Saw jig 304 has many through holes 404, and this through hole has formed passage 406 together with relative vacuum cup 308 holes 404.The saw jig recess 408 of passage 406 straight-through saw jig 304 downsides 410.Saw jig 304 is mounted on the evacuated panel 412 that a slice has evacuated panel recess 414.The saw jig recess 408 of this evacuated panel recess coupling and reciprocity and drill jig 304 downsides 410, thus the cavity 416 of a sealing-in formed.
An intake section 418 of evacuated panel recess 414 is connected with a vacuum system (not shown).Vacuum system provides vacuum draw by passage 406, and when cutting one core assembly sheet package assembling 102, adhesive tape 302 and support substrate 104 is fixed on the saw jig 304.
After the 5th figure shows cutting one core assembly sheet package assembling 102, the cross-sectional view of chip encapsulation assembly flat board 100.When this core assembly sheet package assembling 102 of cutting, the vacuum draw that vacuum system provided is avoided adhesive tape 302 unnecessary movement.This core assembly sheet package assembling 102 is cut in the line 204 that cutting blade 502 is shining dull and stereotyped 100 working faces 202 of chip encapsulation assembly.When cutting was all passed through in the line 204 of all dull and stereotyped 100 working faces 202, this core assembly sheet package assembling 102 had just cut into other chip encapsulation assembly 504.The vacuum draw that adhesion strength and vacuum system provided between dull and stereotyped 100 molded side 108 of adhesive tape 302 and chip encapsulation assembly is enough to deal with the tangential stress that cutting blade 502 is produced when this core assembly sheet package assembling 102 of cutting.
The 6th figure shows this core assembly sheet package assembling 102 and the adhesive tape 302 after the cutting, is moved on the drying table 600 by a Moving Unit (not shown).Drying table 600 has evacuated panel 602 and the vacuum system similar in appearance to cutting bed 400 in fact, and chip encapsulation assembly 504 after cutting as handle and adhesive tape 302 are fixed on the usefulness on this drying table.When in a single day chip encapsulation assembly 504 after the cutting and adhesive tape 302 were fixed on the drying table 600, dry unit 604 with many jet pipes 606 just sprayed the chip encapsulation assembly 504 after dry gas 608 is dried up this cutting.Dry gas 608 be by individual other jet pipe 606 spray to each the cutting after chip encapsulation assembly 504.
After in a single day the 7th figure display chip package assembling 504 had been done, chip encapsulation assembly 504 after the cutting and adhesive tape 302 just moved to one by Moving Unit 702 and remove on the sticking platform 700, for this assembly 504 removes sticking.Moving Unit 702 has a vacuum head 704.This vacuum head is preferably the chip encapsulation assembly 504 that uses after vacuum is aspirated cutting.Remove sticking platform 700 and have in fact, as chip encapsulation assembly 504 after the cutting and adhesive tape 302 are fixed on this except that the usefulness on the sticking platform similar in appearance to the evacuated panel 706 and the vacuum system of cutting bed and drying table 400,600.
Remove on the evacuated panel 706 that glues platform 700 and settling a slice heating board 708.This heating board and vacuum system are got in touch with (not shown).Heating board 708 is also got in touch with a control unit 710 provides heat energy to adhesive tape 302.Moving Unit 702 then is placed on chip encapsulation assembly 504 after the cutting and adhesive tape 302 on the heating platform 708, and remains on this position.This makes that the chip encapsulation assembly 504 after the cutting is fixed on this heating platform when adhesive tape 302 is expanded because of heat energy.Just provide after the control unit 710 predetermined heat energy with adhesive tape 302 with cut after chip encapsulation assembly 504 between adhesion strength thoroughly remove.
The 8th figure shows that Moving Unit 702 is then put on the chip encapsulation assembly 504 after the cutting come from adhesive tape 302, and this assembly 504 is removed from removing sticking platform 700, proceeds ensuing flow process.Moving Unit 702 is removed adhesive tape 302 subsequently from removing sticking platform 700.This assembly 504 is from removing before sticking platform 700 removes, and vacuum system just provides vacuum draw, and adhesive tape 302 is fixed on the heating board 708.
