CN101073296A - Interposer bonding device - Google Patents
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- CN101073296A CN101073296A CNA2005800416497A CN200580041649A CN101073296A CN 101073296 A CN101073296 A CN 101073296A CN A2005800416497 A CNA2005800416497 A CN A2005800416497A CN 200580041649 A CN200580041649 A CN 200580041649A CN 101073296 A CN101073296 A CN 101073296A
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Abstract
An interposer bonding device (3) for bonding an interposer (10) having an interposer side terminal to a base circuit sheet (20) which is provided with a base side terminal. The interposer bonding device (3) comprises a press anvil (31) for holding the base circuit sheet (20) on which the interposer (10) is placed, and a bonding head (32) arranged to move relative to the press anvil (31). The bonding head (32) has a surface (320) which comes in contact with the rear surface of the interposer for applying a pressure thereto wherein the pressing surface (320) is arranged to scan the rear surface of the interposer (10) through relative motion of the bonding head (32) to the press anvil (31) and to press the entire surface of an interposer side terminal (12) against the base circuit sheet (20).
Description
Technical field
The present invention relates to the manufacturing installation of a kind of interpolater (interposer) that is used for to semiconductor chip to be installed and base circuit board (base circuit sheet) electronic component bonded.
Background technology
In the past, there were a kind of folded RF-ID medium that are engaged in antenna plate of interposer layers that for example the IC chip are installed on resin film.When making this RF-ID medium, for example folder is established binding agent sometimes and stacked interpolater and antenna plate pressurizeed along its stacked direction.Like this, as the interposer bonding device that is used for interpolater and antenna plate are pressurizeed and engaged, for example constitute configuration interpolater and antenna plate in the gap of mutual opposed a pair of stamping die, then, make above-mentioned gap diminishingly pressurize, engage (for example with reference to patent documentation 1).
But, in the coupling device of above-mentioned existing interpolater, exist following problems.That is, in above-mentioned coupling device, need implement in turn with processing component be disposed at the step of stamping die, the step of pressurizeing by stamping die and the step of taking out fabricated product, therefore, exist the problem that might fully improve its production efficiency.
Patent documentation 1: the spy opens the 2003-283120 communique
Summary of the invention
The present invention proposes in view of above-mentioned existing problem points, and its purpose is, a kind of coupling device that has improved the interpolater of production efficiency is provided.
The invention provides a kind of interposer bonding device, it is used for interpolater is engaged with base circuit board, above-mentioned interpolater is installed semiconductor chip and is constituted on tabular chip retaining member, and have from this semiconductor chip and extend the interpolater side terminal that is provided with as splicing ear, above-mentioned base circuit board is made of tabular basal component, be provided with the base side terminal on its surface, above-mentioned interposer bonding device is characterised in that
Have: under above-mentioned interpolater side terminal and the opposed state of above-mentioned base side terminal, the punching press anvil that the above-mentioned base circuit board of stacked above-mentioned interpolater is kept; With
Relatively this punching press anvil carries out relative motion and the engagement head that constitutes,
Above-mentioned engagement head has the pressure surface that adds that the back side butt that forms with above-mentioned interpolater or above-mentioned base circuit board pressurizes, this adds pressure surface and scans the back side of above-mentioned interpolater or above-mentioned base circuit board according to the relative motion of the above-mentioned relatively punching press anvil of above-mentioned engagement head, pressurize whole of above-mentioned interpolater side terminal of above-mentioned relatively base circuit board.
Interposer bonding device of the present invention engages above-mentioned interpolater and above-mentioned base circuit board by above-mentioned engagement head with the relative motion of above-mentioned punching press anvil.That is, in this interposer bonding device, applied in a flexible way the energetically above-mentioned interpolater that remains in above-mentioned punching press anvil and above-mentioned base circuit board, with the relative motion of above-mentioned engagement head.
Therefore, in interposer bonding device of the present invention, the step that for example can implement the conveyance processing component simultaneously, supply with to above-mentioned engagement head; With the step that engages above-mentioned interpolater by the engagement head pressurization, and, on one side can implement to engage the step of above-mentioned interpolater by the engagement head pressurization, Yi Bian take out the above-mentioned electronic unit after the processing.Therefore, according to above-mentioned interposer bonding device, can be continuously, efficient implements the processing of above-mentioned electronic unit capitally.
Description of drawings
Fig. 1 is the key diagram that the joint operation to the interposer bonding device among the embodiment 1 describes.
Fig. 2 is the stereogram of the RF-ID medium among the expression embodiment 1.
Fig. 3 is the end view of the interposer bonding device among the embodiment 1.
Fig. 4 is the cutaway view (the A-A alignment among Fig. 3 is looked cutaway view) of the interposer bonding device among the expression embodiment 1.
Fig. 5 is the stereogram of the continuous antenna plate among the expression embodiment 1.
The cutaway view (the B-B alignment among Fig. 5 is looked cutaway view) of the cross-sectional configuration of the continuous antenna plate of Fig. 6 is the configuration of expression among the embodiment 1 interpolater.
