CN101073865A - Production of phi-0.1 cored lead-free soldering wire - Google Patents
Production of phi-0.1 cored lead-free soldering wire Download PDFInfo
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- CN101073865A CN101073865A CN 200710023345 CN200710023345A CN101073865A CN 101073865 A CN101073865 A CN 101073865A CN 200710023345 CN200710023345 CN 200710023345 CN 200710023345 A CN200710023345 A CN 200710023345A CN 101073865 A CN101073865 A CN 101073865A
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Abstract
The invention is concerned with the manufacture method for core non-plumbum tin wire with 0.1mm diameter, it is: the alloy of tin, silver, copper and lanthanum, that the content is silver 0.1 - 4.0%, copper 0.2-2.2%, lanthanum 0.01-0.5%, and tin is surplus, and flux is extrusion to the core non-plumbum tin wire with 6.0mm - 12.0mm diameter by over 350 ton oil-hydraulic press, pulls the core non-plumbum tin wire with 6.0mm - 12.0mm diameter to core non-plumbum tin wire with 0.6mm diameter, uses crude diamond model allotype that is 66 moulds to pull to be the core non-plumbum tin wire with 0.1mm diameter, uses the mould under D group to pull for two hours then changes the mould that can be used by wash three times after changing by kerosene, cools 25 - 30 minutes for each pull wires then pull it again.
Description
Technical field
The present invention relates to a kind of production method that core leadless solder wire is arranged, belong to the welding material processing method.
Background technology
φ 0.1mm lead-free soldering wire is the welding material that is used for high elaboration electronic product, the particularly high high-precision electronic product welding of wiring density, not only fineness is little but also precision is high owing to this lead-free soldering wire, difficulty of processing is big, subject matter is that the little characteristic of wire drawing oil temperature and the high rigidity lengthening coefficient of tin silk of the wire drawing difficulty that matches is big, stick to the tin powder and the dirt of die hole and calibrating strap when particularly being pulled to less than 0.25mm, very easily cause fracture of wire, and can not guarantee to extend indeformable with common mould, the alternating current generator starting is not steady, change apart from big, precision is low, and speed is inhomogeneous during wire drawing, not steady, stressed not even vibrations of welding wire and cause fracture of wire, at present φ 0.1mm has that core leadless solder wire is domestic still not to have this product, relies on import substantially, and the price height.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of φ 0.1mm has the production method of core leadless solder wire, this production method is rationally feasible, and the φ 0.1mm that produces has the core leadless solder wire fineness little and precision is high, can satisfy the welding material demand of high elaboration electronic product.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of φ 0.1mm has the production method of core leadless solder wire, and it is undertaken by following step:
(a) by weight, with argentiferous 0.1～4.0%, cupric 0.2～2.2%, contain SAC lanthanum alloy that lanthanum 0.01～0.5% surplus is a tin and scaling powder and be squeezed into φ 6.0mm～φ 12.0mm core leadless solder wire is arranged with being not less than 350 tons of hydraulic presses, pressure is 160～220Kg/cm
2, room temperature is 95 ± 5 ℃ before the extruding, 65 ± 5 ℃ of back room temperatures go out 1.0～3.0 meters/minute of linear velocities;
(b) again φ 6.0mm～φ 12.0mm there is core leadless solder wire to carry out wire drawing and core leadless solder wire is arranged to φ 0.6mm with wire drawing machine, select the wire drawing oil of import during wire drawing for use, the wire drawing oil temperature is 50～80 ℃, again φ 0.6mm there is core leadless solder wire direct current generator wire drawing, adopt 8 groups to join mould with natural diamond mould and organize from A successively during wire drawing, the B group, the C group, the D group, the E group, the F group, the G group, totally 66 mould wire drawings of H group has core leadless solder wire to φ 0.1mm, standby mould is changed in the following mould wire drawing of D group after 2 hours, the mould of changing is reused after cleaning three times with kerosene again, after every group of wire drawing the cooling of tin silk was entered down the group wire drawing in 25～30 minutes again, the linear velocity that goes out of wire drawing is 250～550m/min, and every assembly nib and number of molds are:
The A group: φ 0.6mm～φ 0.5mm is totally 10 moulds;
The B group: φ 0.49mm～φ 0.41mm is totally 10 moulds;
The C group: φ 0.40mm～φ 0.31mm is totally 10 moulds;
The D group: φ 0.30mm～φ 0.25mm is totally 8 moulds;
The E group: φ 0.24mm～φ 0.20mm is totally 8 moulds;
The F group: φ 0.195mm～φ 0.16mm is totally 8 moulds;
The G group: φ 0.155mm～φ 0.125mm is totally 7 moulds;
The H group: φ 0.12mm～φ 0.10mm is totally 5 moulds.
