CN220639269U - Thermal print head with poor adhesive overflow prevention - Google Patents
Thermal print head with poor adhesive overflow prevention Download PDFInfo
- Publication number
- CN220639269U CN220639269U CN202322427924.7U CN202322427924U CN220639269U CN 220639269 U CN220639269 U CN 220639269U CN 202322427924 U CN202322427924 U CN 202322427924U CN 220639269 U CN220639269 U CN 220639269U
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- China
- Prior art keywords
- print head
- thermal
- thermal print
- substrate
- pressing
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- 230000002265 prevention Effects 0.000 title abstract description 4
- 239000000853 adhesive Substances 0.000 title description 8
- 230000001070 adhesive effect Effects 0.000 title description 8
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000010438 heat treatment Methods 0.000 claims abstract description 53
- 239000003292 glue Substances 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 5
- 230000000994 depressogenic effect Effects 0.000 claims description 3
- 238000003475 lamination Methods 0.000 abstract description 6
- 238000007651 thermal printing Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 23
- 238000007639 printing Methods 0.000 description 8
- 230000000630 rising effect Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of manufacturing of thermal printing heads, in particular to a thermal printing head with poor glue overflow prevention and lamination, which is provided with a heating substrate for the thermal printing head.
Description
Technical field:
the utility model relates to the technical field of manufacturing of thermal printheads, in particular to a thermal printhead which can provide a glue overflow space after ACF pressing so as to prevent poor glue overflow pressing caused by short circuit and open circuit among bonding pad pins due to ACF glue overflow accumulation.
The background technology is as follows:
as is well known, a thermal printhead adopting a flip chip bonding process uses solder or ACF glue to press and connect a heating component on an insulating substrate and a flexible circuit board, wherein a primer layer is arranged on the surface of the insulating substrate, a heating resistor body and an electrode wire are arranged on the upper surface of an effective working area corresponding to the primer layer, the electrode wire is electrically connected with the heating resistor body and is used for supplying power to the heating resistor body, ACF glue is attached to the surface of a pin part of the electrode wire, and the flexible circuit board is pressed on the ACF glue to be fixedly connected with the surface of the insulating substrate.
However, in the process of pressing the flexible circuit board onto the insulating substrate through the ACF glue, because of the product structure and the characteristics of the ACF glue, a part of glue overflows and hardened is formed in the area outside the pressing part, at this time, the glue is extruded below the flexible circuit board to form bulges, the density of conductive particles in the ACF glue at the bulge part becomes more concentrated, and the probability of conducting between particles is increased, namely, the probability of accidental short circuit of the pad pins is increased; in addition, the raised part can form a force opposite to the adhesive force, and the force is continuously applied, and the factors such as time-dependent change, adhesive moisture absorption change and the like influence the effect at the same time, so that the conduction effect of the flexible circuit board and the substrate pad pin is weakened, the problem of contact impedance rise and even circuit breaking occurs, and the product quality reliability and the service life are influenced.
The utility model comprises the following steps:
aiming at the defects and shortcomings in the prior art, the utility model provides a concave type glue overflow groove capable of releasing an ACF glue overflow space, thereby avoiding short circuit or open circuit between bonding pad pins.
The utility model is achieved by the following measures:
the utility model provides a thermal print head that anti-overflow glues and presses bad is equipped with the thermal print head and uses the base plate that generates heat, the thermal print head is with the base plate that generates heat includes insulating substrate, insulating substrate surface is equipped with the primer layer, the upper surface on primer layer is equipped with electrode wire and heating resistor body, electrode wire and heating resistor body electrical connection, electrode wire's pin position extends to the region of pressing, presses the region and presses gluey material through ACF and links to each other with the circuit board, its characterized in that, thermal print head is with the base plate upper surface that generates heat is equipped with the depressed part corresponding to the region edge of pressing.