Fig. 7 is to supplying with the key diagram that the state of continuous antenna plate describes to interposer bonding device among the embodiment 1.
Fig. 8 is the cutaway view (with the cutaway view of the axle center quadrature of punching press anvil) of the cross-sectional configuration after the joint operation of expression among the embodiment 1.
Fig. 9 is the cutaway view (cutaway view that comprises the axle center of punching press anvil) of the cross-sectional configuration after the joint operation of representing among the embodiment 1.
Figure 10 is the cutaway view of the outstanding shape of other protuberances among the expression embodiment 1.
Figure 11 is the end view of the interposer bonding device among the embodiment 2.
Figure 12 is the stereogram that the pressing position of the engagement head among the embodiment 2 is expected.
Figure 13 is the cutaway view (the E-E alignment among Figure 11 is looked cutaway view) in the cross section of the punching press anvil among the expression embodiment 2.
Figure 14 is the front view (F among Figure 13 is to view) of the outer peripheral face of the punching press anvil among the expression embodiment 2.
Figure 15 is the stereogram (G among Figure 14 is to view) of the protuberance among the expression embodiment 2.
Figure 16 is the end view of other interposer bonding devices among the embodiment 2.
Among the figure: 1-electronic unit (RF-ID medium), 10-interpolater, 11-semiconductor chip (IC chip), 12-interpolater side terminal, 13-chip retaining member, 20-base circuit board (antenna plate), the 21-basal component, 22-base side terminal, 24-antenna pattern, 220-gives prominence to variant part, 25-binding agent configuration layer, 3-interposer bonding device, 31-punching press anvil (press anvil), 310-convexes into portion, the 311-protuberance, the 32-engagement head, 320-adds pressure surface.
Embodiment
Among the present invention, said chip retaining member and above-mentioned basal component can pass through synthetic resin such as PET film, PPS resin, PLA resin, general engineering plastic, paper, and nonwoven fabrics, metal materials such as aluminium foil, Copper Foil, or material such as glass forms.Wherein, the material of said chip retaining member and the material of above-mentioned basal component can be the combinations of same material, also can be combinations of different materials.
And preferred above-mentioned basal component is made of the plastic resin material, and above-mentioned punching press anvil comprises that by setting the portion of convexing into of protuberance constitutes, and wherein, protuberance is outstanding towards the part in the zone, the back side of the above-mentioned base side terminal of above-mentioned base circuit board.
Under this situation, make the easily outstanding distortion of a part of the above-mentioned base side terminal that constitutes by above-mentioned plastic resin material by the effect of above-mentioned protuberance.And, can make its outstanding front end be crimped on above-mentioned interpolater side terminal.Therefore, further being electrically connected of above-mentioned interpolater and above-mentioned base circuit board realized on high reliability ground, thereby can improve the durability of above-mentioned electronic unit.
Wherein, can utilize PS, PC, PA, PP, PPE materials such as (PET) as above-mentioned plastic material.
In addition, by in above-mentioned interpolater and the opposed gap that forms of above-mentioned base circuit board, the binding agent that disposes in the gap of above-mentioned at least interpolater side terminal and above-mentioned base side terminal, engage above-mentioned interpolater and above-mentioned base circuit board, above-mentioned binding agent preferably has the insulating properties binding agent of electrical insulating property.
Under this situation, can be from the formation the above-mentioned base side terminal between the outstanding crushed element and above-mentioned interpolater side terminal of above-mentioned protuberance, flow out above-mentioned insulating properties binding agent energetically, make interpolater side terminal and the direct butt of base side terminal.And, thus can the reliability highland realize the electrical connection of base side terminal and interpolater side terminal.On the other hand, at the non-ledge of above-mentioned base side terminal, with the gap of above-mentioned interpolater side terminal in the residual above-mentioned insulating properties binding agent in former state ground.Therefore, the adhesive joint power of the insulating properties binding agent by this under residual can the reliability highland realizes the physical connection of interpolater side terminal and base side terminal, i.e. adhesive joint.
Wherein, as above-mentioned insulating properties binding agent, can adopt hot-melt adhesive, epoxy is binding agent, acrylic acid series binding agent, elastic binder etc.
And, as above-mentioned insulating properties binding agent, preferably adopt thermoplastic binding agent, and, also preferably at least one side of above-mentioned punching press anvil or above-mentioned engagement head, assemble heater.Under this situation,, can improve its flowability by thermoplastic insulating properties binding agent is heated.Thus, can flow out above-mentioned insulating properties binding agent, thereby can reliability realize the status of electrically connecting of the two well from the part reliability highland that above-mentioned interpolater side terminal and above-mentioned base side terminal directly contact.And,, then can make the two thermo-compressed if the contact site of above-mentioned outstanding crushed element and above-mentioned interpolater side terminal is heated.By thermo-compressed, can make the engagement state at the position that interpolater side terminal and base side terminal directly contact better.Therefore, the status of electrically connecting between interpolater side terminal and the base side terminal becomes more reliable, can keep to high reliability its good connection status in long-term use.