Raw material of the present invention is the SAC lanthanum alloy, the leadless welding alloy of having applied for for my company.SAC lanthanum alloy and scaling powder are squeezed into φ 6.0mm～φ 12.0mm core leadless solder wire is arranged with being not less than 350 tons of hydraulic presses according to a conventional method, strictness is controlled out linear velocity 1.0～3.0 meters/minute and extrusion chamber temperature, room temperature is 95 ± 5 ℃ before the extruding, 65 ± 5 ℃ of back room temperatures, pressure are 160～220Kg/cm
3, can improve φ 6.0mm～φ 12.0mm has the compactness of core leadless solder wire structure, guarantees that welding wire surface is smooth, thus the production worker who guarantees in the back is for being difficult for causing fracture of wire and peeling in the preface.Strict control wire drawing oil temperature is at 50～80 ℃, when temperature is lower than 50 ℃, the hardness height of ashbury metal, lengthening coefficient is little, the alloy silk is fracture and its surface peeling just, cause and to operate, when temperature surpasses 80 ℃, make the creep point of ashbury metal near it, also to reduce its extension tensile strength, therefore must wire drawing under 50～80 ℃ of liquid temperature, the difficulty problem that the characteristic that the temperature that has solved wire drawing liquid and the high rigidity lengthening coefficient of tin silk are little matches, adopt the combination of grouping drawing-die, will cool off wire drawing continuously after every group of wire drawing, prevent frictional heating, tin silk tensile strength reduces easily broken.Adopt natural anvil stone mould during wire drawing, the precision height, sizing is accurate, extends indeformable; Adopt the direct current generator wire drawing, direct current generator than the alternating current generator starting steadily changes apart from little, the precision height, thus speed is evenly, steadily when guaranteeing wire drawing, has prevented owing to the stressed not even vibrations of welding wire cause disconnected; Changes standby mould after 2 hours in the mould wire drawing that D group is following, the mould of replacing is reused after cleaning three times with kerosene again, replaces the replacing cleaning with two molds, will stick to the tin powder and the dirt removal of die hole and calibrating strap, reduces and prevents fracture of wire.
The invention has the beneficial effects as follows:
(a) the φ 0.1mm of this method production has core leadless solder wire, can satisfy the high high-precision electronic product welding requirements of wiring density, exempts simultaneously and smear scaling powder again when welding on pad;
(b) production method of the present invention is rationally feasible, cost is low, the good product quality of producing, low price;
(c) adopt the direct current generator wire drawing, starting is steadily changeed apart from little, the precision height, thus speed is evenly, steadily when guaranteeing wire drawing, has prevented owing to the stressed not even vibrations of welding wire cause disconnected;
The product that this method is produced is through Ministry of Information Industry's proprietary material quality supervision and test center testing result:
The rate of spread: 81.2%
Resistivity (Ω .cm): 1.6 * 10
5
Solder joint stretching resistance (N): 189.5
It is that solder stick and element are welded on the pcb board spot size that the solder joint stretching resistance detects: 1.5mm, 1.0mm appears.
