CN101056512A - Device with circuit board - Google Patents
Device with circuit board Download PDFInfo
- Publication number
- CN101056512A CN101056512A CN 200710110722 CN200710110722A CN101056512A CN 101056512 A CN101056512 A CN 101056512A CN 200710110722 CN200710110722 CN 200710110722 CN 200710110722 A CN200710110722 A CN 200710110722A CN 101056512 A CN101056512 A CN 101056512A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulating barrier
- display floater
- base plate
- waveform configuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004888 barrier function Effects 0.000 claims description 24
- 239000002245 particle Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000084 colloidal system Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 2
- 238000009792 diffusion process Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- WABPQHHGFIMREM-BJUDXGSMSA-N lead-206 Chemical class [206Pb] WABPQHHGFIMREM-BJUDXGSMSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A device having circuit plate comprises a first element, a second element and a combination. The first element contains a plurality of touch mat. The second element contains base, a plurality of connection mat, and insulating layer. The connection mat is installation on the base. The insulating layer is installed on the base and has a wave structure, in which, a opening direction of the wave structure is parallel with the base. The combination is arranged between the first element and the second element, in which the touch mat electrically connects to the connection mat.
Description
Technical field
The present invention relates to a kind of device with circuit board, particularly a kind of anisotropy conducting film that utilizes carries out the interelement above-mentioned a kind of device with circuit board that couples of special construction reinforcement that couples and utilize.
Background technology
In some electronic installations, being connected by conducting film between element and circuit board realize, for example the anisotropy conducting film (anisotropic conductive film, ACF).ACF mixes with dielectric synthetic resin and conductive particle, and wherein the central part of conductive particle is generally polymer, and the outside is coating metallic conductor.
ACF often is used to the manufacturing of LCD, directly be packaged in (chip on glass on the glass substrate as chip for driving with panel, COG), or chip for driving is engaged to flexible circuit board (chip on Film, COF), or with chip join in general printed circuit board (PCB) (chip on board, COB).
When application ACF carried out Chip Packaging, common problem was the wrongful removals of conductive particle.Because the conductive particle among the ACF of heating back is diffusive migration towards periphery easily, thereby can make two or more electrical components be electrically connected to each other, thereby causes the short circuit of circuit easily.
Prior art is that special structure is set on the direction of vertical substrate, and for example a spacer block in order to the separation conductive particle, and then is avoided short circuit.Yet, part in base plate line pressing district, the insulating barrier edge of existing substrate is smooth being parallel on the direction of substrate, therefore when ACF meets the flat edges of insulating barrier, easily along the edge diffuses flow of insulating barrier, thereby cause short circuit between circuit.
Summary of the invention
A purpose of the present invention is, proposes a kind of circuit board, and this circuit board has special construction on the direction of parallel base plate.When using conducting resinl to come joint element on this circuit board, this special construction can prevent to form between circuit short circuit.
Another object of the present invention is to, propose a kind of device, have special construction on the element of this device.When using conducting resinl to engage another element of this element and this device, this special construction can prevent to form between circuit short circuit.
To achieve these goals, the present invention proposes a kind of circuit board, this circuit board comprises base plate, a plurality of connection gasket and insulating barrier.These a plurality of connection gaskets are arranged on this base plate.This insulating barrier is arranged on this base plate and has a waveform configuration, and wherein an opening direction of this waveform configuration is parallel with this base plate.In addition, this circuit board also comprises many leads, be positioned on this base plate, and the corresponding electric connection of this lead with this connection gasket, wherein, a plurality of openings of this waveform configuration expose this lead substantially.
The invention allows for a kind of device, this device comprises one first element and one second element.This first element comprises a plurality of contact mats, and this second element comprises base plate, a plurality of connection gasket and insulating barrier.This connection gasket is arranged on this base plate.This insulating barrier is arranged on this base plate and has a waveform configuration, and wherein, an opening direction of this waveform configuration is parallel with this base plate.This first element also comprises many signal line, the corresponding electric connection of this holding wire with this contact mat, and a plurality of openings of this waveform configuration expose this holding wire substantially.Further, this second element also comprises the many leads that are positioned on this base plate, the corresponding electric connection of this lead with this connection gasket, and wherein a plurality of openings of this waveform configuration expose this lead substantially.