And,, also can use the moisture-curable binding agent that in atmosphere, promotes the response type of curing as above-mentioned insulating properties binding agent.Under this situation, will implement, during for example taking care of under the environment within doors in factory or warehouse etc., can promote the curing of above-mentioned insulating properties binding agent based on the above-mentioned electronic unit after the processing of above-mentioned interposer bonding device.Therefore, can make the engagement state of the above-mentioned interpolater in the above-mentioned electronic unit better.
In addition, also can apply above-mentioned insulating properties binding agent to above-mentioned base circuit board according to whole opposed mode with above-mentioned interpolater, then, pressurization engages above-mentioned interpolater and above-mentioned base circuit board.Under this situation,, can improve the bond strength of above-mentioned interpolater by at the above-mentioned insulating properties binding agent of the whole surface attachment of above-mentioned interpolater.And in these cases, when above-mentioned interpolater of pressurization and above-mentioned base circuit board, remaining insulating properties binding agent can make a circulation to be attached to the circumferential lateral surface of interpolater.Thus, between the surface of the circumferential lateral surface of interpolater and base circuit board, can form the inclined plane that constitutes by the insulating properties binding agent.Therefore, except the interpolater surface, also, can further engage interpolater securely by being attached to the insulating properties binding agent of its circumferential lateral surface.
And preferred above-mentioned engagement head constitutes above-mentioned interpolater effect ultrasonic vibration.
Under this situation, the position effect ultrasonic vibration by above-mentioned interpolater side terminal and above-mentioned base side terminal are directly contacted can make interpolater side terminal and the welding of base side terminal.And, engage by this ultrasonic wave, can further improve the reliability of electrical connection between interpolater side terminal and the base side terminal, thereby can improve its durability more.
In addition, preferred above-mentioned punching press anvil is approximately cylindrical shape, keeps above-mentioned base circuit board at its outer surface, and is that the center is rotated with the axle center of above-mentioned approximately cylindrical shape,
Above-mentioned engagement head is utilized the rotation of above-mentioned punching press anvil, and above-mentioned relatively interpolater carries out relative motion.
Under this situation, on one side can make the above-mentioned punching press anvil rotation that has kept above-mentioned base circuit board, Yi Bian engage above-mentioned base circuit board and above-mentioned interpolater.That is, do not keep the above-mentioned punching press anvil of above-mentioned base circuit board static, so the above-mentioned base circuit board of conveyance is on one side implemented processing on one side continuously owing to do not need to make.
And the above-mentioned pressure surface that adds of preferred above-mentioned engagement head is the curved concave shape corresponding with the outer peripheral face of above-mentioned punching press anvil, and forms whole of the above-mentioned base side terminal that can pressurize simultaneously.
Under this situation, the back side of above-mentioned interpolater or above-mentioned base circuit board is being scanned, in the process of above-mentioned relatively base circuit board to whole pressurization of above-mentioned interpolater side terminal, whole of the above-mentioned interpolater side terminal that can pressurize simultaneously.Therefore, can reliability more engage above-mentioned interpolater side terminal in the highland.
In addition, preferred above-mentioned interpolater is according to have a pair of above-mentioned interpolater side terminal across the opposed mode of above-mentioned semiconductor chip, above-mentioned punching press anvil along above-mentioned axle center away from two positions have the above-mentioned portion that convexes into, and, keep above-mentioned base circuit board under portion and the opposed state of above-mentioned base side terminal above-mentioned respectively convexing into.
Under this situation, the above-mentioned above-mentioned protuberance that convexes into portion is little to the possibility of the excessive load of the above-mentioned semiconductor chip effect of above-mentioned interpolater.Therefore, can suppress the primary fault of above-mentioned electronic unit, make the high goods of quality.
And, preferably respectively convex in the portion above-mentioned, be provided with above-mentioned protuberance along the Zhou Fangxiang of above-mentioned punching press anvil, this protuberance forms the front reduced cross-sectional area towards projected direction.
Under this situation,, can reliability more engage above-mentioned interpolater side terminal in the highland by the above-mentioned protuberance of inswept shape.
And preferred above-mentioned punching press anvil disposes the above-mentioned portion that respectively convexes on the whole outer peripheral face of this punching press anvil, can implement the joint of a plurality of above-mentioned interpolaters continuously.
Under this situation, the joint of a plurality of above-mentioned interpolaters can be implemented continuously, thereby above-mentioned electronic unit can be made more efficiently.
In addition, preferred above-mentioned semiconductor chip is the IC chip that the RF-ID medium are used, and above-mentioned base circuit board is provided with the antenna pattern that is electrically connected with above-mentioned IC chip.
Here, RF-ID is the abbreviation of Radio-Frequency IDentification.And, adopting interposer bonding device of the present invention to make under the situation of RF-ID medium, extremely efficiently the goods of fabrication reliability height and excellent quality.Especially because the RF-ID medium require cost degradation, so the action effect of the interposer bonding device of the present invention of formation efficiency excellence is effective especially.In addition, also can use this interposer bonding device to make the ID medium that contact ID uses.
