CN101069260B - 工件的离子束铣削及其程度的确定和控制 - Google Patents

工件的离子束铣削及其程度的确定和控制 Download PDF

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Publication number
CN101069260B
CN101069260B CN2005800364115A CN200580036411A CN101069260B CN 101069260 B CN101069260 B CN 101069260B CN 2005800364115 A CN2005800364115 A CN 2005800364115A CN 200580036411 A CN200580036411 A CN 200580036411A CN 101069260 B CN101069260 B CN 101069260B
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CN
China
Prior art keywords
ion beam
deflection
workpiece
guided
repeatedly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2005800364115A
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English (en)
Chinese (zh)
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CN101069260A (zh
Inventor
D·博古斯拉夫斯基
V·彻里平
C·史密思
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SELA SEMICONDUCTOR ENGINEERING
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SELA SEMICONDUCTOR ENGINEERING
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Publication of CN101069260A publication Critical patent/CN101069260A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/08—Ion sources; Ion guns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/1501—Beam alignment means or procedures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3114—Machining
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31749—Focused ion beam

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Drying Of Semiconductors (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
CN2005800364115A 2004-08-24 2005-08-24 工件的离子束铣削及其程度的确定和控制 Expired - Fee Related CN101069260B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60354404P 2004-08-24 2004-08-24
US60/603,544 2004-08-24
PCT/IL2005/000913 WO2006021958A2 (en) 2004-08-24 2005-08-24 Directed multi-deflected ion beam milling of a work piece and determining and controlling extent thereof

Publications (2)

Publication Number Publication Date
CN101069260A CN101069260A (zh) 2007-11-07
CN101069260B true CN101069260B (zh) 2012-09-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800364115A Expired - Fee Related CN101069260B (zh) 2004-08-24 2005-08-24 工件的离子束铣削及其程度的确定和控制

Country Status (6)

Country Link
US (2) US20080078750A1 (https=)
EP (1) EP1787310A2 (https=)
JP (1) JP5254613B2 (https=)
KR (3) KR20070101204A (https=)
CN (1) CN101069260B (https=)
WO (1) WO2006021958A2 (https=)

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CN101069260B (zh) * 2004-08-24 2012-09-26 西拉半导体工程实验室有限公司 工件的离子束铣削及其程度的确定和控制
DE102007046783A1 (de) * 2007-09-29 2009-04-23 Carl Zeiss Nts Gmbh Vorrichtung zur Ablenkung oder Einlenkung eines Teilchenstrahls
US8232532B2 (en) * 2009-06-23 2012-07-31 Hitachi Global Storage Technologies Netherlands B.V. Off-axis ion milling device for manufacture of magnetic recording media and method for using the same
SG177822A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a sample
SG177823A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a lamella
US9330885B2 (en) * 2011-06-30 2016-05-03 Seagate Technology Llc Method of stack patterning using a ion etching
CA2791249C (en) * 2011-11-10 2014-02-25 Semiconductor Insights Inc. Method and system for ion beam delayering of a sample and control thereof
US20160048066A1 (en) * 2013-08-07 2016-02-18 Sakai Display Products Corporation Method for Manufacturing Display Panel and Display Panel
US9911573B2 (en) * 2014-03-09 2018-03-06 Ib Labs, Inc. Methods, apparatuses, systems and software for treatment of a specimen by ion-milling
US10354836B2 (en) 2014-03-09 2019-07-16 Ib Labs, Inc. Methods, apparatuses, systems and software for treatment of a specimen by ion-milling
US9779914B2 (en) 2014-07-25 2017-10-03 E.A. Fischione Instruments, Inc. Apparatus for preparing a sample for microscopy
CN105957789B (zh) * 2015-03-09 2020-05-12 Ib实验室有限公司 用于通过离子铣处理试样的方法、设备、系统和软件
US9779910B1 (en) * 2016-09-13 2017-10-03 Qualcomm Incorporated Utilization of voltage contrast during sample preparation for transmission electron microscopy
WO2018140903A2 (en) * 2017-01-27 2018-08-02 Howard Hughes Medical Institute Enhanced fib-sem systems for large-volume 3d imaging
US11119012B2 (en) 2017-04-25 2021-09-14 Ib Labs, Inc. Device and method for cleaving a liquid sample
CA3120208A1 (en) * 2018-11-21 2020-05-28 Techinsights Inc. Ion beam delayering system and method, topographically enhanced delayered sample produced thereby, and imaging methods and systems related thereto
US11440151B2 (en) * 2019-06-07 2022-09-13 Applied Materials Israel Ltd. Milling a multi-layered object
US10971618B2 (en) 2019-08-02 2021-04-06 Applied Materials Israel Ltd. Generating milled structural elements with a flat upper surface
US11276557B2 (en) 2019-09-17 2022-03-15 Applied Materials Israel Ltd. Forming a vertical surface
US10903044B1 (en) * 2020-02-12 2021-01-26 Applied Materials Israel Ltd. Filling empty structures with deposition under high-energy SEM for uniform DE layering
WO2022174187A2 (en) * 2021-02-15 2022-08-18 E.A. Fischione Instruments, Inc. System and method for uniform ion milling
US11784025B1 (en) 2022-05-10 2023-10-10 Plasma-Therm Nes Llc Integral sweep in ion beam system
US12288668B2 (en) 2023-05-11 2025-04-29 Applied Materials Israel Ltd. Entropy based image processing for focused ion beam delayer-edge slices detection
ES3010110B2 (es) * 2023-09-29 2025-12-18 Consejo Superior Investigacion Sistema de fabricacion de contactos electricos y metodo de fabricacion asociado

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US6355494B1 (en) * 2000-10-30 2002-03-12 Intel Corporation Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing
CN1377509A (zh) * 1999-10-05 2002-10-30 瓦里安半导体设备联合公司 用于离子注入器的高传输,低能量离子束管线结构

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US4209698A (en) * 1971-12-28 1980-06-24 Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. Transmission-type charged particle beam apparatus
US4710639A (en) * 1985-04-18 1987-12-01 Jeol Ltd. Ion beam lithography system
US4942342A (en) * 1987-09-30 1990-07-17 Nihon Shinku Gijutsu Kabushiki Kaisha Parallel sweeping system for electrostatic sweeping ion implanter
US5637879A (en) * 1996-03-20 1997-06-10 Schueler; Bruno W. Focused ion beam column with electrically variable blanking aperture
CN1377509A (zh) * 1999-10-05 2002-10-30 瓦里安半导体设备联合公司 用于离子注入器的高传输,低能量离子束管线结构
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Also Published As

Publication number Publication date
EP1787310A2 (en) 2007-05-23
US20080078750A1 (en) 2008-04-03
KR101355280B1 (ko) 2014-01-27
WO2006021958A2 (en) 2006-03-02
JP5254613B2 (ja) 2013-08-07
KR20070101204A (ko) 2007-10-16
CN101069260A (zh) 2007-11-07
US20130180843A1 (en) 2013-07-18
WO2006021958A3 (en) 2006-05-04
KR20130135320A (ko) 2013-12-10
JP2008511115A (ja) 2008-04-10
KR20120109641A (ko) 2012-10-08

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Granted publication date: 20120926

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