The present invention can be applied to, but be not limited to, directly be packaged in (chip on glass on the glass substrate in chip for driving with panel, COG), or chip for driving is engaged to flexible circuit board (chip on Film, COF), or with chip join in general printed circuit board (PCB) (chip on board, COB).
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
The end view of Fig. 1 for installing in one embodiment of the invention;
Fig. 2 is the vertical view of circuit board in one embodiment of the invention;
The cut-away section schematic diagram of Fig. 3 for installing in another embodiment of the present invention;
The cut-away section schematic diagram of Fig. 4 for installing in further embodiment of this invention.
Wherein, Reference numeral:
The 10-device
100-first element
The 102-contact mat
200-second element
The 201-base plate
The 202-connection gasket
204,304, the 404-insulating barrier
The 205-waveform configuration
The 50-binding element
The 500-colloid
The 502-conductive particle
Embodiment
Fig. 1 is the device 10 in one embodiment of the invention.Device 10 comprises one first element 100 and one second element 200.First element 100 can be a flip chip integrated circuit (flip chip integrated circuit; FC IC), a carrier band welds integrated circuit (Tape Automated Bonding integrated circuit automatically; TAB IC), a flexible circuit board, a panel, a printed circuit board (PCB), a multilayer chiop module substrate (multi-chip module substrate) or a hybrid circuit substrate (hybrid circuit substrate).Second element 200 can be a flip chip integrated circuit, a carrier band welds integrated circuit, a flexible circuit board, a panel, a printed circuit board (PCB), a multilayer chiop module substrate or a hybrid circuit substrate automatically.Preferably, first element 100 is a display floater, and this display floater can be a display panels, an organic LED display panel, a micro electronmechanical display floater or a plasma display floater, and second element 200 can be a flexible circuit board.Below according to this preferred embodiment the present invention will be described.
Display floater (first element 100) comprises contact mat 102, and flexible circuit board (second element 200) comprises base plate 201, connection gasket 202 and insulating barrier 204.Fig. 2 is the vertical view of flexible circuit board (second element 200).A plurality of connection gaskets 202 are arranged on the base plate 201, and material can be one of them or above-mentioned combination of gold, copper, nickel, tin.Insulating barrier 204 is arranged on the base plate 201 and has a waveform configuration 205, wherein, and an opening direction of this waveform configuration 205 and base plate 201 parallel (further please refer to the explanation of subsequent figure 2).Insulating barrier 204 comprises polyimides (Polyimide; PI), organic material, resin or above-mentioned combination.
This device 10 also comprises a binding element 50, is arranged in display floater (first element 100) and flexible circuit board (second element 200), and this binding element 50 makes contact mat 102 and connection gasket 202 electrically connect accordingly.This binding element 50 comprises colloid 500 and a plurality of conductive particle 502 that mixes with colloid 500.Preferably, this binding element 50 can be anisotropic conductive (ACF).Should be the same domain technical staff with the method for ACF electrically connect contact mat 102 and connection gasket 202 and known, do not add at this and give unnecessary details.
As shown in Figure 2, flexible circuit board (second element 200) also comprises many leads 206, this lead 206 and connection gasket 202 corresponding electric connections, wherein, the opening of waveform configuration 205 and cardinal principle exposed leads 206 parallel with the display floater (first element 100) among Fig. 1.When utilization binding element 50 links (second element 200) with display floater (first element 100), the opening of waveform configuration 205 can be for the conductive particle 502 of taking in and concentrate diffusion, can increase the effect that couples of contact mat 102 and connection gasket 202 so on the one hand, can also prevent that on the other hand conductive particle 502 from spreading to both sides, avoids causing the short circuit of 206 in adjacent lead.What deserves to be mentioned is, as long as having at least one indent part A, the waveform configuration 205 of insulating barrier 204 supplies to take in the conductive particle 502 of diffusion as opening, or has an overhang B to separate the conductive particle 502 of diffusion, can improve the short circuit problem of 206 in the adjacent lead that caused because of conductive particle 502 diffusion, promptly, the present invention does not limit waveform configuration 205, and this waveform configuration 205 can be rule or irregular, continuous or discrete waveform configuration.
