CN101071932A - Semiconductor laser precision tune-up and tempeature control device - Google Patents
Semiconductor laser precision tune-up and tempeature control device Download PDFInfo
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- CN101071932A CN101071932A CN 200710052267 CN200710052267A CN101071932A CN 101071932 A CN101071932 A CN 101071932A CN 200710052267 CN200710052267 CN 200710052267 CN 200710052267 A CN200710052267 A CN 200710052267A CN 101071932 A CN101071932 A CN 101071932A
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- temperature control
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Abstract
This invention dicloses a semiconductor laser alignment and precision temperature control device, Including temperature control by the Ministry, the Ministry of alignment, Shell, a base and joints. Temperature Control and the Department of the Ministry of the true - are installed at the shell, the shell in a fixed base, air installed at the bottom shell connector. Temperature control by the Ministry of laser tube, heat sink, TEC temperature control device, a heat pipe radiator, installed in the laser tube heat sink, the TEC temperature control device affixed to the heat sink, heat pipe back to install radiator, the Ministry of the true - by photoelectric beam collimator feedback and fine-tuning body parts and 2D composed by the two-dimensional fine-tuning agencies regulating frame plate spring, collimating components support slider, adjusting screw on the composition, collimating components rely on support slider and on the plate spring box installed at the regulation, regulation of the screw in the direction perpendicular to each other across the two adjacent frames regulating and extending to the edge components support collimator slider surface. This invention has laser beam alignment and laser temperature control of the two major functions, simple structure, the overall insulation of good, easy-to-use, high precision, stable and reliable performance.
Description
Technical field
The present invention relates to a kind of adjustment and attemperating unit, relate in particular to a kind of semiconductor laser precision and harmonize and attemperating unit.
Background technology
Development along with laser technology, commercialization semiconductor laser power output is increasing, wave-length coverage covers visible and infrared, have characteristics such as volume is little, in light weight, the driving of efficient high and low pressure in addition, thereby they are in spectral technique, optical heterodyne detection, optical fiber communication, high power solid-state laser pumping, medical treatment, processing, and even field such as laser cooling experiment obtains using more and more widely.In above-described various application, the precision of laser output parameter, stable be vital.
Because semiconductor laser light radiation wavelength and power output and junction temperature have very big relation, the fluctuating of temperature can cause the variation of luminous power, or causes the drift of laser frequency, and what influence was exported is accurate, stable.Especially in, high power device, in actual applications, often need noise spectra of semiconductor lasers to carry out temperature control.Because the angle of divergence of semiconductor laser output beam is very big, and asymmetric, therefore, alignment problems also seems very outstanding in actual the use.In addition, also have system optical axis laterally the heart to be adjusted problem.Semiconductor laser as light source, needs the output of high-quality laser usually in various application, not only have good collimation property, possesses precision, stable physical parameter simultaneously.The conventional device complex structure, poor stability, the adjustment precision is low.On the other hand, adjustment speed is slow, and control precision is low.
Summary of the invention
The objective of the invention is to: for overcoming the deficiency of above-mentioned conventional art, provide a kind of whole thermal insulation good, adjustment speed is fast, precision is high, stable performance, simple in structure, semiconductor laser precision that cost is low are harmonized and attemperating unit.
The present invention realizes by following scheme: be made of temperature control portion, adjustment portion, housing, base and joint.Temperature control portion and adjustment portion all are arranged in the housing, and housing is fixed on the base, and housing bottom is provided with Aviation Connector, to guarantee compact overall structure.Temperature control portion is made of laser tube, heat sink, TEC temperature control device, heat-pipe radiator, laser tube be installed in heat sink on, TEC temperature control device be attached to heat sink on, heat-pipe radiator is installed at the back side again, adjustment portion is made up of beam collimation and electro-optical feedback parts and two-dimentional micro-adjusting mechanism, beam collimation and electro-optical feedback parts comprise optical alignment assembly, optical detection transducer, and integral installation is laterally adjusted the location with the realization optical axis on two-dimentional micro-adjusting mechanism, reach coaxial with light beam; The two dimension micro-adjusting mechanism by conditioning box, leaf spring, collimator assembly support slipper, adjusting screw(rod) to constituting, the collimator assembly support slipper rides on the leaf spring and is arranged in the conditioning box, and adjusting screw(rod) is to passing conditioning box two adjacent edges and extending to collimator assembly support slipper surface with orthogonal direction.
Collimator assembly support slipper lateral surface of the present invention has two vertical planes, and as guiding face, to realizing the two dimension fine setting, the center has screwed hole by adjusting screw(rod), in order to fixed beam collimation and electro-optical feedback parts.