The specific embodiment
Embodiment 1
By weight, with argentiferous 0.1%, cupric 2.2%, to contain lanthanum 0.01% surplus tin be 97.69% SAC lanthanum alloy and scaling powder (the scaling powder consumption is by customer requirement) is squeezed into φ 6.0mm core leadless solder wire is arranged with being not less than 350 tons of hydraulic presses, pressure is 160Kg/cm
2, room temperature is 95 ± 5 ℃ before the extruding, 65 ± 5 ℃ of back room temperatures are controlled out 3.0 meters/minute of linear velocities; Again φ 6.0mm there is core leadless solder wire to carry out wire drawing and core leadless solder wire is arranged to φ 0.6mm with wire drawing machine, select the wire drawing oil of import for use, the wire drawing oil temperature is 50 ℃, again φ 0.6mm there is core leadless solder wire direct current generator wire drawing, adopt 8 groups to join mould with natural diamond mould and organize from A successively during wire drawing, the B group, the C group, the D group, the E group, the F group, the G group, totally 66 mould wire drawings of H group has core leadless solder wire to φ 0.1mm, standby mould is changed in the following mould wire drawing of D group after 2 hours, the mould of changing is reused after cleaning three times with kerosene again, after every group of wire drawing the cooling of tin silk was entered down the group wire drawing in 25 minutes again, the linear velocity that goes out of wire drawing is 250m/min, and every assembly nib and number of molds are:
The A group: φ 0.6mm～φ 0.5mm is totally 10 moulds;
The B group: φ 0.49mm～φ 0.41mm is totally 10 moulds;
The C group: φ 0.40mm～φ 0.31mm is totally 10 moulds;
The D group: φ 0.30mm～φ 0.25mm is totally 8 moulds;
The E group: φ 0.24mm～φ 0.20mm is totally 8 moulds;
The F group: φ 0.195mm～φ 0.16mm is totally 8 moulds;
The G group: φ 0.155mm～φ 0.125mm is totally 7 moulds;
The H group: φ 0.12mm～φ 0.10mm is totally 5 moulds.
Embodiment 2
By weight, with argentiferous 0.5%, cupric 1.5%, to contain lanthanum 0.05% surplus tin be 97.95% SAC lanthanum alloy and scaling powder is squeezed into φ 8.0mm core leadless solder wire is arranged with being not less than 350 tons of hydraulic presses, pressure is 180Kg/cm
2, room temperature is 95 ± 5 ℃ before the extruding, 65 ± 5 ℃ of back room temperatures are controlled out 2.0 meters/minute of linear velocities; Again φ 8.0mm there is core leadless solder wire to carry out wire drawing and core leadless solder wire is arranged to φ 0.6mm with wire drawing machine, select the wire drawing oil of import for use, the wire drawing oil temperature is 60 ℃, again φ 0.6mm there is core leadless solder wire direct current generator wire drawing, adopt 8 groups to join mould with natural diamond mould and organize from A successively during wire drawing, the B group, the C group, the D group, the E group, the F group, the G group, totally 66 mould wire drawings of H group has core leadless solder wire to φ 0.1mm, standby mould is changed in the following mould wire drawing of D group after 2 hours, the mould of changing is reused after cleaning three times with kerosene again, after every group of wire drawing the cooling of tin silk was entered down the group wire drawing in 30 minutes again, the linear velocity that goes out of wire drawing is 350m/min, and every assembly nib and number of molds are with embodiment 1.
Embodiment 3
By weight, with argentiferous 1.0%, cupric 1.0%, to contain lanthanum 0.1% surplus tin be 97.9% SAC lanthanum alloy and scaling powder is squeezed into φ 10.0mm core leadless solder wire is arranged with being not less than 350 tons of hydraulic presses, pressure is 200Kg/cm
2, room temperature is 95 ± 5 ℃ before the extruding, 65 ± 5 ℃ of back room temperatures are controlled out 1.5 meters/minute of linear velocities; Again φ 10.0mm there is core leadless solder wire to carry out wire drawing and core leadless solder wire is arranged to φ 0.6mm with wire drawing machine, select the wire drawing oil of import for use, the wire drawing oil temperature is 70 ℃, again φ 0.6mm there is core leadless solder wire direct current generator wire drawing, adopt 8 groups to join mould with natural diamond mould and organize from A successively during wire drawing, the B group, the C group, the D group, the E group, the F group, the G group, totally 66 mould wire drawings of H group has core leadless solder wire to φ 0.1mm, standby mould is changed in the following mould wire drawing of D group after 2 hours, the mould of changing is reused after cleaning three times with kerosene again, after every group of wire drawing the cooling of tin silk was entered down the group wire drawing in 25 minutes again, the linear velocity that goes out of wire drawing is 450m/min, and every assembly nib and number of molds are with on the embodiment.