Fig. 3 is the cut-away section schematic diagram of device 10 in another embodiment of the present invention.Wherein, second element 200 has an insulating barrier 304, and this insulating barrier 304 covers connection gasket 202 partially.Binding element 50 between contact mat 102 and connection gasket 202 so that electrically connect to be provided.Insulating barrier 304 forms a depression on connection gasket 202, so also can concentrate conductive particle 502, and reduces the outside diffusion of conductive particle 502, thereby increases the effect of contact mat 102 and 202 electric property couplings of connection gasket.
Fig. 4 is the cut-away section schematic diagram of device 10 in yet another embodiment of the invention.Wherein, second element 200 has an insulating barrier 404, and this insulating barrier 404 does not cover connection gasket 202.Binding element 50 between contact mat 102 and connection gasket 202 so that electrically connect to be provided.Insulating barrier 404 has thicker thickness with respect to connection gasket 202, so also can concentrate conductive particle 502, and reduces the outside diffusion of conductive particle 502, thereby increases the effect of contact mat 102 and 202 electric property couplings of connection gasket.
In sum, use circuit board of the present invention and the device that contains this circuit board, in process of production, can effectively avoid ACF when engaging, because the wrongful removals of conductive particle, thereby cause to such an extent that be short-circuited between lead, holding wire even energy line or the phenomenon of loose contact.Can effectively increase product percent of pass, and reduce the number of times of reform (rework).
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (16)
1, a kind of device with circuit board is characterized in that, comprises:
One first element comprises a plurality of contact mats;
One second element comprises:
One base plate;
A plurality of connection gaskets are arranged on this base plate;
One insulating barrier is arranged on this base plate, has a waveform configuration, and wherein an opening direction of this waveform configuration is parallel with this base plate;
One binding element, between this first element and this second element, the wherein corresponding electric connection of this contact mat with this connection gasket.
2, the device with circuit board as claimed in claim 1 is characterized in that, this first element also comprises many signal line, corresponding electric connection with this contact mat, and a plurality of openings of this waveform configuration expose this holding wire substantially.
3, the device with circuit board as claimed in claim 1 is characterized in that, this second element also comprises many leads, be positioned on this base plate, and the corresponding electric connection of this lead with this connection gasket, wherein a plurality of openings of this waveform configuration expose this lead substantially.
4, the device with circuit board as claimed in claim 1 is characterized in that, this binding element comprises:
Colloid;
A plurality of conductive particles mix with this colloid.
5, the device with circuit board as claimed in claim 1 is characterized in that, this binding element comprises anisotropic conductive.
6, the device with circuit board as claimed in claim 1, it is characterized in that this first element is that a flip chip integrated circuit, a carrier band weld integrated circuit, a flexible circuit board, a panel, a printed circuit board (PCB), a multilayer chiop module substrate or a hybrid circuit substrate automatically.
7, the device with circuit board as claimed in claim 1, it is characterized in that this second element is that a flip chip integrated circuit, a carrier band weld integrated circuit, a flexible circuit board, a panel, a printed circuit board (PCB), a multilayer chiop module substrate or a hybrid circuit substrate automatically.
8, the device with circuit board as claimed in claim 1 is characterized in that, this first element is a display floater, and this second element is a flexible circuit board.
9, the device with circuit board as claimed in claim 8 is characterized in that, this display floater is a display panels, an organic LED display panel, a micro electronmechanical display floater or a plasma display floater.
10, the device with circuit board as claimed in claim 1 is characterized in that, this first element is a flexible circuit board, and this second element is a display floater.
11, the device with circuit board as claimed in claim 10 is characterized in that, this display floater is a display panels, an organic LED display panel, a micro electronmechanical display floater or a plasma display floater.
12, the device with circuit board as claimed in claim 1 is characterized in that, this insulating barrier partly covers this connection gasket.
13, the device with circuit board as claimed in claim 1 is characterized in that, this insulating barrier does not cover this connection gasket.
14, the device with circuit board as claimed in claim 1 is characterized in that, this insulating barrier partly covers this contact mat.
15, the device with circuit board as claimed in claim 1 is characterized in that, this insulating barrier does not cover this contact mat.