Beam collimation of the present invention and electro-optical feedback parts comprise lens drum, sampling speculum, photosensitive tube, wedge shape tube, emit circle, collimation lens set; Sampling speculum and level are miter angle and are fixedly set in the lens drum through the wedge shape tube, on the lens drum barrel, offer loophole over against the vertical direction of the speculum of sampling, photosensitive tube are installed in the loophole, and collimation lens set is arranged at lens drum one end.
Joint of the present invention is L-shaped.
Loophole of the present invention is a screwed hole, and matches with the photosensitive pipe box of photosensitive tube peripheral hardware.
The present invention is provided with heat insulation layer in inner walls.
The present invention has following characteristics: 1, owing to adopted the two-dimentional fine tuning structure of unique design, make the governor motion of collimating lens simplify greatly, and easy to adjust, can adapt to the laser tube of various encapsulation.System optical axis X/Y direction alignment precision can reach ± 0.01mm; 2, for reducing the influence of ambient temperature to system, double-deck adiabatic measure has been taked in inside of the present invention, to reduce as much as possible and extraneous heat exchange, all heats only can be by two TEC turnover after heat sink, because TEC is a kind of non-linear element, its efficient can sharply descend when cold/hot side temperature difference increases simultaneously.Owing to used thermal conductivity and the less heat-pipe radiator of volume that superelevation is arranged, can under the situation of not using fan forced convection, meet and exceed the effect of conventional aluminium fin radiator; 3, the driving power of laser and temperature-control circuit partly are external in the system of the present invention, and each parts all adopts modularized design, are convenient to realize the replacing upgrading of each parts and safeguard; The present invention can be used for the digital semiconductor laser system, owing to adopt CPU control, and stable and reliable for performance; 4, the present invention has two big functions such as laser beam adjustment and laser tube temperature control, and has light intensity detection feedback signal and the output of temperature detection feedback signal.5, the present invention is optimized design by the laser heat mechanical characteristic fully, and whole thermal insulation is good, and adjustment speed is fast, precision is high.Owing to use heat pipe, there are not moving components such as fan, water pump, avoided the influence of vibrations to light beam.Opticator is keeping only using several parts just to realize the function of tens parts of external like product under the constant prerequisite of degree of regulation.Simplify greatly and dwindled system configuration, make and regulate more reliably, and reduced cost.6, owing to adopt digital control technology,, can obtain desirable temperature control effect by effective algorithm.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a two-dimentional micro-adjusting mechanism structural representation of the present invention;
Fig. 3 is beam collimation and electro-optical feedback modular construction schematic diagram.
Embodiment
The present invention is described in detail below in conjunction with accompanying drawing.
Present embodiment is made of temperature control portion, adjustment portion, housing 3, base 5 and joint 6.Temperature control portion and adjustment portion all are arranged in the housing 3, and housing 3 is fixed on the base 5, and housing 3 inwalls are provided with heat insulation layer 10, and housing 3 bottoms are provided with L shaped Aviation Connector 6, to guarantee compact overall structure.Temperature control portion is made of laser tube 9, heat sink 7, TEC temperature control device 8, heat-pipe radiator 1, and laser tube 9 is installed on heat sink 7, and TEC temperature control device 8 is attached on heat sink 7, and the back side is equipped with heat-pipe radiator 1.Adjustment portion is made up of beam collimation and electro-optical feedback parts 2 and two-dimentional micro-adjusting mechanism 4, beam collimation and electro-optical feedback parts 2 comprise lens drum 21, sampling speculum 22, photosensitive pipe box 23, photosensitive tube 24, wedge shape tube 25, emit circle 26, collimation lens set 27, integral installation is laterally adjusted the location with the realization optical axis on two-dimentional micro-adjusting mechanism 4, reach coaxial with light beam.Sampling speculum 22 is miter angle in wedge shape tube 25 is fixedly set in lens drum 21 with level, on lens drum 21 barrels, over against the sampling speculum 22 vertical direction offer loophole 28, photosensitive tube 24 is installed in the loophole 28, and collimation lens set 27 is arranged at lens drum 21 1 ends.Loophole 28 is a screwed hole, and matches with the photosensitive pipe box 23 of photosensitive tube 24 peripheral hardwares.The structure of two dimension micro-adjusting mechanism 4 as shown in Figure 2, it is made of 44 conditioning box 41, leaf spring 42, collimator assembly support slipper 43, adjusting screw(rod), collimator assembly support slipper 43 rides on the leaf spring 42 and is arranged in the conditioning box 41, adjusting screw(rod) passes 41 liang of adjacent edges of conditioning box and extends to collimator assembly support slipper 43 surfaces with orthogonal direction 44, realizes the two dimension fine setting by the turn adjusting screw(rod) to 44.