Embodiment
(embodiment 1)
This example is the example that interpolater 10 and base circuit board 20 has been carried out the interposer bonding device 3 of electronic component bonded 1 about being used to make.With reference to Fig. 1～Fig. 9 this content is described.
This routine interposer bonding device 3 as depicted in figs. 1 and 2, be a kind of being used for will be on the tabular chip retaining member 13 semiconductor chip 11 is installed and is constituted and have and extend the interpolater 10 that is provided with, the equipment that engages with the base circuit board 20 that constitutes, is provided with base side terminal 22 by tabular basal component 21 on its surface as the interpolater side terminal 12 of splicing ear from this semiconductor chip 11.
This interposer bonding device 3 has: under interpolater side terminal 12 and base side terminal 22 opposed states, and the punching press anvil 31 that the base circuit board 20 of stacked interpolater 10 is kept; With constitute the engagement head 32 that relative punching press anvil 31 carries out relative motion.
Here, this engagement head 32 has the pressure surface 320 that adds that forms according to the mode with the back side butt of interpolater 10 and forms, this adds pressure surface 320 and constitutes: according to the back side of the relative motion of engagement head 32 relative punching press anvils 31 scanning interpolater 10, and whole of base circuit board 20 pressurization interpolater side terminals 12 at least relatively.
Below, this content is elaborated.
At first, the electronic unit 1 of Zhi Zuoing is RF-ID (Radio-Frequency IDentification) medium (the following RF-ID medium 1 that suitably are recited as) that noncontact ID uses as shown in Figure 2 in this example.These RF-ID medium 1 will have been installed the interpolater 10 of the IC chip that RF-ID uses (the following IC chip 11 that suitably is recited as) and carry out stacked joint as the antenna plate (the following antenna plate 20 that suitably is recited as) that above-mentioned base circuit board 20 is provided with antenna pattern 24 and form as semiconductor chip 11.
As shown in Figure 2, interpolater 10 be in the mounted on surface of the tabular chip retaining member 13 of the thickness 200 μ m that constitute by PSF the member of IC chip 11.On the surface of this chip retaining member 13, be provided with conductive welding spots (omitting diagram) that is electrically connected with the electrode pads (omitting diagram) of IC chip 11 and the interpolater side terminal 12 that is provided with from this conductive welding spots extension.Wherein, in this example, conductive welding spots and interpolater side terminal 12 are formed by the conductivity China ink.
In addition, this routine PSF be can substitute, and PC, converted paper etc. adopted as the material of chip retaining member 13.And, in order to protect the electrical connection position of conductive welding spots and electrode pads, can utilize underfill or encapsulating material etc.And, formation method as interpolater side terminal 12 grades of chip retaining member 13, the method of the printing conductive China ink of alternative example, and adopt methods such as copper etching, distribution (dispense), metal forming attach, the direct evaporation of metal, the transfer printing of metal evaporation film, electroconductive polymer layer formation.
In addition, same with the interpolater side terminal 12 that is formed at said chip retaining member 13, the alternative antenna pattern 24 that is made of the conductivity China ink adopts the antenna pattern 24 by copper etched foil, distribution, metal forming attach, methods such as the direct evaporation of metal, the transfer printing of metal evaporation film, electroconductive polymer layer formation form.And, as the material of basal component 21, except this routine PET, can use PET-G, PC, PP, nylon, paper etc.And then, can use silver, graphite, silver chlorate, copper, nickel etc. as the ink material of conductivity China ink.
Then, this routine interposer bonding device 3 is described.This routine interposer bonding device 3 is provided with specified gap G and is had the opposed engagement head 32 that adds pressure surface 320 by the outer surface of the punching press anvil 31 of the roll shape of cylindrical shape roughly and relative punching press anvil 31 and constitute as shown in Figure 3 and Figure 4.
Punching press anvil 31 constitutes and will dispose the continuous tabular continuous antenna plate 200 of interpolater 10 as Fig. 1, Fig. 3 and shown in Figure 4, remains in the outer surface of approximately cylindrical shape.This continuous antenna plate 200 is made of continuous tabular basal component 21, is provided with antenna pattern 24 continuously on its surface.This routine interposer bonding device 3 constitutes: use the continuous antenna plate 200 that has disposed interpolater 10 on each antenna pattern 24, implement the joint of interpolater 10 continuously.
Punching press anvil 31 is as Fig. 1, Fig. 3, Fig. 4 and shown in Figure 7, constitutes according to the mode along its axis direction configuration pair of substrates side terminal 22 to keep above-mentioned continuous antenna plate 200.And, be provided with two row at the outer peripheral face of punching press anvil 31 corresponding to each base side terminal 22 and convex into portion 310.This convexes into portion 310 and forms the whole periphery that spreads all over punching press anvil 31 and the approximate circle ring-type of extending setting.As shown in Figure 9, convexing into portion 310 is configured to each base side terminal 22 of continuous antenna plate 200 opposed.