The concave part of the upper surface of the heating substrate for the thermal printing head comprises an insulating substrate, a primer layer and electrode wires, wherein the upper surface of the insulating substrate is provided with a groove, the primer layer is uniform in thickness, and the electrode wires are uniform in thickness; or the concave part of the upper surface of the heating substrate for the thermal print head comprises an insulating substrate with a flat surface, a ground coat layer with a groove on the upper surface and electrode wires with consistent thickness.
The upper surface of the heating substrate for the thermal print head is provided with a groove-shaped concave part which is arranged in parallel with the heating resistor body and corresponds to the edge of the pressing area.
The upper surface of the heating substrate for the thermal print head is further provided with groove-shaped concave parts which are arranged in parallel with the heating resistor body respectively at the inner side and the outer side of the pressing area, wherein the inner side of the pressing area is close to the heating resistor body side, and the outer side of the pressing area is far away from the heating resistor body side.
According to the utility model, the heights of the upper surface of the heating substrate for the thermal print head corresponding to the pressing area are consistent with those of the upper surface area of the heating substrate for the thermal print head with the non-concave parts, and the concave parts in the shape of the grooves are respectively arranged on the inner side and the outer side of the pressing area, so that the upper surface of the heating substrate for the thermal print head corresponding to the pressing area forms wavy concave-convex appearance, thereby relieving the problem of short circuit of a bonding pad pin caused by contact of conductive particles in ACF glue materials accumulated under an edge flexible circuit board where the thermal print head is pressed, and also relieving the problem of rising or even disconnection of a conduction resistance value caused by rising of the flexible circuit board due to rising of the ACF.
Compared with the prior art, the utility model can effectively avoid the problems of short circuit and open circuit among pins caused by ACF glue overflow under the flexible circuit board, simultaneously reduces the necessary glue overflow interval, provides required conditions for miniaturization of products, ensures the quality and the service life of the thermal print head, and improves the design freedom.
Description of the drawings:
fig. 1 is a top view of the present utility model.
Fig. 2 is a schematic structural view of the present utility model.
FIG. 3 is a cross-sectional view of one embodiment of the present utility model.
FIG. 4 is a cross-sectional view of a second embodiment of the present utility model.
Reference numerals: the thermal printing head heating substrate 1, a metal heat radiating plate 2, a packaging adhesive 3, a circuit board 4, a socket 5, a heating resistor 6, a concave part 7, an insulating substrate 8, a primer layer 9, an electrode wire 10, a pressing region 11 and a groove 12.
The specific embodiment is as follows:
the utility model will be further described with reference to the drawings and examples.
As shown in fig. 1 and 2, the utility model provides a thermal print head with poor glue overflow prevention and lamination, which is provided with a heating substrate 1 for the thermal print head, the heating substrate 1 for the thermal print head comprises an insulating substrate 8, a primer layer 9 is arranged on the surface of the insulating substrate 8, an electrode wire 10 and a heating resistor 6 are arranged on the upper surface of the primer layer 9, the electrode wire 10 is electrically connected with the heating resistor 6, a pin part of the electrode wire 10 extends to a lamination area, the lamination area 11 is connected with a circuit board 4 through an ACF lamination glue, and a concave part 7 is arranged on the upper surface of the heating substrate 1 for the thermal print head corresponding to the edge of the lamination area 11.
The concave part 7 on the upper surface of the heating substrate 1 for the thermal print head comprises an insulating substrate 8, a primer layer 9 and an electrode wire 10, wherein the upper surface of the insulating substrate is provided with a groove 13, the primer layer 9 and the electrode wire 10 are consistent in thickness; or, the concave part 7 on the upper surface of the heating substrate 1 for the thermal print head comprises an insulating substrate 8 with a flat surface, a ground coat layer 9 with a groove 13 on the upper surface, and an electrode wire 10 with uniform thickness.
The upper surface of the heating substrate 1 for the thermal print head is provided with a groove-shaped concave part 7 which is parallel to the heating resistor body 6 and corresponds to the edge of the pressing area 11.