Claims (6)
1, a kind of semiconductor laser precision is harmonized and attemperating unit, it is characterized in that: be made of temperature control portion, adjustment portion, housing (3), base (5) and joint (6); Temperature control portion and adjustment portion all are arranged in the housing (3), housing (3) is fixed on the base (5), housing (3) bottom is provided with Aviation Connector (6), temperature control portion is by laser tube (9), heat sink (7), TEC temperature control device (8), heat-pipe radiator (1) constitutes, laser tube (9) is installed on heat sink (7), TEC temperature control device (8) is attached on heat sink (7), heat-pipe radiator (1) is installed at the back side again, adjustment portion is made up of beam collimation and electro-optical feedback parts (2) and two-dimentional micro-adjusting mechanism (4), beam collimation and electro-optical feedback parts (2) comprise the optical alignment assembly, the optical detection transducer, integral installation is gone up with the realization optical axis at two-dimentional micro-adjusting mechanism (4) and is laterally adjusted the location, reaches coaxial with light beam; Two dimension micro-adjusting mechanism (4) is made of (44) conditioning box (41), leaf spring (42), collimator assembly support slipper (43), adjusting screw(rod), collimator assembly support slipper (43) rides in leaf spring (42) and goes up and be arranged in the conditioning box (41), and adjusting screw(rod) passes conditioning box (41) two adjacent edges and extends to collimator assembly support slipper (43) surface with orthogonal direction (44).
2, semiconductor laser precision according to claim 1 is harmonized and attemperating unit, it is characterized in that: collimator assembly support slipper (43) lateral surface has two vertical planes, as guiding face, by adjusting screw(rod) (44) are realized the two dimension fine setting, the center has screwed hole, in order to fixed beam collimation and electro-optical feedback parts (2).
3, semiconductor laser precision according to claim 1 and 2 is harmonized and attemperating unit, it is characterized in that: beam collimation and electro-optical feedback parts (2) comprise lens drum (21), sampling speculum (22), photosensitive tube (24), wedge shape tube (25), emit circle (26), collimation lens set (27); Sampling speculum (22) is miter angle in wedge shape tube (25) is fixedly set in lens drum (21) with level, on lens drum (21) barrel, over against the sampling speculum (22) vertical direction offer loophole (28), photosensitive tube (24) is installed in the loophole (28), and collimation lens set (27) is arranged at lens drum (21) one ends.
4, semiconductor laser precision according to claim 1 and 2 is harmonized and attemperating unit, and it is characterized in that: joint (6) is L-shaped.
5, semiconductor laser precision according to claim 3 is harmonized and attemperating unit, and it is characterized in that: loophole (28) is a screwed hole, and matches with the photosensitive pipe box (23) of photosensitive tube (24) peripheral hardware.
6, semiconductor laser precision according to claim 1 and 2 is harmonized and attemperating unit, it is characterized in that: be provided with heat insulation layer (10) at housing (3) inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100522675A CN100464473C (en) | 2007-05-22 | 2007-05-22 | Semiconductor laser precision tune-up and tempeature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100522675A CN100464473C (en) | 2007-05-22 | 2007-05-22 | Semiconductor laser precision tune-up and tempeature control device |
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| Publication Number | Publication Date |
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| CN101071932A true CN101071932A (en) | 2007-11-14 |
| CN100464473C CN100464473C (en) | 2009-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007100522675A Expired - Fee Related CN100464473C (en) | 2007-05-22 | 2007-05-22 | Semiconductor laser precision tune-up and tempeature control device |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315585A (en) * | 2011-07-26 | 2012-01-11 | 中国科学院长春光学精密机械与物理研究所 | Air-cooling and heat-radiating device for high-power semiconductor laser module |
