CN101083163A - 抗外界静电冲击的高分子保护元件 - Google Patents
抗外界静电冲击的高分子保护元件 Download PDFInfo
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- CN101083163A CN101083163A CN 200710093840 CN200710093840A CN101083163A CN 101083163 A CN101083163 A CN 101083163A CN 200710093840 CN200710093840 CN 200710093840 CN 200710093840 A CN200710093840 A CN 200710093840A CN 101083163 A CN101083163 A CN 101083163A
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- 239000000463 material Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 186
- 229920005989 resin Polymers 0.000 claims description 177
- 239000011347 resin Substances 0.000 claims description 177
- 150000001875 compounds Chemical class 0.000 claims description 146
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 81
- 229910052751 metal Inorganic materials 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 70
- 229920002521 macromolecule Polymers 0.000 claims description 61
- 239000011889 copper foil Substances 0.000 claims description 41
- 229910052759 nickel Inorganic materials 0.000 claims description 38
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 238000012856 packing Methods 0.000 claims description 23
- 239000002344 surface layer Substances 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 18
- 238000002360 preparation method Methods 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 238000001723 curing Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011888 foil Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229920000728 polyester Polymers 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 238000011536 re-plating Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011231 conductive filler Substances 0.000 claims description 8
- 239000002002 slurry Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000005041 Mylar™ Substances 0.000 claims description 3
- 229920006361 Polyflon Polymers 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- 229920006231 aramid fiber Polymers 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 claims description 2
- 238000000016 photochemical curing Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract description 3
- 230000003068 static effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- NPURPEXKKDAKIH-UHFFFAOYSA-N iodoimino(oxo)methane Chemical compound IN=C=O NPURPEXKKDAKIH-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
Description
项目 | 环氧树脂 | 白炭黑 | 碳化硅 | 碳黑 | 镍粉 |
重量(克) | 100 | 2 | 40 | 3 | 60 |
Claims (35)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100938407A CN101083163B (zh) | 2007-05-29 | 2007-05-29 | 抗外界静电冲击的高分子保护元件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100938407A CN101083163B (zh) | 2007-05-29 | 2007-05-29 | 抗外界静电冲击的高分子保护元件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101083163A true CN101083163A (zh) | 2007-12-05 |
CN101083163B CN101083163B (zh) | 2010-09-22 |
Family
ID=38912627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100938407A Active CN101083163B (zh) | 2007-05-29 | 2007-05-29 | 抗外界静电冲击的高分子保护元件 |
Country Status (1)
Country | Link |
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CN (1) | CN101083163B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105575573A (zh) * | 2015-12-18 | 2016-05-11 | 深圳顺络电子股份有限公司 | 一种多层片式压敏电阻器及其制备方法 |
CN107705944A (zh) * | 2017-11-15 | 2018-02-16 | 江苏苏杭电子有限公司 | 高稳定性热敏电阻加工工艺 |
CN110565134A (zh) * | 2019-10-09 | 2019-12-13 | 深圳华络电子有限公司 | 一种电感器件的电极制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002359459A (ja) * | 2001-06-01 | 2002-12-13 | Nec Corp | 電子部品の実装方法、プリント配線基板および実装構造体 |
CN2586237Y (zh) * | 2002-12-10 | 2003-11-12 | 久尹股份有限公司 | 一种半导化陶瓷元件的封装结构 |
CN1588577A (zh) * | 2004-08-13 | 2005-03-02 | 上海维安热电材料股份有限公司 | 表面贴装型高分子复合电压敏感元件及其制造方法 |
-
2007
- 2007-05-29 CN CN2007100938407A patent/CN101083163B/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105575573A (zh) * | 2015-12-18 | 2016-05-11 | 深圳顺络电子股份有限公司 | 一种多层片式压敏电阻器及其制备方法 |
CN105575573B (zh) * | 2015-12-18 | 2017-12-01 | 深圳顺络电子股份有限公司 | 一种多层片式压敏电阻器及其制备方法 |
CN107705944A (zh) * | 2017-11-15 | 2018-02-16 | 江苏苏杭电子有限公司 | 高稳定性热敏电阻加工工艺 |
CN107705944B (zh) * | 2017-11-15 | 2019-03-05 | 昆山苏杭电路板有限公司 | 高稳定性热敏电阻加工工艺 |
CN110565134A (zh) * | 2019-10-09 | 2019-12-13 | 深圳华络电子有限公司 | 一种电感器件的电极制备方法 |
US11655554B2 (en) | 2019-10-09 | 2023-05-23 | Dongguan Hualuo Electronics Co., Ltd. | Method for preparing electrode of inductive component |
Also Published As
Publication number | Publication date |
---|---|
CN101083163B (zh) | 2010-09-22 |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20071205 Assignee: SHANGHAI KETER POLYMER MATERIAL Co.,Ltd. Assignor: SHANGHAI SHENWO ELECTRONICS CO.,LTD. Contract record no.: 2012310000119 Denomination of invention: Macromolecular protection element for preventing outside electrostatic impact Granted publication date: 20100922 License type: Exclusive License Record date: 20120723 |
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TR01 | Transfer of patent right |
Effective date of registration: 20240311 Address after: Block A, Building 1, No. 180 Chengye Road, Sheshan Town, Songjiang District, Shanghai, February 2016 Patentee after: SHANGHAI KETER NEW MATERIALS CO.,LTD. Country or region after: China Patentee after: SHANGHAI SHENWO ELECTRONICS CO.,LTD. Address before: 201108, No. 1165, Lane 123, Jin Du Road, Shanghai, Minhang District Patentee before: SHANGHAI SHENWO ELECTRONICS CO.,LTD. Country or region before: China |
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