Convex into portion 310 as shown in Figures 3 and 4, form by being provided with continuously according to the striated protuberance 311 that extends setting with the approximately parallel mode of axis direction.Each protuberance 311 is outstanding towards the outer circumferential side of punching press anvil 31.In this example, according to several protuberance 311 relative each base side terminal 22 opposed modes, set it and form spacing (with reference to Fig. 8).And in this example, the projecting height hd that establishes above-mentioned protuberance 311 is 400 μ m.
And this routine punching press anvil 31 has not shown heater.And, constitute and can heat each protuberance 311 by the heat that this heater produced.In addition, in this routine interposer bonding device 3, pressurize by the 311 pairs of continuous antenna plate 200 of protuberance after the heating.Thus, can make constitute continuous antenna plate 200 the basal component 21 that forms by thermoplastic easily and the form accuracy highland is outstanding is out of shape.
In addition, add pressure surface 320 and be implemented as the diamond-coated processing of surface-treated, suppress friction with the back side of interpolater 10.Substitute this processing, implement surface treatment such as teflon (R) coating grade, or also be effective at the superhard chip that the surface configuration that adds pressure surface 320 is made of tungsten carbide to adding pressure surface.Perhaps, also the rotation roller can be set at the front end of engagement head 32, with the outer peripheral face of this rotation roller as adding pressure surface.
Then, the production order to the RF-ID medium 1 that used this routine interposer bonding device 3 describes.When making interpolater 10, as shown in Figure 5, at first,, prepare above-mentioned continuous antenna plate 200 by surface formation antenna pattern 24 at continuous tabular basal component 21 with RF-ID medium 1 that antenna plate 20 engages.Then, utilize this continuous antenna plate 200, at least following operation is implemented on the surface of base side terminal 22: the binding agent working procedure of coating that the binding agent configuration layer 25 of the insulating properties binding material 250 with electrical insulating property is set; The interpolater arrangement step of configuration interpolater 10; Utilize above-mentioned interposer bonding device 3 to engage the joint operation of interpolater 10.Then, downcut each RF-ID medium 1 from the continuous antenna plate 200 that has engaged interpolater 10.
In the binding agent working procedure of coating, as shown in Figure 5, in the surface to continuous antenna plate 200, comprise the zone coating insulating properties binding agent 250 of pair of substrates side terminal 22, and be provided with binding agent configuration layer 25.In this example, according to the mode of the configuring area that comprises interpolater 10, be provided with the binding agent configuration layer 25 of thickness 40～80 μ m.Wherein, as this insulating properties binding agent 250, used to have thermoplasticity and be the hot-melt adhesive (hot melt) of moisture-curable (the model TE-031 that 3M company makes) in this example.
In addition, except above-mentioned, can also utilize epoxy is binding agent, acrylic acid series binding agent, elastic adhesive, polyurethane series binding agent etc. as insulating properties binding agent 250.In addition, also can substitute the insulating properties binding agent 250 of moisture-curable, use the binding agent of thermohardening type, ultraviolet hardening, response type such as electronic beam solidified.
Then, in the interpolater arrangement step,, distinguish opposed mode according to base side terminal 22 and interpolater side terminal 12, at the surface configuration interpolater 10 of continuous antenna plate 200 as Fig. 5 and shown in Figure 6.Here, as mentioned above, comprise the configuring area of interpolater 10 and be provided with above-mentioned binding agent configuration layer 25 in this example.Therefore, interpolater 10 is established insulating properties adhesive linkage 25 with its whole clip surface and is opposed with antenna plate 20.
Then,, use this routine interposer bonding device 3, implement relatively continuously the joint operation that antenna plate 200 pressurizations engage interpolaters 10 as Fig. 7～shown in Figure 9.As mentioned above, the punching press anvil 31 of interposer bonding device 3 has according to the protuberance 311 that is provided with continuously with the opposed mode striated in the back side of each base side terminal 22.And, by the protuberance 311 of this routine projecting height hd=400 μ m, can on base side terminal 22, form the outstanding variant part 220 of the about 100 μ m of projecting height hs=.Wherein, the projecting height hd as protuberance 311 preferably is made as 100～800 μ m.Under this situation, can discharge from the gap of the protuberance 311 of adjacency might be from interpolater 10 and the insulating properties binding agent 250 of outflow between the antenna plate 200 continuously.
And, in this example, make the surface temperature that will add pressure surface be maintained 200 ℃ punching press anvil 31 rotations, with the interpolater 10 that punching press anvil 31 keeps by continuous antenna plate 200, the clearance G conveyance that is become to engagement head 32 continuously.As mentioned above, in this example, with respect to the thick board member 21 of the 100 μ m that constitute continuous antenna plate 200 with constitute the combination of the thick chip retaining member 13 of 200 μ m of interpolater 10, the clearance G of punching press anvil 31 and engagement head 32 is set at 230 μ m.Therefore, if at the interpolater 10 of the continuous surface configuration of antenna plate 200 by above-mentioned gap, antenna plate 200 pressurization interpolaters 10 relatively continuously then.This routine interposer bonding device 3 utilizes the plus-pressure that produces here, engages interpolater 10 securely.