In the preceding method, disclose and a kind ofly cut the chip encapsulation assembly that is formed on the base version, and can separate this assembly and the instrument that can be bonded at the adhesive tape on this assembly.This instrument can be enhanced productivity, and can be employed widely.Though the present invention only discloses some embodiment, the operator that links can make many changes and/or modification and not have category and spirit departing from the present invention in obvious this exposure.For example, the disclosed embodiment according to the present invention, heat answers adhesive tape that chip encapsulation assembly is fixed on other flow process platform, but this adhesive tape also can by the heat-sensitive glue adhesive tape or similarly adhesive tape replace, effectively chip encapsulation assembly is fixed on other flow process platform.
Claims (22)
- One kind as the separate chip package assembling with can glue the instrument that takes off the adhesive tape on this assembly, it is characterized in that, comprising:A Moving Unit is as usefulness fixing and the dislocation chip encapsulation assembly; And,A platform, this can dispose chip encapsulation assembly and adhesive tape, as fixing glue adhesive tape and the usefulness that provides heat energy to come the separate chip package assembling and can on chip encapsulation assembly, glue the adhesive tape that takes off,Wherein chip encapsulation assembly with can glue separating of the adhesive tape that takes off on this assembly; At first be adhesive tape to be fixed, and provide heat energy to lower to glue the adhesion strength of taking off the adhesive tape on this assembly by this; This fixes adhesive tape then, and Moving Unit is then fixed chip encapsulation assembly, and chip encapsulation assembly is come out from the adhesive tape dislocation.
- 2. instrument as claimed in claim 1 is characterized in that, wherein this platform provide heat energy as the separate chip package assembling with can glue the adhesive tape that takes off on this assembly the time, Moving Unit is then fixed chip encapsulation assembly.
- 3. instrument as claimed in claim 1 is characterized in that wherein this utilizes vacuum to fix adhesive tape.
- 4. instrument as claimed in claim 1 is characterized in that, wherein adhesive tape is sticking taking off on the molded side of chip encapsulation assembly.
- 5. instrument as claimed in claim 1 is characterized in that, comprises cutting bed usefulness as the diced chip package assembling before separate chip package assembling and adhesive tape again.
- 6. instrument as claimed in claim 5 is characterized in that, comprise again a drying table before separate chip package assembling and adhesive tape as drying up the usefulness of chip encapsulation assembly.
- 7. instrument as claimed in claim 1 is characterized in that, wherein Moving Unit is preferably and utilizes vacuum to fix chip encapsulation assembly.
- 8. instrument as claimed in claim 1 is characterized in that wherein the decreased extent of adhesive tape adhesion strength depends on the content of the heat energy that this provides.
- 9. instrument as claimed in claim 8 is characterized in that, wherein the content of heat energy is controlled by a control unit.
- 10. instrument as claimed in claim 1 is characterized in that, wherein adhesive tape can be shifted out from this by Moving Unit after separating with chip encapsulation assembly.
- 11. instrument as claimed in claim 1 is characterized in that, wherein this have one in fact plane surface as the usefulness that contacts with adhesive tape.
- 12. one kind as the separate chip package assembling with can glue the method for taking off the adhesive tape on this assembly, it is characterized in that method comprises step:The fixed chip package assembling;Provide heat energy as the adhesion strength that lowers adhesive tape, adhesive tape can glue on chip encapsulation assembly and take off;The fixing glue adhesive tape; AndThe process chip package assembling is as coming out this assembly from the adhesive tape dislocation,The step that wherein lowers the adhesive tape adhesion strength is before the process chip package assembling is as the step that chip encapsulation assembly is come out from the adhesive tape dislocation, and adhesive tape can glue and take off on chip encapsulation assembly.
- 13. step as claimed in claim 12 is characterized in that, also comprises step:Before separate chip package assembling and adhesive tape by a cutting bed diced chip package assembling.
- 14. step as claimed in claim 13 is characterized in that, wherein the step by cutting bed diced chip package assembling comprises the step of being dried up chip encapsulation assembly by a drying table again.