16, the device with circuit board as claimed in claim 1 is characterized in that, this insulating barrier comprises polyimides, organic material, resin or above-mentioned combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101107222A CN101056512B (en) | 2007-06-06 | 2007-06-06 | Device with circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101107222A CN101056512B (en) | 2007-06-06 | 2007-06-06 | Device with circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101056512A true CN101056512A (en) | 2007-10-17 |
| CN101056512B CN101056512B (en) | 2010-09-22 |
Family
ID=38796056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101107222A Active CN101056512B (en) | 2007-06-06 | 2007-06-06 | Device with circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101056512B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102413644A (en) * | 2010-09-24 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module |
| CN101613073B (en) * | 2008-06-26 | 2012-08-29 | 鸿富锦精密工业（深圳）有限公司 | Micro electromechanical system (MEMS) |
| WO2013152646A1 (en) * | 2012-04-10 | 2013-10-17 | 宸鸿科技(厦门)有限公司 | Bonding structure |
| CN103491703A (en) * | 2013-07-04 | 2014-01-01 | 友达光电股份有限公司 | Display device and circuit board module thereof |
| TWI449657B (en) * | 2008-07-04 | 2014-08-21 | Hon Hai Prec Ind Co Ltd | Micro electro-mechanical system |
| CN108366487A (en) * | 2018-01-30 | 2018-08-03 | 业成科技（成都）有限公司 | Circuit board connected structure and circuit board joint method |
| CN108574158A (en) * | 2017-03-14 | 2018-09-25 | 群创光电股份有限公司 | Display device and its manufacturing method |
| CN112235942A (en) * | 2020-09-21 | 2021-01-15 | 广州国显科技有限公司 | Display module |
| CN113725379A (en) * | 2020-05-25 | 2021-11-30 | 京东方科技集团股份有限公司 | Display module and display device |
-
2007
- 2007-06-06 CN CN2007101107222A patent/CN101056512B/en active Active
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101613073B (en) * | 2008-06-26 | 2012-08-29 | 鸿富锦精密工业（深圳）有限公司 | Micro electromechanical system (MEMS) |
| TWI449657B (en) * | 2008-07-04 | 2014-08-21 | Hon Hai Prec Ind Co Ltd | Micro electro-mechanical system |
| CN102413644B (en) * | 2010-09-24 | 2013-11-27 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module |
| CN102413644A (en) * | 2010-09-24 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module |
| WO2013152646A1 (en) * | 2012-04-10 | 2013-10-17 | 宸鸿科技(厦门)有限公司 | Bonding structure |
| CN103491703B (en) * | 2013-07-04 | 2016-03-16 | 友达光电股份有限公司 | Display device and circuit board module thereof |
| CN103491703A (en) * | 2013-07-04 | 2014-01-01 | 友达光电股份有限公司 | Display device and circuit board module thereof |
| CN108574158A (en) * | 2017-03-14 | 2018-09-25 | 群创光电股份有限公司 | Display device and its manufacturing method |
| CN108574158B (en) * | 2017-03-14 | 2020-10-09 | 群创光电股份有限公司 | Display device and method for manufacturing the same |
| CN108366487A (en) * | 2018-01-30 | 2018-08-03 | 业成科技（成都）有限公司 | Circuit board connected structure and circuit board joint method |
| CN113725379A (en) * | 2020-05-25 | 2021-11-30 | 京东方科技集团股份有限公司 | Display module and display device |
| WO2021238443A1 (en) * | 2020-05-25 | 2021-12-02 | 京东方科技集团股份有限公司 | Display module and display apparatus |
| CN113725379B (en) * | 2020-05-25 | 2022-12-09 | 京东方科技集团股份有限公司 | Display module and display device |
| CN112235942A (en) * | 2020-09-21 | 2021-01-15 | 广州国显科技有限公司 | Display module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101056512B (en) | 2010-09-22 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180427 Address after: Hongkong Chinese Tsuen Tai Chung Road No. 8 TCL industrial center 13 floor Patentee after: Huaxing Optoelectronic International (Hong Kong) Co.,Ltd. Address before: Hsinchu, Taiwan, China Patentee before: AU OPTRONICS Corp. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231214 Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: Hongkong Chinese Tsuen Tai Chung Road No. 8 TCL industrial center 13 floor Patentee before: Huaxing Optoelectronic International (Hong Kong) Co.,Ltd. |