According to possessing the punching press anvil 31 that is provided with the portion of convexing into 310 this routine interposer bonding device 3, can make the outstanding distortion of a part of each the base side terminal 22 in the antenna plate 20 by protuberance 311 with the combination of engagement head 32.That is, as Fig. 8 and shown in Figure 9, can be corresponding with the protuberance 311 that striated is provided with pressing surfaces at punching press anvil 31, on each base side terminal 22, form the outstanding variant part 220 of striated.And base side terminal 22 directly contacts with the outstanding variant part 220 of interpolater side terminal 12 via this striated, and the part beyond this outstanding variant part 220 forms gap 222 between the two.
Therefore, between this outstanding variant part 220 and interpolater side terminal 12, flow out insulating properties binding agent 250, make outstanding variant part 220 be crimped on interpolater side terminal 12.Thus, can the reliability highland realize being electrically connected of interpolater side terminal 12 and base side terminal 22.On the other hand, in the non-protuberance 221 except outstanding variant part 220 in each base side terminal 22 and the gap 222 of opposed interpolater side terminal 12, do not flow out insulating properties binding agent 250 fully, proper insulating cohesive agent 250 former states ground is residual.Therefore, by residuing in the insulating properties binding agent 250 in this gap, can the reliability highland realize the adhesive joint between interpolater side terminal 12 and the base side terminal 22, i.e. physical connection.
And, in this example, be provided with binding agent configuration layer 25 in the zone of the configuring area that comprises interpolater 10.Therefore, interpolater 10 is opposed with continuous antenna plate 200 by insulating properties binding agent 250 with its almost whole surface.Its result, interpolater 10 by secure bond in continuous antenna plate 20.
In addition, pressurize if make interpolater 10 and antenna plate 20 butts, then remaining insulating properties binding agent 250 can circuitous be attached to the circumferential lateral surface of interpolater 10.As a result, between the circumferential lateral surface and continuous antenna plate 200 of interpolater 10, form the skewed inclined plane 251 that constitutes by insulating properties binding agent 250.Thus, except the surface of interpolater 10, the circumferential lateral surface 105 of interpolater 10 also becomes adhesive surface, makes interpolater 10 be engaged in continuous antenna plate 200 very securely.
And, this routine interposer bonding device 3, with the punching press anvil 31 of basal component 21 butts that constitute by thermoplastic in possess heater.Therefore, Yi Bian by using the continuous antenna plate 20 of this punching press anvil 31 heating, implement above-mentioned joint operation on one side, utilize the protuberance 310 of punching press anvil 31 can efficient well and the form accuracy highland form above-mentioned outstanding variant part 220.And interpolater side terminal 12 thermo-compressed are given prominence to variant part 220 relatively, thereby can improve reliability of electrical connection.
Here, employed insulating properties binding agent 250 has thermoplasticity in this example.Therefore, if, then can improve its flowability by heater heats insulating properties binding agent 250.Therefore, can make insulating properties binding agent 250 high reliability ground from the outstanding variant part 220 of base side terminal 22, with interpolater side terminal 12 between outflow, thereby can reliability realize electrical connection between the two well.
And above-mentioned interposer bonding device 3 possesses and is used for that engagement head 32 is carried out ultrasonic wave and adds the unit that shakes that adds that shakes as mentioned above.Therefore, in interpolater side terminal 12 and base side terminal 22 direct position contacting, can by ultrasonic wave engage welding the two, thereby can further improve reliability of electrical connection.If combination thermo-compressed and engage interpolater side terminal 12 and base side terminal 22 based on the welding that ultrasonic wave engages then between the long-term operating period of using RF-ID medium 1, can high stability be kept superior status of electrically connecting between the two.
And, the response type binding agent that employed insulating properties binding agent 250 is moisture-curables in this example.Therefore, medium in the keeping process of the RF-ID of made medium 1 after having implemented above-mentioned pressurization stamping procedure, can be fully near the engagement state of interpolater 10.
In addition, as the shape of the protuberance 311 that is provided with at the pressing surfaces of punching press anvil 31, the striated of alternative example forms the protuberance 311 of different shapes such as bulk, distribution shape, crosswise, comb shape shape.And,, also the protuberance 311 that extends the approximate circle ring-type that is provided with along its all direction at the outer peripheral face of punching press anvil 31 can be disposed side by side along axis direction as convexing into portion 310.