- 15. step as claimed in claim 12 is characterized in that, also comprises step:The process chip package assembling as this assembly after the adhesive tape dislocation comes out, utilize vacuum to fix and this adhesive tape of dislocation by a Moving Unit.
- 16. step as claimed in claim 12 is characterized in that, wherein the step of fixed chip package assembling comprises the step of aspirating chip encapsulation assembly by a vacuum Moving Unit.
- 17. step as claimed in claim 12 is characterized in that, wherein the step of fixing glue adhesive tape comprises and utilizes vacuum draw this adhesive tape to be fixed on the step of a slice heating board.
- 18. step as claimed in claim 17 is characterized in that, wherein heating board becomes fluid to be communicated with a vacuum system.
- 19. step as claimed in claim 12, it is characterized in that, wherein provide heat energy as the adhesion strength that lowers adhesive tape, adhesive tape can glue the step of taking off and comprise the step of heat energy to a slice heating board is provided that this heating board can be disposed adhesive tape and chip encapsulation assembly on this assembly.
- 20. step as claimed in claim 12 is characterized in that, wherein the process chip package assembling comprises the step of aspirating chip encapsulation assembly by a vacuum Moving Unit as the step that this assembly is come out from the adhesive tape dislocation.
- 21. step as claimed in claim 12 is characterized in that, wherein provides heat energy as the adhesion strength that lowers adhesive tape, adhesive tape can glue the step of taking off and depend on the content that this provides adhesive tape heat energy on chip encapsulation assembly.
- 22. step as claimed in claim 21 is characterized in that, wherein the content of heat energy is controlled by a control unit.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/SG2004/000346 WO2006043901A1 (en) | 2004-10-21 | 2004-10-21 | Singulating and de-tapping arrays of semiconductor packages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101084572A true CN101084572A (en) | 2007-12-05 |
Family
ID=36203230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004800445419A Pending CN101084572A (en) | 2004-10-21 | 2004-10-21 | Singulating and de-tapping arrays of semiconductor packages |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101084572A (en) |
| WO (1) | WO2006043901A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309916A (en) * | 2020-10-28 | 2021-02-02 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip splicing platform and chip splicing base plate leveling method |
| CN112850150A (en) * | 2021-02-26 | 2021-05-28 | 河南农业职业学院 | Multi-station pickup device for electronic part machining |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090047964A1 (en) | 2007-08-17 | 2009-02-19 | Qualcomm Incorporated | Handoff in ad-hoc mobile broadband networks |
| US9398453B2 (en) | 2007-08-17 | 2016-07-19 | Qualcomm Incorporated | Ad hoc service provider's ability to provide service for a wireless network |
| US9179367B2 (en) | 2009-05-26 | 2015-11-03 | Qualcomm Incorporated | Maximizing service provider utility in a heterogeneous wireless ad-hoc network |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4921564A (en) * | 1988-05-23 | 1990-05-01 | Semiconductor Equipment Corp. | Method and apparatus for removing circuit chips from wafer handling tape |
| JP3408894B2 (en) * | 1995-05-17 | 2003-05-19 | 日東電工株式会社 | Manufacturing method of semiconductor chip |
| JPH1167699A (en) * | 1997-08-13 | 1999-03-09 | Texas Instr Japan Ltd | Manufacture of semiconductor device |
-
2004
- 2004-10-21 WO PCT/SG2004/000346 patent/WO2006043901A1/en active Application Filing
- 2004-10-21 CN CNA2004800445419A patent/CN101084572A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309916A (en) * | 2020-10-28 | 2021-02-02 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip splicing platform and chip splicing base plate leveling method |
| CN112309916B (en) * | 2020-10-28 | 2024-01-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip splicing base plate leveling method |
| CN112850150A (en) * | 2021-02-26 | 2021-05-28 | 河南农业职业学院 | Multi-station pickup device for electronic part machining |
| CN112850150B (en) * | 2021-02-26 | 2022-09-09 | 河南农业职业学院 | Multi-station pickup device for electronic part machining |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006043901A1 (en) | 2006-04-27 |
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