Embodiment 4
By weight, with argentiferous 3.0%, cupric 0.5%, to contain lanthanum 0.2% surplus tin be 96.3% SAC lanthanum alloy and scaling powder is squeezed into φ 12.0mm core leadless solder wire is arranged with being not less than 350 tons of hydraulic presses, pressure is 220Kg/cm
2, room temperature is 95 ± 5 ℃ before the extruding, 65 ± 5 ℃ of back room temperatures are controlled out 1.0 meters/minute of linear velocities; Again 12.0mm there is core leadless solder wire to carry out wire drawing and core leadless solder wire is arranged to φ 0.6mm with wire drawing machine, select the wire drawing oil of import for use, the wire drawing oil temperature is 80 ℃, again φ 0.6mm there is core leadless solder wire direct current generator wire drawing, adopt 8 groups to join mould with natural diamond mould and organize from A successively during wire drawing, the B group, the C group, the D group, the E group, the F group, the G group, totally 66 mould wire drawings of H group has core leadless solder wire to φ 0.1mm, standby mould is changed in the following mould wire drawing of D group after 2 hours, the mould of changing is reused after cleaning three times with kerosene again, after every group of wire drawing the cooling of tin silk was entered down the group wire drawing in 30 minutes again, the linear velocity that goes out of wire drawing is 550m/min, and every assembly nib and number of molds are with embodiment 1.
Embodiment 5
By weight, with argentiferous 5.0%, cupric 0.2%, to contain lanthanum 0.5% surplus tin be 94.3% SAC lanthanum alloy and scaling powder is squeezed into φ 8.0mm and core leadless solder wire is arranged, as follows embodiment 1 or 2 with being not less than 350 tons of hydraulic presses.
Claims (1)
1. a φ 0.1mm has the production method of core leadless solder wire, it is characterized in that: undertaken by following step:
(a) by weight, with argentiferous 0.1～4.0%, cupric 0.2～2.2%, contain SAC lanthanum alloy that lanthanum 0.01～0.5% surplus is a tin and scaling powder and be squeezed into φ 6.0mm～φ 12.0mm core leadless solder wire is arranged with being not less than 350 tons of hydraulic presses, pressure is 160～220K g/cm
2, room temperature is 95 ± 5 ℃ before the extruding, 65 ± 5 ℃ of back room temperatures go out 1.0～3.0 meters/minute of linear velocities;
(b) again φ 6.0mm～φ 12.0mm there is core leadless solder wire to carry out wire drawing and core leadless solder wire is arranged to φ 0.6mm with wire drawing machine, use wire drawing oil during wire drawing, the wire drawing oil temperature is 50～80 ℃, again φ 0.6mm there is core leadless solder wire direct current generator wire drawing, adopt 8 groups to join mould with natural diamond mould and organize from A successively during wire drawing, the B group, the C group, the D group, the E group, the F group, the G group, totally 66 mould wire drawings of H group has core leadless solder wire to φ 0.1mm, standby mould is changed in the following mould wire drawing of D group after 2 hours, the mould of changing is reused after cleaning three times with kerosene again, after every group of wire drawing the cooling of tin silk was entered down the group wire drawing in 25～30 minutes again, the linear velocity that goes out of wire drawing is 250～550m/min, and every assembly nib and number of molds are:
The A group: φ 0.6mm～φ 0.5mm is totally 10 moulds;
The B group: φ 0.49mm～φ 0.41mm is totally 10 moulds;
The C group: φ 0.40mm～φ 0.31mm is totally 10 moulds;
The D group: φ 0.30mm～φ 0.25mm is totally 8 moulds;
The E group: φ 0.24mm～φ 0.20mm is totally 8 moulds;
The F group: φ 0.195mm～φ 0.16mm is totally 8 moulds;
The G group: φ 0.155mm～φ 0.125mm is totally 7 moulds;