| CN102570289A (en) * | 2011-05-25 | 2012-07-11 | 北京国科世纪激光技术有限公司 | Temperature controlling and heat radiating system for optical fiber coupling module |
| CN101614861B (en) * | 2009-08-12 | 2013-01-02 | 中国航空工业第一集团公司北京长城计量测试技术研究所 | Fixing support body for fixing reflector in injection-molded mirror canal |
| CN103697851A (en) * | 2013-11-29 | 2014-04-02 | 浙江省计量科学研究院 | Adjusting device for cross translation of flange plate |
| CN104752950A (en) * | 2015-04-07 | 2015-07-01 | 王胤 | Laser collaboration temperature control and seal mounting base |
| RU2623709C1 (en) * | 2016-02-10 | 2017-06-28 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") | Small-size laser head with liquid cooling |
| CN106975853A (en) * | 2017-04-16 | 2017-07-25 | 杭州光库科技有限公司 | The cooling mechanism of twin-channel laser marking machine |
| CN108233156A (en) * | 2018-02-10 | 2018-06-29 | 北京工业大学 | A kind of cooling system based on slab laser |
| CN108493756A (en) * | 2018-02-07 | 2018-09-04 | 杭州电子科技大学 | One kind being based on Nd:YVO4/Nd:GdVO4The two-frequency laser of interwoven crystal |
| CN109038208A (en) * | 2018-08-14 | 2018-12-18 | 苏州冠德能源科技有限公司 | The encapsulating structure of quantum cascade laser |
| CN109893101A (en) * | 2019-04-26 | 2019-06-18 | 中国科学院长春光学精密机械与物理研究所 | A kind of caries diagnosis imaging device and hand-held caries diagnosis imager |
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| JPH0521887A (en) * | 1990-12-04 | 1993-01-29 | Nec Corp | Semiconductor laser device |
| JPH0770777B2 (en) * | 1993-03-30 | 1995-07-31 | 日本電気株式会社 | Method for stabilizing wavelength of semiconductor laser and wavelength stabilizing light source |
| JPH10247757A (en) * | 1997-03-04 | 1998-09-14 | Nippon Telegr & Teleph Corp <Ntt> | Light emitting module for light communication |
| DE60108106T2 (en) * | 2001-07-30 | 2005-12-08 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Temperature-controlled light modulator arrangement |
| CN2602516Y (en) * | 2002-12-16 | 2004-02-04 | 中国科学院光电技术研究所 | Power supply, refrigeration, heat emission, and temperature control system special for semiconductor laser |
-
2007
- 2007-05-22 CN CNB2007100522675A patent/CN100464473C/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101614861B (en) * | 2009-08-12 | 2013-01-02 | 中国航空工业第一集团公司北京长城计量测试技术研究所 | Fixing support body for fixing reflector in injection-molded mirror canal |
| CN102570289A (en) * | 2011-05-25 | 2012-07-11 | 北京国科世纪激光技术有限公司 | Temperature controlling and heat radiating system for optical fiber coupling module |
| CN102315585A (en) * | 2011-07-26 | 2012-01-11 | 中国科学院长春光学精密机械与物理研究所 | Air-cooling and heat-radiating device for high-power semiconductor laser module |
| CN103697851A (en) * | 2013-11-29 | 2014-04-02 | 浙江省计量科学研究院 | Adjusting device for cross translation of flange plate |
| CN103697851B (en) * | 2013-11-29 | 2016-08-24 | 浙江省计量科学研究院 | Adjusting apparatus for the translation of ring flange cross |
| CN104752950B (en) * | 2015-04-07 | 2017-07-14 | 王胤 | A kind of collimation temperature control sealed installing seat of laser |
| CN104752950A (en) * | 2015-04-07 | 2015-07-01 | 王胤 | Laser collaboration temperature control and seal mounting base |
| RU2623709C1 (en) * | 2016-02-10 | 2017-06-28 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") | Small-size laser head with liquid cooling |
| CN106975853A (en) * | 2017-04-16 | 2017-07-25 | 杭州光库科技有限公司 | The cooling mechanism of twin-channel laser marking machine |
| CN106975853B (en) * | 2017-04-16 | 2019-11-22 | 杭州光库科技有限公司 | The cooling mechanism of twin-channel laser marking machine |
| CN108493756A (en) * | 2018-02-07 | 2018-09-04 | 杭州电子科技大学 | One kind being based on Nd:YVO4/Nd:GdVO4The two-frequency laser of interwoven crystal |
| CN108493756B (en) * | 2018-02-07 | 2020-06-12 | 杭州电子科技大学 | YVO based on Nd4/Nd:GdVO4Double-frequency laser of combined crystal |
| CN108233156A (en) * | 2018-02-10 | 2018-06-29 | 北京工业大学 | A kind of cooling system based on slab laser |
| CN109038208A (en) * | 2018-08-14 | 2018-12-18 | 苏州冠德能源科技有限公司 | The encapsulating structure of quantum cascade laser |
| CN109893101A (en) * | 2019-04-26 | 2019-06-18 | 中国科学院长春光学精密机械与物理研究所 | A kind of caries diagnosis imaging device and hand-held caries diagnosis imager |
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| Publication number | Publication date |
|---|---|
| CN100464473C (en) | 2009-02-25 |
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