The upper surface of the heating substrate 1 for the thermal print head is further provided with groove-shaped concave parts 7 which are arranged in parallel with the heating resistor 6 on the inner side and the outer side of the pressing area 11, wherein the inner side of the pressing area 11 is close to the heating resistor 6, and the outer side of the pressing area 11 is far from the heating resistor 6.
According to the utility model, the height of the upper surface of the heating substrate 1 for the thermal print head corresponding to the pressing area 11 is consistent with that of the upper surface area of the heating substrate 1 for the thermal print head corresponding to the non-concave part, and the groove-shaped concave parts are respectively arranged on the inner side and the outer side of the pressing area 11, so that the upper surface of the heating substrate 1 for the thermal print head corresponding to the pressing area 11 forms a wavy concave-convex appearance, thereby relieving the problem of short circuit of a bonding pad pin caused by contact of conductive particles in ACF (conductive film) adhesive materials accumulated under an edge flexible circuit board 4 at the pressing position of the thermal print head, and also relieving the problem of rising of a conduction resistance value and even disconnection caused by rising of the flexible circuit board due to rising of the ACF.
Example 1:
as shown in fig. 2 and 3, this example provides a thermal print head capable of preventing ACF from being excessively stuck, wherein a metal heat dissipating plate 2 is provided, a thermal print head heat generating substrate 1 and a flexible circuit board 4 are provided on the metal heat dissipating plate 2, the thermal print head heat generating substrate 1 includes an insulating substrate 8, a ground coat layer 9 is provided on a surface of the insulating substrate 8, a lead electrode 10 of a common electrode and an individual electrode is provided on a surface of the ground coat layer 9, a heat generating resistor 6 is disposed between the common electrode and the individual electrode in a main printing direction, and a protective layer is covered on surfaces of the heat generating resistor 6 and a part of the individual electrodes and the common electrode, one end of the common electrode is connected to the heat generating resistor 6 in a sub printing direction, and the other end is connected to a printing power supply; one end of each individual electrode is connected with the heating resistor body 6 along the secondary printing direction, and the other end of each individual electrode is connected with a control IC, wherein the control IC is arranged on the heating substrate 1 for the thermal printing head, and the control IC is also encapsulated and protected by the encapsulation adhesive 3; the bonding pad pins of the heating substrate 1 and the bonding pad pins of the flexible circuit board 4 are connected by pressing and conducting by using ACF glue; the flexible circuit board 4 is also provided with a socket 5 connected with the printer body;
in this example, the electrode wire 10 with equal thickness is disposed on the heating substrate 1, the electrode wire layer 10 with equal thickness and the under-glaze layer 9 are disposed in the concave portion 7 disposed at the edge of the pressing region 11 of the heating substrate 1, and at least one side groove 12 is disposed on the upper surface of the insulating substrate 8 corresponding to the concave portion 7, so that the concave portion 7 with continuous groove appearance is formed on the upper surface of the film layer attached to the upper surface of the insulating substrate 8.
By arranging the concave part 7 at the edge of the pressing area 11 of the heating substrate 1, the glue overflow space after the ACF is pressed can be effectively provided, and the problems of short circuit and open circuit among bonding pad pins caused by the glue overflow accumulation of the ACF are further avoided.
