CN103358056A - Method for manufacturing lead-free solder wire - Google Patents

Abstract

The invention discloses a method for manufacturing lead-free solder wire, and relates to the technical field of solder wires. The method comprises the following manufacturing process: weighing raw materials according to a certain proportion, melting the proportioned raw materials in a tin smelting furnace, stirring uniformly for 20-30 minutes, and adding soldering flux; manufacturing a uniformly stirred solution into a billet bar; extruding the billet bar by using an extruding machine to obtain a coarse solder wire; performing near-net-shape shaping rolling and fine drawing on the coarse solder wire to obtain a finished solder wire; soaking the finished solder wire into a solution with a luminescent property for 30-60 minutes to produce an anti-counterfeiting mark; drying the soaked solder tine wire, and wrapping the outer surface of the solder tine wire with a film; winding, packaging and warehousing the solder strip. The method is simple in manufacturing process; by the method, the production time is shortened, the cost is saved, and the anti-counterfeiting mark can be obtained.

Description

A kind of preparation method of lead-free soldering wire

Technical field:

The present invention relates to the solder stick technical field, be specifically related to a kind of preparation method of lead-free soldering wire.

Background technology:

Along with electronics and electric equipment products constantly to miniaturization, lightweight, low energy consumption future development, require the employed material should be more and more light, simultaneously requirement must have good combination property.Although copper has good electric conductivity, thermal conductivity, corrosion resistance and good mechanical property, be widely used in various industrial circles and along with developing rapidly of economy demand increasing, but it is few in natural reserves, and exploitation and processing cost are high.Therefore, for a long time, people wish close in some industrial circle employing performance always and contain abundant light metal instead of copper.Aluminium and alloy thereof have that density is little, quality is light, heat conduction and electric conductivity good (being only second to Ag, Cu, Au), good corrosion resistance, low cost and other advantages, become undoubtedly the best replacer of copper.In industries such as automobile, naval vessel, Aero-Space, buildings, the application of aluminium and aluminium alloy is very extensively with ripe.Along with the copper price continues to rise, also more and more receive publicity for copper with aluminium in the Electronic Packaging field.

Its manufacturing process of existing solder stick is complicated, and the production time is long, and the solder stick time grown easily and made moist, use inconvenience.

Summary of the invention:

The preparation method that the purpose of this invention is to provide a kind of lead-free soldering wire, its manufacture craft is simple, has shortened the production time, saves cost, and has anti-fake mark.

In order to solve the existing problem of background technology, the present invention adopts following technical scheme:

Its fabrication processing is:

(1), according to proportional quantity raw material is carried out counterweight, then the raw material that counterweight is good is put into the fusing of tin metallurgy stove and is stirred, and its mixing time is 20-30 minute, and adds scaling powder;

(2), the solution that stirs is made excellent base;

(3), adopt extruder that excellent base is pushed, obtain thick tin silk;

(4), thick tin silk is carried out newly net forming rolling and small drawing, obtain the finished product solder stick;

(5), with finished product scolding tin trichocyst in the solution of the characteristics of luminescence, its soak time is 30-60 minute, makes anti-fake mark;

(6), the oven dry of the solder stick after will soaking, then at the outer surface stretch wrap film of soldering tin bar;

(7), soldering tin bar is twined, packs and puts in storage.

Described raw material comprises tin 96-97%, copper 2-3%, silver-colored 0.5-1% according to the quality percentage.

The present invention has following beneficial effect: manufacture craft is simple, has shortened the production time, saves cost, and has anti-fake mark.

The specific embodiment:

This specific embodiment adopts following technical scheme: its fabrication processing is:

(1), according to proportional quantity raw material is carried out counterweight, then the raw material that counterweight is good is put into the fusing of tin metallurgy stove and is stirred, and its mixing time is 20-30 minute, and adds scaling powder;

(2), the solution that stirs is made excellent base;

(3), adopt extruder that excellent base is pushed, obtain thick tin silk;

(4), thick tin silk is carried out newly net forming rolling and small drawing, obtain the finished product solder stick;

(5), with finished product scolding tin trichocyst in the solution of the characteristics of luminescence, its soak time is 30-60 minute, makes anti-fake mark;

(6), the oven dry of the solder stick after will soaking, then at the outer surface stretch wrap film of soldering tin bar;

(7), soldering tin bar is twined, packs and puts in storage.

Described raw material comprises tin 96-97%, copper 2-3%, silver-colored 0.5-1% according to the quality percentage.

This specific embodiment has following beneficial effect: manufacture craft is simple, has shortened the production time, saves cost, and has anti-fake mark.

Claims (1)

1. the preparation method of a lead-free soldering wire is characterized in that its fabrication processing is:

(1), according to proportional quantity raw material is carried out counterweight, then the raw material that counterweight is good is put into the fusing of tin metallurgy stove and is stirred, and its mixing time is 20-30 minute, and adds scaling powder;

(2), the solution that stirs is made excellent base;

(3), adopt extruder that excellent base is pushed, obtain thick tin silk;

(4), thick tin silk is carried out newly net forming rolling and small drawing, obtain the finished product solder stick;

(5), with finished product scolding tin trichocyst in the solution of the characteristics of luminescence, its soak time is 30-60 minute, makes anti-fake mark;

(6), the oven dry of the solder stick after will soaking, then at the outer surface stretch wrap film of soldering tin bar;

(7), soldering tin bar is twined, packs and puts in storage.