For example, as the protuberance 311 of bulk as shown in figure 10, a protuberance 311 of the striated of alternative example (shape of being represented by symbol DL) is provided with roughly the uniformly-spaced outstanding shape of 5 bulks of configuration point-blank.Under this situation, these each outstanding shapes constitute each protuberance 311 respectively.At this moment, as the configuration shape of the portion that convexes into 310 that integral body constituted of these protuberances 311, can be approximate identical with the portion that convexes into 310 (with reference to Fig. 3 and Fig. 4) of this example.In addition, the cross sectional shape as each protuberance 311 for example can be the square of 400 μ m (size of being represented by Wt among this figure) * 400 μ m.And, in convexing into portion 310, the interval Wh of the protuberance 311 of adjacency can be set at 400 μ m.Here, the outstanding inclination angle D as each protuberance 311 is preferably set to 5 degree～15 degree.
In addition, the mode according to the configuring area that comprises interpolater is provided with binding agent configuration layer 25 in this example.Also can substitute this practice, be defined in littlely than the configuring area of interpolater that perimembranous is provided with binding agent configuration layer 25 in it.And, also can form binding agent configuration layer 25 respectively independently corresponding to each base side terminal 22.
The joint method of this routine interpolater 10 is not limited to the manufacturing of RF-ID medium 1, all is effective in the making of the various electronic units that used interpolater 10.For example, can be at FPC (flexible printing substrate), computer made of paper (paper computer), promptly throw in the manufacturing process of various electronic units such as formula electric product and apply in a flexible way.
(embodiment 2)
This example is the interposer bonding device 3 based on embodiment 1, has mainly changed the example of shape of the portion that convexes into 310 that adds pressure surface 320 and punching press anvil 31 of engagement head 32.With reference to Figure 11～Figure 16 this content is described.
In this routine interposer bonding device 3 as shown in figure 11, engagement head 32 and antenna plate 20 butts, punching press anvil 31 and interpolater 10 butts.
This routine engagement head 32 is as Figure 11 and shown in Figure 12, and what have that forniciform outer peripheral face with punching press anvil 31 forms crooked concavity accordingly adds pressure surface 320.It is wideer than interpolater 10 that this adds the size of pressure surface 320 on the Zhou Fangxiang of punching press anvil 31.Therefore, in this routine interposer bonding device 3, can with stipulated time of punching press anvil 31 conveyance interpolaters 10 by adding pressurize simultaneously whole of interpolater side terminal 12 of pressure surface 320.
As shown in figure 12, in adding pressure surface 320,, be provided with along above-mentioned Zhou Fangxiang and extend the recess 328 that is provided with in the axial substantial middle portion of punching press anvil 31.Therefore, add pressure surface 320 according to this, little to the possibility of the excessive load of IC chip 11 effects of interpolater 10.In addition, in adding the edge portion of pressure surface 320, the edge portion 329 of the rotation upstream side of preferred punching press anvil 31 is pre-formed its angular shape and is convex surface shape.Under this situation, can be swimmingly interpolater 10 and antenna plate 20 be sent into and add pressure surface 320 sides.
As Figure 13～shown in Figure 15, the portion that respectively convexes into 310 of the punching press anvil 31 that this is routine, be respectively formed at the outer peripheral face that extends the base portion 319 in the big footpath that is provided with along Zhou Fangxiang.Respectively convex into portion 310 and have the protuberance 315 that two row are arranged along Zhou Fangxiang respectively.In addition, in Figure 13, omitted engagement head 32 and be illustrated by the broken lines antenna plate 20 and interpolater 10.
This routine protuberance 315 is the shape that is provided with the approximate quadrangular pyramid shape of planar portions at front end as shown in figure 15.As the shape of protuberance 315, except this routine quadrangular pyramid shape, can form triangle taper or different shape such as coniform.
In addition, in this routine interposer bonding device 3, as shown in figure 16, also can under the state that makes engagement head 32 and interpolater 10 butts, punching press anvil 32 and antenna plate 20 butts, engage interpolater 10.
Claims (10)
1, a kind of interposer bonding device, it is used for interpolater is engaged with base circuit board, described interpolater is installed semiconductor chip and is constituted on tabular chip retaining member, and have from this semiconductor chip and extend the interpolater side terminal that is provided with as splicing ear, described base circuit board is made of tabular basal component, be provided with the base side terminal on its surface, described interposer bonding device is characterised in that
Have: under described interpolater side terminal and the opposed state of described base side terminal, the punching press anvil that the described base circuit board of stacked described interpolater is kept; With
Relatively this punching press anvil carries out relative motion and the engagement head that constitutes,
Described engagement head has the pressure surface that adds that the back side butt that forms with described interpolater or described base circuit board pressurizes, this adds pressure surface and scans the back side of described interpolater or described base circuit board according to the relative motion of the described relatively punching press anvil of described engagement head, pressurize whole of described interpolater side terminal of described relatively base circuit board.
2, interposer bonding device according to claim 1 is characterized in that,
Described basal component is made of the plastic resin material, and described punching press anvil is provided with the portion of convexing into, and this portion of convexing into comprises towards the outstanding protuberance of the part in the zone, the back side of the described base side terminal of described base circuit board.