The H group: φ 0.12mm～φ 0.10mm is totally 5 moulds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100233459A CN100464933C (en) | 2007-06-09 | 2007-06-09 | Production of phi-0.1 cored lead-free soldering wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100233459A CN100464933C (en) | 2007-06-09 | 2007-06-09 | Production of phi-0.1 cored lead-free soldering wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101073865A true CN101073865A (en) | 2007-11-21 |
| CN100464933C CN100464933C (en) | 2009-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007100233459A Expired - Fee Related CN100464933C (en) | 2007-06-09 | 2007-06-09 | Production of phi-0.1 cored lead-free soldering wire |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500961A (en) * | 2011-12-09 | 2012-06-20 | 广西泰星电子焊接材料有限公司 | Process for improving content stability of soldering flux for solder, and device for vertically injecting soldering flux for solder |
| CN102528335A (en) * | 2010-12-16 | 2012-07-04 | 北京有色金属研究总院 | Preparation method of hardly drawn alloy tin wire and application thereof |
| CN102553960A (en) * | 2011-12-13 | 2012-07-11 | 浙江亚通焊材有限公司 | Preparation method for tin-bismuth series alloy temperature fuse material with high plasticity |
| CN103358056A (en) * | 2013-06-22 | 2013-10-23 | 宁波市鄞州品达电器焊料有限公司 | Method for manufacturing lead-free solder wire |
| CN106312376A (en) * | 2015-06-26 | 2017-01-11 | 云南锡业集团有限责任公司研究设计院 | Method for producing ultra-fine tin wire |
| CN107607249A (en) * | 2017-09-06 | 2018-01-19 | 马鞍山市奈特仪表科技有限公司 | A kind of low temperature refrigerant pressure gauge and its production method |
| CN108941967A (en) * | 2018-08-09 | 2018-12-07 | 重庆源晶电子材料有限公司 | A kind of low temperature has core solder stick and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ZA801080B (en) * | 1979-03-13 | 1981-03-25 | Bekaert Sa Nv | Welding electrode |
| JPH0246939A (en) * | 1988-08-03 | 1990-02-16 | Sumitomo Metal Ind Ltd | Manufacture of conjugated wire material |
| JP2000158185A (en) * | 1998-11-26 | 2000-06-13 | Nippon Welding Rod Kk | Manufacture of welding wire |
| CN100348362C (en) * | 2005-05-11 | 2007-11-14 | 昆山成利焊锡制造有限公司 | Method for producing lead-free in wire of three cores in diameter 0.25 mm |
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2007
- 2007-06-09 CN CNB2007100233459A patent/CN100464933C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528335A (en) * | 2010-12-16 | 2012-07-04 | 北京有色金属研究总院 | Preparation method of hardly drawn alloy tin wire and application thereof |
| CN102528335B (en) * | 2010-12-16 | 2014-08-27 | 北京有色金属研究总院 | Preparation method of hardly drawn alloy tin wire and application thereof |
| CN102500961A (en) * | 2011-12-09 | 2012-06-20 | 广西泰星电子焊接材料有限公司 | Process for improving content stability of soldering flux for solder, and device for vertically injecting soldering flux for solder |
| CN102553960A (en) * | 2011-12-13 | 2012-07-11 | 浙江亚通焊材有限公司 | Preparation method for tin-bismuth series alloy temperature fuse material with high plasticity |
| CN102553960B (en) * | 2011-12-13 | 2014-01-22 | 浙江亚通焊材有限公司 | Preparation method for tin-bismuth series alloy temperature fuse material with high plasticity |
| CN103358056A (en) * | 2013-06-22 | 2013-10-23 | 宁波市鄞州品达电器焊料有限公司 | Method for manufacturing lead-free solder wire |
| CN106312376A (en) * | 2015-06-26 | 2017-01-11 | 云南锡业集团有限责任公司研究设计院 | Method for producing ultra-fine tin wire |
| CN106312376B (en) * | 2015-06-26 | 2019-11-15 | 云南锡业集团有限责任公司研究设计院 | A method of producing ultra-fine solder stick |
| CN107607249A (en) * | 2017-09-06 | 2018-01-19 | 马鞍山市奈特仪表科技有限公司 | A kind of low temperature refrigerant pressure gauge and its production method |
| CN108941967A (en) * | 2018-08-09 | 2018-12-07 | 重庆源晶电子材料有限公司 | A kind of low temperature has core solder stick and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN100464933C (en) | 2009-03-04 |
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