Example 2:
as shown in fig. 2 and fig. 4, this example provides a thermal print head capable of preventing ACF from being excessively stuck, wherein a metal heat dissipating plate 2 is provided, a heat generating substrate 1 and a flexible circuit board 4 are provided on the metal heat dissipating plate 2, the heat generating substrate 1 includes an insulating substrate 8, a primer layer 9 is provided on a surface of the insulating substrate 8, electrode wires 10 of a common electrode and an individual electrode are provided on a surface of the primer layer 9, a heat generating resistor 6 is disposed between the common electrode and the individual electrode in a main printing direction, as a heat generating body generating joule heat, surfaces of the heat generating resistor 6 and a part of the individual electrodes and the common electrode are covered with a protective layer, one end of the common electrode is connected to the heat generating resistor 6 in a sub printing direction, and the other end is connected to a printing power supply; one end of each individual electrode is connected with the heating resistor body 6 along the secondary printing direction, and the other end of each individual electrode is connected with a control IC, wherein the control IC is arranged on the heating substrate 1, and the control IC is also encapsulated and protected by the encapsulation adhesive 3; the bonding pad pins of the heating substrate 1 and the bonding pad pins of the flexible circuit board 4 are connected by pressing and conducting by using ACF glue; the flexible circuit board 4 is also provided with a socket 5 connected with the printer body;
in this example, the electrode wires 10 with equal thickness are disposed on the heating substrate 1, a concave portion 7 is disposed at the edge of the pressing region 11 of the heating substrate 1, the insulating substrate 8 corresponding to the concave portion 7 has a flat upper surface, and has the electrode wires 10 with equal thickness, and at least one side groove 12 is disposed on the upper surface of the under-glaze layer 9 at equal intervals, so that the electrode wire layer 10 disposed on the upper side of the under-glaze layer 9 forms the concave portion 7 with a continuous groove appearance;
through set up depressed part 7 in the region 11 edge that presses of heating base plate 1, can effectively provide the overflow space after the ACF is pressed to alleviate the thermal print head and press the pad pin short circuit problem that conductive particle contact caused in the ACF glue material that piles up under the flexible circuit board of department edge, also alleviate the ACF uplift simultaneously and lead to the conduction resistance value that flexible circuit board perk caused to rise even the problem of breaking circuit.
Compared with the prior art, the utility model can effectively avoid the problems of short circuit and open circuit among pins caused by ACF glue overflow under the flexible circuit board, simultaneously reduces the necessary glue overflow interval, provides certain required conditions for product miniaturization, ensures the quality and the service life of the thermal print head, and can improve the degree of freedom of design.
Claims (4)
1. The utility model provides a thermal print head that anti-overflow glues and presses bad is equipped with the thermal print head and uses the base plate that generates heat, the thermal print head is with the base plate that generates heat includes insulating substrate, insulating substrate surface is equipped with the primer layer, the upper surface on primer layer is equipped with electrode wire and heating resistor body, electrode wire and heating resistor body electrical connection, electrode wire's pin position extends to the region of pressing, presses the region and presses gluey material through ACF and links to each other with the circuit board, its characterized in that, thermal print head is with the base plate upper surface that generates heat is equipped with the depressed part corresponding to the region edge of pressing.
2. The thermal printhead of claim 1 wherein said thermal printhead is characterized in that said thermal printhead is characterized by a heat-generating substrate having a recess in the upper surface comprising an insulating substrate with a recess in the upper surface, a primer layer of uniform thickness, and electrode wires of uniform thickness; or the concave part of the upper surface of the heating substrate for the thermal print head comprises an insulating substrate with a flat surface, a ground coat layer with a groove on the upper surface and electrode wires with consistent thickness.
3. The thermal printhead of claim 1 wherein said thermal printhead is characterized in that said thermal printhead is provided with a groove-like depression parallel to said heating resistor body at the edge of said pressing area corresponding to said upper surface of said heating substrate.
4. The thermal head of claim 1, wherein the upper surface of the thermal head substrate further comprises groove-shaped recesses formed in parallel with the heat generating resistor on the inner side and the outer side of the pressing region, respectively, the inner side of the pressing region being closer to the heat generating resistor, and the outer side of the pressing region being farther from the heat generating resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322427924.7U CN220639269U (en) | 2023-09-07 | 2023-09-07 | Thermal print head with poor adhesive overflow prevention |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322427924.7U CN220639269U (en) | 2023-09-07 | 2023-09-07 | Thermal print head with poor adhesive overflow prevention |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220639269U true CN220639269U (en) | 2024-03-22 |
Family
ID=90290873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322427924.7U Active CN220639269U (en) | 2023-09-07 | 2023-09-07 | Thermal print head with poor adhesive overflow prevention |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220639269U (en) |
-
2023
- 2023-09-07 CN CN202322427924.7U patent/CN220639269U/en active Active
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