3, interposer bonding device according to claim 1 is characterized in that,
By in described interpolater and the opposed gap that forms of described base circuit board, the binding agent that disposes in the gap of described at least interpolater side terminal and described base side terminal, engage described interpolater and described base circuit board, described binding agent is the insulating properties binding agent with electrical insulating property.
4, interposer bonding device according to claim 3 is characterized in that,
Described engagement head constitutes described interpolater effect ultrasonic vibration.
5, interposer bonding device according to claim 2 is characterized in that,
Described punching press anvil is approximately cylindrical shape, keeps described base circuit board at its outer surface, and is that the center is rotated with the axle center of described approximately cylindrical shape,
Described engagement head is utilized the rotation of described punching press anvil, and described relatively interpolater carries out relative motion.
6, interposer bonding device according to claim 5 is characterized in that,
The described pressure surface that adds of described engagement head is the curved concave shape corresponding with the outer peripheral face of described punching press anvil, and forms whole of the described interpolater that can pressurize simultaneously.
7, interposer bonding device according to claim 5 is characterized in that,
Described interpolater is according to have a pair of described interpolater side terminal across the opposed mode of described semiconductor chip, described punching press anvil along described axle center away from two positions have the described portion that convexes into, and, keep described base circuit board under portion and the opposed state of described base side terminal described respectively convexing into.
8, interposer bonding device according to claim 6 is characterized in that,
Respectively convex in the portion described, be provided with described protuberance along the Zhou Fangxiang of described punching press anvil, this protuberance forms the front reduced cross-sectional area towards projected direction.
9, interposer bonding device according to claim 5 is characterized in that,
Described punching press anvil disposes the described portion that respectively convexes on the whole outer peripheral face of this punching press anvil, can implement the joint of a plurality of described interpolaters continuously.
According to each described interposer bonding device in the claim 1～9, it is characterized in that 10, described semiconductor chip is the IC chip that the RF-ID medium are used, described base circuit board is provided with the antenna pattern that is electrically connected with described IC chip.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP350841/2004 | 2004-12-03 | ||
| JP351258/2004 | 2004-12-03 | ||
| JP2004350841 | 2004-12-03 | ||
| JP2004351258 | 2004-12-03 | ||
| PCT/JP2005/022220 WO2006059732A1 (en) | 2004-12-03 | 2005-12-03 | Interposer bonding device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101693806A Division CN101383022B (en) | 2004-12-03 | 2005-12-03 | Electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101073296A true CN101073296A (en) | 2007-11-14 |
| CN101073296B CN101073296B (en) | 2011-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008101693806A Active CN101383022B (en) | 2004-12-03 | 2005-12-03 | Electronic component |
| CN2005800416497A Active CN101073296B (en) | 2004-12-03 | 2005-12-03 | Interposer bonding device |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101693806A Active CN101383022B (en) | 2004-12-03 | 2005-12-03 | Electronic component |
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| CN (2) | CN101383022B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107106133A (en) * | 2015-01-13 | 2017-08-29 | 皇家飞利浦有限公司 | With the interpolater of spring electric interconnection |
| CN109399114A (en) * | 2018-12-11 | 2019-03-01 | 宁波隆威婴儿用品有限公司 | A kind of comb body plant grain machine |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5591298A (en) * | 1988-01-19 | 1997-01-07 | Kimberly-Clark Corporation | Machine for ultrasonic bonding |
| US5342460A (en) * | 1989-06-13 | 1994-08-30 | Matsushita Electric Industrial Co., Ltd. | Outer lead bonding apparatus |
| US6010340A (en) * | 1998-03-04 | 2000-01-04 | Internatinal Business Machines Corporation | Solder column tip compliancy modification for use in a BGA socket connector |
| FR2787609B1 (en) * | 1998-12-21 | 2001-02-09 | Gemplus Card Int | NON-CONTACT CHIP CARD MANUFACTURING PROCESS |
| JP2003168099A (en) * | 2001-11-30 | 2003-06-13 | Oji Paper Co Ltd | Device for manufacturing ic chip mounting body |
| JP3739752B2 (en) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | Small-piece transfer device capable of random-cycle shifting |
-
2005
- 2005-12-03 CN CN2008101693806A patent/CN101383022B/en active Active
- 2005-12-03 CN CN2005800416497A patent/CN101073296B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107106133A (en) * | 2015-01-13 | 2017-08-29 | 皇家飞利浦有限公司 | With the interpolater of spring electric interconnection |
| CN107106133B (en) * | 2015-01-13 | 2020-06-30 | 皇家飞利浦有限公司 | Interposer electrically interconnected with spring |
| CN109399114A (en) * | 2018-12-11 | 2019-03-01 | 宁波隆威婴儿用品有限公司 | A kind of comb body plant grain machine |
| CN109399114B (en) * | 2018-12-11 | 2023-12-29 | 宁波隆威婴儿用品有限公司 | Comb body grain planting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101383022B (en) | 2012-08-22 |
| CN101383022A (en) | 2009-03-11 |
| CN101073296B (en) | 2011-07-06 |
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